MX877 8-Channel, 60V Driver with Push-Pull Output, 3 Wire Interface INTEGRATED CIRCUITS DIVISION Features • • • • • • • • Description Eight (8) Outputs Rated at 60V, ±80mA Push-Pull Driver Configuration 6V to 60V Driver Supply Range 2.7V to 5.5V Logic Supply Range 3-Wire Serial Interface plus Chip Select Captures Serial & Parallel Input Data Outputs Can Be Paralleled 28-Lead QFN Package The MX877 is an 8-channel, high voltage switch with 8-bit parallel or serial input control. The MX877 connects directly to a microprocessor through a standard 3-wire serial interface. The push-pull output configuration can drive up to 60 volts at 80mA. Outputs can be paralleled for increased drive current up to a device total of 400mA, sink or source. The MX877 is designed to operate over a temperature range of -40°C to +85°C, and is available in a 28-lead QFN Package. Applications • White Goods • ATE • Industrial Equipment Ordering Information Part Description MX877R QFN-28 (73/Tube) MX877RTR QFN-28 Tape & Reel (2500/Reel) Functional Block Diagram VCC VPWR CS* SDO I/O Register Parallel Inputs Shift Direction IN7 IN6 IN5 IN4 IN3 IN2 IN1 IN 0 Latch Register Driver Parallel In & Out Level Translator OUT7 OUT6 OUT5 OUT4 OUT3 OUT2 OUT1 OUT0 SCK SDI OE GND DS-MX877-R02 www.ixysic.com 1 MX877 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Dynamic Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Serial Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Parallel Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 4 5 6 6 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Parallel In / Parallel Out Application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Serial Cascade Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Control System Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 8 8 8 9 10 10 10 10 10 11 R02 MX877 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.2 Pin Description 1.1 Package Pinout The thermal pad is connected internally to GND. 14 13 12 11 10 9 8 7 6 5 4 3 2 1 15 16 17 18 19 20 21 22 23 24 25 26 27 28 BOT TOM V IEW R02 Pin# Name 1 OUT7 2 N/C No Internal Connection 3 GND Ground 4 VPWR High Voltage Supply (6V to 60V) 5 N/C No Internal Connection 6 VCC Logic Supply (2.7V to 5.5V) 7 SDO Serial Data Output 8 IN7 Parallel Input 9 IN6 Parallel Input 10 IN5 Parallel Input 11 IN4 Parallel Input 12 IN3 Parallel Input 13 IN2 Parallel Input 14 IN1 Parallel Input 15 IN0 Parallel Input 16 SCK Serial Clock 17 VPWR High Voltage Supply (6V to 60V) 18 SDI Serial Data Input 19 CS* Chip Select (Active Low) 20 OE Output Enable 21 GND Ground 22 OUT0 Parallel Output 23 OUT1 Parallel Output 24 OUT2 Parallel Output 25 OUT3 Parallel Output 26 OUT4 Parallel Output 27 OUT5 Parallel Output 28 OUT6 Parallel Output www.ixysic.com Description Parallel Output 3 MX877 INTEGRATED CIRCUITS DIVISION 1.3 Absolute Maximum Ratings Parameter Symbol Min Max VPWR Supply Voltage VPWR - 60 V Logic Supply Voltage VCC - 6 V Input Pin Voltage VIN - 6 V IOUTn - ±100 mA TJ - 150 °C Continuous Output Current OUT0 - OUT7 Operating Junction Temperature Thermal Resistance (Junction to Ambient) Operating Temperature Storage Temperature RJA Units 110 Typical Absolute maximum electrical ratings are at 25°C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the device to the absolute maximum ratings for an extended period may degrade the device and affect its reliability. °C/W TA -40 85 °C TSTG -55 150 °C Voltages with respect to GND=0V. ESD Warning: ESD (electrostatic discharge) sensitive device. Although the MX877 features proprietary ESD protection circuitry, permanent damage may be sustained if subjected to high energy electrostatic discharges. Proper ESD precautions are recommended to avoid performance degradation or loss of functionality. 1.4 DC Electrical Characteristics VCC=5V, VPWR=42V, TA=25°C, unless otherwise specified. Parameter Conditions Symbol Minimum Typical Maximum Units Logic Supply Voltage - VCC 2.7 - 5.5 V Logic Supply Current fSCK=5MHz ICC - 50 - A fSCK=0 ICC - - 1 A VPWR Voltage - VPWR 6 - 60 V VPWR Current Total of all Outputs IPWR GND Current Quiescent VPWR Current Total of all Outputs VPWR=42V, No Load - - - 400 400 mA mA IPWR - mA IN0-IN7, SCK, SDI, OE, CS* VIH VCC-0.5 0.75 High Level Input Voltage - - V Low Level Input Voltage - VIL - - 0.5 1 1 V A A Any One Output, Sink or Source IOUTn - - ±80 mA VPWR=42V ROUTn - 9 - OE=Logic Low IOUTn - - 1 A Quiescent Logic Supply Current Input Leakage Current SDO Tri-State Leakage Current OUT0-OUT7 Current OUT0-OUT7 ON Resistance OUT0-7 Tri-State Leakage Current Notes: CS*=Logic High To avoid unwanted output during VPWR application and system initialization, keep OE at a logic low until CS* has completed one cycle. Thermal Resistance is measured in still air with the device soldered to a 6 square inch board without a ground plane. Applications may require derating of the specified maximum currents to avoid exceeding the maximum operation junction temperature. 4 www.ixysic.com R02 MX877 INTEGRATED CIRCUITS DIVISION 1.5 Dynamic Electrical Characteristics VCC=5V, VPWR=42V, TA=25°C, unless otherwise specified. Parameter Conditions Symbol Minimum Typical Maximum Units SCK Period - - 100 - DC ns SCK High Time - - 40 - - ns SCK Low Time - - 40 - - ns - tCSwh 50 - - ns Setup Time tCSs 150 - - ns SCK Low (Parallel Input Mode) tCSwl 150 - - ns INx to CS Falling (SETUP TIME) - tINs 15 - - ns INx to CS Falling (HOLD TIME) - tINh 30 - - ns SDI to SCK Rising (SETUP TIME) - tSDIs 20 - - ns SDI to SCK Rising (HOLD TIME) - tSDIh 25 - - ns SCK Falling to to SDO Data Valid - tSDO - 10 - ns CS* Rising to SDO High Z - tSDOz - 12 - ns CS* Rising to OUTx Rising To 50%, C(OUTx)=1000pF tOUTr - 750 - ns CS* Rising to OUTx Falling To 50%, C(OUTx)=1000pF tOUTf - 570 - ns OUTx Rise Time From 10% to 90%, C(OUTx)=1000pF - - 110 - ns OUTx Fall Time CS* High Time CS* Falling to SCK Rising CS* Low Time From 10% to 90%, C(OUTx)=1000pF - - 75 - ns OE Rising to OUTx Rising To 90% - - 580 - ns OE Rising to OUTx Falling To 90% - - 390 - ns OE Falling to OUTx High Z To 10%, OUTx High - - 130 - ns To 10%, OUTx Low - - 90 - ns R02 www.ixysic.com 5 MX877 INTEGRATED CIRCUITS DIVISION 1.6 Serial Timing INx tINh tINs CS* tCSs tCSwh SCK tSDIh tSDIs SDI tSDOz tSDO SDO tOUTr tOUTf OUTx 1.7 Parallel Timing INx tINs tINh CS* tCSwl tOUTr OUTx 6 tOUTf www.ixysic.com R02 MX877 INTEGRATED CIRCUITS DIVISION 2 Functional Description Figure 1. Serial Data Transfer Example The MX877 is an 8 channel high voltage driver with 8-bit input control. The MX877 interfaces to a microprocessor through a standard 3 wire serial interface and an active-low chip select, or can be used in a parallel-in, parallel-out configuration. Parallel data is transferred to the I/O register of the MX877 through the parallel input pins, IN0 through IN7 on the falling edge of the chip select pin, CS*. When CS* is in a logic low state, serial data can be transferred to the I/O register through the serial input pin, SDI, and from the I/O register through the serial output pin, SDO. Parallel or serial input data is transferred from the I/O register to the latch and high voltage output drivers, OUT0 through OUT7, on the positive edge of CS*. This data remains latched until the next positive edge of CS*. The 8-bit I/O shift register is clocked by the serial clock pin, SCK. Serial data presented at the SDI pin is transferred to the shift register on the positive edge of SCK. Data shifts out of the register through the SDO pin on the negative edge of SCK. SDI and SCK are ignored, and SDO transitions to a high impedance condition when CS* is at a logic high state. Serial data is received by the MX877 through the SDI pin. This data is accepted on the rising edge of SCK. A specific output is programmed to a logic high state if SDI is at a logic high state during the rising edge of SCK. Conversely, a specific output is programmed to a logic low state if SDI is at a logic low state during the rising edge of SCK. Outputs transition to their programmed states on the positive edge of CS* if the output enable pin, OE is in a logic high state. The MSB input data (IN7) is presented at the serial output pin, SDO on the falling edge of CS*. Input data from IN6 through IN0 is sequentially presented at SDO on negative SCK transitions if CS* remains in a logic low state. If CS* is at a logic low state beyond 8 cycles of SCK, SDI data that has propagated through the I/O register will then be presented at SDO. The SDO pin transitions to a high impedance state when CS* is in a logic level high state, thus allowing multiple serial peripherals to share the microprocessor data pin. R02 IN7 0 IN6 0 IN5 1 IN4 0 IN3 1 IN2 1 IN1 1 IN0 0 SDI 1 t1 0 0 0 0 1 1 0 0 0 1 0 1 1 1 0 CS * SCK SDO SDI at time t1 OUT7 1 OUT6 0 OUT5 0 OUT4 0 OUT3 0 OUT2 1 OUT1 1 OUT0 0 Devices may be serially cascaded by connecting SDO to SDI of the next device. Pins SCK and CS* are common to all devices in serial cascade. For n-cascaded devices the CS* should remain low for 8n cycles of SCK. An output enable pin, OE enables the driver outputs OUT0 through OUT7 when logic high. A logic low level on OE forces the OUT0 through OUT7 outputs to a high impedance state. The MX877 can also operate as a parallel-in, parallel-out level shifter and driver. SCK must remain at a logic low state when operating in this mode. Parallel input data presented to IN0 through IN7 is captured on the falling edge of CS*. This data is transferred to OUT0 through OUT7 on the rising edge of CS*, and remains latched until the next rising edge of CS*. www.ixysic.com 7 MX877 INTEGRATED CIRCUITS DIVISION 3 Application Examples 3.1 Parallel In / Parallel Out Application IN OUT 8 8 CS* SDI OE SCK 3.2 Serial Cascade Application MASTER IN SDO IN OUT 8 8 SCK CS* OE SDI SDO IN OUT 8 8 SCK CS* OE SDI MASTER OUT 8 www.ixysic.com R02 MX877 INTEGRATED CIRCUITS DIVISION 3.3 Control System Application System MX877 capture sensors IN 8 SDI SDO drive µC SCK actuators OUT 8 CS* OE Type 1 timing: capture N drive N analyze N, calculate N+1 capture N+1 drive N+1 CS* µC SDI µC output N output N+1 SCK SDO input N µC input N+1 µC Type 2 timing: analyze N, calculate N+1 capture N drive N+1 capture N+1 CS* SDI µC don't care output N+1 SCK SDO R02 input N µC www.ixysic.com 9 MX877 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification MX877R MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles MX877R 260°C 30 seconds 3 4.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 10 www.ixysic.com R02 MX877 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 4.5.1 QFN-28 Package & Recommended PCB Land Pattern Recommended PCB Land Pattern 2 1 5.00 BSC (0.197 BSC) 0.18 / 0.30 (0.007 / 0.012) 28 0.500 BSC (0.0197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.200 REF (0.008 REF) 0.00 / 0.05 (0.000 / 0.002) 0.50 (0.020) 4.70 (0.185) Pin 1 REF 3.25 (0.128) 3.00 / 3.25 (0.118 / 0.128) 3.00 / 3.25 (0.118 / 0.128) 5.00 BSC (0.197 BSC) 0.45 / 0.65 (0.018 / 0.026) 4.70 (0.185) 3.25 (0.128) 1.00 (0.039) 0.30 (0.012) NOTES: (Unless otherwise specified) 1. Coplanarity applies to the exposed heat sink slug as well as the terminals. 2. Dimensions and tolerancing conform to ASME Y14.5M-1994. 3. Molded package shall conform to JEDEC Standard configuration MO-220 Variation VHHD-1. 4. Pins 2 and 5 are not internally connected. 5. Thermal pad is internally connected to GND (pins 3 & 21). Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 4.5.2 Tape & Reel Dimensions 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) B 330.2 DIA. (13.00 DIA.) ø1.55 ± 0.05 (ø0.061 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) R0.50 TYP (R0.020 TYP) 12.00 ± 0.10 (0.472 ± 0.004) Top Cover Tape Thickness 0.066 MAX. (0.0026 MAX.) BO=5.30 ± 0.10 (0.209 ± 0.004) Embossed Carrier KO=1.10 ± 0.10 (0.043 ± 0.004) Section B-B Embossment 5.50 ± 0.05 (0.217 ± 0.002) A A B 8.00 ± 0.10 (0.315 ± 0.004) AO=5.30 ± 0.10 (0.209 ± 0.004) Section A-A ø1.50 MIN (ø0.059 MIN) Dimensions mm (inches) NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. ±0.2mm For additional information please visit www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-MX877-R02 ©Copyright 2016, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 6/9/2016 R02 www.ixysic.com 11