HTQF

Q-Family F-Series Quick-turn Clock Oscillators. 1.0 pS Phase Jitter.
HTQF: CMOS Output 245 MHz max.
HPQF: LVPECL Outputs 1450 MHz max.
HDQF: LVDS Outputs 1450 MHz max.
The HTQF, HPQF and HDQF Series are members of Mercury’s Q-Family Quick-Turn crystal
oscillators that can be delivered within days. With low current consumption (54 mA for
LVPECL 622.080 MHz at 3.3V) and an integrated phase jitter performance of 1.0 pS RMS,
they have gained its precision frequency control market position by providing engineers with
next-day samples for prototypes and low cost, fast delivery for volume production. The
perfect solution to replace traditional XO’s & VCXO’s that use a more expensive, high
frequency, fundamental crystal and a noisy PLL multiplier circuit.
MERCURY
Since 1973
576 package shown
General Specifications: at Ta=+25°C, CL=15 pF
Output Logic Type
Frequency Range
Load
Power Supply Voltage (VDD)
Output “High” Voltage; VOH
Output “Low” Voltage; VOL
Frequency Stability ǂ
Duty Cycle (at 50% VDD)
Rise Time (Tr) /
Fall Time (Tf)
(10% VDD ↔ 90% VDD)
Current Consumption,
VDD = +2.5V.
All values are typical and
over the operating
temperatures.
Current Consumption,
VDD = +3.3V.
All values are typical and
over the operating
temperatures.
LVCMOS / LVTTL
LVPECL
LVDS
10 ~ 245 MHz
10 ~ 1450 MHz
10 ~ 1450 MHz
15 pF
Differential
Differential
VDD = +2.5V D.C.±5% (voltage code “25”) or +3.3V D.C.±10% (voltage code “3”)
Note: Not over a continuous range from 2.5V to 3.3V.
175 mV min.
VDD - 1.03V min. Differential Output Voltage (VOD) 350 mV typical
0.9*VDD min.
VDD - 0.6V max.
VOD Magnitude Change (Δ VOD)
50 mV max.
Offset
Voltage
(V
)
1.25V typical
VDD - 1.85V min.
OS
0.1*VDD max.
VDD - 1.6V max
VOS Magnitude Change (Δ VOS)
50 mV max.
±50 ppm over -40°C to +85°C (Stability code is “E”)*
* Other frequency stabilities are available, please contact Mercury.
ǂ
Inclusive of all conditions: Calibration tolerance at 25°C, frequency stability over the
operating temp range, 1st yr aging at 25°C, supply voltage & output load changes, shock &
vibration.
50% ±2%
50% ±2%
50% ±5%
600 pS. max.
250 pS max.
350 pS max.
10 MHz: 15 mA
50 MHz: 18 mA
100 MHz: 22 mA
150 MHz: 24 mA
200 MHz: 28 mA
250 MHz: 31 mA
10 MHz: 17 mA
50 MHz: 20 mA
100 MHz: 24 mA
150 MHz: 28 mA
200 MHz: 33 mA
250 MHz: 37 mA
100 MHz: 46 mA
250 MHz: 48 mA
500 MHz: 53 mA
750 MHz: 56 mA
1 GHz: 60 mA
1.35 GHz: 65 mA
100 MHz: 48 mA
250 MHz: 50 mA
500 MHz: 55 mA
750 MHz: 59 mA
1 GHz: 62 mA
1.35 GHz: 68 mA
100 MHz: 16 mA typical
250 MHz: 18 mA typical
500 MHz: 21 mA typical
750 MHz: 22 mA typical
1 GHz: 24 mA typical
1.35 GHz: 26 mA typical
100 MHz: 18 mA typical
250 MHz: 20 mA typical
500 MHz: 22 mA typical
750 MHz: 24 mA typical
1 GHz: 26 mA typical
1.35 GHz: 28 mA typical
MERCURY
www.mercury-crystal.com
Taiwan: TEL (886)-2-2406-2779, FAX (886)-2-2496-0769, e-mail: [email protected]
U.S.A.: TEL (1)-909-466-0427, FAX (1)-909-466-0762, e-mail: [email protected]
MERCURY
Page 1 of 5
May 27, 2013
Revision 2
Current with Output
Disabled
Start-up Time
16 mA typical
16 mA typical
16 mA typical
10 ms max.
Aging
±2 ppm max. first year at 25°C; ±10 ppm max. over 10 years
Output Enable Function
0.7% of VDD minimum or no connection to enable output. LVCMOS/LVTTL level.
OE Control on Pad 1
0.3% of VDD maximum to disable output (high impedance). LVCMOS/LVTTL level.
Output Enable Time
200 ns max.
Output Disable Time
Phase Jitter, rms
(12 KHz to 20 MHz)
Phase Jitter, rms
(1.875 MHz to 20 MHz)
50 ns max.
1.0 pS typical
< 100 fs
Absolute Maximum Ratings
Power Supply Voltage VDD
Input Voltage
Output Voltage
Operation Junction Temperature
+4.0 V max.
-0.5V min.; VDD+0.5V max.
-0.5V min.; VDD+0.5V max.
-40°C min.; +125°C max.
Part Number Format and Example:
Example: 3HPQF576E-622.080
3
Supply Voltage
“3” for 3.3V
“25” for 2.5V
HPQF
576
HTQF: CMOS
Package Size
HPQF: LVPECL “576”: 7x5 mm
HDQF: LVDS
“536”: 5x3.2 mm
E
Frequency Stability Code “E”:
±50 ppm over -40 to +85°C.
Other frequency stabilities are
available.
622.080
Frequency
(MHz)
-
HTQF, HPQF and HDQF Series Phase Noise and Phase Jitter Data (typical)
Frequency (MHz)
SSB
Phase
Noise
Data
(dBc/Hz
Typical
77.760
122.880
125.0
156.250
212.5
491.520
622.080
1000
1250
10 Hz offset
-57
-68
-63
-55
-62
-61
-48
-52
-42
100 Hz offset
-94
-99
-94
-85
-93
-86
-85
-82
-81
1 KHz offset
-114
-113
-113
-109
-105
-100
-101
-93
-93
10 KHz offset
-123
-119
-118
-116
-113
-105
-102
-97
-96
100 KHz offset
-124
-120
-119
-118
-115
-105
-103
-97
-97
1 MHz offset
-144
-140
-137
-139
-135
-126
-124
-116
-119
-152
-148
-146
-146
-143
-137
-133
-127
-129
0.9
0.8
1.1
0.9
1.0
1.1
1.2
1.5
1.1
5 MHz offset
Phase Jitter pS
(12KHz ~ 20 MHz, RMS)
MERCURY
Page 2 of 5
May 27, 2013
Revision 2
Phase Noise Plot of 3HPQF-622.080 MHz, VDD=+3.3V,
Environmental Performance Specifications
Green Requirement
Moisture Sensitivity Level
Second Level Interconnect
Storage temp. range
Humidity
Fine Leak / Gross Leak
Solderability
Reflow
Vibration
Shock
Resistance to Solvent
Temperature Cycling
ESD Rating
Pad Surface Finish
Weight of the Device
MERCURY
RoHS compliant, Pb (lead) free in accordance with EU Directive 2002/95/EC
6/6 (2002/95/EC) and WEEE (2002/96/EC).
Free of halide, cadmium, hexavalent chromium, lead, mercury, PBB’s and PBDE’s.
Level 1 (infinite) according to IPC/JEDEC J-STD-020D.1
e4
-55 to +125°C
85% RH, 85°C, 48 hours
MIL-Std-883, method 1014, condition A / MIL-Std-883, method 1014, condition C
MIL-STD-202F method 208E
260°C for 10 sec. 2X.
MIL-STD-202F method 204, 35G, 50 to 2000 Hz
MIL-STD-202F method 213B, test condi. E, 1000GG ½ sine wave
MIL-STD-202, method 215
MIL-STD-883, method 1010
Human body model (HBM): 1500 V min.
Gold (0.3 um to 1.0 um) over nickel (1.27 um to 8.89 um)
576 package: 0.18 grams typical
536 package: 0.09 grams typical
Page 3 of 5
May 27, 2013
Revision 2
Output OE Function on pad 1
VDD
Pad 1
OE Function
VIH
VIL
Enable Time
Disable Time
High Impedance
Duty cycle=
Test Circuits and Output Waveforms
VDD
5
4
15 pF
0.1 uF
10 uF
Measured at 50% VDD
T2
CMOS
NC
6
.
T1
VOH
90%VDD
50%VDD
1
2
3
10%VDD
Output NC
Enable
VOL
CMOS
Tr
VDD
LVPECL
ZO=50Ω
VDD
6
0.1 uF
10 uF
T2
T1
5
4
ZO=50Ω
PECL
R1 R3
R2 R4
VOH
90%VDD
LVPECL
Receiver
50%VDD
10%VDD
VOL
PECL
1
2
Tr
3
Tf
Vss
Output NC
Enable
VDD=3.3 V: R1=R3=127Ω; R2=R4=82.5Ω
VDD=2.5 V: R1=R3=250Ω; R2=R4=62.5Ω
5
100Ω
6
0.1 uF
10 uF
VDD
4
T2
T1
LVDS
50%VDD
1
LVDS
VOH
90%VDD
2
10%VDD
3
Output NC
Enable
MERCURY
VOS
VOL
LVDS
Page 4 of 5
May 27, 2013
Revision 2
VOD
Package Dimensions and Recommended Solder Pad Layout
0.10
Bottom view
MEC
3
2
5.08 typical
3
5.08
6
0.90
Bottom view
2
0.9
1
3
2
3
2.54 typical
25.4
`
Pad Electrical Connections
Pad 1
OE: High Enable
Pad 2
No Connection
Pad 3
Ground
Pad 4
Pad 5
Pad 6
CMOS: Output
CMOS: No connection
Supply volltage
LVPECL or LVDS: Differential Output
LVPECL or LVDS: Complementary Output
Recommended Solder Reflow Profile (per IPC/JEDEC J-STD-020D.1)
Tp
TL
Tsmax
Temperature
Max. Ramp Up Rate=3°C/s
Max. Ramp Down Rate=6°C/s
tp
Preheat Area
Tc-5°C
User Tp≤Tc
tL
Tsmin
Tc
Tc-5°C
User tp
ts
25
Time 25°C to Peak
Time
Profile Feature
Sn-Pb Eutectic Assembly
Preheat/Soak
- Temperature min. (Ts min.)
100⁰C
- Temperature max. (Ts max.)
150⁰C
- Time (ts) (Ts min. to Ts max.)
60 to 120 seconds
Ramp-up rate (TL to Tp)
3⁰C / sec. max.
Liquidous temperature (TL )
183⁰C
Time (tL) maintained above TL
60 to 150 seconds
Peak package body temperature (Tp)
235⁰C
Time (Tp) within 5⁰C of the classification temperature Tc 10 to 30 seconds
Ramp-down rate (Tp to TL)
6⁰C / second max.
Time 25⁰C to peak temperature
6 minutes max.
All temperatures refer to topside of the package, measured on the package body surface.
MERCURY
1
Land Pattern
1.8
Land Pattern
5
4
MEC
1
1.8 max.
0.70
1.8
0.64
0.55
2
5.00±0.15
4
5
3.20±0.15
5.00±0.15
4
1
2.0
6
0.10
6
1.2±0.1
5
1.20
1.40
4
1.0
7.00±0.15
5
1.3
6
unit: (mm)
536 Package unit: mm
1.27
576 Package unit: mm
Page 5 of 5
May 27, 2013
Pb-free Assembly
150⁰C
200⁰C
60 to 180 seconds
3⁰C / sec. max.
217⁰C
60 to 150 seconds
260⁰C
20 to 40 seconds
6⁰C / second max.
8 minutes max.
Revision 2