Data Sheet

MX879
8-Channel, 60V Driver with
Open-Drain Output, 3 Wire Interface
INTEGRATED CIRCUITS DIVISION
Features
Description
•
•
•
•
•
•
•
•
The MX879 is an 8-channel, high voltage switch with
8-bit parallel or serial input control. The MX879
connects directly to a microprocessor through a
standard 3-wire serial interface. The open-drain,
pull-up output configuration can drive up to 60 volts at
-120mA. Outputs can be paralleled for increased drive
current up to a device total of 600mA source.
Eight (8) Outputs Rated at 60V, -120mA
Open-Drain, Pull-Up Driver Configuration
6V to 60V Driver Supply Range
2.7V to 5.5V Logic Supply Range
3-Wire Serial Interface plus Chip Select
Captures Serial & Parallel Input Data
Outputs Can Be Paralleled
28-Lead QFN Package
The MX879 is designed to operate over a temperature
range of -40°C to +85°C, and is available in a 28-lead
QFN Package.
Applications
• White Goods
• ATE
• Industrial Equipment
Ordering Information
Pb
e3
Part
Description
MX879R
QFN-28 (73/Tube)
MX879RTR
QFN-28 Tape & Reel (2500/Reel)
Functional Block Diagram
VPWR
VCC
CS*
SDO
I/O
Register
Parallel Inputs
Shift Register
IN7
IN6
IN5
IN4
IN3
IN2
IN1
IN0
Latch
Register
Driver
Parallel
In & Out
Level
Translator
OUT7
OUT6
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
SCK
SDI
OE
GND
DS-MX879-R01
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MX879
INTEGRATED CIRCUITS DIVISION
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Dynamic Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Serial Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Parallel Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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4
4
5
6
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2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Parallel In / Parallel Out Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 Serial Cascade Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 Control System Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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R01
MX879
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.2 Pin Description
1.1 Package Pinout
14
13
12
11
10
9
8
7
6
5
4
3
2
1
15
16
17
18
19
20
21
22
23
24
25
26
27
28
BOT TOM V IEW
R01
Pin#
Name
1
OUT7
Parallel Output
2
N/C
No Connection
3
GND
Ground
4
VPWR
High Voltage Supply (6V to 60V)
5
N/C
No Connection
6
VCC
Logic Supply (2.7V to 5.5V)
7
SDO
Serial Data Output
8
IN7
Parallel Input
9
IN6
Parallel Input
10
IN5
Parallel Input
11
IN4
Parallel Input
12
IN3
Parallel Input
13
IN2
Parallel Input
14
IN1
Parallel Input
15
IN0
Parallel Input
16
SCK
Serial Clock
17
VPWR
High Voltage Supply (6V to 60V)
18
SDI
Serial Data Input
19
CS*
Chip Select (Active Low)
20
OE
Output Enable
21
GND
Ground
22
OUT0
Parallel Output
23
OUT1
Parallel Output
24
OUT2
Parallel Output
25
OUT3
Parallel Output
26
OUT4
Parallel Output
27
OUT5
Parallel Output
28
OUT6
Parallel Output
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Description
3
MX879
INTEGRATED CIRCUITS DIVISION
1.3 Absolute Maximum Ratings
Parameter
Symbol
Min
Max
VPWR Supply Voltage
VPWR
-
60
V
Logic Supply Voltage
VCC
-
6
V
Input Pin Voltage
VIN
-
6
V
IOUTn
-
-150
mA
TJ
-
150
°C
Continuous Output Current
OUT0 - OUT7
Operating Junction Temperature
Thermal Resistance
(Junction to Ambient)
Operating Temperature
Storage Temperature
RJA
Units
110 Typical
Absolute maximum electrical ratings are at 25°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to the absolute maximum ratings for
an extended period may degrade the device and affect its
reliability.
°C/W
TA
-40
85
°C
TSTG
-55
150
°C
Voltages with respect to GND=0V.
ESD Warning: ESD (electrostatic discharge) sensitive device. Although the MX879 features proprietary ESD protection
circuitry, permanent damage may be sustained if subjected to high energy electrostatic discharges. Proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
1.4 DC Electrical Characteristics
VCC=5V, VPWR=42V, TA=25°C, unless otherwise specified.
Parameter
Conditions
Minimum
Typical
Maximum
Units
Logic Supply Voltage
-
2.7
-
5.5
V
Logic Supply Current
fSCK=5MHz
-
50
-
A
fSCK=0
-
-
1
A
VPWR Voltage
-
6
-
60
V
VPWR Current
Total of all Outputs
-
-
600
mA
Quiescent VPWR Current
VPWR=42V, No Load
-
0.75
-
mA
High Level Input Voltage
IN0-IN7, SCK, SDI, OE, CS*
VCC-0.5
-
-
V
Low Level Input Voltage
-
-
-
0.5
V
Input Leakage Current
-
-
-
1
A
CS*=Logic High
-
-
1
A
Quiescent Logic Supply Current
SDO Tri-State Leakage Current
OUT0-OUT7 Current
OUT0-OUT7 ON Resistance
OUT0-OUT7 Tri-State Leakage Current
Notes:
Any One Output, Source
-
-
-120
mA
VPWR=42V
-
7
-

OE=Logic Low
-
-
1
A
To avoid unwanted output during VPWR application and system initialization, keep OE at a logic low until
CS* has completed one cycle.
Thermal Resistance is measured in still air with the device soldered to a 6 square inch board without a
ground plane. Applications may require derating of the specified maximum currents to avoid exceeding the
maximum operation junction temperature.
4
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MX879
INTEGRATED CIRCUITS DIVISION
1.5 Dynamic Electrical Characteristics
VCC=5V, VPWR=42V, TA=25°C, unless otherwise specified.
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Units
SCK Period
-
-
100
-
DC
ns
SCK High Time
-
-
40
-
-
ns
SCK Low Time
-
-
40
-
-
ns
-
tCSwh
50
-
-
ns
Setup Time
tCSs
150
-
-
ns
SCK Low (Parallel Input Mode)
tCSwl
150
-
-
ns
INx to CS Falling (SETUP TIME)
-
tINs
15
-
-
ns
INx to CS Falling (HOLD TIME)
-
tINh
30
-
-
ns
SDI to SCK Rising (SETUP TIME)
-
tSDIs
20
-
-
ns
SDI to SCK Rising (HOLD TIME)
-
tSDIh
25
-
-
ns
SCK Falling to to SDO Data Valid
-
tSDO
-
10
-
ns
CS* Rising to SDO High Z
-
tSDOz
-
12
-
ns
CS* Rising to OUTx Rising
To 50%, C(OUTx)=1000pF
tOUTr
-
680
-
ns
From 10% to 90%, C(OUTx)=1000pF
-
-
110
-
ns
To 90%
-
-
580
-
ns
OE Rising to OUTx Falling
To 90%
-
-
390
-
ns
OE Falling to OUTx High Z
To 10%, OUTx High
-
-
130
-
ns
To 10%, OUTx Low
-
-
90
-
ns
CS* High Time
CS* Falling to SCK Rising
CS* Low Time
OUTx Rise Time
OE Rising to OUTx Rising
R01
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MX879
INTEGRATED CIRCUITS DIVISION
1.6 Serial Timing
INx
tINh
tINs
CS*
tCSs
tCSwh
SCK
tSDIh
tSDIs
SDI
tSDOz
tSDO
SDO
tOUTr
tOUTf
OUTx
1.7 Parallel Timing
INx
tINs
tINh
CS*
tCSwl
tOUTr
OUTx
6
tOUTf
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MX879
INTEGRATED CIRCUITS DIVISION
2 Functional Description
Figure 1. Serial Data Transfer Example
The MX879 is an 8-channel high-voltage driver with
8-bit input control. The MX879 interfaces to a
microprocessor through a standard 3-wire serial
interface and an active-low chip select, or can be used
in a parallel-in, parallel-out configuration.
Parallel data is transferred to the I/O register of the
MX879 through the parallel input pins, IN0 through
IN7, on the falling edge of the chip select pin, CS*.
When CS* is in a logic-low state, serial data can be
transferred to the I/O register through the serial input
pin, SDI, and from the I/O register through the serial
output pin, SDO. Parallel or serial input data is
transferred from the I/O register to the latch and high
voltage output drivers, OUT0 through OUT7, on the
positive edge of CS*. This data remains latched until
the next positive edge of CS*.
The 8-bit I/O shift register is clocked by the serial clock
pin, SCK. Serial data presented at the SDI pin is
transferred to the shift register on the positive edge of
SCK. Data shifts out of the register through the SDO
pin on the negative edge of SCK. SDI and SCK are
ignored, and SDO transitions to a high impedance
condition when CS* is at a logic high state.
Serial data is received by the MX879 through the SDI
pin. This data is accepted on the rising edge of SCK. A
specific output is programmed to a logic-high state if
SDI is at a logic-high state during the rising edge of
SCK. Conversely, a specific output is programmed to a
logic-low state if SDI is at a logic-low state during the
rising edge of SCK. Outputs transition to their
programmed states on the positive edge of CS* if the
output enable pin, OE, is in a logic-high state.
The MSB input data (IN7) is presented at the serial
output pin, SDO, on the falling edge of CS*. Input data
from IN6 through IN0 is sequentially presented at
SDO on negative SCK transitions if CS* remains in a
logic-low state. If CS* is at a logic-low state beyond 8
cycles of SCK, SDI data that has propagated through
the I/O register will then be presented at SDO. The
SDO pin transitions to a high-impedance state when
CS* is in a logic-high state, thus allowing multiple
serial peripherals to share the microprocessor data
pin.
R01
IN7
0
IN6
0
IN5
1
IN4
0
IN3
1
IN2
1
IN1
1
IN0
0
SDI
1
t1
0
0
0
0
1
1
0
0
0
1
0
1
1
1
0
CS *
SCK
SDO
SDI at
time t1
OUT7
1
OUT6
0
OUT5
0
OUT4
0
OUT3
0
OUT2
1
OUT1
1
OUT0
0
Devices may be serially cascaded by connecting SDO
to SDI of the next device. Pins SCK and CS* are
common to all devices in serial cascade. For
n-cascaded devices the CS* should remain low for 8n
cycles of SCK.
An output enable pin, OE, enables the driver outputs
OUT0 through OUT7 when logic-high. A logic-low
level on OE forces the OUT0 through OUT7 outputs to
a high-impedance state.
The MX879 can also operate as a parallel-in,
parallel-out level shifter and driver. SCK must remain
at a logic-low state when operating in this mode.
Parallel input data presented to IN0 through IN7 is
captured on the falling edge of CS*. This data is
transferred to OUT0 through OUT7 on the rising edge
of CS*, and remains latched until the next rising edge
of CS*.
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MX879
INTEGRATED CIRCUITS DIVISION
3 Application Examples
3.1 Parallel In / Parallel Out Application
IN
OUT
8
8
CS*
SDI
OE
SCK
3.2 Serial Cascade Application
MASTER IN
SDO
IN
OUT
8
8
SCK
CS*
OE
SDI
SDO
IN
OUT
8
8
SCK
CS*
OE
SDI
MASTER OUT
8
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R01
MX879
INTEGRATED CIRCUITS DIVISION
3.3 Control System Application
System
MX879
capture
sensors
IN
8
SDI
SDO
drive
µC
SCK
actuators
OUT
8
CS*
OE
Type 1 timing:
capture N
drive N
analyze N, calculate N+1
capture N+1
drive N+1
CS*
µC
SDI
µC
output N
output N+1
SCK
SDO
input N
µC
input N+1
µC
Type 2 timing:
analyze N, calculate N+1
capture N
drive N+1
capture N+1
CS*
SDI
µC
don't care
output N+1
SCK
SDO
R01
input N
µC
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9
MX879
INTEGRATED CIRCUITS DIVISION
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
MX879R
MSL 3
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Pb
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Device
Maximum Temperature x Time
MX879R
260°C for 30 seconds
e3
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R01
MX879
INTEGRATED CIRCUITS DIVISION
4.4 Mechanical Dimensions
4.4.1 QFN-28 Package & Recommended PCB Land Pattern
2
1
5.00 BSC
(0.197 BSC)
0.18 / 0.30
(0.007 / 0.012)
28
0.500 BSC
(0.0197 BSC)
0.80 / 1.00
(0.031 / 0.039)
0.200 REF
(0.008 REF)
0.50
(0.020)
4.70
(0.185)
Pin 1 REF
3.25
(0.128)
3.00 / 3.25
(0.118 / 0.128)
3.00 / 3.25
(0.118 / 0.128)
5.00 BSC
(0.197 BSC)
0.45 / 0.65
(0.018 / 0.026)
4.70
(0.185)
3.25
(0.128)
0.30
(0.012)
NOTES: (Unless otherwise specified)
1. Coplanarity applies to the exposed
heat sink slug as well as the terminals.
2. Dimensions and tolerancing conform
to ASME Y14.5M-1994.
3. Molded package shall conform to
JEDEC Standard configuration
MO-220 Variation VHHD-1.
0.00 / 0.05
(0.000 / 0.002)
1.00
(0.039)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
4.4.2 Tape & Reel
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
B
330.2 DIA.
(13.00 DIA.)
ø1.55 ± 0.05
(ø0.061 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
R0.50 TYP
(R0.020 TYP)
12.00 ± 0.10
(0.472 ± 0.004)
Top Cover
Tape Thickness
0.066 MAX.
(0.0026 MAX.)
BO=5.30 ± 0.10
(0.209 ± 0.004)
Embossed Carrier
KO=1.10 ± 0.10
(0.043 ± 0.004)
Section B-B
Embossment
5.50 ± 0.05
(0.217 ± 0.002)
A
A
B
8.00 ± 0.10
(0.315 ± 0.004)
AO=5.30 ± 0.10
(0.209 ± 0.004)
Section A-A
ø1.50 MIN
(ø0.059 MIN)
Dimensions
mm
(inches)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. ±0.2mm
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IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed
or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical
harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
to its products at any time without notice.
Specification: DS-MX879-R01
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
R01
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