MAX1567ETL Rev. A RELIABILITY REPORT FOR MAX1567ETL PLASTIC ENCAPSULATED DEVICES November 13, 2003 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance Executive Director Conclusion The MAX1567 sucessfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments I. Device Description A. General The MAX1567 provides a complete power-supply solution for digital cameras. It improves performance, component count, and size compared to conventional multichannel controllers in 2-cell AA, 1-cell lithium-ion (Li+), and dualbattery designs. On-chip MOSFETs provide up to 95% efficiency for critical power supplies, while additional channels operate with external FETs for optimum design flexibility. This optimizes overall efficiency and cost, while also reducing board space. The MAX1567 includes six high-efficiency DC-to-DC conversion channels: • • • • • Step-up DC-to-DC converter with on-chip power FETs Main DC-to-DC converter with on-chip FETs, configurable to step either up or down Step-down core DC-to-DC converter with on-chip FETs DC-to-DC controller for white LEDs or other output Transformerless inverting DC-to-DC controller (typically for negative CCD bias) All DC-to-DC channels operate at one fixed frequency settable from 100kHz to 1MHz to optimize size, cost, and efficiency. Other features include soft-start, power-OK outputs, and overload protection. The MAX1567 is available in space-saving 40-pin thin QFN packages. An evaluation kit is available to expedite designs. B. Absolute Maximum Ratings Item Rating PV, PVSU, SDOK, AUX1OK, SCF, ON_, FB_, SUSD to GND -0.3V to +6V PG_ to GND -0.3V to +0.3V DL1, DL3, INDL2, PVM, PVSD to GND -0.3V to (PVSU + 0.3V) DL2 to GND -0.3V to (INDL2 + 0.3V) LXSU Current (Note 1) 3.6A LXM Current (Note 1) 3.6A LXSD Current (Note 1) 2.25A REF, OSC, CC_ to GND -0.3V to (PVSU + 0.3V) Operating Temperature Range -40°C to +85°C Junction Temperature +150°C Storage Temperature Range -65°C to +150°C Lead Temperature (soldering, 10s) +300°C Continuous Power Dissipation (TA = +70°C) 40-Pin Thin QFN 2105mW Derates above +70°C 40-Pin Thin QFN 26.3mW/°C Note 1: LXSU has internal clamp diodes to PVSU and PGSU, LXM has internal clamp diodes to PVM and PGM, and LXSD has internal clamp diodes to PVSD and PGSD. Applications that forward bias these diodes should take care not to exceed the devices’ power dissipation limits. II. Manufacturing Information A. Description/Function: Six-Channel, High-Efficiency, Digital Camera Power Supplies B. Process: B8 (Standard 0.8 micron silicon gate CMOS) C. Number of Device Transistors: 9420 D. Fabrication Location: California, USA E. Assembly Location: Thailand F. Date of Initial Production: July, 2003 III. Packaging Information A. Package Type: 40-Lead Thin QFN (6 x 6) B. Lead Frame: Copper C. Lead Finish: Solder Plate D. Die Attach: Silver-Filled Epoxy E. Bondwire: Gold (1.3 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: # 05-9000-0520 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1 IV. Die Information A. Dimensions: 127 x 147 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Copper/Silicon D. Backside Metallization: None E. Minimum Metal Width: .8 microns (as drawn) F. Minimum Metal Spacing: .8 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord Bryan Preeshl Kenneth Huening (Manager, Rel Oprations) (Executive Director of QA) (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows: λ= 1 = MTTF 1.83 192 x 4389 x 48 x 2 (Chi square value for MTTF upper limit) Thermal acceleration factor assuming a 0.8eV activation energy λ = 22.62 x 10-9 λ= 22.62 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. The following Burn-In Schematic (Spec. #06-6202) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85°C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The PN07-1 die type has been found to have all pins able to withstand a transient pulse of +/-800V, per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA. Table 1 Reliability Evaluation Test Results MAX1567ETL TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased Time = 192 hrs. FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES DC Parameters & functionality 48 0 Moisture Testing (Note 2) Pressure Pot Ta = 121°C P = 15 psi. RH= 100% Time = 168hrs. DC Parameters & functionality 77 0 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality 77 0 DC Parameters & functionality 77 Mechanical Stress (Note 2) Temperature Cycle -65°C/150°C 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic D.I.P. qualification lots. Note 2: Generic package/process data 0 Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except VPS1 3/ All VPS1 pins 2. All input and output pins All other input-output pins 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open TERMINAL C R1 R2 S1 TERMINAL A REGULATED HIGH VOLTAGE SUPPLY S2 C1 DUT SOCKET SHORT TERMINAL B TERMINAL D Mil Std 883D Method 3015.7 Notice 8 R = 1.5kΩ C = 100pf CURRENT PROBE (NOTE 6) DOCUMENT I.D. 06-6202 REVISION A MAXIM TITLE: BI Circuit (MAX1566/1567) PN07 PAGE 2