PM1205

PM1205
AC Power Switch
INTEGRATED CIRCUITS DIVISION
Parameter
AC Operating Voltage
Load Current
On-State Voltage Drop
(IL=500mArms)
Rating
240
500
1.4
Features
• Load Current up to 0.5Arms
• Blocking Voltages up to 500VP
• 5mA Sensitivity
• Zero-Crossing Detection
• DC Control, AC Output
• Optically Isolated
• TTL and CMOS Compatible
• Low EMI and RFI Generation
• High Noise Immunity
• VDE compatible
• Machine Insertable, Wave Solderable
Units
Vrms
mArms
Vrms
Description
The PM1205 is an AC Solid State Switch using optical
coupling with dual power SCR outputs to produce
an alternative to optocoupler and Triac circuits. The
PM1205 switches are robust enough to provide a
blocking voltage of up to 500VP. In addition, tightly
controlled zero-cross circuitry ensures switching of
AC loads without the generation of transients. The
input and output circuits are optically coupled to
provide 3750Vrms of isolation and noise immunity
between control and load circuits. As a result, the
PM1205 is well suited for industrial environments
where electromagnetic interference could disrupt the
operation of electromechanical relays.
Approvals
• UL Recognized Component: UL 508 File E69938
• CSA Certified Component: File 043639
Ordering Information
Applications
• Programmable Control
• Process Control
• Power Control Panels
• Remote Switching
• Gas Pump Electronics
• Contactors
• Large Relays
• Solenoids
• Motors
• Heaters
Part #
PM1205
PM1205S
PM1205STR
Description
6-Lead DIP (50/Tube)
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount (1000/Reel)
Pin Configuration
1
– LED
2
3
DS-PM1205-R10
6
+ LED
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ZC
5
AC Load
AC Load
4
1
INTEGRATED CIRCUITS DIVISION
PM1205
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Min
3750
-40
-40
Max
500
5
100
1
150
800
+85
+125
Units
VP
V
mA
A
mW
mW
Vrms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
AC Operating Voltage
Load Current (Continuous)
Maximum Surge Current
Off-State Leakage Current
On-State Voltage Drop
Critical Rate of Rise
Switching Speeds
Turn-On
Turn-Off
Zero-Cross Turn-On Voltage 1
Operating Frequency
Load Power Factor for Guaranteed Turn-On 2
Capacitance Input-To-Output
Input Characteristics
Input Control Current
For Normal Environment
For High Noise Environment
Input Voltage Drop
Input Dropout Voltage
Reverse Input Current
1
2
2
Conditions
Symbol
Min
Typ
Max
Units
IF=5mA
VL=120-240VAC
t<16ms
VL=500VDC
IL=0.5Arms
-
VOP
IL
IPEAK
ILEAK
dV/dt
20
0.005
1000
1200
240
0.5
12
1
1.4
-
Vrms
Arms
A
mA
Vrms
V/µs
IF=5mA
ton
toff
20
0.25
-
2
3
0.5
0.5
5
1
500
-
0.9
0.8
-
1.2
-
5
10
1.4
10
1st half-cycle
Subsequent half-cycle
-
IF=5mA
VR=5V
PF
CI/O
IF
VF
IR
Cycles
V
V
Hz
pF
mA
V
V
µA
Zero Cross 1st half-cycle @ < 100Hz.
Snubber circuits may be required at low power factors.
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R10
INTEGRATED CIRCUITS DIVISION
PM1205
PERFORMANCE DATA*
0.8
RTJA = 60ºC/W
0.4
0.2
20
Forward Voltage (V)
1.0
0
-40
1.3
25
Peak Surge Current (A)
Load Current (Arms)
1.2
0.6
Typical Forward Voltage
vs. Temperature
Max Surge Current
Non-Repetitive
Load Current
Free Air
NOTE: Values apply to
TJ=50ºC before surge.
15
10
5
0
0
55
Ambient Temperature (ºC)
85
1.2
1.1
1.0
0.9
16
50
100
0
10
25
40
55
70
85
Ambient Temperature (ºC)
Pulse Duration (ms)
Typical dV/dt
vs. Temperature
dV/dt Method
Critical Rate of Rise (V/Ps)
1400
1200
Vo
1000
800
Vo = 300V
63%
dV 0.63 x 300V 189
=
=
dt
RC
RC
In accordance with
EIA/NARM Standards
RS-443 for Solid State Relays
600
400
200
0
10%
0
25
50
Ambient Temperature (ºC)
85
RC
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R10
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3
INTEGRATED CIRCUITS DIVISION
PM1205
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PM1205
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PM1205
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
4
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R10
INTEGRATED CIRCUITS DIVISION
PM1205
Mechanical Dimensions
PM1205
3.302 ± 0.051
(0.130 ± 0.002)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
Pin 1
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 TYP.
(0.010 TYP.)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285 TYP.)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP.
(0.160 TYP.)
0.457 ± 0.076
(0.018 ± 0.003)
Dimensions
mm
(inches)
2.007 ± 0.102
(0.079 ± 0.004)
PM1205S
9.525 ± 0.254
(0.375 ± 0.010)
2.540 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.254
(0.300 ± 0.010)
Pin 1
9.652 ± 0.381
(0.380 ± 0.015)
3.302 ± 0.051
(0.130 ± 0.002)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0256)
0.635 ± 0.127
(0.025 ± 0.005)
1.65
(0.065)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
2.159 ± 0.102
(0.085 ± 0.004)
R10
8.90
(0.350)
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5
INTEGRATED CIRCUITS DIVISION
PM1205
PM1205STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-PM1205-R10
©Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/21/2013