TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5003 Series SP5003 Series 4 Channel Common Mode Filter with ESD Protection RoHS Pb GREEN Description The SP5003 Series can protect and filter two differential line pairs in a small RoHS-compliant TDFN-10 package, with cost and space savings over discrete solutions. Pinout Features • High Common Mode Stop Band Attenuation: • ±15kV ESD protection per channel (IEC 610004-2 Level 4, contact discharge) > 16 dB at 900 MHz • Common Mode Imped ance: Zc: 32Ω at 100 MHz • AEC-Q101 qualified • Large differential bandwidth > 4.0 GHz In 1+ 1 10 Out 1+ In 1- 2 9 Out 1- G ND 3 8 G ND In 2+ 4 7 Out 2+ In 2- 6 Out 2- 5 • TDFN-10 2.50mm × 2.00mm × 0.75mm package with 0.50mm lead pitch Note :This drawing is not to scale. Functional Block Diagram External Applications Pin1 Pin10 Pin2 Pin9 Pin4 Pin7 Pin5 Pin6 (Connector) Pin3 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 • RoHS-compliant, Leadfree packaging Pin8 • HDMI/DVI Display in Mobile Phones Internal (ASIC) • MIPI D-PHY (CSI-2, DSI, etc) in Mobile Phones and Digital Still Cameras SP5003 The SP5003 Series is a highly integrated Common Mode Filter (CMF) providing both ESD protection and EMI common mode noise filtering for systems using high speed differential serial interfaces, such as MIPI D-PHY or HDMI. TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5003 Series Absolute Maximum Ratings Symbol IDC Thermal Information Parameter DC Current Per Line PDC DC Package Power Rating TOP TSTOR Value Units 100 mA 0.5 Watts Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Typ Max Units RCH Pins 1−10, 2−9, 4−7 and 5−6 3.5 5.0 Ω Total Channel Capacitance CTOTAL VI/O = 1.65VDC Reverse Bias; f=1MHz, 30mVAC 0.8 1.3 pF Reverse Standoff Voltage VRWM 5.0 V Channel Resistance Min Breakdown Voltage VBR IT=1mA 6.0 8.0 10.0 V Forward Voltage at IF VF IF=1mA 0.4 0.7 1.5 V VLeak=+3.3V 0.01 0.10 µA Positive (tp=8/20µs) 1.36 Reverse Leakage Current Dynamic Resistance2 3 ILEAK RDYN Negative (tp=8/20µs) 0.6 TLP, tp=100ns, I/O to GND 0.42 Ω IEC61000-4-2 (Contact Discharge) ±15 kV IEC61000-4-2 (Air Discharge) ±30 kV ESD Withstand Voltage1 2 VESD Differential Mode Cutoff Frequency2 F3dB ZSOURCE=50 Ω, ZLOAD50 Ω 4.0 GHz Common Mode Impedance ZC @100MHz 32 Ω Common Mode Stop Band Attenuation2 Fatten f=900MHz 16 dB Notes: 1 ESD zapping at I/O pins (1,2,4,5) with respect to GND. 2 Guaranteed by design. 3 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Differential Mode Attenuation vs. Frequency Common Mode Attenuation vs. Frequency 0 0 −1 −5 −10 −3 Inseron Loss(dB) Inseron Loss(dB) −2 −4 −5 −6 −7 −15 −20 −25 −30 −8 −35 −9 −40 −10 1 10 100 Frequency (MHz) 1000 10000 1 10 100 1000 10000 Frequency (MHz) © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5003 Series Transmission Line Pulsing (TLP) Plot Soldering Parameters Reflow Condition 20 18 TLP Current (A) 16 Pre Heat 14 12 10 8 6 4 2 4 6 8 10 12 14 16 18 20 TLP Voltage (V) Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 150°C 200°C - Time (min to max) (ts) 60 – 180 secs 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max 2 0 - Temperature Min (Ts(min)) - Temperature Max (Ts(max)) Average ramp up rate (Liquidus) Temp (TL) to peak Reflow 0 Pb – Free assembly - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Ordering Information Part Number Package Size Marking Min. Order Qty. SP5003-04TTG TDFN-10 2.5x2.0mm 42*** 3000 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 42 *** 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. TP Temperature Product Series 42 = SP5003 tP Critical Zone TL to TP Ramp-up TL tL TS(max) Ramp-do Ramp-down Preheat TS(min) 25 Date Code (Year / Week) Part Numbering System SP 5003 – 04 T T G tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes ) T= Tape & Reel Series Number of Channels 04 = 4 Channel TDFN-10 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14 G= Green Package TDFN-10 (2.5x2.0mm) SP5003 22 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP5003 Series Package Dimensions —TDFN-10 D TDFN-10 A B L 2X 0.10 C L JEDEC MO-229 L1 Millimeters E Min PIN 1 MARKING DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS 2X 0.10 C TOP VIEW A3 MOLD CMPD EXPOSED Cu 0.05 C A3 A1 DETAIL B A 0.05 C A1 ALTERNATE CONSTRUCTIONS C SIDE VIEW 1 8X DETAIL A 0.30 A 0.70 0.80 0.028 0.031 0.00 0.05 0.000 0.002 A3 0.2 REF 0.15 0.25 0.008 REF 0.006 0.010 D 2.50 BSC 0.098 BSC E 2.00 BSC 0.079 BSC e 0.50 BSC 0.020 BSC L 0.70 0.90 0.028 0.035 L1 0.05 0.15 0.002 0.006 2.30 8X L 0.10 MIN Max PACK AGE OUTLINE 8X 1.07 5 Inches Min A1 b DETAIL B Max 1 10 e 6 0.45 9X b 0.10 M C A B 0.05 M C 0.50 PITCH Recommended Soldering Footprint BOTTOM VIEW Tape & Reel Specification –TDFN-10 P0 T P2 扑1.50 +0.10 Device Orientation in Tape E Top Cover Tape 5° Max K0 A0 F W B0 P 1.00 ±0.05 Pin1 Location Symbol Dimensions Millimetres E 1.75+/- 0.10 F 3.5 +/- 0.05 P 4.0 +/- 0.10 P0 4.0 +/- 0.10 P2 2.0 +/- 0.05 W 8.00 +0.30/- 0.10 A0 2.19 +/- 0.05 B0 2.77 +/- 0.05 K0 1.05 +/- 0.05 T 0.25+/- 0.02 © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/08/14