MX879 8-Channel, 60V Driver with Open-Drain Output, 3 Wire Interface Features Description • • • • • • • • The MX879 is an 8-channel, high voltage switch with 8-bit parallel or serial input control. The MX879 connects directly to a microprocessor through a standard 3-wire serial interface. The open-drain, pull-up output configuration can drive up to 60 volts at -120mA. Outputs can be paralleled for increased drive current up to a device total of 600mA source. Eight (8) Outputs Rated at 60V, -120mA Open-Drain, Pull-Up Driver Configuration 6V to 60V Driver Supply Range 2.7V to 5.5V Logic Supply Range 3-Wire Serial Interface plus Chip Select Captures Serial & Parallel Input Data Outputs Can Be Paralleled 28-Lead QFN Package The MX879 is designed to operate over a temperature range of -40°C to +85°C, and is available in a 28-lead QFN Package. Applications • White Goods • ATE • Industrial Equipment Ordering Information Pb RoHS 2002/95/EC e3 Part Description MX879R QFN-28 (73/Tube) MX879RTR QFN-28 Tape & Reel (2500/Reel) Functional Block Diagram VPWR VCC CS* SDO I/O Register Parallel Inputs Shift Register IN7 IN6 IN5 IN4 IN3 IN2 IN1 IN0 Latch Register Driver Parallel In & Out Level Translator OUT7 OUT6 OUT5 OUT4 OUT3 OUT2 OUT1 OUT0 SCK SDI OE GND July 29, 2011 www.clare.com 1 MX879 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Dynamic Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Serial Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Parallel Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 4 5 6 6 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Parallel In / Parallel Out Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Serial Cascade Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Control System Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.clare.com 8 8 8 9 10 10 10 10 11 July 29, 2011 MX879 1 Specifications 1.2 Pin Description 1.1 Package Pinout 14 13 12 11 10 9 8 7 6 5 4 3 2 1 15 16 17 18 19 20 21 22 23 24 25 26 27 28 BOT TOM V IEW July 29, 2011 Pin# Name 1 OUT7 Parallel Output 2 N/C No Connection 3 GND Ground 4 VPWR High Voltage Supply (6V to 60V) 5 N/C No Connection 6 VCC Logic Supply (2.7V to 5.5V) 7 SDO Serial Data Output 8 IN7 Parallel Input 9 IN6 Parallel Input 10 IN5 Parallel Input 11 IN4 Parallel Input 12 IN3 Parallel Input 13 IN2 Parallel Input 14 IN1 Parallel Input 15 IN0 Parallel Input 16 SCK Serial Clock 17 VPWR High Voltage Supply (6V to 60V) 18 SDI Serial Data Input 19 CS* Chip Select (Active Low) 20 OE Output Enable 21 GND Ground 22 OUT0 Parallel Output 23 OUT1 Parallel Output 24 OUT2 Parallel Output 25 OUT3 Parallel Output 26 OUT4 Parallel Output 27 OUT5 Parallel Output 28 OUT6 Parallel Output www.clare.com Description 3 MX879 1.3 Absolute Maximum Ratings Parameter Symbol Min Max Units VPWR Supply Voltage VPWR - 60 V Logic Supply Voltage VCC - 6 V Input Pin Voltage VIN - 6 V IOUTn - -150 mA TJ - 150 °C Continuous Output Current OUT0 - OUT7 Operating Junction Temperature Thermal Resistance (Junction to Ambient) Operating Temperature Storage Temperature RJA 110 Typical Absolute maximum electrical ratings are at 25°C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the device to the absolute maximum ratings for an extended period may degrade the device and affect its reliability. °C/W TA -40 85 °C TSTG -55 150 °C Voltages with respect to GND=0V. ESD Warning: ESD (electrostatic discharge) sensitive device. Although the MX879 features proprietary ESD protection circuitry, permanent damage may be sustained if subjected to high energy electrostatic discharges. Proper ESD precautions are recommended to avoid performance degradation or loss of functionality. 1.4 DC Electrical Characteristics VCC=5V, VPWR=42V, TA=25°C, unless otherwise specified. Parameter Conditions Minimum Typical Maximum Units Logic Supply Voltage - 2.7 - 5.5 V Logic Supply Current fSCK=5MHz - 50 - A fSCK=0 - - 1 A VPWR Voltage - 6 - 60 V VPWR Current Total of all Outputs - - 600 mA Quiescent VPWR Current VPWR=42V, No Load - 0.75 - mA High Level Input Voltage IN0-IN7, SCK, SDI, OE, CS* VCC-0.5 - - V Low Level Input Voltage - - - 0.5 V Input Leakage Current - - - 1 A CS*=Logic High - - 1 A Quiescent Logic Supply Current SDO Tri-State Leakage Current OUT0-OUT7 Current OUT0-OUT7 ON Resistance OUT0-OUT7 Tri-State Leakage Current Notes: Any One Output, Source - - -120 mA VPWR=42V - 7 - OE=Logic Low - - 1 A To avoid unwanted output during VPWR application and system initialization, keep OE at a logic low until CS* has completed one cycle. Thermal Resistance is measured in still air with the device soldered to a 6 square inch board without a ground plane. Applications may require derating of the specified maximum currents to avoid exceeding the maximum operation junction temperature. 4 www.clare.com July 29, 2011 MX879 1.5 Dynamic Electrical Characteristics VCC=5V, VPWR=42V, TA=25°C, unless otherwise specified. Parameter Conditions Symbol Minimum Typical Maximum Units SCK Period - - 100 - DC ns SCK High Time - - 40 - - ns SCK Low Time - - 40 - - ns CS* High Time - tCSwh 50 - - ns Setup Time tCSs 150 - - ns SCK Low (Parallel Input Mode) tCSwl 150 - - ns INx to CS Falling (SETUP TIME) - tINs 15 - - ns INx to CS Falling (HOLD TIME) - tINh 30 - - ns SDI to SCK Rising (SETUP TIME) - tSDIs 20 - - ns SDI to SCK Rising (HOLD TIME) - tSDIh 25 - - ns SCK Falling to to SDO Data Valid - tSDO - 10 - ns CS* Rising to SDO High Z - tSDOz - 12 - ns CS* Falling to SCK Rising CS* Low Time To 50%, C(OUTx)=1000pF tOUTr - 680 - ns From 10% to 90%, C(OUTx)=1000pF - - 110 - ns OE Rising to OUTx Rising To 90% - - 580 - ns OE Rising to OUTx Falling To 90% - - 390 - ns OE Falling to OUTx High Z To 10%, OUTx High - - 130 - ns To 10%, OUTx Low - - 90 - ns CS* Rising to OUTx Rising OUTx Rise Time July 29, 2011 www.clare.com 5 MX879 1.6 Serial Timing INx tINh tINs CS* tCSs tCSwh SCK tSDIh tSDIs SDI tSDOz tSDO SDO tOUTr tOUTf OUTx 1.7 Parallel Timing INx tINs tINh CS* tCSwl tOUTr OUTx 6 tOUTf www.clare.com July 29, 2011 MX879 2 Functional Description Figure 1. Serial Data Transfer Example The MX879 is an 8-channel high-voltage driver with 8-bit input control. The MX879 interfaces to a microprocessor through a standard 3-wire serial interface and an active-low chip select, or can be used in a parallel-in, parallel-out configuration. Parallel data is transferred to the I/O register of the MX879 through the parallel input pins, IN0 through IN7, on the falling edge of the chip select pin, CS*. When CS* is in a logic-low state, serial data can be transferred to the I/O register through the serial input pin, SDI, and from the I/O register through the serial output pin, SDO. Parallel or serial input data is transferred from the I/O register to the latch and high voltage output drivers, OUT0 through OUT7, on the positive edge of CS*. This data remains latched until the next positive edge of CS*. The 8-bit I/O shift register is clocked by the serial clock pin, SCK. Serial data presented at the SDI pin is transferred to the shift register on the positive edge of SCK. Data shifts out of the register through the SDO pin on the negative edge of SCK. SDI and SCK are ignored, and SDO transitions to a high impedance condition when CS* is at a logic high state. Serial data is received by the MX879 through the SDI pin. This data is accepted on the rising edge of SCK. A specific output is programmed to a logic-high state if SDI is at a logic-high state during the rising edge of SCK. Conversely, a specific output is programmed to a logic-low state if SDI is at a logic-low state during the rising edge of SCK. Outputs transition to their programmed states on the positive edge of CS* if the output enable pin, OE, is in a logic-high state. The MSB input data (IN7) is presented at the serial output pin, SDO, on the falling edge of CS*. Input data from IN6 through IN0 is sequentially presented at SDO on negative SCK transitions if CS* remains in a logic-low state. If CS* is at a logic-low state beyond 8 cycles of SCK, SDI data that has propagated through the I/O register will then be presented at SDO. The SDO pin transitions to a high-impedance state when CS* is in a logic-high state, thus allowing multiple serial peripherals to share the microprocessor data pin. July 29, 2011 IN7 0 IN6 0 IN5 1 IN4 0 IN3 1 IN2 1 IN1 1 IN0 0 SDI 1 t1 0 0 0 0 1 1 0 0 0 1 0 1 1 1 0 CS * SCK SDO SDI at time t1 OUT7 1 OUT6 0 OUT5 0 OUT4 0 OUT3 0 OUT2 1 OUT1 1 OUT0 0 Devices may be serially cascaded by connecting SDO to SDI of the next device. Pins SCK and CS* are common to all devices in serial cascade. For n-cascaded devices the CS* should remain low for 8n cycles of SCK. An output enable pin, OE, enables the driver outputs OUT0 through OUT7 when logic-high. A logic-low level on OE forces the OUT0 through OUT7 outputs to a high-impedance state. The MX879 can also operate as a parallel-in, parallel-out level shifter and driver. SCK must remain at a logic-low state when operating in this mode. Parallel input data presented to IN0 through IN7 is captured on the falling edge of CS*. This data is transferred to OUT0 through OUT7 on the rising edge of CS*, and remains latched until the next rising edge of CS*. www.clare.com 7 MX879 3 Application Examples 3.1 Parallel In / Parallel Out Application IN OUT 8 8 CS* SDI OE SCK 3.2 Serial Cascade Application MASTER IN SDO IN OUT 8 8 SCK CS* OE SDI SDO IN OUT 8 8 SCK CS* OE SDI MASTER OUT 8 www.clare.com July 29, 2011 MX879 3.3 Control System Application System MX879 capture sensors IN 8 SDI SDO drive µC SCK actuators OUT 8 CS* OE Type 1 timing: capture N drive N analyze N, calculate N+1 capture N+1 drive N+1 CS* µC SDI µC output N output N+1 SCK SDO input N µC input N+1 µC Type 2 timing: capture N analyze N, calculate N+1 drive N+1 capture N+1 CS* SDI µC don't care output N+1 SCK SDO July 29, 2011 input N µC www.clare.com 9 MX879 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating MX879R MSL 3 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Pb 10 RoHS 2002/95/EC Device Maximum Temperature x Time MX879R 260°C for 30 seconds e3 www.clare.com July 29, 2011 MX879 4.4 Mechanical Dimensions 4.4.1 QFN-28 Package & Recommended PCB Land Pattern 4.70 (0.185) 3.25 (0.128) 2 1 5.00 BSC (0.197 BSC) 0.18 / 0.30 (0.007 / 0.012) 28 0.500 BSC (0.0197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.200 REF (0.008 REF) 0.50 (0.020) 4.70 (0.185) Pin 1 REF 3.25 (0.128) 3.00 / 3.25 (0.118 / 0.128) 3.00 / 3.25 (0.118 / 0.128) 5.00 BSC (0.197 BSC) 0.45 / 0.65 (0.018 / 0.026) NOTES: (Unless otherwise specified) 1. Coplanarity applies to the exposed heat sink slug as well as the terminals. 2. Dimensions and tolerancing conform to ASME Y14.5M-1994. 3. Molded package shall conform to JEDEC Standard configuration MO-220 Variation VHHD-1. 0.00 / 0.05 (0.000 / 0.002) 1.00 (0.039) 0.30 (0.012) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 4.4.2 Tape & Reel 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) B 330.2 DIA. (13.00 DIA.) ø1.55 ± 0.05 (ø0.061 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) R0.50 TYP (R0.020 TYP) Top Cover Tape Thickness 0.066 MAX. (0.0026 MAX.) 12.00 ± 0.10 (0.472 ± 0.004) BO=5.30 ± 0.10 (0.209 ± 0.004) Embossed Carrier KO=1.10 ± 0.10 (0.043 ± 0.004) Section B-B Embossment 5.50 ± 0.05 (0.217 ± 0.002) A A B ø1.50 MIN (ø0.059 MIN) 8.00 ± 0.10 (0.315 ± 0.004) AO=5.30 ± 0.10 (0.209 ± 0.004) Section A-A Dimensions mm (inches) NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. ±0.2mm For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-MX879-20110729 ©Copyright 2011, Clare, Inc. All rights reserved. Printed in USA. 7/29/2011 July 29, 2011 www.clare.com 11