TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3011 Series SP3011 Series 0.40pF Diode Array for USB 3.0 RoHS Pb GREEN Description The SP3011 integrates six channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for USB 3.0 ports that may experience destructive electrostatic discharges (ESD). This high density array can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. It’s extremely low loading capacitance makes it ideal for protecting any high-speed signal pins. Pinout Features 8 14 7 • Low leakage current of 0.1μA (TYP) at 5V • EFT, IEC61000-4-4, 40A (5/50ns) • Small form factor μDFN (JEDEC MO-229) package saves board space • Lightning, IEC61000-4-5, 3A (8/20μs) 1 *Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the opposite pin with the PCB trace. • Low capacitance of 0.4pF (TYP) per I/O Applications Functional Block Diagram Pin 11 Pin 12 Pin 13 Pin 14 • ESD, IEC61000-4-2, ±8kV contact, ±15kV air Pin 8 Pin 9 GND (Pin 10) • Notebooks • Desktops • External Storage • Ultramobile PC • Digital Camcorder • Smartphone • MP3/PMP Player • Set Top Box (DVR/PVR) Application Example USB Port USB Controller VBUS Additional Information SSTX+ Outside World Datasheet Resources Samples SSTX- IC SSRX+ SSRXGND SP3011-06UTG D+ D- Signal GND Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3011 Series Absolute Maximum Ratings Symbol Parameter Value Units 3.0 A Operating Temperature –40 to 125 °C Storage Temperature –55 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Symbol Test Conditions Reverse Standoff Voltage Parameter VRWM IR ≤ 1µA Reverse Leakage Current ILEAK VC Clamp Voltage1 Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance Typ Max Units 6.0 V 0.5 µA VR=5V, Any I/O to GND 0.1 IPP=1A, tp=8/20µs, Fwd 11.0 IPP=2A, tp=8/20µs, Fwd 12.5 V (VC2-VC1) / (IPP2-IPP1) 1.5 Ω V IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV CI/O-GND 1 Min Reverse Bias=0V 0.4 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 0.5 0 -5 Attenuation (dB) Capacitance (pF) 0.4 0.3 0.2 0.1 -10 -15 -20 -25 0.0 0.0 -30 1.0 2.0 3.0 4.0 10 5.0 100 Clamping Voltage vs. IPP 1000 10000 Frequency (MHz) Bias Voltage (V) Pulse Waveform 110% 16.0 100% 14.0 90% 80% 10.0 Percent of IPP Clamp Voltage (VC) 12.0 8.0 6.0 70% 60% 50% 40% 30% 4.0 20% 10% 2.0 0% 0.0 1.0 1.5 2.0 2.5 Peak Pulse Current - IPP (A) 3.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3011 Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Part Numbering System Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) tP TP Temperature Reflow Condition tS time to peak temperature Time Product Characteristics SP 3011 – 06 U T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Number of Channels Package U=µDFN-14 (3.5x1.35mm) -06 = 6 Channels Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters Part Marking System 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. R* 6 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Number of Product Series Channels R = SP3011 Assembly Site Ordering Information Part Number Package Marking Min. Order Qty. SP3011-06UTG µDFN-14 R*6 3000 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3011 Series Embossed Carrier Tape & Reel Specification — µDFN-14 P1 P0 D0 P2 User Feeding Direction E Symbol Millimeters A0 1.58 ± 0.10 F W B0 3.73 ± 0.10 D0 0.60 + 0.05 D1 Ø 0.60 + 0.05 Pin 1 Location D1 A0 T K0 B0 E 1.75 ± 0.10 F 5.50 ± 0.05 K0 0.68 ± 0.10 P0 2.00 ± 0.05 P1 4.00 ± 0.10 P2 4.00 ± 0.10 T 0.28 ± 0.02 W 12.00 + 0.30 /- 0.10 Package Dimensions — µDFN-14 (3.5x1.35x0.5mm) Top View A D JEDEC Symbol E PIN 1 Index Area 1 2 3 4 B A1 A2 A C MO-229 Millimeters b Inches Min Nom Max Min Nom Max A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 0.203 Ref A2 Side View Seating Plane µDFN-14 (3.5x1.35x0.5mm) Package 0.008 Ref b 0.15 0.20 0.25 0.006 0.008 0.012 D 3.40 3.50 3.60 0.134 0.138 0.142 D2 - - - - - - E 1.25 1.35 1.45 0.050 0.054 0.058 E1 - - - - - - 0.500 BSC e L 0.25 0.30 0.020 BSC 0.35 0.010 0.012 0.014 Notes: 1. Dimension and tolerancing comform to ASME Y14.5M-1994. Bottom View 2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily exact. Recomended Soldering Pad Layout Pin 1 Identification Chamfer 0.10X45º Symbol Millimeter Inches © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13