RENESAS R1Q3A3636BBG-40R

R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
36-Mbit QDR™II SRAM
4-word Burst
REJ03C0342-0003
Preliminary
Rev. 0.03
Apr.11, 2008
Description
The R1Q3A3636B is a 1,048,576-word by 36-bit, the R1Q3A3618B is a 2,097,152-word by 18-bit, and the
R1Q3A3609B is a 4,194,304-word by 9-bit synchronous quad data rate static RAM fabricated with advanced CMOS
technology using full CMOS six-transistor memory cell. It integrates unique synchronous peripheral circuitry and a
burst counter. All input registers controlled by an input clock pair (K and /K) and are latched on the positive edge of K
and /K. These products are suitable for applications which require synchronous operation, high speed, low voltage, high
density and wide bit configuration. These products are packaged in 165-pin plastic FBGA package.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.8 V ± 0.1 V power supply for core (VDD)
1.4 V to VDD power supply for I/O (VDDQ)
DLL circuitry for wide output data valid window and future frequency scaling
Separate independent read and write data ports with concurrent transactions
100% bus utilization DDR read and write operation
Four-tick burst for reduced address frequency
Two input clocks (K and /K) for precise DDR timing at clock rising edges only
Two output clocks (C and /C) for precise flight time and clock skew matching-clock and data delivered together to
receiving device
Internally self-timed write control
Clock-stop capability with µs restart
User programmable impedance output
Fast clock cycle time: 3.3 ns (300 MHz)/4.0 ns (250 MHz)/ 5.0 ns (200 MHz)/6.0 ns (167 MHz)
Simple control logic for easy depth expansion
JTAG boundary scan
Notes: QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress
Semiconductor, IDT, NEC, Samsung, and Renesas Technology Corp.
Preliminary:
The specifications of this device are subject to change without notice. Please contact your nearest
Renesas Technology's Sales Dept. regarding specifications.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 1 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Ordering Information
Part Number
Organization
Cycle time
R1Q3A3636BBG-33R
3.3 ns
1-M word
R1Q3A3636BBG-40R
4.0 ns
× 36-bit
R1Q3A3636BBG-50R
5.0 ns
R1Q3A3636BBG-60R
6.0 ns
R1Q3A3618BBG-33R
3.3 ns
2-M word
R1Q3A3618BBG-40R
4.0 ns
×
18-bit
R1Q3A3618BBG-50R
5.0 ns
R1Q3A3618BBG-60R
6.0 ns
R1Q3A3609BBG-33R
3.3 ns
4-M word
R1Q3A3609BBG-40R
4.0 ns
× 9-bit
R1Q3A3609BBG-50R
5.0 ns
R1Q3A3609BBG-60R
6.0 ns
Notes:
1. Part Number
(0:1)
R1 : Renesas Memory prefix
(2:3)
Q2 : QDRII 2-word Burst SRAM
Q3 : QDRII 4-word Burst SRAM
Q4 : DDRII 2-word Burst SRAM
Q5 : DDRII 4-word Burst SRAM
Q6 : DDRII 2-word Burst SRAM
Separate I/O
(4)
A : VDD=1.8V
(5:6)
36 : Density = 36Mb
72 : Density = 72Mb
(7:8)
36 : Organization = x36
18 : Organization = x18
09 : Organization = x9
Clock frequency
300 MHz
250 MHz
200 MHz
167 MHz
300 MHz
250 MHz
200 MHz
167 MHz
300 MHz
250 MHz
200 MHz
167 MHz
(9)
R
A
B
(10:11) BG
(12:13) 60
50
40
33
(14)
R
I
(15)
B
T
S
None
(16)
0∼ 9 , A ∼Z
2. Marking Name
Marking Name(0:14) =Part Number (0:14)
------------Pb
Marking Name(0:16) =Part Number (0:14)+Bx------------Pb-free
(Example) R1Q3A3609BBG-60R
------------Pb
R1Q3A3609BBG-60RB0 ------------Pb-free
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 2 of 25
Package
Notes
Plastic FBGA 165-pin
PLBG0165FB-A
: 1stGeneration
: 2ndGeneration
: 3rdGeneration
: Package type=BGA
: Cycle time=6.0 ns
: Cycle time=5.0 ns
: Cycle time=4.0 ns
: Cycle time=3.3 ns
: Temperature range= 0°C ∼70°C
: Temperature range= -40°C∼ 85°C
: Pb-free
: Tape&Reel
: Pb-free and Tape&Reel
: Standard (Pb and Tray)
:Renesas internal use
(x= 0∼ 9 , A ∼Z )
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Pin Arrangement
R1Q3A3636B series
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
/CQ
Q27
D27
D28
Q29
Q30
D30
/DOFF
D31
Q32
Q33
D33
D34
Q35
TDO
2
Q18
Q28
D20
D29
Q21
D22
3
NC
D18
D19
Q19
Q20
D21
Q22
VREF
VDDQ
Q31
D32
Q24
Q34
D26
D35
TCK
D23
Q23
D24
D25
Q25
Q26
SA
VSS
4
/W
SA
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
SA
SA
5
/BW2
/BW3
SA
6
/K
K
NC
7
/BW1
/BW0
SA
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
SA
SA
SA
SA
C
/C
SA
SA
SA
8
/R
SA
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
SA
SA
9
SA
D17
D16
Q16
Q15
D14
Q13
10
NC
Q17
Q7
D15
D6
Q14
D13
VDDQ
VREF
D12
Q12
D11
D10
Q10
Q9
SA
Q4
D3
Q11
Q1
D9
D0
TMS
9
SA
NC
NC
NC
NC
NC
NC
10
NC
NC
Q7
NC
D6
NC
NC
VDDQ
VREF
NC
NC
NC
NC
NC
NC
SA
Q4
D3
NC
Q1
NC
D0
TMS
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
(Top View)
R1Q3A3618B series
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
/CQ
NC
NC
NC
NC
NC
NC
/DOFF
NC
NC
NC
NC
NC
NC
TDO
2
Q9
NC
D11
NC
Q12
D13
3
SA
D9
D10
Q10
Q11
D12
Q13
VREF
VDDQ
NC
NC
Q15
NC
D17
NC
TCK
D14
Q14
D15
D16
Q16
Q17
SA
VSS
4
/W
SA
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
SA
SA
5
/BW1
NC
SA
6
/K
K
NC
7
NC
/BW0
SA
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
SA
SA
SA
SA
C
/C
SA
SA
SA
(Top View)
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 3 of 25
8
/R
SA
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
SA
SA
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
R1Q3A3609B series
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1
/CQ
NC
NC
NC
NC
NC
NC
/DOFF
NC
NC
NC
NC
NC
NC
TDO
2
NC
NC
D5
NC
NC
D6
3
SA
NC
NC
NC
Q5
NC
Q6
VREF
VDDQ
NC
NC
Q7
NC
D8
NC
TCK
NC
NC
D7
NC
NC
Q8
SA
VSS
4
/W
SA
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
SA
SA
5
NC
NC
SA
6
/K
K
NC
7
NC
/BW
SA
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDD
VDD
VSS
VSS
SA
SA
SA
SA
C
/C
SA
SA
SA
8
/R
SA
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
SA
SA
9
SA
NC
NC
NC
NC
NC
NC
10
SA
NC
NC
NC
D3
NC
NC
VDDQ
VREF
NC
NC
NC
NC
NC
NC
SA
Q2
NC
NC
NC
NC
D0
TMS
11
CQ
Q4
D4
NC
Q3
NC
NC
ZQ
D2
NC
Q1
D1
NC
Q0
TDI
(Top View)
Notes: 1. Address expansion order for future higher density SRAMs (i.e. 72Mb → 144Mb →288Mb): (9A → 3A → 10A)
→ 2A → 7A → 5B.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 4 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Pin Description
Name
SA
I/O type
Input
Descriptions
/R
Input
Synchronous read: When low, this input causes the address inputs to be registered
and a READ cycle to be initiated. This input must meet setup and hold times around
the rising edge of K, and is ignored on the subsequent rising edge of K.
/W
Input
Synchronous write: When low, this input causes the address inputs to be registered
and a WRITE cycle to be initiated. This input must meet setup and hold times around
the rising edge of K, and is ignored on the subsequent rising edge of K.
/BWx
Input
Synchronous byte writes: When low, these inputs cause their respective byte to be
registered and written during WRITE cycles. These signals must meet setup and hold
times around the rising edges of K and /K for each of the two rising edges comprising
the WRITE cycle. See Byte Write Truth Table for signal to data relationship.
K, /K
Input
Input clock: This input clock pair registers address and control inputs on the rising
edge of K, and registers data on the rising edge of K and the rising edge of /K. /K is
ideally 180 degrees out of phase with K. All synchronous inputs must meet setup and
hold times around the clock rising edges. These balls cannot remain VREF level.
C, /C
Input
Output clock: This clock pair provides a user-controlled means of tuning device output
data. The rising edge of /C is used as the output timing reference for first and third
output data. The rising edge of C is used as the output timing reference for second
and fourth output data. Ideally, /C is 180 degrees out of phase with C. C and /C may
be tied high to force the use of K and /K as the output reference clocks instead of
having to provide C and /C clocks. If tied high, C and /C must remain high and not to
be toggled during device operation. These balls cannot remain VREF level.
/DOFF
Input
DLL disable: When low, this input causes the DLL to be bypassed for stable, low
frequency operation.
ZQ
Input
Output impedance matching input: This input is used to tune the device outputs to the
system data bus impedance. Q and CQ output impedance are set to 0.2 × RQ, where
RQ is a resistor from this ball to ground. This ball can be connected directly to VDDQ,
which enables the minimum impedance mode. This ball cannot be connected directly
to VSS or left unconnected.
TMS
TDI
TCK
Input
IEEE1149.1 test inputs: 1.8 V I/O levels. These balls may be left not connected if the
JTAG function is not used in the circuit.
Input
IEEE1149.1 clock input: 1.8 V I/O levels. This ball must be tied to VSS if the JTAG
function is not used in the circuit.
D0 to Dn
Input
Synchronous data inputs: Input data must meet setup and hold times around the
rising edges of K and /K during WRITE operations. See Pin Arrangement figures for
ball site location of individual signals. The ×9 device uses D0 to D8. Remaining signals
are not used. The ×18 device uses D0 to D17. Remaining signals are not used. The
×36 device uses D0 to D35.
CQ, /CQ
Output
TDO
Output
Q0 to Qn
Output
Synchronous data outputs: Output data is synchronized to the respective C and /C, or
to the respective K and /K if C and /C are tied high. This bus operates in response to
/R commands. See Pin Arrangement figures for ball site location of individual signals.
The ×9 device uses Q0 to Q8. Remaining signals are not used. The ×18 device uses
Q0 to Q17. Remaining signals are not used. The ×36 device uses Q0 to Q35.
VDD
Supply
Power supply: 1.8 V nominal. See DC Characteristics and Operating Conditions for
range.
VDDQ
Supply
Power supply: Isolated output buffer supply. Nominally 1.5 V. 1.8 V is also
permissible. See DC Characteristics and Operating Conditions for range.
Synchronous address inputs: These inputs are registered and must meet the setup
and hold times around the rising edge of K. All transactions operate on a burst-of-four
words (two clock periods of bus activity). These inputs are ignored when device is
deselected.
Synchronous echo clock outputs: The edges of these outputs are tightly matched to
the synchronous data outputs and can be used as a data valid indication. These
signals run freely and do not stop when Q tristates.
IEEE 1149.1 test output: 1.8 V I/O level.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 5 of 25
Notes
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Name
VSS
VREF
I/O type
Supply

NC

Descriptions
Notes
Power supply: Ground.
HSTL input reference voltage: Nominally VDDQ/2, but may be adjusted to improve
system noise margin. Provides a reference voltage for the HSTL input buffers.
No connect: These signals are not internally connected. These signals can be left
floating or connected to ground to improve package heat dissipation.
Notes: 1. All power supply and ground balls must be connected for proper operation of the device.
Block Diagram (R1Q3A3636B / R1Q3A3618B / R1Q3A3609B series)
18/19/20
Address
Address
Registry
and
Logic
18/19/20
ZQ
/R
K
/K
72
/36
/18
144
/72
/36
MUX
Logic
Memory
Array
72
/36
/18
K
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 6 of 25
Q
(Data out)
Output
Select
Output
Buffer
Data
D 36/18/9 Registry
(Data in)
and
72
/36
/18
Sense Amp
/BWx
Write
Register
4/2/1
Write Driver
/W
MUX
72
/36
/18
Output
Register
/R
/W
K
(/K)
36/18/9
2
CQ
/CQ
C
C,/C
or
K,/K
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
General Description
Power-up and Initialization Sequence
The following supply voltage application sequence is recommended: VSS, VDD, VDDQ, VREF then VIN.
After the stable power, there are three possible sequences.
1. Sequence when DLL disable (/DOFF pin fixed low)
Just after the stable power and clock (K, /K, C, /C), 1024 NOP cycles (min.) are required for all operations,
including JTAG functions, to become normal.
2a. Sequence controlled by /DOFF pin when DLL enable Just after the stable power and clock (K, /K, C, /C), take
/DOFF to be high.
The additional 1024 NOP cycles (min.) are required to lock the DLL and for all operations to become normal.
2b. Sequence controlled by Clock (/DOFF pin fixed high) when DLL enable If /DOFF pin is fixed high with
unstable clock, the clock (K, /K, C, /C) must be stopped for 30ns (min.).
During stop clock stage, C pin must tie low for 30 ns (min.). C, /C, K and /K cannot remain VREF level.
The additional 1024 NOP cycles (min.) are required to lock the DLL and for all operations to become normal.
Notes: 1. After K or C clock is stopped, clock recovery cycles (1024 NOP cycles (min.)) are required for read/write
operations to become normal.
2. When DLL is enable and the operating frequency is changed, DLL reset should be required again. After DLL
reset again, the 1024 NOP cycles (min.) are needed to lock the DLL.
1. Sequence when DLL disable (/DOFF pin fixed low)
Status
Power Up
Unstable
Clock Stage
Stable
Clock Stage
NOP Stage
Normal
Operation
VDD
VDDQ
VREF
VIN
1024cycle min.
C, /C, K, /K
2a. Sequence controlled by /DOFF pin when DLL enable
Status
Power Up
Unstable
Clock Stage
Stable
Clock Stage
NOP & DLL
Locking Stage
VDD
VDDQ
VREF
/DOFF
1024cycle min.
C, /C, K, /K
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 7 of 25
Normal
Operation
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
2b. Sequence controlled by Clock (/DOFF pin fixed high) when DLL enable
Status
Power Up
Unstable
Clock Stage
Stop
Clock Stage
NOP & DLL
Locking Stage
30ns min.
1024cycle min.
Normal
Operation
VDD
VDDQ
VREF
/DOFF
C, /C, K, /K
DLL Constraints
1. DLL uses either K or C clock as its synchronizing input, the input should have low phase jitter which is specified as
TKC var.
2. The lower end of the frequency at which the DLL can operate is 119MHz.
Programmable Output Impedance
1. Output buffer impedance can be programmed by terminating the ZQ ball to VSS through a precision resistor (RQ).
The value of RQ is five times the output impedance desired. The allowable range of RQ to guarantee impedance
matching with a tolerance of 10% is 250 Ω typical. The total external capacitance of ZQ ball must be less than 7.5
pF.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 8 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
K Truth Table
Operation
Write Cycle:
Load address, input write data
on consecutive K and /K rising
edges
Read Cycle:
Load address, output read
data on consecutive C and /C
rising edges
NOP (No operation)
Standby (Clock stopped)
K
↑
↑
↑
Stopped
/R
H*7
L*8
H
×
/W
L*8
×
H
×
D or Q
Data in
Input
data
D(A+0)
D(A+1)
D(A+2)
D(A+3)
Output
clock
Data out
K(t+1)↑
/K(t+1)↑
K(t+2)↑
/K(t+2)↑
Output
data
Q(A+0)
Q(A+1)
Q(A+2)
Q(A+3)
/C(t+1)↑
Output
clock
D = × or Q = High-Z
Previous state
C(t+2)↑
/C(t+2)↑
C(t+3)↑
Notes: 1. H: high level, L: low level, ×: don’t care, ↑: rising edge.
2. Data inputs are registered at K and /K rising edges. Data outputs are delivered at C and /C rising edges,
except if C and /C are high, then data outputs are delivered at K and /K rising edges.
3. /R and /W must meet setup/hold times around the rising edges (low to high) of K and are registered at the
rising edge of K.
4. This device contains circuitry that will ensure the outputs will be in high-Z during power-up.
5. Refer to state diagram and timing diagrams for clarification.
6. When clocks are stopped, the following cases are recommended; the case of K = low, /K = high, C = low and
/C = high, or the case of K = high, /K = low, C = high and /C = low. This condition is not essential, but permits
most rapid restart by overcoming transmission line charging symmetrically.
7. If this signal was low to initiate the previous cycle, this signal becomes a “don’t care” for this operation;
however, it is strongly recommended that this signal be brought high, as shown in the truth table.
8. This signal was high on previous K clock rising edge. Initiating consecutive READ or WRITE operations on
consecutive K clock rising edges is not permitted. The device will ignore the second request.
Byte Write Truth Table (x36)
Operation
Write D0 to D35
Write D0 to D8
Write D9 to D17
Write D18 to D26
K
↑

↑

↑

↑

/K

↑

↑

↑

↑
/BW0
L
L
L
L
H
H
H
H
/BW1
L
L
H
H
L
L
H
H
/BW2
L
L
H
H
H
H
L
L
/BW3
L
L
H
H
H
H
H
H
↑

H
H
H
L

↑
H
H
H
L
Write nothing
↑

H
H
H
H

↑
H
H
H
H
Notes: 1. H: high level, L: low level, ↑: rising edge.
2. Assumes a WRITE cycle was initiated. /BWx can be altered for any portion of the BURST WRITE operation
provided that the setup and hold requirements are satisfied.
Write D27 to D35
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 9 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Byte Write Truth Table (x18)
Operation
Write D0 to D17
Write D0 to D8
Write D9 to D17
Write nothing
K
↑

↑

↑

↑

/K

↑

↑

↑

↑
/BW0
L
L
L
L
H
H
H
H
/BW1
L
L
H
H
L
L
H
H
Notes: 1. H: high level, L: low level, ↑: rising edge.
2. Assumes a WRITE cycle was initiated. /BWx can be altered for any portion of the BURST WRITE operation
provided that the setup and hold requirements are satisfied.
Byte Write Truth Table (x9)
Operation
Write D0 to D8
K
↑
/K

/BW
L
Write nothing

↑
↑

L
H

↑
H
Notes: 1. H: high level, L: low level, ↑: rising edge.
2. Assumes a WRITE cycle was initiated. /BWx can be altered for any portion of the BURST WRITE operation
provided that the setup and hold requirements are satisfied.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 10 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Bus Cycle State Diagram
/R = H & R Count = 4
/R = H
Read Port NOP
RInit = 0
/R = L
Load New
Read Address
RCount = 0
RInit = 1
Supply voltage
provided
Always
/R = L
&
RCount = 4
Read Double
RCount
= R Count + 2
RCount
=2
Always
Increment
Read Address
by Two *1
RInit = 0
Power Up
Supplu voltage
provided
Write Port NOP
/W = L
RInit = 0
Load New
Write Address
WCount = 0
Always
/W = L
&
WCount = 4
Write Double
WCount
= W Count + 2
WCount
=2
Always
Increment
Write Address
by Two *1
/W = H
/W = H & W Count = 4
Notes: 1. The address is concatenated with one additional internal LSB to facilitate burst operation. The address order
is always fixed as: xxx…xxx+0, xxx…xxx+1, xxx…xxx+2, xxx…xxx+3.
Bus cycle is terminated at the end of this sequence (burst count = 4).
2. Read and write state machines can be active simultaneously. Read and write cannot be simultaneously
initiated. Read takes precedence.
3. State machine control timing sequence is controlled by K.
Absolute Maximum Ratings
Parameter
Input voltage on any ball
Input/output voltage
Core supply voltage
Output supply voltage
Junction temperature
Storage temperature
Symbol
VIN
VI/O
VDD
VDDQ
Tj
TSTG
Rating
−0.5 to VDD + 0.5 (2.5 V max.)
−0.5 to VDDQ + 0.5 (2.5 V max.)
−0.5 to 2.5
−0.5 to VDD
+125 (max)
−55 to +125
Unit
V
V
V
V
°C
°C
Notes
1, 4
1, 4
1, 4
1, 4
Notes: 1. All voltage is referenced to VSS.
2. Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation
should be restricted the Operation Conditions. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
3. These CMOS memory circuits have been designed to meet the DC and AC specifications shown in the tables
after thermal equilibrium has been established.
4. The following supply voltage application sequence is recommended: VSS, VDD, VDDQ, VREF then VIN.
Remember, according to the Absolute Maximum Ratings table, VDDQ is not to exceed 2.5 V, whatever the
instantaneous value of VDDQ.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 11 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Recommended DC Operating Conditions
(Ta = 0 to +70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Notes
Power supply voltage --core
VDD
1.7
1.8
1.9
V
Power supply voltage --I/O
VDDQ
1.4
1.5
VDD
V
Input reference voltage --I/O
VREF
0.68
0.75
0.95
V
1
Input high voltage
VIH (DC)
VREF + 0.1

VDDQ + 0.3
V
2, 3
Input low voltage
VIL (DC)
−0.3

VREF − 0.1
V
2, 3
Notes: 1. Peak to peak AC component superimposed on VREF may not exceed 5% of VREF.
2. Overshoot: VIH (AC) ≤ VDDQ + 0.5 V for t ≤ tKHKH/2
Undershoot: VIL (AC) ≥ −0.5 V for t ≤ tKHKH/2
Power-up: VIH ≤ VDDQ + 0.3 V and VDD ≤ 1.7 V and VDDQ ≤ 1.4 V for t ≤ 200 ms
During normal operation, VDDQ must not exceed VDD.
Control input signals may not have pulse widths less than tKHKL (min) or operate at cycle rates less than tKHKH
(min).
During normal operation, VIH(DC) must not exceed VDDQ and VIL(DC) must not be lower than VSS.
3. These are DC test criteria. The AC VIH / VIL levels are defined separately to measure timing parameters.
DC Characteristics
(Ta = 0 to +70°C, VDD = 1.8V ± 0.1V)
Parameter
Operating
supply current
(READ /
WRITE)
(×9)
(×18)
(×36)
Standby supply
current (NOP)
(×9 /
×18 /
×36)
Parameter
Input leakage current
Output leakage current
Output high voltage
Output low voltage
Symbol
IDD
IDD
IDD
−33
Max
650
700
750
−40
Max
600
650
700
−50
Max
550
600
650
−60
Max
500
550
600
Unit
mA
mA
mA
Notes
1, 2, 3
1, 2, 3
1, 2, 3
ISB1
380
350
340
330
mA
2, 4, 5
Symbol
ILI
ILO
VOH (Low)
VOH
VOL (Low)
VOL
Notes: 1.
2.
3.
4.
5.
Min
−2
−5
VDDQ −0.2
VDDQ/2 −0.08
VSS
VDDQ/2 −0.08
Max
2
5
VDDQ
VDDQ/2 +0.08
0.2
VDDQ/2 +0.08
Unit
µA
µA
V
V
V
V
Test conditions
|IOH| ≤ 0.1 mA
Note 6
IOL ≤ 0.1 mA
Note 7
Notes
10
11
8, 9
8, 9
8, 9
8, 9
All inputs (except ZQ, VREF) are held at either VIH or VIL.
IOUT = 0 mA. VDD = VDD max, tKHKH = tKHKH min.
Operating supply currents are measured at 100% bus utilization.
All address / data inputs are static at either VIN > VIH or VIN < VIL.
Reference value (Condition=NOP currents are valid when entering NOP after all pending READ and WRITE
cycles are completed.)
6. Outputs are impedance-controlled. |IOH| = (VDDQ/2)/(RQ/5) for values of 175 Ω ≤ RQ ≤ 350 Ω.
7. Outputs are impedance-controlled. IOL = (VDDQ/2)/(RQ/5) for values of 175 Ω ≤ RQ ≤ 350 Ω.
8. AC load current is higher than the shown DC values. AC I/O curves are available upon request.
9. HSTL outputs meet JEDEC HSTL Class I standards.
10. 0 ≤ VIN ≤ VDDQ for all input balls (except VREF, ZQ, TCK, TMS, TDI ball).
11. 0 ≤ VOUT ≤ VDDQ (except TDO ball), output disabled.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 12 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Thermal Resistance
Parameter
Junction to Ambient
Junction to Case
Note:
Symbol
θJA
θJC
Typ
24.5
5.6
Unit
°C/W
°C/W
Notes
These parameters are calculated under the condition of wind velocity = 1 m/s.
Capacitance
(Ta = +25°C, f=1.0MHz, VDD = 1.8V, VDDQ = 1.5V)
Parameter
Symbol
Min
Typ
Input capacitance
CIN

2
Clock input capacitance
CCLK

2
Input/output capacitance (D, Q, ZQ)
CI/O

3
Notes: 1. These parameters are sampled and not 100% tested.
2. Except JTAG (TCK, TMS, TDI, TDO) pins.
Max
3
3
4.5
Unit
pF
pF
pF
Test conditions
VIN = 0 V
VCLK = 0 V
VI/O = 0 V
Notes
1, 2
1, 2
1, 2
AC Test Conditions
(Ta = 0 to +70°C, VDD = 1.8V ±0.1V)
Input waveform (Rise/fall time ≤ 0.3 ns)
1.25 V
0.75 V
Test points
0.75 V
0.25 V
Output waveform
VDDQ /2
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 13 of 25
Test points
VDDQ /2
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Output load condition
0.75 V
VDDQ /2
VREF
50 Ω
Z0 = 50 Ω
Q
SRAM
250 Ω
ZQ
AC Operating Conditions
Parameter
Input high voltage
Input low voltage
Symbol
VIH (AC)
VIL (AC)
Min
VREF + 0.2

Typ


Max

VREF − 0.2
Unit
V
V
Notes
1, 2, 3, 4
1, 2, 3, 4
Notes: 1. All voltages referenced to VSS (GND).
2. These conditions are for AC functions only, not for AC parameter test.
3. Overshoot: VIH (AC) ≤ VDDQ + 0.5 V for t ≤ tKHKH/2
Undershoot: VIL (AC) ≥ −0.5 V for t ≤ tKHKH/2
Power-up: VIH ≤ VDDQ + 0.3 V and VDD ≤ 1.7 V and VDDQ ≤ 1.4 V for t ≤ 200 ms
During normal operation, VDDQ must not exceed VDD. Control input signals may not have pulse widths less
than tKHKL (min) or operate at cycle rates less than tKHKH (min).
4. To maintain a valid level, the transitioning edge of the input must:
a. Sustain a constant slew rate from the current AC level through the target AC level, VIL (AC) or VIH (AC).
b. Reach at least the target AC level.
c. After the AC target level is reached, continue to maintain at least the target DC level, VIL (DC) or VIH (DC).
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 14 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
AC Characteristics
(Ta = 0 to +70°C, VDD = 1.8V ± 0.1V)
Parameter
Symbol
Average
clock cycle
time (K, /K,
C, /C)
-33
-40
-50
-60
Unit
Notes
Min
Max
Min
Max
Min
Max
Min
Max
tKHKH
3.30
8.40
4.00
8.40
5.00
8.40
6.00
8.40
ns
Clock
phase jitter
(K, /K, C,
/C)
tKC var

0.20

0.20

0.20

0.20
ns
Clock high
time (K, /K,
C, /C)
tKHKL
1.32

1.60

2.00

2.40

ns
Clock low
time (K, /K,
C, /C)
tKLKH
1.32

1.60

2.00

2.40

ns
Clock to
/clock (K to
/K, C to /C)
tKH/KH
1.49

1.80

2.20

2.70

ns
/Clock to
clock (/K to
K, /C to C)
t/KHKH
1.49

1.80

2.20

2.70

ns
Clock to
data clock
(K to C, /K
to /C)
tKHCH
0
0.75
0
1.10
0
1.60
0
2.10
ns
DLL lock
time (K, C)
tKC lock
1,024

1,024

1,024

1,024

Cycle
2
K static to
DLL reset
tKC reset
30

30

30

30

ns
7
C, /C high
to output
valid
tCHQV

0.45

0.45

0.45

0.50
ns
C, /C high
to output
hold
tCHQX
-0.45

-0.45

-0.45

-0.50

ns
C, /C high
to echo
clock valid
tCHCQV

0.45

0.45

0.45

0.50
ns
C, /C high
to echo
clock hold
tCHCQX
-0.45

-0.45

-0.45

-0.50

ns
CQ, /CQ
high to
output valid
tCQHQV

0.27

0.30

0.35

0.40
ns
4, 7
CQ, /CQ
high to
output hold
tCQHQX
-0.27

-0.30

-0.35

-0.40

ns
4, 7
C, /C high
to output
high-Z
tCHQZ

0.45

0.45

0.45

0.50
ns
5
C, /C high
to output
low-Z
tCHQX1
-0.45

-0.45

-0.45

-0.50

ns
5
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 15 of 25
3
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Parameter
Symbol
Address
valid to K
rising edge
-33
-40
-50
-60
Unit
Notes
Min
Max
Min
Max
Min
Max
Min
Max
tAVKH
0.40

0.50

0.60

0.70

ns
1
Control
inputs valid
to K rising
edge
tIVKH
0.40

0.50

0.60

0.70

ns
1
Data-in
valid to K,
/K rising
edge
tDVKH
0.30

0.35

0.40

0.50

ns
1
K rising
edge to
address
hold
tKHAX
0.40

0.50

0.60

0.70

ns
1
K rising
edge to
control
inputs hold
tKHIX
0.40

0.50

0.60

0.70

ns
1
K, /K rising
edge to
data-in
hold
tKHDX
0.30

0.35

0.40

0.50

ns
1
Notes: 1. This is a synchronous device. All addresses, data and control lines must meet the specified setup and hold
times for all latching clock edges.
2. VDD slew rate must be less than 0.1 V DC per 50 ns for DLL lock retention. DLL lock time begins once VDD
and input clock are stable. It is recommended that the device is kept inactive during these cycles.
3. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
4. Echo clock is very tightly controlled to data valid / data hold. By design, there is a ±0.1 ns variation from echo
clock to data. The datasheet parameters reflect tester guardbands and test setup variations.
5. Transitions are measured ±100 mV from steady-state voltage.
6. At any given voltage and temperature tCHQZ is less than tCHQX1 and tCHQZ less than tCHQV.
7. These parameters are sampled.
Remarks:
1.
2.
3.
4.
5.
Test conditions as specified with the output loading as shown in AC Test Conditions unless otherwise noted.
Control input signals may not be operated with pulse widths less than tKHKL (min).
If C, /C are tied high, K, /K become the references for C, /C timing parameters.
VDDQ is +1.5 V DC.
Control signals are /R, /W, /BW, /BW0, /BW1, /BW2 and /BW3.
BWn signals must operate at the same timing as Data in.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 16 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Timing Waveforms
Read and Write Timing
1
2
NOP
3
READ
4
WRITE
5
READ
6
WRITE
7
NOP
8
NOP
9
NOP
K
tKHKL
tKHKH
tKH/KH
tKLKH
t/KHKH
/K
/R
tIVKH
tKHIX
/W
tIVKH
A0
Address
tAVKH
A1
tKHIX
A2
tKHAX
A3
D10
D11
D12
D13
D30
D31
D32
D33
Data in
tDVKH
Qx3
tKHDX
Q00
Q01
Q02
tDVKH
Q03 Q20
tKHDX
Q21
Q22 Q23
Data out
tCHQZ
-tCHQX1
tCHQV
-tCHQX
tCHQV
-tCHQX
tCQHQV
-tCQHQX
CQ
tCHCQV
-tCHCQX
/CQ
tCHCQV
-tCHCQX
C
tKHKL
tKHCH
tKHKH
tKH/KH
tKLKH
t/KHKH
/C
tKHCH
Notes: 1. Q00 refers to output from address A0+0. Q01 refers to output from the next internal burst address following
A0, i.e., A0+1.
2. Outputs are disable (high-Z) one clock cycle after a NOP.
3. In this example, if address A2 = A1, then data Q20 = D10, Q21 = D11. Write data is forwarded immediately
as read results.
4. To control read and write operations, /BW signals must operate at the same timing as Data in.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 17 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
JTAG Specification
These products support a limited set of JTAG functions as in IEEE standard 1149.1.
Disabling the Test Access Port
It is possible to use this device without utilizing the TAP. To disable the TAP controller without interfering with normal
operation of the device, TCK must be tied to VSS to preclude mid level inputs. TDI and TMS are designed so an
undriven input will produce a response identical to the application of a logic 1,and may be left unconnected. But they
may also be tied to VDD through a 1kΩ resistor.TDO should be left unconnected.
Test Access Port (TAP) Pins
Symbol I/O
TCK
Pin assignments
2R
Description
Notes
TMS
10R
Test mode select. This is the command input for the TAP controller state
machine.
TDI
11R
Test data input. This is the input side of the serial registers placed between
TDI and TDO. The register placed between TDI and TDO is determined by
the state of the TAP controller state machine and the instruction that is
currently loaded in the TAP instruction.
TDO
1R
Test data output. Output changes in response to the falling edge of TCK.
This is the output side of the serial registers placed between TDI and TDO.
Test clock input. All inputs are captured on the rising edge of TCK and all
outputs propagate from the falling edge of TCK.
Notes: The device does not have TRST (TAP reset). The Test-Logic Reset state is entered while TMS is held high for
five rising edges of TCK. The TAP controller state is also reset on SRAM POWER-UP.
TAP DC Operating Characteristics
(Ta = 0 to +70°C, VDD = 1.8V ± 0.1V)
Parameter
Input high voltage
Input low voltage
Input leakage current
Output leakage current
Symbol
VIH
VIL
ILI
ILO
Min
+1.3
−0.3
−5.0
−5.0
Typ




Max
VDD + 0.3
+0.5
+5.0
+5.0
Unit
V
V
µA
µA
VOL1


0.2
V
VOL2


0.4
V
Output high voltage
VOH1
1.6


V
VOH2
1.4


V
Notes: 1. All voltages referenced to VSS (GND).
2. Power-up: VIH ≤ VDDQ + 0.3 V and VDD ≤ +1.7 V and VDDQ ≤ +1.4 V for t ≤ 200 ms.
3. In “EXTEST” mode and “SAMPLE” mode, VDDQ is nominally 1.5 V.
4. ZQ: VIH = VDDQ.
Output low voltage
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 18 of 25
Notes
0 V ≤ VIN ≤ VDD
0 V ≤ VIN ≤ VDD,
output disabled
IOLC = 100 µA
IOLT = 2 mA
|IOHC| = 100 µA
|IOHT| = 2 mA
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
TAP AC Test Conditions
Parameter
Symbol
Ta
VREF
VIL, VIH
tr, tf
Temperature
Input timing measurement reference levels
Input pulse levels
Input rise/fall time
Output timing measurement reference levels
Test load termination supply voltage (VTT)
Output load
Conditions
0 ≤ Ta ≤ +70
0.9
0 to 1.8
≤ 1.0
0.9
0.9
See figures
Unit
°C
V
V
ns
V
V
Input waveform
1.8 V
0.9 V
Test points
0.9 V
0V
Output waveform
0.9 V
Test points
0.9 V
Output load condition
VTT = 0.9 V
DUT
50 Ω
TDO
Z0 = 50 Ω
20 pF
External Load at Test
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 19 of 25
Notes
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
TAP AC Operating Characteristics
(Ta = 0 to +70°C, VDD = 1.8V ±0.1V)
Parameter
Symbol
Min
Typ
Max
Unit
Test clock (TCK) cycle time
tTHTH
100


ns
TCK high pulse width
tTHTL
40


ns
TCK low pulse width
tTLTH
40


ns
Test mode select (TMS) setup
tMVTH
10


ns
TMS hold
tTHMX
10


ns
Capture setup
tCS
10


ns
Capture hold
tCH
10


ns
TDI valid to TCK high
tDVTH
10


ns
TCK high to TDI invalid
tTHDX
10


ns
TCK low to TDO unknown
tTLQX
0


ns
TCK low to TDO valid
tTLQV


20
ns
Notes: 1. tCS + tCH defines the minimum pause in RAM I/O pad transitions to assure pad data capture.
TAP Controller Timing Diagram
tTHTH
tTHTL tTLTH
TCK
tMVTH
tTHMX
TMS
tDVTH
tTHDX
TDI
tTLQV
TDO
tTLQX
PI
(SRAM)
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 20 of 25
tCS
tCH
Notes
1
1
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Test Access Port Registers
Register name
Instruction register
Bypass register
ID register
Boundary scan register
Length
3 bits
1 bits
32 bits
109 bits
Symbol
IR [2:0]
BP
ID [31:0]
BS [109:1]
Notes
TAP Controller Instruction Set
IR2
0
IR1
0
IR0
0
Instruction
EXTEST
Description
0
0
1
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID
register when the controller is in capture-DR mode and places the ID
register between the TDI and TDO balls in shift-DR mode. The IDCODE
instruction is the default instruction loaded in at power up and any time
the controller is placed in the Test-Logic-Reset state.
0
1
0
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM
outputs are forced to an inactive drive state (high-Z), moving the TAP
controller into the capture-DR state loads the data in the RAMs input into
the boundary scan register, and the boundary scan register is connected
between TDI and TDO when the TAP controller is moved to the shift-DR
state.
0
1
1
RESERVED
The RESERVED instructions are not implemented but are reserved for
future use. Do not use these instructions.
1
0
0
SAMPLE
(/PRELOAD)
When the SAMPLE instruction is loaded in the instruction register,
moving the TAP controller into the capture-DR state loads the data in the
RAMs input and I/O buffers into the boundary scan register. Because the
RAM clock(s) are independent from the TAP clock (TCK) it is possible for
the TAP to attempt to capture the I/O ring contents while the input buffers
are in transition (i.e., in a metastable state). Although allowing the TAP to
SAMPLE metastable input will not harm the device, repeatable results
cannot be expected. Moving the controller to shift-DR state then places
the boundary scan register between the TDI and TDO balls.
1
1
1
0
1
1
1
0
1
RESERVED
RESERVED
BYPASS
The EXTEST instruction allows circuitry external to the component
package to be tested. Boundary scan register cells at output balls are
used to apply test vectors, while those at input balls capture test results.
Typically, the first test vector to be applied using the EXTEST instruction
will be shifted into the boundary scan register using the PRELOAD
instruction. Thus, during the Update-IR state of EXTEST, the output
driver is turned on and the PRELOAD data is driven onto the output balls.
Notes
1, 2, 3
3, 4
3
The BYPASS instruction is loaded in the instruction register when the
bypass register is placed between TDI and TDO. This occurs when the
TAP controller is moved to the shift-DR state. This allows the board level
scan path to be shortened to facilitate testing of other devices in the scan
path.
Notes: 1. Data in output register is not guaranteed if EXTEST instruction is loaded.
2. After performing EXTEST, power-up conditions are required in order to return part to normal operation.
3. RAM input signals must be stabilized for long enough to meet the TAPs input data capture setup plus hold
time (tCS plus tCH). The RAMs clock inputs need not be paused for any other TAP operation except capturing
the I/O ring contents into the boundary scan register.
4. Clock recovery initialization cycles are required to return from the SAMPLE-Z instruction.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 21 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Boundary Scan Order Boundary Scan Order
Bit #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Ball ID
6R
6P
6N
7P
7N
7R
8R
8P
9R
11P
10P
10N
9P
10M
11N
9M
9N
11L
11M
9L
10L
11K
10K
9J
9K
10J
11J
11H
10G
9G
11F
11G
9F
10F
11E
10E
10D
9E
10C
11D
x9
/C
C
SA
SA
SA
SA
SA
SA
SA
Q0
D0
NC
NC
NC
NC
NC
NC
Q1
D1
NC
NC
NC
NC
NC
NC
Q2
D2
ZQ
NC
NC
NC
NC
NC
NC
Q3
D3
NC
NC
NC
NC
Signal names
x18
/C
C
SA
SA
SA
SA
SA
SA
SA
Q0
D0
NC
NC
Q1
D1
NC
NC
Q2
D2
NC
NC
Q3
D3
NC
NC
Q4
D4
ZQ
NC
NC
Q5
D5
NC
NC
Q6
D6
NC
NC
Q7
D7
41
42
43
44
45
46
47
48
49
9C
9D
11B
11C
9B
10B
11A
10A
9A
NC
NC
Q4
D4
NC
NC
CQ
SA
SA
NC
NC
Q8
D8
NC
NC
CQ
NC
SA
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 22 of 25
x36
/C
C
SA
SA
SA
SA
SA
SA
SA
Q0
D0
D9
Q9
Q1
D1
D10
Q10
Q2
D2
D11
Q11
Q3
D3
D12
Q12
Q4
D4
ZQ
D13
Q13
Q5
D5
D14
Q14
Q6
D6
D15
Q15
Q7
D7
Bit #
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
Ball ID
8B
7C
6C
8A
7A
7B
6B
6A
5B
5A
4A
5C
4B
3A
2A
1A
2B
3B
1C
1B
3D
3C
1D
2C
3E
2D
2E
1E
2F
3F
1G
1F
3G
2G
1H
1J
2J
3K
3J
2K
D16
Q16
Q8
D8
D17
Q17
CQ
NC
SA
90
91
92
93
94
95
96
97
98
1K
2L
3L
1M
1L
3N
3M
1N
2M
x9
SA
SA
NC
/R
NC
/BW
K
/K
NC
NC
/W
SA
SA
SA
VSS
/CQ
NC
NC
NC
NC
NC
NC
NC
NC
Q5
D5
NC
NC
NC
NC
NC
NC
Q6
D6
/DOFF
NC
NC
NC
NC
NC
Signal names
x18
SA
SA
NC
/R
NC
/BW0
K
/K
NC
/BW1
/W
SA
SA
SA
VSS
/CQ
Q9
D9
NC
NC
Q10
D10
NC
NC
Q11
D11
NC
NC
Q12
D12
NC
NC
Q13
D13
/DOFF
NC
NC
Q14
D14
NC
x36
SA
SA
NC
/R
/BW1
/BW0
K
/K
/BW3
/BW2
/W
SA
SA
NC
VSS
/CQ
Q18
D18
D27
Q27
Q19
D19
D28
Q28
Q20
D20
D29
Q29
Q21
D21
D30
Q30
Q22
D22
/DOFF
D31
Q31
Q23
D23
D32
NC
Q7
D7
NC
NC
NC
NC
NC
NC
NC
Q15
D15
NC
NC
Q16
D16
NC
NC
Q32
Q24
D24
D33
Q33
Q25
D25
D34
Q34
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Bit #
99
100
101
102
103
104
Ball ID
3P
2N
2P
1P
3R
4R
x9
Q8
D8
NC
NC
SA
SA
Signal names
x18
Q17
D17
NC
NC
SA
SA
x36
Q26
D26
D35
Q35
SA
SA
Bit #
105
106
107
108
109
Ball ID
4P
5P
5N
5R

Signal names
x9
x18
x36
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
INTERNAL INTERNAL INTERNAL
Notes: In boundary scan mode,
1. Clock balls (K, /K, C, /C) are referenced to each other and must be at opposite logic levels for reliable
operation.
2. CQ and /CQ data are synchronized to the respective C and /C (except EXTEST, SAMPLE-Z).
3. If C and /C tied high, CQ is generated with respect to K and /CQ is generated with respect to /K (except
EXTEST, SAMPLE-Z).
4. ZQ must be driven to VDDQ supply to ensure consistent results.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 23 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
ID Register
Part

R1Q3A3636B
R1Q3A3618B
R1Q3A3609B
Revision number
(31:29)

000
000
000
Notes: 1. Type number
MMM :Density
WW :Organization
Q
:QDR/DDR
B
:Burst lengths
S
:I/O
Type number
(28:12)
0 0MMM 0WW0 10Q0 B0S0
0 0010 0110 1010 1010
0 0010 0100 1010 1010
0 0010 0000 1010 1010
011:72Mb,
11: x 36,
1: QDR,
1: 4-word burst,
1: Separate I/O,
010:36Mb,
10: x 18,
0: DDR
0: 2-word burst
0: Common I/O
Vendor JEDEC code
(11:1)

0100 0100 011
0100 0100 011
0100 0100 011
001:18Mb
00: x 9,
Start bit
(0)

1
1
1
01: x 8
TAP Controller State Diagram Package Dimensions
1
Test Logic Reset
0
Run Test/Idle
1
0
Select DR Scan
1
1
0
1
Capture DR
Capture IR
1
Exit1 DR
Shift IR
1
1
Exit2 DR
Pause IR
0
1
Exit2 IR
1
1
Update DR
1
Notes:
0
0
Pause DR
1
1
Exit1 IR
0
0
0
0
Shift DR
0
0
0
0
1
Select IR Scan
0
Update IR
1
0
The value adjacent to each state transition in this figure represents the signal present at TMS at
the time of a rising edge at TCK.
No matter what the original state of the controller, it will enter Test-Logic-Reset when TMS is held
high for at least five rising edges of TCK.
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 24 of 25
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Package Dimensions
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B (PLBG0165FB-A)
JEITA Package Code
P-LBGA165-15x17-1.00
RENESAS Code
PLBG0165FB-A
Previous Code
BP-165A
MASS[Typ.]
0.7g
D
A
B
E
INDEX
y1 S
y
A1
A
S
S
e
e
R
P
N
M
Reference
Symbol
L
Dimension in Millimeters
Min
Nom
Max
J
D
14.90
15.00
15.10
H
E
16.90
17.00
17.10
G
v
K
F
w
E
D
A
1.34
1.40
1.46
C
A1
0.27
0.32
0.37
B
e
A
b
x
1
2
3
4
5
6
φ b
7
8
9
0.45
0.50
0.55
0.20
10 11
φ× M S A B
φ0.07 M S
y
0.15
y1
0.25
SD
SE
ZD
ZE
REJ03C0342-0003 Rev.0.03 Apr.11, 2008
Page 25 of 25
1.00
Revision History
Rev.
Date
0.01
0.02
Jan.31, 2008
Mar.07,2008
0.03
Apr.11,2008
R1Q3A3636B/R1Q3A3618B/R1Q3A3609B
Data Sheet
Contents of Modification
Description
Page

Initial issue
P7
DLL Constraints
2.the lower end of the frequency at which the DLL can operate is 119MHz
P14 AC characteristics
Average clock cycle time is enlarged
tKHKH(-33)(max) 8.40ns tKHKH(-40)(max) 8.40ns, tKHKH(-50)(max) 8.40ns,
tKHKH(-60)(max) 8.40ns
P2
Ordering Infomatuon: Adding Part Number and Marking Name
1.Part Number
(9) R: 1stGeneration,A: 2ndGeneration,B: 3rdGeneration
(10:11) BG: Package type=BGA
(12:13) 60: Cycle time=6.0 ns,50 : Cycle time=5.0 ns,40: Cycle time=4.0 ns
33: Cycle time=3.3 ns
(14) R: Temperature range= 0°C ∼70°C,I: Temperature range= -40°C ∼85°C
(15) B: Pb-free,T: Tape&Reel,S: Pb-free and Tape&Reel
None: Standard (Pb and Tray)
(16) 0 ∼ 9 , A∼ Z :Renesa internal use
2.Marking Name
Marking Name(0:14) =Part Number (0:14)
------------Pb
Marking Name(0:16) =Part Number (0:14)+Bx------------Pb-free (x= 0 ∼ 9 , A∼ Z)
(Example)
R1Q3A3609BBG-60R
------------Pb
R1Q3A3609BBG-60RB0 ------------Pb-free
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