CPC1966B AC Power Switch INTEGRATED CIRCUITS DIVISION Parameter AC Operating Voltage Load Current On-State Voltage Drop Blocking Voltage Rating 20 - 240 3 0.8 800 Units Vrms Arms Vrms (at IL = 3Arms) VP Features • • • • • • • • • • • • Load Current up to 3Arms 800VP Blocking Voltage 5mA Sensitivity 5000Vrms Input to Output Isolation Off-State dV/dt: 1000V/s Minimum 12.5mm External Creepage Distance with Appropriate Layout Zero-Cross Switching DC Control, AC Output Optically Isolated TTL and CMOS Compatible Low EMI and RFI Generation High Noise Immunity Description CPC1966B is an AC Solid State Switch utilizing dual power SCR outputs. This device also includes zero-cross turn-on circuitry and is specified with a blocking voltage of 800VP . In addition, the tightly controlled zero-cross circuitry ensures low noise switching of AC loads by minimizing the generation of transients. The optically coupled input and output circuits provide 5000Vrms of isolation and noise immunity between the control and load circuits. As a result, the CPC1966B is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communication and control systems. Approvals • UL 508: Pending • CSA Industrial Control Switches Approval: Pending Ordering Information Part # CPC1966B Applications • • • • • • • • • • Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Description 8-Pin Power SOIC (25/Tube) Pin Configuration 8 AC Load 7 RoHS 2002/95/EC DS-CPC1966B-R02 AC Load 5 ZC 1 N/C Pb 6 2 + LED 3 – LED 4 N/C e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1966B Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage (VDRM) Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage Input to Output ESD, Human Body Model Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 20 mW / ºC Ratings 800 5 50 1 150 2400 5000 8 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms kV °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current, Continuous Maximum Surge Current Off State Leakage Current On-State Voltage Drop 1 Off-State dV/dt Switching Speeds Turn-on Turn-off Zero-Cross Turn-On Voltage Holding Current Latching Current Operating Frequency 2 Load Power Factor for Guaranteed Turn-On 3 Input Characteristics Input Control Current 4 Input Drop-out Voltage Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units VL=120-240Vrms t < 16ms VDRM IL=2AP IF=0mA IL IP 0.1 1000 0.88 - 3 30 100 1.1 - Arms AP AP VP V/s ton toff IH IL 20 5 44 48 - 0.5 0.5 20 5 50 75 500 cycles cycles V V mA mA Hz 60Hz PF 0.25 - - - f=60Hz, IL=1A Resistive IF=5mA VR=5V IF VF IR 0.8 0.9 - 1.2 - 5 1.4 10 mA V V A - CI/O - - 3 pF IF = 5 mA 1st half cycle Subsequent half cycle - ILEAK dV/dt 1 Tested at a peak value equivalent. 2 Zero Cross 1st half cycle @ <100Hz. 3 Snubber circuits may be required at low power factors. 4 For high-noise environments, or for high-frequency operation, use I > 10mA. F 2 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1966B Performance Data (@ 25ºC Unless Otherwise Noted) * LED Forward Voltage Distribution (N=50, IF=5mA) 35 25 LED Current to Operate Distribution (60Hz Resistive Load) (N=50, VL=120VAC) 20 Zero Cross Voltage Distribution (N=50, IF=5mA) 25 20 15 10 5 0 1.25 1.26 1.27 1.28 1.29 LED Forward Voltage (V) 20 Device Count (N) Device Count (N) Device Count (N) 30 15 10 1.44 1.48 1.52 30 30 25 Device Count (N) Device Count (N) 1.60 25 20 15 10 4.3 4.6 4.9 5.2 5.5 Zero Cross Voltage (V) 5.8 20 15 10 5 0.88 0.90 0.92 0.94 0.96 SCR Forward Voltage (V) LED Forward Voltage vs. Temperature IF=50mA 0 850 852 854 856 858 Blocking Voltage (VP) LED Current to Operate vs. Load Frequency (VL=140Vrms, RL=400:) 2.8 1.6 0.98 LED Current (mA) 1.5 IF=20mA 1.4 1.3 IF=10mA 1.2 3.0 2.4 2.2 2.0 1.8 1.6 1.2 20 40 60 Temperature (ºC) 80 100 ZL=200mH IL=500mA 2.5 2.0 RL=400: IL=350mA 1.5 1.0 1.4 IF=5mA 860 LED Current to Operate (fO=60Hz) 3.5 2.6 LED Current (mA) 0.86 0 4.0 1.64 Typical Blocking Voltage Distribution (N=50) 35 5 Forward Voltage (V) 1.56 LED Current (mA) 0 -20 5 0 1.40 Typical SCR Forward Voltage Distribution (N=50, IF=5mA, IL=2A) 1.1 -40 10 5 0 1.30 15 0 100 200 300 400 Load Frequency (Hz) 500 600 0.5 -40 -20 0 20 40 60 Temperature (ºC) 80 100 * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R02 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1966B Performance Data (@ 25ºC Unless Otherwise Noted) * 1.00 Voltage Drop (VP) 2 0 -2 0.90 0.85 0.80 -4 0.75 -6 -1.5 0.70 -40 -1.0 -0.5 0.0 0.5 Load Voltage (VP) 1.0 1.5 VL=600V VL=300V 10 1 -40 -20 0 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 60 50 40 30 20 -40 100 100 920 3.5 880 3.0 840 800 760 720 -40 -20 0 20 40 60 Temperature (ºC) 80 100 80 100 Maximum Load Current vs. Temperature Load Current (Arms) Blocking Voltage (VP) Leakage Current (nA) 10000 100 -20 Holding Current vs. Temperature (IF=0mA) 70 Typical Blocking Voltage vs. Temperature Leakage Current vs. Temperature 1000 80 IL=3AP IL=2AP IL=1AP 0.95 4 Load Current (AP) Voltage Drop vs. Temperature (IF=5mA) Holding Current (mA) 6 Typical Load Voltage vs. Load Current (IF=5mA) 2.5 2.0 1.5 1.0 -20 0 20 40 60 Temperature (ºC) 80 100 -40 -20 0 20 40 60 Temperature (ºC) Maximum Surge Current (non-Repetitive) (Values Apply to TJ=50ºC Before Surge) 35 Load Current (AP) 30 25 20 15 10 5 0 1 10 100 1000 Time (ms) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R02 INTEGRATED CIRCUITS DIVISION CPC1966B Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1966B MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1966B 245ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R02 RoHS 2002/95/EC e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1966B MECHANICAL DIMENSIONS CPC1966B 21.082 ± 0.381 (0.830 ± 0.015) Pin 8 16.764 ± 0.381 (0.660 ± 0.015) 3.302 ± 0.051 (0.130 ± 0.002) 0.127 ± 0.076 (0.005 ± 0.003) 15.90 (0.626) 10.160 ± 0.254 (0.400 ± 0.010) 2.00 (0.079) 0.889 ± 0.127 (0.035 ± 0.005) Pin 1 0.764 ± 0.102 (0.030 ± 0.004) 5.076 ± 0.127 (0.200 ± 0.005) 7.622 ± 0.127 (0.300 ± 0.005) Recommended PCB Pattern 1.524 typ (0.060) 1.016 ± 0.127 (0.040 ± 0.005) 1.650 ± 0.102 (0.065 ± 0.004) 5.080 ± 0.127 (0.200 ± 0.005) 0.381 ± 0.025 (0.015 ± 0.001) Dimensions Unless Otherwise Noted mm (inches) Note: Tolerances are non-cumulative. 5.076 (0.200) 7.622 (0.300) 5.076 (0.200) 0.95 (0.037) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1966B-R02 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 6/26/2012