TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3021 Series SP3021 Series 0.5pF 8kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP3021 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-toback configuration provides symmetrical ESD protection for data lines when AC signals are present. Pinout Features 1 • E SD protection of ±8kV contact discharge, ±15kV air discharge, (IEC61000-4-2) • Low capacitance of 0.5pF @ VR=0V • EFT, IEC61000-4-4, 40A (5/50ns) • 0402 small footprint available • L ow leakage current of 1μA at 5V • L ightning protection, IEC61000-4-5, 2A (tp=8/20µs) 2 Applications Functional Block Diagram • Smart Phones • MHL/MIPI/MDDI • External Storage • HDMI, Display Port, eSATA • Ultrabooks, Notebooks • Tablets, eReaders • Set Top Boxes, Game Consoles 2 1 • USB 3.0/USB 2.0 USB3.0 Application Example USB Port USB Controller VBUS Additional Information SP1003 *Packages are shown as transparent D+ IC D- Datasheet Resources Samples SSTX+ SSTXSSRX+ SSRX- Pin 1 Signal Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP3021x6 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3021 Series Symbol Parameter Value IPP Peak Current (tp=8/20μs) TOP Operating Temperature TSTOR Storage Temperature Parameter Units Rating Units –55 to 150 °C 2.0 A Storage Temperature Range –40 to 125 °C Maximum Junction Temperature 150 °C °C Maximum Lead Temperature (Soldering 20-40s) 260 °C –55 to 150 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage Test Conditions Min 7.0 Typ Max 5.0 VRWM Reverse Breakdown Voltage VBR 1R=1mA Reverse Leakage Current ILEAK VR=5V VC Clamp Voltage1 Dynamic Resistance Diode Capacitance1 1 13.1 V 14.7 V 1.6 IEC61000-4-2 (Contact) ±8 IEC61000-4-2 (Air) ±15 CD Reverse Bias=0V Ω kV kV 0.5 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 1 0 0.8 -5 Attenuation (dB) 0.9 Capacitance (pF) 0.7 0.6 0.5 0.4 0.3 -10 -15 -20 -25 0.2 -30 0.1 -35 0 0 1 2 3 4 5 10 DC Bias (V) Pulse Waveform 100 Frequency (MHz) 1000 Transmission Line Pulsing(TLP) Plot 110% 100% 90% TLP Current (A) Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) TLP Voltage (V) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 µA IPP=2A, tp=8/20µs, Fwd (VC2-VC1)/(IPP2-IPP1) VESD V V IPP=1A, tp=8/20µs, Fwd RDYN ESD Withstand Voltage1 Units SP3021 Thermal Information Absolute Maximum Ratings TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3021 Series Product Characteristics Ordering Information Lead Plating Pre-Plated Frame or Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Part Number Package SP3021-01ETG SOD882 _ • Marking Min. Order Qty. 12000 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Part Numbering System Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Part Marking System SP 3021 – 01 E T G TVS Diode Arrays (SPA® Diodes) tP TP Temperature Reflow Condition SOD882 G= Green T= Tape & Reel Series Number of Channels Package E: SOD882 Pin 1 Indicator Product ID © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3021 Series Package Dimensions — SOD882 Symbol 0.325 0.325 0.650 0.650 Package SOD882 JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.035 0.039 0.043 B 0.50 0.60 0.70 0.020 0.024 0.028 C 0.40 0.50 0.60 0.016 0.020 0.024 0.45 D 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 0.975 Recommanded Soldering Pad Layout Embossed Carrier Tape & Reel Specification — SOD882 D evice Orientation in Tape Pin 1 Location Notes : 1. All dimensions are in millimeters © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/26/15 Symbol Millimeters A0 0.70±0.045 B0 1.10±0.045 K0 0.65±0.045 F 3.50±0.05 P1 2.00±0.10 W 8.00 + 0.30 -0.10