MAX4662xxE Rev. A RELIABILITY REPORT FOR MAX4662xxE PLASTIC ENCAPSULATED DEVICES March 17, 2003 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance Executive Director Conclusion The MAX4662 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments I. Device Description A. General The MAX4662 quad analog switch features low on-resistance of 2.5Ω max. On-resistance is matched between switches to 0.5Ω max and is flat (0.5Ω max) over the specified signal range. The switch can handle Rail-to-Rail® analog signals. Off-leakage current is only 5nA max at TA = +85°C. This analog switch is ideal in low-distortion applications and is the preferred solution over mechanical relays in automatic test equipment or applications where current switching is required. It has lower power requirements, use less board space, and is more reliable than mechanical relays. The MAX4662 has four normally open (NO) switches. This device operates from a single +4.5V to +36V supply or from dual ±4.5V to ±20V supplies. A separate logic supply pin guarantees TTL/CMOS-logic compatibility when operating across the entire supply voltage range B. Absolute Maximum Ratings Item V+ to GND V- to GND V+ to VVL to GND All Other Pins to GND (Note 1) Continuous Current (COM_, NO_, NC_) Peak Current (COM_, NO_, NC_) (pulsed at 1ms, 10% duty cycle) Operating Temperature Ranges MAX4662C_E MAX4662E_E Storage Temperature Range Lead Temperature (soldering, 10sec) Continuous Power Dissipation (TA = +70°C) 16-Pin DIP 16-Pin WSO 16-Pin SSOP Derates above +70°C 16-Pin DIP 16-Pin WSO 16-Pin SSOP Rating -0.3V to +44V +0.3V to -44V -0.3V to +44V (GND - 0.3V) to (V+ + 0.3V) (V- - 0.3V) to (V+ + 0.3V) ±200mA ±300mA 0°C to +70°C -40°C to +85°C -65°C to +150°C +300°C 842mW 762mW 571mW 10.53mW/°C 9.52mW/°C 7.1mW/°C Note 1: Signals on NC_, NO_, COM_, or IN_ exceeding V+ or V- will be clamped by internal diodes. Limit forward diode current to maximum II. Manufacturing Information A. Description/Function: 2.5W, Quad, SPST, CMOS Analog Switch B. Process: S5HV - Medium voltage 5 micron silicon gate CMOS C. Number of Device Transistors: 108 D. Fabrication Location: Oregon, USA E. Assembly Location: Philippines or Malaysia F. Date of Initial Production: July, 1999 III. Packaging Information A. Package Type: 16-Lead WSO 16-Lead PDIP 16-Lead SSOP B. Lead Frame: Copper Copper Copper C. Lead Finish: Solder Plate Solder Plate Solder Plate D. Die Attach: Silver-filled Epoxy Silver-filled Epoxy Silver-filled Epoxy E. Bondwire: Gold (1.3 mil dia.) Gold (1.3 mil dia.) Gold (1.2 mil dia.) F. Mold Material: Epoxy with silica filler Epoxy with silica filler Epoxy with silica filler G. Assembly Diagram: # 05-1201-0121 # 05-1201-0119 # 05-1201-0120 H. Flammability Rating: Class UL94-V0 Class UL94-V0 Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD-020-A: Level 1 Level 1 Level 1 IV. Die Information A. Dimensions: 140 x 163 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: 5 microns (as drawn) F. Minimum Metal Spacing: 5 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Manager, Rel Operations) Bryan Preeshl (Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows: λ= 1 = MTTF 4.04 (Chi square value for MTTF upper limit) 192 x 4389 x 80 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV λ = 29.97 x 10-9 λ = 29.97 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The attached Burn-In Schematic (Spec. # 06-0067) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The AH45-1 die type has been found to have all pins able to withstand a transient pulse of ±2500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA. Table 1 Reliability Evaluation Test Results MAX4662xxE TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased Time = 192 hrs. FAILURE IDENTIFICATION PACKAGE DC Parameters & functionality SAMPLE SIZE NUMBER OF FAILURES 80 1 77 77 77 0 0 0 0 Moisture Testing (Note 2) Pressure Pot Ta = 121°C P = 15 psi. RH= 100% Time = 168hrs. DC Parameters & functionality PDIP WSO SSOP 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality 77 DC Parameters & functionality 77 Mechanical Stress (Note 2) Temperature Cycle -65°C/150°C 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data 0 Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except VPS1 3/ All VPS1 pins 2. All input and output pins All other input-output pins 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open. TERMINAL C R1 R2 S1 TERMINAL A REGULATED HIGH VOLTAGE SUPPLY S2 C1 DUT SOCKET SHORT TERMINAL B TERMINAL D Mil Std 883D Method 3015.7 Notice 8 R = 1.5kΩ C = 100pf CURRENT PROBE (NOTE 6) ONCE PER SOCKET ONCE PER BOARD 100 OHMS +15V 10 K 10 K 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 0.1 uF 10 K 100 OHMS +5V 10 K 0.1 uF 0.1 uF 100 OHMS -15V 0.1 uF 0.1 uF PACKAGE: 16-DIP DEVICES: MAX 313/314/327/332/352/353/362/365/313L/314L/313F/314F DG202/212/412/413/442/445/412F/413F DRAWN BY: TEK TAN NOTES: Max current for MAX314/314L/353/DG413/413F/313F/314F=3.5mA (+15v). All others = 10uA (+15v) / 10uA (-15v) / 10uA ( +5v). DOCUMENT I.D. 06-0067 REVISION E MAXIM TITLE: BI Circuit (MAX313/314/313L/314L/327/332/352/353/362/365/DG202/212/412/413/442/445/412F/ 413F/313F/314F) PAGE 2 OF 3