Cover
88F6710, 88F6707, and
88F6W11
ARMADA® 370 SoC
Hardware Specifications
Doc. No. MV-S107978-00, Rev. G
April 3, 2014, Preliminary
Marvell. Moving Forward Faster
Document Classification: Proprietary Information
88F6710, 88F6707, and 88F6W11
Hardware Specifications
Document Conventions
Note: Provides related information or information of special importance.
Caution: Indicates potential damage to hardware or software, or loss of data.
Warning: Indicates a risk of personal injury.
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Doc Status: Preliminary
Technical Publication: 0.xx
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Doc. No. MV-S107978-00 Rev. G
Page 2
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Revision History
Revision History
Table 1:
Revision History
R e v i s io n
Date
C o m m e n ts
Rev. G
April 3, 2014
Revised Release
New revision for public release.
Rev. F
September 19, 2013
Revised Release
Rev. E
October 17, 2012
Revised Release
Rev. D
September 2, 2012
Revised Release
Rev. C
January 26, 2012
Revised Release
Rev. B
October 10, 2011
Revised Release
Rev. A
August 10, 2011
Initial Release
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
THIS PAGE IS INTENTIONALLY LEFT BLANK.
Doc. No. MV-S107978-00 Rev. G
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Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
88F6710, 88F6707, and 88F6W11
ARMADA® 370 SoC Hardware Specifications
PRODUCT OVERVIEW
The 88F6710, 88F6707, and 88F6W11 are complete
system-on-chip (SoC) solutions based on the Marvell®
Core Processor embedded CPU technology. By
leveraging the successful Marvell system controllers and
extensive expertise in ARM instruction-set-compliant
CPUs, the 88F6710/6707/6W11 present a new level of
performance, integration, and efficiency to raise the
performance/power and performance/cost bars, and
provide a simple system design.
The 88F6710/6707/6W11 integrate a single Superscalar
processor with:
ARMv7-compliant Marvell® Core Processor CPU
that includes Marvell micro-architecture
enhancements and a double precision
IEEE-compliant Floating Point Unit (FPU)
256 KB Layer 2 (L2) cache
Low-latency, high-bandwidth, tightly coupled DDR3
memory controller
Four Integrated multi-speed SERDES lanes
IPSec and Storage Acceleration Engines
The advanced I/O peripherals for these devices include:
88F6710: PCI Express (PCIe) Gen2.0, USB 2.0 with
integrated PHY, SATA II ports, Ethernet, I2S, S/PDIF,
TDM, and device bus interfaces
88F6707: PCI Express (PCIe) Gen2.0, USB 2.0 with
integrated PHY, SATA II ports, Ethernet, and SDIO,
and TDM interfaces
88F6W11: PCI Express (PCIe) Gen2.0, USB 2.0
with integrated PHY, I2S, S/PDIF, Ethernet, SDIO,
TDM, and device bus interfaces
An SPI Flash interface and a parallel NAND Flash
interface are also included in these devices.
For enhanced handshake and data flow, a full hardware
I/O cache coherency interconnect is implemented
between the CPU and the I/Os. There is also support for
full software I/O cache coherency.
Optimized for low-power operation, and providing
advanced power management capabilities, the
88F6710/6707/6W11 is ideally suited for a wide range of
applications that require both high performance and
minimal power consumption. The rich and diversified
interface mix of the 88F6710/6707/6W11 allows it to be
the perfect solution for different types of applications and
systems in various fields, such as:
Integrated Service Router
Networking and Telecom line cards
Control plane networking applications
Wireless access point
NAS and Media Server
Switch controller
Plug computing
Thin clients
The innovative Coherency Fabric architecture provides a
coherent interconnect between the CPU and the I/Os.
The bus efficiency also enables a high-frequency,
high-bandwidth, and low-latency access time throughout
the CPU memory subsystem.
The on-chip Mbus architecture, a Marvell® proprietary
crossbar interconnect for non-blocking any-to-any
connectivity, enables concurrent transactions among
multiple units. This design results in high system
throughput, allowing system designers to create
high-performance products.
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 5
88F6710, 88F6707, and 88F6W11
Hardware Specifications
88F6710 Block Diagram
ARMv7 CPU,
with FPU
256 KB L2 Cache
32KB L1-I
32KB L1-D
Advanced Power
Management
DDR3 DRAM
16-bit Controller
Coherency Fabric
Device Bus,
NOR Flash,
NAND Flash,
2 x SPI,
2 x UART,
2 x I2C, SDIO
2 x RGMII/SGMII
Ethernet
Networking
Controllers
DMA/Storage
Engine
Mbus Crossbar Switch
Securtiy Engine
I2S and
S/PDIF Audio
2 x SATA II
2 x PCIe 2.0 x 1
TDM Interface
with 2 VoIP
Channels
4 SERDES Lanes
Doc. No. MV-S107978-00 Rev. G
Page 6
2 x USB 2.0
Host/Device
2 x USB
PHY
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Product Overview
88F6707 Block Diagram
ARMv7 CPU,
with FPU
256 KB L2 Cache
32KB L1-I
32KB L1-D
Coherency Fabric
Advanced Power
Management
DDR3 DRAM
16-bit Controller
NAND Flash,
2 x SPI,
2 x UART,
2 x I2C, SDIO
2 x RGMII/SGMII
Ethernet
Networking
Controllers
Mbus Crossbar Switch
DMA/Storage
Engine
Securtiy Engine
2 x USB 2.0
Host/Device
2 x SATA II
2 x PCIe 2.0 x 1
2 x USB PHY
4 SERDES Lanes
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 7
88F6710, 88F6707, and 88F6W11
Hardware Specifications
88F6W11 Block Diagram
ARMv7 CPU,
with FPU
256 KB L2 Cache
32KB L1-I
32KB L1-D
Advanced Power
Management
DDR3 DRAM
16-bit Controller
Coherency Fabric
Device Bus,
NOR Flash,
NAND Flash,
2 x SPI,
2 x UART,
2 x I2C, SDIO
2 x RGMII/SGMII
Ethernet
Networking
Controllers
DMA/Storage
Engine
Mbus Crossbar Switch
Securtiy Engine
I2S and
S/PDIF Audio
2 x PCIe 2.0 x 1
TDM Interface
with 2 VoIP
Channels
4 SERDES Lanes
Doc. No. MV-S107978-00 Rev. G
Page 8
2 x USB 2.0
Host/Device
2 x USB PHY
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Features
FEATURES
The 88F6710, 88F6707, and 88F6W11 include:
• High-performance, dual-issue, and out-of-order
ARMv7 CPU with Floating Point Unit (FPU)
• 256 KB, 4-way L2 cache
• 16-bit SDRAM interface supporting DDR3-1333
memories
• Advanced power management
• Two Ethernet networking controllers
• Four SERDES lanes with versatile muxing options
for SGMII, PCIe, and SATA
• Two x1 PCI Express 2.0 interfaces
• SATA II ports (88F6710/88F6707 only)
• Two USB 2.0 Host/Device ports with
integrated PHY
• Security cryptographic engine
• Integrated DMA/Storage Accelerator engines
(DMA, RAID parity or iSCSI CRC channels)
• Time Division Multiplexing TDM interface
supporting up to two VoIP channels
(88F6710/88F6W11 only)
• 8/16-bit Device bus (88F6710/88F6W11 only)
• 8/16-bit NAND Flash controller
• Two SPI interfaces
Dual-Issue and out-of-order ARMv7-compliant
CPU
• Up to 1.2 GHz
• 2.6 DMIPS/MHz
• Superscalar RISC CPU issues two instructions per
cycle
• Single/double precision Floating Point Unit
(VFP3-16) IEEE 754 compliant
• Compliant with ARMv7 architecture, published in
the ARM Architecture Reference Manual, Second
Edition
• 32-bit instruction set for performance and flexibility
• Thumb-2 and Thumb-EE instruction set for code
density
• Supports DSP instructions to boost performance
for signal processing applications
• MMU-ARMv7 VMSA compliant
• 32-KB L1 Instruction cache four-way
set-associative, physically indexed, physically
tagged, parity protected
• 32-KB L1 Data cache, eight-way set-associative,
physically indexed physically tagged, parity
protected
• MESI cache coherency scheme
• Hit Under Miss (HUM) and multiple outstanding
requests
• Advanced write coalescing support
• Variable stages pipeline—six to ten stages
• Out-of-order execution for increased performance
• In-order retire via a Reordering Buffer (ROB)
• Advanced branch prediction—32 Branch Target
Buffer (BTB) and 1K entries Branch Prediction Unit
(BPU) with GShare algorithm
• Branch Return Stack Point for subroutine call
• 64-bit internal data bus with 64-bit load/store
instructions
• Endianness options—Little, Big, and Mixed
Endianness
• JTAG/ARM-compatible ICE, and Embedded Trace
Module (ETM) for enhanced realtime debug
capabilities
256 KB Unified L2
• Four-way, write-back and write-through cache
• Physically addressed
• Non-blocking pipeline supports multiple
outstanding requests and HUM operation
• I/O direct access to/from L2 cache for all Mbus
masters, allowing descriptors and data to be
directly deposited into the L2 cache
• ECC protected
• Integrated Interchip Sound (I2S) audio in/out
interface or S/PDIF (Sony/Philips Digital
Interconnect Format) interface
(88F6710/88F6W11 Only)
• SD/SDIO/MMC Host interface
• Two 16750 compatible UART ports
Two I2C interfaces
Programmable Timers and Watchdogs
Internal Real Time Clock (RTC)
Internal Thermal Sensor
Internal Spread Spectrum Clock Generator (SSCG)
Interrupt controller with priority scheme
Adaptive Voltage Scaling (AVS) mechanism
Industrial grade devices for -40°C storage/junction
temperature
Internal architecture
• High-bandwidth, low-latency Coherency Fabric
•
•
•
•
•
•
•
•
interconnect between the Marvell® Core Processor
CPU and CPU memory sub-system
• Support for full hardware or software cache
coherency between the CPU and the I/Os
• Advanced Mbus (crossbar extension) architecture
with any-to-any concurrent I/O connectivity
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 9
88F6710, 88F6707, and 88F6W11
Hardware Specifications
DDR3 SDRAM controller
• 16-bit interface
• Supports DDR3 1.35V and 1.5V
• DDR3 up to 667 MHz clock rate (DDR3-1333)
• Clock ratio of 1:N, 2:N, and 3:N between the DDR
SDRAM and the CPU, respectively
• Auto calibration of I/Os output impedance
• Supports four SDRAM ranks
• Supports all DDR devices densities up to 4 Gb x8
or 8 Gb x16
• DDR3 write and read leveling
• DDR3 address mirroring support
• Supports DDR3 BL8
• Supports 2T and 3T modes to enable
high-frequency operation even under heavy-load
configuration
• Supports SDRAM bank interleaving
• Supports up to 32 open pages
• Supports up to 128-byte burst per single memory
access
Advanced Power Management
• CPU dynamic Wait-For-Interrupt mode (Idle)
• CPU dynamic Power-down mode (Deep Idle)
• SDRAM Self Refresh and Power Down modes
• Unused SERDES shutdown
• Selectable clock gating of different interfaces
Two Ethernet Networking Controllers and MACs
• Supports 10/100/1000/2500 Mbps
• Supported interfaces include:
RGMII, MII, GMII, and SGMII
• Supports link aggregation
• Priority queueing on receive based on DA or
VLAN-Tag
• Per queue and per port egress rate shaping
Two PCI Express 2.0 Interfaces
• PCI Express Gen 1.1 at 2.5 Gbps / Gen 2.0 at
5 Gbps
• Port 0 may be configured as Root Complex or
Endpoint; Port 1 is Root Complex only
• x1 link width
• Lane polarity inversion support
• Maximum payload size of 128 bytes
• Single Virtual Channel (VC-0)
• Replay buffer support
• Extended PCI Express configuration space
• Power management: L0s and L1 ASPM active
power state support; software L1 and L2 support
• MSI support as Endpoint
• MSI/MSI-x support as Root Complex
• Error message support
PCI Express master specific features
• Supports DMA bursts between memory and PCI
Express
• Supports up to four outstanding read transactions
• Maximum read request of up to 128 bytes
• Maximum write request of up to 128 bytes
PCI Express target specific features
• Supports reception of up to eight read requests
• Maximum read request of up to 4 KB
• Maximum write request of up to 128 bytes
• Supports PCI Express access to all of the device’s
internal registers
Two USB 2.0 ports
• USB 2.0 compatible with integrated PHY
• Support for interface as a USB Host or Device
(peripheral)
• Enhanced Host Controller interface (EHCI)
compatible as a host
• As a host, supports direct connection to all
peripheral types (LS, FS, HS)
• As a peripheral, connects to all host types (HS, FS)
and hubs
• Six independent endpoints supporting control,
interrupt, bulk, and isochronous data transfers
• Dedicated DMA for data movement between
memory and port
Marvell® 3 Gbps (Gen2i) SATA II interfaces
(88F6710/88F6707 only)
• 88F6707/88F6710: Two ports
• Compliant with SATA II Phase 1 specifications
- Supports SATA II Native Command Queuing
(NCQ), up to 32 outstanding commands
- First party DMA (FPDMA) full support
- Backwards compatible with SATA I devices
Supports queuing based on Marvell® DSA Tag
Layer 2/3/4 frame parsing
Supports long frames (up to 10 KB)
TCP/IP and UDP/IP acceleration on both receive
and transmit
• 802.3az EEE (Energy Efficient Ethernet)
• WOL based on magic packet, ARP filter, user
configurable waking packet
•
•
•
•
Four High Speed Integrated SERDES lanes
• Integrated low-power, high-speed SERDES PHYs,
based on proven Marvell SERDES technology
• Diverse muxing options for the following interfaces:
- 88F6707/88F6710: PCIe, SATA, and SGMII
- 88F6W11: PCIe and SGMII
Doc. No. MV-S107978-00 Rev. G
Page 10
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Features
• Supports SATA II Phase 2 advanced features
- 3 Gbps (Gen2i) SATA II speed
- Port Multiplier (PM)—Performs FIS-based
• 8/16-bit width device support
• Up to 128B burst per a single device bus access
NAND Flash controller
• 8/16-bit width device support
• Hardware ECC supporting SLC and MLC devices
(up to 16-bit ECC per 512B)
• Supports small page (512B) and large page (2KB,
4KB, and 8KB)
• Four chip selects
Two SPI ports
• General purpose SPI interface
• Up to four chip selects
• Configurable clock polarity and clock phase
• Supports direct access to SPI slave
• Boot from serial flash in 24/32-bit address
SD/SDIO/MMC Host interface
• 1-bit/4-bit SD, SDIO, and MMC cards
• SD PHY 1.1 up to 50 MHz
• Supports SDHC cards (SD PHY 2.0)
• Hardware generate/check CRC on all command
and data transaction on card bus
Two UART interfaces
• 16750 UART compatible
• Each port has two pins for transmit and receive
operations, and two pins for modem control
functions
Integrated programable 32-bit timers/counters
and watchdog timers
Interrupt controller
• Advanced interrupt controller with interrupt
prioritization mechanism
switching as defined in SATA working group PM
definition
- Port Selector (PS)—Issues the protocol-based
Out-Of-Band (OOB) sequence to select the
active host port
•
•
•
•
Supports external SATA (eSATA)
Supports device 48-bit addressing
Supports ATA Tag Command Queuing
Enhanced-DMA [EDMA] for the SATA port
- Automatic command execution without host
intervention
- Command queuing support, for up to 32
outstanding commands
- Separate SATA request/response queues
- 64-bit addressing support for descriptors and
data buffers in system memory
• Read ahead
• Advanced interrupt coalescing
• Advanced drive diagnostics via the ATA SMART
command
Cryptographic engine
• Hardware implementation of the IPsec encryption
and authentication protocols to boost packet
processing speed
• Implements AES, DES, and 3DES encryption
algorithms
• Implements SHA1, SHA2, and MD5 authentication
algorithms
• Supports storage de-duplication acceleration
Two DMA/Storage Acceleration Engines
• Two channels per engine
• RAID parity calculation on up to eight source blocks
• iSCSI CRC-32 calculation
• Memory initialization
TDM interface (88F6710/88F6W11 only)
• Generic interface to standard
SLIC/SLAC/DAA/codec devices
• Compatible with standard PCM highway formats
• TDM protocol support for two VoIP channels, up to
128 time slots
• Two integrated DMA engines to transfer voice data
to/from memory buffer
Device Bus controller (88F6710/88F6W11 only)
• 16-bit multiplexed address/data bus
• Supports different types of standard memory
devices such as NOR Flash and ROM
• Five chip selects with programmable timing
• Optional external wait-state support
Two I2C interfaces
• General purpose I2C master/slave
• EEPROM Serial initialization support
I2S, S/PDIF Audio In/Out interface
(88F6710/88F6W11 only)
• Either I2S or S/PDIF inputs can be active at one
time
• Both I2S and S/PDIF outputs can be
simultaneously active, transferring the same PCM
data
• I2S-specific features
- Sample rates of 44.1/48/96 kHz
- I2S input and I2S output operate at the same
sample rate
- I2S input and I2S output support independent bit
depths (16/24-bit)
- Supports plain I2S, right-justified and left-justified
formats
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 11
88F6710, 88F6707, and 88F6W11
Hardware Specifications
• S/PDIF-specific features
- Compliant with 60958-1, 60958-3, and
Clock generation support
• Core PLL for internal generation of Core clock,
PCIe clock, GbE clock, USB clock, and SATA clock
from a single 25-MHz crystal reference clock
• CPU PLL for internal generation of CPU clock,
L2 clock and SDRAM clock
• TDM PLL for internal generation of TDM clock
• Audio DCO for internal generation of audio clocks
(88F6710 only)
• Supports internal generation of spread spectrum
clocking on the CPU and SDRAM clocks
286-pin HSBGA 19 x 19 mm, 1 mm ball pitch,
green compliant package
IEC61937 specifications
- Sample rates of 44.1/48/96 kHz
- 16/20/24-bit depths
Real Time Clock
Integrated BootROM
• Boot from SPI Flash, Parallel NOR Flash, SATA,
NAND Flash, PCIe, and UART
Multi-purpose pins dedicated for peripheral
functions and General Purpose I/O (GPIO)
• Each pin can be configured independently
• GPIO inputs can be used to register interrupts from
external devices, and generate maskable interrupts
Doc. No. MV-S107978-00 Rev. G
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Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Table of Contents
Table of Contents
Revision History ....................................................................................................................................... 3
Product Overview ....................................................................................................................................... 5
Features....................................................................................................................................................... 9
Preface ..................................................................................................................................................... 21
About this Document ..................................................................................................................................... 21
Relevant Devices .......................................................................................................................................... 21
Related Documentation ................................................................................................................................. 21
Document Conventions ................................................................................................................................. 22
1
Product Summary ...................................................................................................................... 23
2
Pin Information .......................................................................................................................... 25
2.1
Pin Logic ....................................................................................................................................................... 25
2.2
Pin Descriptions ............................................................................................................................................ 29
2.3
Internal Pull-up and Pull-down Pins .............................................................................................................. 63
3
Unused Interface Strapping ...................................................................................................... 64
4
88F6710, 88F6707, and 88F6W11 Pin Maps and Pin Lists ..................................................... 66
5
Clocking ..................................................................................................................................... 67
5.1
Clock Frequency Configuration Options ........................................................................................................ 68
5.2
Spread Spectrum Clock Generator (SSCG) .................................................................................................. 68
6
Pin Multiplexing ......................................................................................................................... 69
6.1
Multi Purpose Pins Functional Summary ...................................................................................................... 69
6.2
Multi Purpose Pins Power Segments ............................................................................................................ 70
6.3
Multi Purpose Pins Functional Considerations .............................................................................................. 71
6.4
Gigabit Ethernet Pins Multiplexing on the MPP ............................................................................................. 71
6.5
High-Speed SERDES Multiplexing ................................................................................................................ 73
6.6
Device Bus/NAND Flash Multiplexing (88F6710/88F6W11 Only) ................................................................. 74
7
Reset and Initialization .............................................................................................................. 76
7.1
Power Up/Down Sequence ........................................................................................................................... 76
7.2
Hardware Reset ............................................................................................................................................ 78
7.3
PCI Express Reset ........................................................................................................................................ 79
7.4
Power On Reset (POR) ................................................................................................................................. 80
7.5
Reset Configuration ...................................................................................................................................... 80
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 13
88F6710, 88F6707, and 88F6W11
Hardware Specifications
7.6
Serial ROM Initialization ................................................................................................................................ 81
7.7
Boot Sequence .............................................................................................................................................. 83
8
JTAG Interface ........................................................................................................................... 84
8.1
CoreSight™ Subsystem ARMv7 Mode ......................................................................................................... 85
8.2
Instruction Register ....................................................................................................................................... 85
8.3
Bypass Register ............................................................................................................................................ 86
8.4
JTAG Scan Chain ......................................................................................................................................... 86
8.5
ID Register .................................................................................................................................................... 86
9
Electrical Specifications ........................................................................................................... 87
9.1
Absolute Maximum Ratings .......................................................................................................................... 87
9.2
Recommended Operating Conditions ........................................................................................................... 89
9.3
Thermal Power Dissipation ........................................................................................................................... 91
9.4
Current Consumption .................................................................................................................................... 93
9.5
DC Electrical Specifications .......................................................................................................................... 94
9.6
AC Electrical Specifications ........................................................................................................................ 103
9.7
Differential Interface Electrical Characteristics ............................................................................................ 137
10
Thermal Data ............................................................................................................................ 157
11
Package .................................................................................................................................... 158
12
Part Order Numbering/Package Marking .............................................................................. 159
12.1
Part Order Numbering ................................................................................................................................. 159
12.2
Package Marking ........................................................................................................................................ 161
Doc. No. MV-S107978-00 Rev. G
Page 14
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
List of Tables
List of Tables
Revision History ....................................................................................................................................... 3
Table 1:
Revision History ............................................................................................................................... 3
Preface ..................................................................................................................................................... 21
1
Product Summary ........................................................................................................................... 23
Table 2:
2
88F6710, 88F6707, and 88F6W11 Similarities and Differences .................................................... 23
Pin Information ............................................................................................................................... 25
Table 3:
Interface Pin Prefixes ...................................................................................................................... 29
Table 4:
Power Supply Pins Description ....................................................................................................... 31
Table 5:
Adaptive Voltage Scaling (AVS) Pin Description ............................................................................ 32
Table 6:
Reduced Gigabit Media Independent Interface (RGMII) Pin Description ....................................... 33
Table 7:
Gigabit Media Independent Interface (GMII) Pin Description ......................................................... 34
Table 8:
Media Independent Interface (MII) Pin Description ........................................................................ 35
Table 9:
Serial Gigabit Media Independent Interface (SGMII) Pin Description ............................................. 36
Table 10:
General Purpose Pins (GPP) Pin Description ................................................................................ 37
Table 11:
Inter-IC Sound (I2S) Interface Pin Description ............................................................................... 38
Table 12:
JTAG Interface Pin Description ...................................................................................................... 39
Table 13:
Miscellaneous Pin Description ........................................................................................................ 40
Table 14:
Multi Purpose Pins (MPP) Pin Description ...................................................................................... 41
Table 15:
Device Bus Pin Description ............................................................................................................ 42
Table 16:
NAND Flash Interface Pin Description ............................................................................................ 43
Table 17:
PCI Express 0 (PCIe) Interface Pin Description ............................................................................. 45
Table 18:
PCI Express 1 (PCIe) Interface Pin Description ............................................................................. 46
Table 19:
Power Management Unit Pin Description ....................................................................................... 47
Table 20:
Crystal Reference Clock Pin Description ........................................................................................ 48
Table 21:
Real Time Clock (RTC) Interface Pin Description ........................................................................... 49
Table 22:
Serial-ATA (SATA) Interface Pin Description .................................................................................. 50
Table 23:
Secure Digital Input/Output (SDIO) Interface Pin Description ........................................................ 51
Table 24:
SDRAM DDR3 Interface Pin Description ........................................................................................ 52
Table 25:
Serial Management Interface (SMI) Pin Description ....................................................................... 55
Table 26:
Sony/Philips Digital Interface (S/PDIF) Pin Description .................................................................. 56
Table 27:
Serial Peripheral Interface (SPI) Pin Description ............................................................................ 57
Table 28:
Time Division Multiplexing (TDM) Interface Pin Description ........................................................... 58
Table 29:
I2C Interface Pin Description .......................................................................................................... 59
Table 30:
Universal Asynchronous Receiver Transmitter (UART) Interface Pin Description ......................... 60
Table 31:
Universal Serial Bus (USB) 2.0 Interface Pin Description ............................................................... 61
Table 32:
Reserved/Not Connected (NC) Pins Description ............................................................................ 62
Table 33:
Internal Pull-up Pins ........................................................................................................................ 63
Table 34:
Internal Pull-down Pins ................................................................................................................... 63
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 15
88F6710, 88F6707, and 88F6W11
Hardware Specifications
3
Unused Interface Strapping ........................................................................................................... 64
Table 35:
Unused Interface Strapping ............................................................................................................ 64
4
88F6710, 88F6707, and 88F6W11 Pin Maps and Pin Lists .......................................................... 66
5
Clocking ........................................................................................................................................... 67
Table 36:
6
7
8
9
Clock Frequency Options ............................................................................................................... 68
Pin Multiplexing .............................................................................................................................. 69
Table 37:
VDDO Voltage Configuration Options ............................................................................................ 70
Table 38:
Gigabit Ethernet Pins Multiplexing .................................................................................................. 72
Table 39:
88F6710, 88F6707, and 88F6W11 SERDES Lanes Multiplex Options .......................................... 73
Table 40:
Device Bus/NAND Flash Multiplexing ............................................................................................. 74
Reset and Initialization ................................................................................................................... 76
Table 41:
I/O and Core Voltages .................................................................................................................... 76
Table 42:
Power-Up Sequence Symbols ........................................................................................................ 77
JTAG Interface ................................................................................................................................ 84
Table 43:
Supported JTAG Instructions .......................................................................................................... 85
Table 44:
IDCODE Register Map ................................................................................................................... 86
Electrical Specifications ................................................................................................................ 87
Table 45:
Absolute Maximum Ratings ............................................................................................................ 87
Table 46:
Recommended Operating Conditions ............................................................................................. 89
Table 47:
Core and CPU Thermal Power Dissipation ..................................................................................... 91
Table 48:
I/O Interface Thermal Power Dissipation ........................................................................................ 92
Table 49:
Current Consumption ...................................................................................................................... 93
Table 50:
General 3.3V Interface (CMOS) DC Electrical Specifications ......................................................... 94
Table 51:
General 2.5V Interface (CMOS) DC Electrical Specifications ......................................................... 95
Table 52:
General 1.8V Interface (CMOS) DC Electrical Specifications ......................................................... 96
Table 53:
SDRAM DDR3 (1.5V) Interface DC Electrical Specifications ......................................................... 97
Table 54:
SDRAM DDR3L (1.35V) Interface DC Electrical Specifications ..................................................... 98
Table 55:
I2C Interface 3.3V DC Electrical Specifications .............................................................................. 99
Table 56:
SPI Interface 3.3V DC Electrical Specifications .............................................................................. 99
Table 57:
TDM Interface 3.3V DC Electrical Specifications .......................................................................... 100
Table 58:
NAND Flash 1.8V DC Electrical Specification .............................................................................. 101
Table 59:
NAND Flash 3.3V DC Electrical Specification .............................................................................. 101
Table 60:
AVS DC Electrical Specification ................................................................................................... 102
Table 61:
Reference Clock and Reset AC Timing Specifications ................................................................ 103
Table 62:
RGMII AC Timing Table ................................................................................................................ 106
Table 63:
GMII AC Timing Table .................................................................................................................. 108
Table 64:
MII MAC Mode AC Timing Table .................................................................................................. 110
Table 65:
SMI Master Mode AC Timing Table .............................................................................................. 112
Table 66:
SDRAM DDR3 Interface AC Timing Table ................................................................................... 114
Table 67:
SDIO Host in High-Speed Mode AC Timing Table ....................................................................... 117
Table 68:
MMC High Speed Host AC Timing Table ..................................................................................... 119
Doc. No. MV-S107978-00 Rev. G
Page 16
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
List of Tables
10
Table 69:
Device Bus Interface AC Timing Table ......................................................................................... 121
Table 70:
SPI (Master Mode) AC Timing Table ............................................................................................ 123
Table 71:
I2C Master AC Timing Table ........................................................................................................ 125
Table 72:
I2C Slave AC Timing Table .......................................................................................................... 125
Table 73:
JTAG Interface AC Timing Table .................................................................................................. 127
Table 74:
NAND Flash AC Timing Table ...................................................................................................... 129
Table 75:
TDM Interface AC Timing Table ................................................................................................... 131
Table 76:
Inter-IC Sound (I2S) AC Timing Table .......................................................................................... 133
Table 77:
S/PDIF AC Timing Table .............................................................................................................. 135
Table 78:
PCI Express Interface Differential Reference Clock Characteristics ............................................ 138
Table 79:
PCI Express Interface Spread Spectrum Requirements ............................................................... 138
Table 80:
PCI Express 1.1 Interface Driver and Receiver Characteristics ................................................... 139
Table 81:
PCI Express 2.0 Interface Driver and Receiver Characteristics ................................................... 140
Table 82:
SATA I Interface Gen1i Mode Driver and Receiver Characteristics ............................................. 142
Table 83:
SATA II Interface Gen2i Mode Driver and Receiver Characteristics ............................................ 144
Table 84:
SATA II Interface Gen2m Mode Driver and Receiver Characteristics .......................................... 145
Table 85:
USB Low Speed Driver and Receiver Characteristics .................................................................. 146
Table 86:
USB Full Speed Driver and Receiver Characteristics ................................................................... 147
Table 87:
USB High Speed Driver and Receiver Characteristics ................................................................. 148
Table 88:
SGMII Interface Driver and Receiver Characteristics (1000BASE-X) ........................................... 150
Table 89:
SGMII Interface Settings and Configuration (1000 BASE-X) ........................................................ 151
Table 90:
DR-SGMII Driver and Receiver Characteristics ............................................................................ 153
Table 91:
DR-SGMII Settings and Configuration .......................................................................................... 154
Thermal Data ................................................................................................................................. 157
Table 92:
11
12
Thermal Data for the 88F6710, 88F6707, and 88F6W11 in HSBGA Package ............................. 157
Package ......................................................................................................................................... 158
Part Order Numbering/Package Marking .................................................................................... 159
Table 93:
88F6710, 88F6707, and 88F6W11 Commercial Grade Part Order Options ................................. 160
Table 94:
88F6710, 88F6707, and 88F6W11 Industrial Grade Part Order Options ..................................... 160
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 17
88F6710, 88F6707, and 88F6W11
Hardware Specifications
List of Figures
Revision History ....................................................................................................................................... 3
Product Overview ..................................................................................................................................... 5
88F6710 Block Diagram .......................................................................................................................................6
88F6707 Block Diagram .......................................................................................................................................7
88F6W11 Block Diagram ......................................................................................................................................8
Features ..................................................................................................................................................... 9
Preface ..................................................................................................................................................... 21
1
Product Summary ........................................................................................................................... 23
2
Pin Information ............................................................................................................................... 25
Figure 1:
88F6710 Pin Logic Diagram ........................................................................................................... 26
Figure 2:
88F6707 Pin Logic Diagram ........................................................................................................... 27
Figure 3:
88F6W11 Pin Logic Diagram .......................................................................................................... 28
3
Unused Interface Strapping ........................................................................................................... 64
4
88F6710, 88F6707, and 88F6W11 Pin Maps and Pin Lists .......................................................... 66
5
Clocking ........................................................................................................................................... 67
6
Pin Multiplexing .............................................................................................................................. 69
7
Reset and Initialization ................................................................................................................... 76
8
Figure 4:
Power Up Sequence Example ........................................................................................................ 77
Figure 5:
Serial ROM Data Structure ............................................................................................................. 82
Figure 6:
Serial ROM Read Example ............................................................................................................. 83
JTAG Interface ................................................................................................................................ 84
Figure 7:
9
CoreSight Subsystem ARMv7 Mode ............................................................................................. 85
Electrical Specifications ................................................................................................................ 87
Figure 8:
TCLK_OUT Reference Clock Test Circuit .................................................................................... 105
Figure 9:
TCLK_OUT AC Timing Diagram ................................................................................................... 105
Figure 10:
RGMII Test Circuit ........................................................................................................................ 106
Figure 11:
RGMII AC Timing Diagram ........................................................................................................... 107
Figure 12:
GMII Test Circuit ........................................................................................................................... 108
Figure 13:
GMII Output AC Timing Diagram .................................................................................................. 109
Figure 14:
GMII Input AC Timing Diagram ..................................................................................................... 109
Figure 15:
MII MAC Mode Test Circuit ........................................................................................................... 110
Figure 16:
MII MAC Mode Output Delay AC Timing Diagram ........................................................................ 110
Doc. No. MV-S107978-00 Rev. G
Page 18
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
List of Figures
Figure 17:
MII MAC Mode Input AC Timing Diagram ..................................................................................... 111
Figure 18:
MDIO Master Mode Test Circuit ................................................................................................... 112
Figure 19:
MDC Master Mode Test Circuit .................................................................................................... 113
Figure 20:
SMI Master Mode Output AC Timing Diagram ............................................................................. 113
Figure 21:
SMI Master Mode Input AC Timing Diagram ................................................................................ 113
Figure 22:
SDRAM DDR3 Interface Test Circuit ............................................................................................ 115
Figure 23:
SDRAM DDR3 Interface Write AC Timing Diagram ..................................................................... 115
Figure 24:
SDRAM DDR3 Interface Address and Control AC Timing Diagram ............................................. 116
Figure 25:
SDRAM DDR3 Interface Read AC Timing Diagram ..................................................................... 116
Figure 26:
Secure Digital Input/Output (SDIO) Test Circuit ........................................................................... 117
Figure 27:
SDIO Host in High Speed Mode Output AC Timing Diagram ....................................................... 118
Figure 28:
SDIO Host in High Speed Mode Input AC Timing Diagram .......................................................... 118
Figure 29:
MMC Test Circuit .......................................................................................................................... 119
Figure 30:
MMC High-Speed Host Output AC Timing Diagram ..................................................................... 120
Figure 31:
MMC High-Speed Host Input AC Timing Diagram ........................................................................ 120
Figure 32:
Device Bus Interface Test Circuit ................................................................................................. 121
Figure 33:
Device Bus Interface Output Delay AC Timing Diagram .............................................................. 122
Figure 34:
Device Bus Interface Input AC Timing Diagram ........................................................................... 122
Figure 35:
SPI (Master Mode) Test Circuit .................................................................................................... 123
Figure 36:
SPI (Master Mode) AC Timing Diagram ....................................................................................... 124
Figure 37:
I2C Test Circuit ............................................................................................................................. 126
Figure 38:
I2C Output Delay AC Timing Diagram .......................................................................................... 126
Figure 39:
I2C Input AC Timing Diagram ....................................................................................................... 126
Figure 40:
JTAG Interface Test Circuit .......................................................................................................... 127
Figure 41:
JTAG Interface Output Delay AC Timing Diagram ....................................................................... 128
Figure 42:
JTAG Interface Input AC Timing Diagram .................................................................................... 128
Figure 43:
NAND Flash Test Circuit ............................................................................................................... 129
Figure 44:
NAND Flash Input AC Timing Diagram ......................................................................................... 130
Figure 45:
TDM Interface Test Circuit ............................................................................................................ 132
Figure 46:
TDM Interface Output Delay AC Timing Diagram ......................................................................... 132
Figure 47:
TDM Interface Input Delay AC Timing Diagram ............................................................................ 132
Figure 48:
Inter-IC Sound (I2S) Test Circuit .................................................................................................. 133
Figure 49:
Inter-IC Sound (I2S) Output Delay AC Timing Diagram ............................................................... 134
Figure 50:
Inter-IC Sound (I2S) Input AC Timing Diagram ............................................................................ 134
Figure 51:
S/PDIF Test Circuit ....................................................................................................................... 136
Figure 52:
PCI Express Interface 1.1 Test Circuit .......................................................................................... 141
Figure 53:
PCI Express Interface 2.0 Test Circuit .......................................................................................... 141
Figure 54:
Low/Full Speed Data Signal Rise and Fall Time .......................................................................... 148
Figure 55:
High Speed TX Eye Diagram Pattern Template ........................................................................... 149
Figure 56:
High Speed RX Eye Diagram Pattern Template ........................................................................... 149
Figure 57:
Tri-Speed Interface Driver Output Voltage Limits And Definitions ................................................ 151
Figure 58:
Driver Output Differential Amplitude and Eye Opening ................................................................ 152
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 19
88F6710, 88F6707, and 88F6W11
Hardware Specifications
10
11
Figure 59:
DR-SGMII Driver Output Voltage Limits and Definitions ............................................................... 155
Figure 60:
DR-SGMII Driver Output Differential Voltage under Pre-emphasis .............................................. 156
Figure 61:
DR-SGMII Driver Output Differential Amplitude and Eye Opening ............................................... 156
Thermal Data ................................................................................................................................. 157
Package ......................................................................................................................................... 158
Figure 62:
12
HSBGA 19x19 mm, 286-pin Package and Dimensions ................................................................ 158
Part Order Numbering/Package Marking .................................................................................... 159
Figure 63:
Sample Part Number .................................................................................................................... 159
Figure 64:
Sample Package Marking and Pin 1 Location .............................................................................. 161
Doc. No. MV-S107978-00 Rev. G
Page 20
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Preface
About this Document
Preface
About this Document
This datasheet provides the hardware specifications for the 88F6710, 88F6707, and 88F6W11. The
hardware specifications include detailed pin information, configuration settings, electrical
characteristics and physical specifications.
This datasheet is intended to be the basic source of information for designers of new systems.
All of the features and interfaces described in this document do not necessarily apply to all of the
devices. It is noted in the document if a feature or interface only applies to specific device(s). Also,
see Table 1, Product Summary, on page 23 for a list of features and interfaces relevant to each of
the devices.
In this document, the 88F6710, 88F6707, and 88F6W11 are often referred to as
“88F6710/6707/6W11” or the “device”.
Relevant Devices
88F6707
88F6710
88F6W11
Related Documentation
The following documents contain additional information related to the 88F6710, 88F6707, and
88F6W11. For the latest revision, contact a Marvell representative.
88F6707, 88F6710, and 88F6W11 Functional Specifications, Doc No. MV-S107979-00
88F6707, 88F6710, and 88F6W11 Hardware Design Guide, Doc No. MV-S302079-00
TB-300: Differences Between Revisions A0 and A1 of the ARMADA® 370 88F6707 and
88F6W11 Devices, Doc No. MV-S108325-00
See the Marvell Extranet website for the latest product documentation.
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 21
88F6710, 88F6707, and 88F6W11
Hardware Specifications
Document Conventions
The following conventions are used in this document:
Signal Range
A signal name followed by a range enclosed in brackets represents a range of logically related
signals. The first number in the range indicates the most significant bit (MSb) and the last
number indicates the least significant bit (LSb).
Example: DB_Addr[12:0]
Active Low Signals #
An n letter at the end of a signal name indicates that the signal’s active state occurs when
voltage is low.
Example: INTn
State Names
State names are indicated in italic font.
Example: linkfail
Register Naming
Conventions
Register field names are indicated by angle brackets.
Example: <RegInit>
Register field bits are enclosed in brackets.
Example: Field [1:0]
Register addresses are represented in hexadecimal format.
Example: 0x0
Reserved: The contents of the register are reserved for internal use only or for future use.
A lowercase <n> in angle brackets in a register indicates that there are multiple registers with
this name.
Example: Multicast Configuration Register<n>
Reset Values
Reset values have the following meanings:
0 = Bit clear
1 = Bit set
Abbreviations
Kb: kilobit
KB: kilobyte
Mb: megabit
MB: megabyte
Gb: gigabit
GB: gigabyte
Numbering Conventions
Unless otherwise indicated, all numbers in this document are decimal (base 10).
An 0x prefix indicates a hexadecimal number.
An 0b prefix indicates a binary number.
Doc. No. MV-S107978-00 Rev. G
Page 22
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Product Summary
1
Product Summary
Table 2 summarizes the interface similarities and differences between the 88F6707 and 88F6W11
devices.
Table 2:
88F6710, 88F6707, and 88F6W11 Similarities and Differences
F ea t ur e
88F6710
88F6707
8 8 F 6 W 11
Similarities
Single Marvell® Core Processor ARMv7- compliant CPU, with a
Floating Point Unit (FPU)
Up to 1.2 GHz
Shared L2 cache
256 KB, 4-way L2 cache
DDR3 SDRAM Interface
16-bit Width DDR3-1333 MHz
Gigabit Ethernet Interface
GMII/MII/RGMII/SGMII
These options are multiplexed with other functionality
2 Ports
SERDES Lanes
Multiplex of:
• SGMII
• PCIe
• SATA
4 Lanes
PCI Express (PCIe) Gen2.0 Interface
PCIe SERDES lanes are multiplexed with other functionality
2 x 1 PCIe Interfaces
8/16-bit Width
NAND Flash Controller
USB2.0 Interface
2 Host/Device Ports with integrated PHY
Cryptographic Engine and Security Accelerator (CESA)
XOR DMA Engine
Integrated CESA for network security.
2 XOR DMA Engines (4 Channels)
Serial Peripheral Interface (SPI)
2 Interfaces
SDIO/MMC Interface
Supports Host Interface
16750-Compatible UART Interface
2 Interfaces
Advanced Power Management Unit
Supported
Advanced Interrupt Controller
Supported
Adaptive Voltage Scaling (AVS)
Supported
Integrated programable 32-bit timers/counters and
watchdog timers
Supported
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 23
88F6710, 88F6707, and 88F6W11
Hardware Specifications
Table 2:
88F6710, 88F6707, and 88F6W11 Similarities and Differences (Continued)
F ea t ur e
88F6710
88F6707
Internal Real Time Clock (RTC)
Supported
Internal Thermal Sensor
Supported
Internal Spread Spectrum Clock Generator (SSCG)
Supported
Interrupt controller with priority scheme
Supported
8 8 F 6 W 11
Differences
Integrated Interchip Sound (I2S) audio in/out interface or
S/PDIF (Sony/Philips Digital Interconnect Format) interface
Supported
Unsupported
Supported
8/16-bit Width Device Bus
Supported
Unsupported
Supported
Time Division Multiplexing Interface (TDM) (2 Channels)
2 Channels
Unsupported
2 Channels
Serial ATA II (SATA II) Interface with Integrated PHY(s)
2 Ports
2 Ports
Unsupported
Doc. No. MV-S107978-00 Rev. G
Page 24
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Pin Information
Pin Logic
2
Pin Information
This section provides the pin logic diagram for the device and a detailed description of the pin
assignments and their functionality.
2.1
Pin Logic
This section provides the pin logic diagram for the 88F6710, 88F6707, and 88F6W11.
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 25
88F6710, 88F6707, and 88F6W11
Hardware Specifications
Figure 1: 88F6710 Pin Logic Diagram
AU_I2SBCLK
M _A[15:0]
AU_I2SDI
AU_I2SDO
AU_EXTCLK
M _BA[2:0]
M _CASn
I2S
M _CLKOUT[1:0]/M _CLKOUTn[1:0]
AU_I2SLRCLK
M _CKE[1:0]
AU_I2SM CLK
M _CSn[3:0]
SDRAM
JT_CLK
M _DQ[15:0]
JT_TDI
JT_TDO
JT_TM S_CORE
M _DQS[1:0]/M _DQSn[1:0]
M _ODT[3:0]
JTAG
M _RASn
JT_TM S_CPU
M _RESETn
JT_RSTn
M _WEn
CDRn
SMI
M Rn
SYSRST_OUTn
M _DM [1:0]
GE_M DC
GE_M DIO
Miscellaneous
SYSRSTn
AU_SPDIFI
SPDIF
TCLK_OUT
AU_SPDIFRM CLK
AU_SPDIFO
M PP[65:0]
MPP
DEV_A[2:0]
NF_ALE
DEV_AD[15:0]
NF_CSn[3:0]
DEV_ALE[1:0]
NF_CLE
NF_IO[15:0]
DEV_BOOTCSn
NAND Flash
Device Bus
NF_RDYn
DEV_BURSTn_LASTn
DEV_CSn[3:0]
NF_REn
DEV_OEn
NF_WEn
DEV_READYn
DEV_WEn[1:0]
PEX0_CLK_P/N
PEX1_CLK_P/N
PCIe_CLKREQ<n>
PCIe
PEX_RST_OUTn
SPI0_CSn[3:0]
SPI
PEX<n>x1_TX_P/N
PEX<n>x1_RX_P/N
SPI1_CSn[1:0]
SPI<n>_M ISO
SPI<n>_M OSI
n = 0 thru 1
SPI<n>_SCK
n = 0 thru 1
VDD_CPU_PD
PMU
TDM _INTn
REF_CLK_XIN
XOUT
Crystal
Reference
TDM _RSTn
TDM
GE<n>_RXCLK
GE<n>_TXCLKOUT
TDM _DTX
TDM _FSYNC
GE<n>_RXCTL
GE<n>_RXD[3:0]
TDM _DRX
TDM _PCLK
Ethernet
I2C<n>_SCK
I2C
GE<n>_TXCTL
GE<n>_TXD[3:0]
I2C<n>_SDA
n = 0 thru 1
n = 0 thru 1
UA<n>_CTS
RTC_XIN
RTC_XOUT
RTC
UA<n>_RTS
UART
UA<n>_RXD
UA<n>_TXD
SATA<n>_PRESENT_ACTIVEn
SATA<n>_RX_P/N
SATA<n>_TX_P/N
n = 0 thru 1
SATA
USB
n = 0 thru 1
SD_CLK
SD_CM D
SDIO/MMC
SGMII
SD_D[3:0]
n = 0 thru 1
SGM II<n>_RX_P/N
SGM II<n>_TX_P/N
n = 0 thru 1
AVS
Doc. No. MV-S107978-00 Rev. G
Page 26
USB<n>_DP/M
AVS_FB
Copyright © 2014 Marvell
Document Classification: Proprietary Information
April 3, 2014, Preliminary
Pin Information
Pin Logic
Figure 2: 88F6707 Pin Logic Diagram
M _A[ 15:0]
M _BA[ 2:0]
JT_CLK
M _CASn
JT_TDI
M _CLKOUT[ 1:0]/ M _CLKOUTn[ 1:0]
JT_TDO
JT_TM S_CORE
M _CKE[ 1:0]
JTAG
M _CSn[ 3:0]
SDRAM
JT_TM S_CPU
JT_RSTn
M _DM [ 1:0]
M _DQ[ 15:0]
M _DQS[1:0] /M _DQSn[ 1:0]
CDRn
M _ODT[3:0]
M Rn
SYSRST_OUTn
M _RASn
Miscellaneous
M _RESETn
SYSRSTn
M _WEn
TCLK_OUT
M PP[ 65:0]
MPP
SMI
NF_ALE
GE_M DIO
SPI0_CSn[ 3:0]
NF_CSn[ 3:0]
SPI1_CSn[ 1:0]
SPI
NF_CLE
NF_IO[ 15:0]
GE_M DC
NAND Flash
SPI<n>_M ISO
SPI<n>_M OSI
NF_RDYn
SPI<n>_SCK
NF_REn
n = 0 t hru 1
NF_WEn
I2C<n>_SCK
I2C
PEX0_CLK_P/ N
PEX1_CLK_P/ N
PCIe_CLKREQ<n>
PEX_RST_OUTn
I2C<n>_SDA
n = 0 t hru 1
PCIe
UA<n>_CTS
PEX<n>x1_TX_P/ N
UA<n>_RTS
UART
PEX<n>x1_RX_P/ N
n = 0 thru 1
UA<n>_RXD
UA<n>_TXD
n = 0 t hru 1
VDD_CPU_PD
REF_CLK_XIN
XOUT
PMU
Crystal
Reference
USB
SGMII
GE<n>_RXCLK
GE<n>_RXCTL
GE<n>_RXD[ 3:0]
GE<n>_TXCLKOUT
USB<n>_DP/ M
n = 0 t hru 1
SGM II<n>_RX_P/N
SGM II<n>_TX_P/N
n = 0 t hru 1
Ethernet
RTC
GE<n>_TXCTL
RTC_XIN
RTC_XOUT
GE<n>_TXD[ 3:0]
AVS
n = 0 thru 1
AVS_FB
SATA<n>_PRESENT_ACTIVEn
SATA<n>_RX_P/ N
SATA<n>_TX_P/ N
SATA
n = 0 thru 1
SD_CLK
SD_CM D
SDIO/MMC
SD_D[ 3:0]
Copyright © 2014 Marvell
April 3, 2014, Preliminary
Doc. No. MV-S107978-00 Rev. G
Document Classification: Proprietary Information
Page 27
88F6710, 88F6707, and 88F6W11
Hardware Specifications
Figure 3: 88F6W11 Pin Logic Diagram
JT_CLK
M _A[15:0]
JT_TDI
M _BA[2:0]
JT_TDO
JT_TM S_CORE
M _CASn
JTAG
M _CLKOUT[1:0]/M _CLKOUTn[1:0]
JT_TM S_CPU
M _CKE[1:0]
JT_RSTn
M _CSn[3:0]
SDRAM
CDRn
M _DQ[15:0]
M Rn
SYSRST_OUTn
M _DM [1:0]
M _DQS[1:0]/M _DQSn[1:0]
Miscellaneous
M _ODT[3:0]
SYSRSTn
M _RASn
TCLK_OUT
M _RESETn
M _WEn
M PP[65:0]
MPP
SMI
NF_ALE
GE_M DC
GE_M DIO
NF_CSn[3:0]
NF_CLE
NF_IO[15:0]
DEV_A[2:0]
NAND Flash
DEV_AD[15:0]
NF_RDYn
DEV_ALE[1:0]
NF_REn
DEV_BOOTCSn
Device Bus
NF_WEn
DEV_BURSTn_LASTn
DEV_CSn[3:0]
PEX0_CLK_P/N
DEV_OEn
PEX1_CLK_P/N
PCIe_CLKREQ<n>
PEX_RST_OUTn
DEV_READYn
DEV_WEn[1:0]
PCIe
PEX<n>x1_TX_P/N
PEX<n>x1_RX_P/N
SPI0_CSn[3:0]
n = 0 thru 1
SPI1_CSn[1:0]
SPI
VDD_CPU_PD
PMU
SPI<n>_M ISO
SPI<n>_M OSI
SPI<n>_SCK
REF_CLK_XIN
XOUT
Crystal
Reference
n = 0 thru 1
I2C<n>_SCK
I2C
GE<n>_RXCLK
GE<n>_RXCTL
GE<n>_RXD[3:0]
GE<n>_TXCLKOUT
I2C<n>_SDA
n = 0 thru 1
Ethernet
UA<n>_CTS
GE<n>_TXCTL
UA<n>_RTS
UART
GE<n>_TXD[3:0]
n = 0 thru 1
UA<n>_RXD
UA<n>_TXD
n = 0 thru 1
RTC_XIN
RTC_XOUT
RTC
USB
USB<n>_DP/M
n = 0 thru 1
SD_CLK
SD_CM D
SDIO/MMC
SD_D[3:0]
SGMII
SGM II<n>_RX_P/N
SGM II<n>_TX_P/N
n = 0 thru 1
AU_I2SBCLK
AVS
AU_I2SDI
AU_I2SDO
AU_EXTCLK
I2S
TDM _INTn
AU_I2SLRCLK
AU_I2SM CLK
AVS_FB
TDM _RSTn
TDM
TDM _DRX
TDM _DTX
TDM _FSYNC
TDM _PCLK
AU_SPDIFI
SPDIF
AU_SPDIFRM CLK
AU_SPDIFO
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Pin Information
Pin Descriptions
2.2
Pin Descriptions
This section details all the pins for the different interfaces providing a functional description of each
pin and pin attributes.
The following list defines the abbreviations and acronyms used in the pin description tables.
Te r m
D e fi n it io n
<n>
Represents port number when there are more than one ports
Analog
Analog Driver/Receiver or Power Supply
Calib
Calibration pad type
CML
Current Mode Logic
CMOS
Complementary Metal-Oxide-Semiconductor
DDR
Double Data Rate
GND
Ground Supply
HCSL
High-speed Current Steering Logic
I
Input
I/O
Input/Output
O
Output
OD
Open Drain pin
Power
Power Supply
SDR
Single Data Rate
SSTL
Stub Series Terminated Logic
t/s
Tri-State pin
TS
Tri-State Value
XXXn
n - Suffix represents an Active Low Signal
Table 3:
Interface Pin Prefixes
In t e r f a c e
Prefix
Audio Interface
AU_
Gigabit Ethernet
GE_
I2C
I2C_
JTAG
JT_
SDRAM
M_
Misc
N/A
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
Table 3:
Interface Pin Prefixes (Continued)
In t e r f a c e
Prefix
MPP
N/A
PCI Express
PEX_
PCIe_
Real Time Clock
RTC_
Serial-ATA
SATA_
Secure Digital Input/Output
SDIO_
Serial Gigabit Media
Independent Interface
SGMII_
SERDES
SRD_
SPI
SPI_
TDM
TDM_
UART
UA_
USB
USB_
Doc. No. MV-S107978-00 Rev. G
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Pin Information
Pin Descriptions
2.2.1
Power Supply Pins
Includes the analog power supplies for the PLLs or PHYS.
Table 4:
Power Supply Pins Description
Pin Name
Pi n Ty p e
D es c r ip t i o n
MISC_PLL_AVDD
Analog Power
1.8V Core and TDM PLLs quiet power supply
NOTE: For the 88F6710 and 88F6W11, includes the Audio PLLs quiet
power supply.
MISC_PLL_AVSS
Analog Ground
Core and TDM PLLs quiet ground
NOTE: For the 88F6710 and 88F6W11, includes the Audio PLLs quiet
ground.
CPU_PLL_AVDD
Analog Power
1.8V CPU PLL and Thermal Sensor quiet power supply
CPU_PLL_AVSS
Analog Ground
CPU PLL and Thermal Sensor quiet ground
RTC_AVDD
Analog Power
1.8V RTC interface voltage
NOTE: 1.5V interface voltage when operating from battery power.
SRD_AVDD
Analog Power
1.8V SERDES and PCI Express clock outputs quiet power supply
USB_AVDD
Analog Power
3.3V USB 2.0 PHY quiet power supply
USB_AVDDL
Analog Power
1.8V USB 2.0 PHY quiet power supply
VDD
Power
0.9V core voltage
VDDO_A
Power
3.3V I/O supply voltage for MPP[4:0]
VDDO_B
Power
1.8/2.5/3.3V I/O supply voltage for the MPP[16:5]
VDDO_C
Power
1.8/2.5/3.3V I/O supply voltage for the MPP[31:17]
VDDO_D
Power
1.8V or 3.3V I/O supply voltage for MPP[65:63] and MPP[46:32]
VDDO_E
Power
1.8V or 3.3V I/O supply voltage for MPP[52:47]
VDDO_F
Power
1.8V or 3.3V I/O supply voltage for MPP[62:53]
VDDO_M
Power
1.35/1.5V I/O supply voltage for the SDRAM interface
VDD_CPU
Power
0.9/1.1V CPU voltage
VDD_CPU_AON
Power
Always on VDD_CPU power supply input for AVS operation during
VDD_CPU power down.
NOTE: For VDD_CPU_AON connectivity information, see the device Design
Guideline.
VSS
Ground
Ground
XTAL_AVDD
Analog Power
1.8V XTAL quiet power supply
XTAL_AVSS
Analog Ground
XTAL quiet ground
AVS_AVDD
Analog Power
1.8V Adaptive Voltage Scaling (AVS) quiet power supply
NOTE: For further connectivity information, see the design guide.
For additional details concerning unused pins, see the Section
"Unused Interface Strapping".
AVS_AVSS
Analog Ground
AVS quiet ground
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.2
Adaptive Voltage Scaling (AVS)
Note
Table 5:
For additional details concerning unused pins, see the Section 3, Unused Interface
Strapping, on page 64.
Adaptive Voltage Scaling (AVS) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
AVS_FB
O
Analog
AVS_AVDD
AVS feedback to the external power regulator to adjust the
voltage level.
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Pin Information
Pin Descriptions
2.2.3
Reduced Gigabit Media Independent Interface (RGMII)
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Note
Table 6:
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Reduced Gigabit Media Independent Interface (RGMII) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
Where <n> represents numbers 0 thru 1
GE<n>_RXCLK
I
CMOS
GE0: VDDO_B
GE1: VDDO_C
RGMII Receive Clock
Receives 125 MHz for 1000 Mbps, 25 MHz for 100 Mbps,
and 2.5 MHz for 10 Mbps.
All RGMII input pins are referenced to GE<n>_RXCLK.
GE<n>_RXCTL
I
CMOS
DDR
GE0: VDDO_B
GE1: VDDO_C
RGMII Receive Control
A logical derivative of receive data valid (RXDV) on
GE<n>_RXCLK rising edge, and data error (RXERR) on
GE<n>_RXCLK falling edge.
GE<n>_RXD[3:0]
I
CMOS
DDR
GE0: VDDO_B
GE1: VDDO_C
RGMII Receive Data
Contains the receive data nibble inputs that run at double
data rate.
Bits [3:0] are presented on the rising edge of
GE<n>_RXCLK.
GE<n>_TXCLKOUT
O
CMOS
GE0: VDDO_B
GE1: VDDO_C
RGMII Transmit Clock
Provides 125 MHz for 1000 Mbps, 25 MHz for 100 Mbps,
and 2.5 MHz for 10 Mbps.
All RGMII output pins are referenced to
GE<n>_TXCLKOUT.
GE<n>_TXCTL
O
CMOS
DDR
GE0: VDDO_B
GE1: VDDO_C
RGMII Transmit Control
A logical derivative of transmit data enable (TXEN) on
GE<n>_TXCLKOUT rising edge, and data error (TXERR)
on GE<n>_TXCLKOUT falling edge.
GE<n>_TXD[3:0]
O
CMOS
DDR
GE0: VDDO_B
GE1: VDDO_C
RGMII Transmit Data
Contains the transmit data nibble outputs that run at
double data rate.
Bits [3:0] are presented on the rising edge of
GE<n>_TXCLKOUT.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.4
Gigabit Media Independent Interface (GMII)
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Note
Table 7:
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Gigabit Media Independent Interface (GMII) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
GE0_COL
I
CMOS
VDDO_C
GMII Collision Indication
This signal is relevant for half-duplex mode only.
This signal is asynchronous.
GE0_CRS
I
CMOS
VDDO_C
GMII Carrier Sense Indication
This signal is relevant for half-duplex mode only.
This signal is asynchronous.
GE0_TXCLKOUT
O
CMOS
VDDO_B
GMII Transmit Clock
All GMII output pins are referenced to GE0_TXCLKOUT.
GE0_RXCLK
I
CMOS
VDDO_B
GMII Receive Clock
RXD, RXDV, and RXERR pins are referenced to
GE0_RXCLK.
GE0_RXD[3:0]
I
CMOS
SDR
VDDO_B
GMII Receive Data
This bus is referenced to GE0_RXCLK.
GE0_RXD[7:4]
I
CMOS
SDR
VDDO_B
GMII Receive Data
This bus is referenced to GE0_RXCLK.
GE0_RXDV
I
CMOS
SDR
VDDO_B
GMII Receive Data Valid
This pin is referenced to GE0_RXCLK.
GE0_RXERR
I
CMOS
SDR
VDDO_C
GMII Receive Error
This pin is referenced to GE0_RXCLK.
GE0_TXD[3:0]
O
CMOS
SDR
VDDO_B
GMII Transmit Data
This bus is referenced to GE0_TXCLKOUT.
GE0_TXD[7:4]
O
CMOS
SDR
VDDO_C
GMII Transmit Data
This bus is referenced to GE0_TXCLKOUT.
GE0_TXEN
O
CMOS
SDR
VDDO_B
GMII Transmit Enable
Indicates that the packet is being transmitted on the data
lines.
This pin is referenced to GE0_TXCLKOUT.
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Pin Information
Pin Descriptions
2.2.5
Media Independent Interface (MII)
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Note
Table 8:
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Media Independent Interface (MII) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
GE0_COL
I
CMOS
VDDO_C
MII Collision Indication
This signal is relevant for half-duplex mode only.
This signal is asynchronous.
GE0_CRS
I
CMOS
VDDO_C
MII Carrier Sense Indication
This signal is relevant for half-duplex mode only.
This signal is asynchronous.
GE0_RXCLK
I
CMOS
VDDO_B
MII Receive Clock
GE0_RXD[3:0], GE0_RXDV, and GE0_RXERR pins are
referenced to GE0_RXCLK.
GE0_RXD[3:0]
I
CMOS
SDR
VDDO_B
MII Receive Data
This bus is referenced to GE0_RXCLK.
GE0_RXDV
I
CMOS
SDR
VDDO_B
MII Receive Data Valid
This pin is referenced to GE0_RXCLK.
GE0_RXERR
I
CMOS
SDR
VDDO_C
MII Receive Error
This pin is referenced to GE0_RXCLK.
GE0_TXCLK
I
CMOS
VDDO_C
MII Transmit Reference Clock
This clock is provided by an external PHY device
connected to the MAC.
All MII output pins are referenced to GE0_TXCLK.
GE0_TXD[3:0]
O
CMOS
SDR
VDDO_B
MII Transmit Data
This bus is referenced to GE0_TXCLK.
GE0_TXEN
O
CMOS
SDR
VDDO_B
MII Transmit Enable
Indicates that the packet is being transmitted on the data
lines.
This pin is referenced to GE0_TXCLK.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.6
Serial Gigabit Media Independent Interface (SGMII)
The Gigabit Ethernet ports support a direct connection to Gigabit PHYs for 10/100/1000/2500 Mbps
using Auto-Negotiation capabilities.
In addition, this interface can be directly connected to SFP for 1000BASE-X.
Note
Table 9:
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Serial Gigabit Media Independent Interface (SGMII) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
Where <n> represents numbers 0 thru 1
SGMII<n>_RX_P/N
I
CML
SRD_AVDD
SGMII / 1000BASE-X interface input to the
1.25/3.125 Gbps SERDES.
SGMII<n>_TX_P/N
O
CML
SRD_AVDD
SGMII / 1000BASE-X interface output from the
1.25/3.125 Gbps SERDES.
Doc. No. MV-S107978-00 Rev. G
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Pin Information
Pin Descriptions
2.2.7
General Purpose Pins (GPP)
Each individual pin can be defined as an input, output, or level interrupt input.
These pins can be used for indications retrieving or for peripherals control.
When not in use, program interface to GPIOs and set GPIOs as output.
Table 10: General Purpose Pins (GPP) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
GPIO[4:0]
I/O
CMOS
VDDO_A
General Purpose Pin(s)
GPIO[16:5]
I/O
CMOS
VDDO_B
General Purpose Pin(s)
GPIO[31:17]
I/O
CMOS
VDDO_C
General Purpose Pin(s)
GPIO[46:32]
GPIO[65:63]
I/O
CMOS
VDDO_D
General Purpose Pin(s)
GPIO[52:47]
I/O
CMOS
VDDO_E
General Purpose Pin(s)
GPIO[62:53]
I/O
CMOS
VDDO_F
General Purpose Pin(s)
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.8
Inter-IC Sound (I2S) Interface (88F6710/88F6W11 Only)
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 11: Inter-IC Sound (I2S) Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
AU_I2SBCLK
O
CMOS
VDDO_B or
VDDO_D or
VDDO_F
I2S Bit Clock (64 x Fs)
AU_I2SDI and AU_I2SDO are referenced to this clock.
NOTE: Fs is the audio sampling rate.
AU_I2SDI
I
CMOS
SDR
VDDO_B or
VDDO_F
I2S Receiver Serial Data In
This signal is referenced to AU_I2SBCLK.
AU_I2SDO
O
CMOS
SDR
VDDO_B or
VDDO_D or
VDDO_F
I2S Receiver Serial Data Out
This signal is referenced to AU_I2SBCLK.
AU_EXTCLK
I
CMOS
VDDO_B or
VDDO_F
I2S External Master Clock
When in use, AU_I2SBCLK, AU_I2SMCLK, and
AU_I2SLRCLK are being generated from this signal.
AU_I2SLRCLK
O
CMOS
VDDO_B or
VDDO_D or
VDDO_F
I2S Word Select Left/Right Clock (1 x Fs)
NOTE: Fs is the audio sampling rate.
AU_I2SMCLK
O
CMOS
VDDO_B or
VDDO_D or
VDDO_F
I2S Master Clock (256 x Fs)
NOTE: Fs is the audio sampling rate.
Doc. No. MV-S107978-00 Rev. G
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Pin Information
Pin Descriptions
2.2.9
JTAG Interface
The device supports a JTAG interface and is compliant with the IEEE 1149.1 standard.
It supports mandatory and optional boundary scan instructions.
Note
For additional pull-up/down details, see Section 3, Unused Interface Strapping,
on page 64.
Table 12: JTAG Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
JT_CLK
I
CMOS
VDDO_A
JTAG Test Clock
JT_TDI, JT_TDO, JT_TMS_CORE and JT_TMS_CPU
are referenced to this clock.
NOTE: When unused, must be pulled down.
JT_TDI
I
CMOS
SDR
VDDO_A
JTAG Test Data Input
Sampled on JT_TCK rising edge.
NOTE: When unused, must be pulled up to a power rail.
JT_TDO
O
CMOS
SDR
VDDO_A
JTAG Test Data Output
Driven on JT_TCK falling edge.
NOTE: When unused, can be left unconnected.
JT_TMS_CORE
I
CMOS
SDR
VDDO_A
JTAG Test Mode Select
Sampled on JT_TCK rising edge.
TMS signal for CORE.
NOTE: When unused, must be pulled up to a power rail.
JT_TMS_CPU
I
CMOS
SDR
VDDO_A
JTAG Test Mode Select
Sampled on JT_TCK rising edge.
TMS signal for CPU.
NOTE: When unused, must be pulled up to a power rail.
JT_RSTn
I
CMOS
VDDO_A
JTAG Test Asynchronous Reset
NOTE: This pin must be pulled down to GND.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.10
Miscellaneous
The Miscellaneous signals list contains clocks, reset, and PLL related signals.
Table 13: Miscellaneous Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
CDRn
I
CMOS
VDDO_A
Active low, CPU Debugger Reset input.
May be used by the debugger logic to reset the device.
NOTE: CDRn does not reset the CPU and CORE PLLs,
and the source of their control (the PMU and
CoreSight debug system).
This pin is internally pulled up.
MRn
I
CMOS
VDDO_A
Active-Low, Manual Reset Input
SYSRST_OUTn is asserted low as long as the MRn input
signal is asserted low, and for an additional 100 ms after
MRn (manual reset) de-assertion
NOTE: This pin is internally pulled up.
M_NCAL
Calib
VDDO_M
Memory SDRAM Interface Calibration.
Calibrates output NMOS driver and ODT.
Connect to VDDO_M through a 931 ohm +/- 1% resistor.
M_PCAL
Calib
VDDO_M
Memory SDRAM Interface Calibration.
Calibrates output PMOS driver and ODT.
Connect to VSS through a 931 ohm +/- 1% resistor.
SRD_ISET
Calib
Pull-down resistor for the SERDES and USB reference
current.
6.04 kilohm pull-down to VSS with resistor accuracy of
1%.
SYSRST_OUTn
O
OD
CMOS
VDDO_A
Reset request from the device to the board reset logic.
NOTE: A pull-up resistor must be added for this pin.
SYSRSTn
I
CMOS
VDDO_A
System Reset
Main reset signal of the device.
Used to reset all units to their initial state.
NOTE: For reset timing, see in the device Design Guide.
TCLK_OUT
O
CMOS
VDDO_C or
VDDO_D
General Purpose Clock Output
Core Clock (TCLK) divided by 2 to 7.
TP
Analog
Test Point
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Pin Information
Pin Descriptions
2.2.11
Multi Purpose Pins (MPP)
For more information about the interfaces implemented on the MPP pins, see Section 6, Pin
Multiplexing, on page 69.
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 14: Multi Purpose Pins (MPP) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
MPP[4:0]
I/O
CMOS
VDDO_A
Multi Purpose Pins (MPP)
Refer to Sheet "Multiplexed Pins" for additional
information for available functionalities.
MPP[16:5]
I/O
CMOS
VDDO_B
Multi Purpose Pins (MPP)
Refer to Sheet "Multiplexed Pins" for additional
information for available functionalities.
MPP[31:17]
I/O
CMOS
VDDO_C
Multi Purpose Pins (MPP)
Refer to Sheet "Multiplexed Pins" for additional
information for available functionalities.
MPP[46:32]
MPP[65:63]
I/O
CMOS
VDDO_D
Multi Purpose Pins (MPP)
Refer to Sheet "Multiplexed Pins" for additional
information for available functionalities.
MPP[52:47]
I/O
CMOS
VDDO_E
Multi Purpose Pins (MPP)
Refer to Sheet "Multiplexed Pins" for additional
information for available functionalities.
MPP[62:53]
I/O
CMOS
VDDO_F
Multi Purpose Pins (MPP)
Refer to Sheet "Multiplexed Pins" for additional
information for available functionalities.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.12
Device Bus (88F6710/88F6W11 only)
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 15: Device Bus Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
DEV_A[1:0]
O
CMOS
VDDO_D
Device Bus Address.
DEV_A[2]
O
CMOS
VDDO_F
Device Bus Address.
DEV_AD[7:0]
I/O
CMOS
VDDO_D
Device Bus Data Input/Output.
Output command, address and data.
Input data during read operations.
DEV_AD[13:8]
I/O
CMOS
VDDO_E
Device Bus Data Input/Output.
Output command, address and data.
Input data during read operations.
DEV_AD[15:14]
I/O
CMOS
VDDO_F
Device Bus Data Input/Output.
Output command, address and data.
Input data during read operations.
DEV_ALE[1:0]
O
CMOS
VDDO_F
Device Bus Address Latch Enable.
DEV_BOOTCSn
O
CMOS
VDDO_D
Device Bus Boot Chip Select. Corresponds to Boot Bank.
DEV_CSn[3:0]
O
CMOS
VDDO_F
Device Bus Chip Select.
DEV_OEn
O
CMOS
VDDO_D
Device Bus Output Enable
DEV_READYn
I
CMOS
VDDO_D
Device Bus Ready.
Used as cycle extender when interfacing a slow device.
DEV_WEn[0]
O
CMOS
VDDO_D
Device Bus Byte Write Enable (bit per byte).
DEV_WEn[1]
O
CMOS
VDDO_F
Device Bus Byte Write Enable (bit per byte).
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Pin Information
Pin Descriptions
2.2.13
NAND Flash Interface
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 16: NAND Flash Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
NF_ALE
O
CMOS
VDDO_F
NAND Flash Address Latch Enable
The Address Latch Enable signal is one of the signals
used by the host to indicate the type of bus cycle
(command, address, data).
This pin is referenced to NF_WEn.
NF_CSn[0]
O
CMOS
VDDO_D
NAND Flash Chip Enable
Controls the device selection.
Referenced to NF_WEn during output command,
address, and data.
Referenced to NF_REn during read operations.
NF_CSn[3:1]
O
CMOS
VDDO_F
NAND Flash Chip Enable
Controls the device selection.
Referenced to NF_WEn during output command,
address, and data.
Referenced to NF_REn during read operations.
NF_CLE
O
CMOS
VDDO_D
NAND Flash Command Latch Enable
The Command Latch Enable signal is one of the signals
used by the host to indicate the type of bus cycle
(command, address, data).
This pin is referenced to NF_WEn.
NF_IO[7:0]
I/O
CMOS
VDDO_D
NAND Flash Data Input/Output
Output command, address, and data referenced to
NF_WEn.
Input data during read operations referenced to NF_REn.
NF_IO[13:8]
I/O
CMOS
VDDO_E
NAND Flash Data Input/Output
Output command, address, and data referenced to
NF_WEn.
Input data during read operations referenced to NF_REn.
NF_IO[15:14]
I/O
CMOS
VDDO_F
NAND Flash Data Input/Output
Output command, address, and data referenced to
NF_WEn.
Input data during read operations referenced to NF_REn.
NF_RDY
I
CMOS
VDDO_D
NAND Flash Ready/Busy
The Ready/Busy asynchronous signal indicates the target
status. When low, the signal indicates that one or more
operations are in progress.
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Hardware Specifications
Table 16: NAND Flash Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
NF_REn
O
CMOS
VDDO_D
NAND Flash Read Enable
The NF_IO bus and NF_CEn are referenced to NF_REn
during read operations.
This pin may have a different source when using CE care
or CE don't care flashes.
For full details, refer to the Functional Specification.
NF_WEn
O
CMOS
VDDO_D
NAND Flash Write Enable
The NF_IO bus, NF_CEn, NF_ALE, and NF_CLE are
referenced to NF_WEn during write operations.
This pin may have a different source when using CE care
or CE don't care flashes.
For full details, refer to the Functional Specification.
Doc. No. MV-S107978-00 Rev. G
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Pin Information
Pin Descriptions
2.2.14
PCI Express 0 (PCIe) Interface
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 17: PCI Express 0 (PCIe) Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
PEX0_CLK_P/N
I/O
HCSL
SRD_AVDD
PCI Express Reference Clock 100 MHz Differential pair.
When functioning as output, each pin must be pulled
down through a 49.9 ohm 1% resistor.
NOTE: When the PCIe interface is unused, leave
unconnected.
If an external PCIe clock is used, the clock is
internally ditributed to PEX0 and PEX1.
PCIe_CLKREQ0
I
CMOS
VDDO_B or
VDDO_F
Relevant to PCIe Root Complex.
Endpoint request to enable/disable the reference clock.
NOTE: This pin is implemented on the Multi Purpose Pin
Interface. See the Multi Purpose and General
Purpose Pins Functionality section.
PCIe_RST_OUTn
O
CMOS
VDDO_F
Endpoint external triggered reset.
For further details, refer to the RESET section.
NOTE: This pin is implemented on the Multi Purpose Pin
Interface. See the Multi Purpose and General
Purpose Pins Functionality section.
PEX0_RX_P/N
I
CML
SRD_AVDD
Receive Lane Differential pair of PCI Express.
NOTE: When the PCIe interface is not used, these pins
can be left NC.
PEX0_TX_P/N
O
CML
SRD_AVDD
Transmit Lane Differential pair of PCI Express.
NOTE: When the PCIe interface is not used, these pins
can be left NC.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.15
PCI Express 1 (PCIe) Interface
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 18: PCI Express 1 (PCIe) Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
PEX1_CLK_P/N
O
HCSL
SRD_AVDD
PCI Express Reference Clock 100 MHz Differential pair.
Each pin must be pulled down through a 49.9 ohm 1%
resistor.
NOTE: When the PCIe interface is unused, leave
unconnected.
If an external PCIe clock is used on
PEX0_CLK_P/N, the clock is internally distributed
to PEX0 and PEX1.
PCIe_CLKREQ1
I
CMOS
VDDO_B or
VDDO_E or
VDDO_F
Relevant to PCIe Root Complex.
Endpoint request to enable/disable the reference clock.
NOTE: This pin is implemented on the Multi Purpose Pin
Interface. See the Multi Purpose and General
Purpose Pins Functionality section.
PEX1_RX_P/N
I
CML
SRD_AVDD
Receive Lane Differential pair of PCI Express.
NOTE: When the PCIe interface is not used, these pins
can be left NC.
PEX1_TX_P/N
O
CML
SRD_AVDD
Transmit Lane Differential pair of PCI Express.
NOTE: When the PCIe interface is not used, these pins
can be left NC.
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Pin Information
Pin Descriptions
2.2.16
Power Management Unit
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Table 19: Power Management Unit Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
VDD_CPU_PD
O
CMOS
VDDO_A
Power Management Unit - Power Down Signal.
Output to the external power regulator / power switch to
stop or resume the power supply.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.17
Crystal Reference Clock
Table 20: Crystal Reference Clock Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
REF_CLK_XIN
I
CMOS
XTAL_AVDD
Reference clock input from the external oscillator or input
from the external crystal. Used as input to core and CPU
PLLs, USB PLL, and SERDES PLL.
XOUT
O
Analog
XTAL_AVDD
Feedback signal to the external crystal.
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Pin Information
Pin Descriptions
2.2.18
Real Time Clock (RTC) Interface
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 21: Real Time Clock (RTC) Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
RTC_XIN
I
Analog
RTC_AVDD
Crystal Clock Input
RTC_XOUT
O
Analog
RTC_AVDD
Crystal Clock Output (feedback)
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.19
Serial-ATA (SATA) Interface (88F6710/88F6707 only)
When unused, can be left unconnected.
Note
Table 22: Serial-ATA (SATA) Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
Where <n> represents numbers 0 thru 1
SATA0_PRESENT_A
CTIVEn
O
CMOS
VDDO_B or
VDDO_D or
VDDO_F
Disk Present Indication.
SATA1_PRESENT_A
CTIVEn
O
CMOS
VDDO_B or
VDDO_E or
VDDO_F
Disk Present Indication.
SATA<n>_RX_P/N
I
CML
SRD_AVDD
Receive Lane Differential pair of SATA.
NOTE: When unused, can be left unconnected.
SATA<n>_TX_P/N
O
CML
SRD_AVDD
Transmit Lane Differential pair of SATA.
NOTE: When unused, can be left unconnected.
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Pin Information
Pin Descriptions
2.2.20
Secure Digital Input/Output (SDIO)/Multi Media Card (MMC)
Interface
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Table 23: Secure Digital Input/Output (SDIO) Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
SD_CLK
O
CMOS
VDDO_B or
VDDO_E or
VDDO_F
SDIO Clock Output
SD_CMD and SD_DATA signals are referenced to this
clock.
SD_CMD
I/O
CMOS
SDR
VDDO_B or
VDDO_E
SDIO Command/Response
This signal is referenced to SD_CLK.
NOTE: This pin must be pulled up to a power rail through
10 kilohm resistor.
SD_D[3:0]
I/O
CMOS
SDR
VDDO_B or
VDDO_E
SDIO Data Bus
This bus is referenced to SD_CLK.
NOTE: This bus must be pulled up to a power rail through
10 kilohm resistor.
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Hardware Specifications
2.2.21
SDRAM DDR3 Interface
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 24: SDRAM DDR3 Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
M_A[15:0]
O
SSTL
SDR
VDDO_M
DRAM Address Outputs
Provides the row address for ACTIVE commands
(M_RASn), the column address, Auto Precharge bit
(A[10]) and Burst Chop (A[12]) information for
READ/WRITE commands (M_CASn), to determine, with
the bank address bits (M_BA), the DRAM address.
These signals are referenced to M_CLKOUT and
M_CLKOUTn.
NOTE: When unused, can be left unconnected.
M_BA[2:0]
O
SSTL
SDR
VDDO_M
DRAM Bank Address Outputs
Selects one of the eight virtual banks during an ACTIVE
(M_RASn) , READ/WRITE (M_CASn), or PRECHARGE
command.
These signals are referenced to M_CLKOUT and
M_CLKOUTn.
NOTE: When unused, can be left unconnected.
M_CASn
O
SSTL
SDR
VDDO_M
DRAM Column Address Strobe
Asserted to indicate an active column address driven on
the address lines.
This signal is referenced to M_CLKOUT and
M_CLKOUTn.
M_CKE[1:0]
O
SSTL
SDR
VDDO_M
DRAM Clock Enable Control
Driven high to enable DRAM clock.
Driven low when setting the DRAM in self Refresh Mode
or Power Down mode.
All M_CKE pins are driven together (no separate self
refresh or power down mode per each DRAM bank).
These signals are referenced to M_CLKOUT and
M_CLKOUTCKn.
NOTE: When unused, can be left unconnected.
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Pin Information
Pin Descriptions
Table 24: SDRAM DDR3 Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
M_CLKOUT[1:0]/
M_CLKOUTn[1:0]
O
SSTL
VDDO_M
DRAM Differential Clock Output
All address and control output signals are clocked on the
crossing of the positive edge of M_CLKOUT and negative
edge of M_CLKOUTn.
The M_DQS/M_DQSn output (during the WRITE data
phase) is referenced to the crossings of M_CLKOUT and
M_CLKOUTn (Both directions of crossing).
NOTE: When unused, can be left unconnected. For
additional details, see also Unused Interface
Strapping chapter.
M_CSn[3:0]
O
SSTL
SDR
VDDO_M
DRAM Chip Select Control
Asserted to select a specific DRAM physical bank.
These signals are referenced to M_CLKOUT and
M_CLKOUTn.
NOTE: When unused, can be left unconnected.
M_DM[1:0]
O
SSTL
DDR
VDDO_M
DRAM Data Mask
Driven during writes to the DRAM to mask the
corresponding group of M_DQ and M_DQS/M_DQSn
pins.
These signals are referenced to M_DQS and M_DQSn.
NOTE: When unused, can be left unconnected.
M_DQ[15:0]
I/O
SSTL
DDR
VDDO_M
DRAM Data Bus
Driven during writes to the DRAM. Driven by the DRAM
during reads.
These signals are referenced to M_DQS and M_DQSn.
NOTE: For additional details with unused pins, see the
section "Unused Interface Strapping".
M_DQS[1:0]/
M_DQSn[1:0]
I/O
SSTL
DDR
VDDO_M
DRAM Data Strobe
Data strobe for input and output data.
Driven during writes to the DRAM. Driven by the DRAM
during reads.
NOTE: For additional details with unused pins, see the
section "Unused Interface Strapping".
M_ODT[3:0]
O
SSTL
SDR
VDDO_M
DRAM On Die Termination Control
Driven to the DRAM to turn on/off DRAM on die
termination resistor.
This signal is referenced to M_CLKOUT[1:0] and
M_CLKOUTn[1:0].
NOTE: When unused, can be left unconnected.
M_RASn
O
SSTL
SDR
VDDO_M
DRAM Row Address Strobe
Asserted to indicate an active row address driven on the
address lines.
This signal is referenced to M_CLKOUT and
M_CLKOUTn.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
Table 24: SDRAM DDR3 Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
M_RESETn
O
CMOS
VDDO_M
DRAM active low asynchronous reset.
NOTE: When unused, can be left unconnected.
M_WEn
O
SSTL
SDR
VDDO_M
DRAM Write Enable Command
Active low.
Asserted to indicate a WRITE command to the DRAM.
This signal is referenced to M_CLKOUT and
M_CLKOUTn.
Doc. No. MV-S107978-00 Rev. G
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Pin Information
Pin Descriptions
2.2.22
Serial Management Interface (SMI)
The Master SMI interface is used for CPU management and Auto-Negotiation with PHY devices
connected to the device.
This interface complies with IEEE 802.3 Clause 22 standard.
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 25: Serial Management Interface (SMI) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
GE_MDC
O
CMOS
VDDO_C
Serial Management Interface Data Clock
Provides the timing reference for the transfer of the
GE_MDIO signal.
NOTE: When not used, can be left NC.
GE_MDIO
I/O
CMOS
SDR
VDDO_C
Serial Management Interface Data Input/Output
Must be pulled up to a power rail using a 2.0 kilohm
resistor.
NOTE: When not used, must be pulled up to a power rail.
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Hardware Specifications
2.2.23
Sony/Philips Digital Interface (S/PDIF)
(88F6710/88F6W11 only)
This interface is implemented on the Multi Purpose Pin interface. For more information, see the Pin
Multiplexing section.
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 26: Sony/Philips Digital Interface (S/PDIF) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
AU_SPDIFI
I
CMOS
VDDO_B or
VDDO_E
S/PDIF Receiver Data In
AU_SPDIFO
O
CMOS
VDDO_B or
VDDO_D or
VDDO_E
S/PDIF Transmitter Data Out
AU_SPDIFRMCLK
O
CMOS
VDDO_B or
VDDO_E
S/PDIF Recovered Master Clock (256xFs)
NOTE: Fs is the audio sampling rate.
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Pin Information
Pin Descriptions
2.2.24
Serial Peripheral Interface (SPI)
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Table 27: Serial Peripheral Interface (SPI) Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
SPI0_CSn[0]
O
CMOS
SDR
VDDO_D
SPI Chip-Select
This signal is referenced to SPI0_SCK.
NOTE: This pin must be pulled up to a power rail.
SPI0_CSn[1]
O
CMOS
SDR
VDDO_B or
VDDO_D or
VDDO_E
SPI Chip-Select
This signal is referenced to SPI0_SCK.
NOTE: This pin must be pulled up to a power rail.
SPI0_CSn[2]
O
CMOS
SDR
VDDO_B or
VDDO_D or
VDDO_F
SPI Chip-Select
This signal is referenced to SPI0_SCK.
NOTE: This pin must be pulled up to a power rail.
SPI0_CSn[3]
O
CMOS
SDR
VDDO_B or
VDDO_F
SPI Chip-Select
This signal is referenced to SPI0_SCK.
NOTE: This pin must be pulled up to a power rail.
SPI1_CSn[0]
O
CMOS
SDR
VDDO_B or
VDDO_C or
VDDO_E
SPI Chip-Select
This signal is referenced to SPI1_SCK.
NOTE: This pin must be pulled up to a power rail.
SPI1_CSn[1]
O
CMOS
SDR
VDDO_B or
VDDO_F
SPI Chip-Select
This signal is referenced to SPI1_SCK.
NOTE: This pin must be pulled up to a power rail.
SPI0_MISO
I
CMOS
SDR
VDDO_D
SPI Data In (Master In / Slave Out)
This signal is referenced to SPI0_SCK.
SPI0_MOSI
O
CMOS
SDR
VDDO_D
SPI Data Out (Master Out / Slave In)
This signal is referenced to SPI0_SCK.
SPI0_SCK
O
CMOS
VDDO_D
SPI Clock Output
All SPI signals are referenced to this clock.
SPI1_MISO
I
CMOS
SDR
VDDO_B or
VDDO_C or
VDDO_E
SPI Data In (Master In / Slave Out)
This signal is referenced to SPI1_SCK.
SPI1_MOSI
O
CMOS
SDR
VDDO_B or
VDDO_C or
VDDO_E
SPI Data Out (Master Out / Slave In)
This signal is referenced to SPI1_SCK.
SPI1_SCK
O
CMOS
VDDO_B or
VDDO_E
SPI Clock Output
All SPI signals are referenced to this clock.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.25
Time Division Multiplexing (TDM) Interface
(88F6710/88F6W11 only)
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 28: Time Division Multiplexing (TDM) Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
TDM_INTn
I
CMOS
VDDO_B or
VDDO_F
Interrupt input from the SLIC device.
TDM_RSTn
O
CMOS
VDDO_B or
VDDO_F
SLIC Codec asynchronous reset signal.
TDM_DRX
I
CMOS
SDR
VDDO_B or
VDDO_F
Pulse Code Modulation (PCM) Input Data
This signal is referenced to TDM_PCLK.
TDM_DTX
O
CMOS
SDR
VDDO_B or
VDDO_F
Pulse Code Modulation (PCM) Output Data
This signal is referenced to TDM_PCLK.
TDM_FSYNC
I/O
CMOS
SDR
VDDO_B or
VDDO_F
Frame Synchronous Signal
Driven by the device if configured as Frame master.
Input to the device (driven by an external component) if
configured as Frame slave.
This signal is referenced to TDM_PCLK.
TDM_PCLK
I/O
CMOS
VDDO_B or
VDDO_C or
VDDO_F
Pulse Code Modulation (PCM) Bit Clock
Driven by the device if configured as PCLK master.
Input to the device (driven by an external component) if
configured as PCLK slave.
TDM_FSYNC, TDM_DTX, and TDM_DRX are referenced
to this clock.
Doc. No. MV-S107978-00 Rev. G
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Pin Information
Pin Descriptions
2.2.26
I2C Interface
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 29: I2C Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
I2C0_SCK
I/O
OD
CMOS
VDDO_A
I2C0 Serial Clock
Serves as output when acting as a I2C master.
Serves as input when acting as a I2C slave.
NOTE: Must be pulled up to a power rail.
I2C0_SDA
I/O
OD
CMOS
SDR
VDDO_A
I2C0 Serial Data/Address
Address or write data driven by the I2C master or read
response data driven by the I2C slave.
NOTE: Must be pulled up to a power rail.
I2C1_SCK
I/O
OD
CMOS
VDDO_B or
VDDO_C or
VDDO_E
I2C1 Serial Clock
Serves as output when acting as a I2C master.
Serves as input when acting as a I2C slave.
NOTE: Must be pulled up to a power rail.
I2C1_SDA
I/O
OD
CMOS
SDR
VDDO_B or
VDDO_C or
VDDO_E
I2C1 Serial Data/Address
Address or write data driven by the I2C master or read
response data driven by the I2C slave.
NOTE: Must be pulled up to a power rail.
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Hardware Specifications
2.2.27
Universal Asynchronous Receiver Transmitter (UART)
Interface
This interface is implemented on the Multi Purpose Pin interface. For more information, see
Section 6, Pin Multiplexing, on page 69.
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 30: Universal Asynchronous Receiver Transmitter (UART) Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
UA0_CTS
I
CMOS
VDDO_B or
VDDO_C or
VDDO_D or
VDDO_E or
VDDO_F
UART0 Clear To Send
UA0_RTS
O
CMOS
VDDO_B or
VDDO_C or
VDDO_D or
VDDO_E or
VDDO_F
UART0 Request To Send
UA0_RXD
I
CMOS
VDDO_A
UART0 Receive Data
UA0_TXD
O
CMOS
VDDO_A
UART0 Transmit Data
UA1_CTS
I
CMOS
VDDO_D or
VDDO_F
UART1 Clear To Send
UA1_RTS
O
CMOS
VDDO_D or
VDDO_F
UART1 Request To Send
UA1_RXD
I
CMOS
VDDO_B or
VDDO_C or
VDDO_D or
VDDO_F
UART1 Receive Data
UA1_TXD
O
CMOS
VDDO_B or
VDDO_C or
VDDO_D or
VDDO_F
UART1 Transmit Data
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Pin Information
Pin Descriptions
2.2.28
Universal Serial Bus (USB) 2.0 Interface
Note
For additional details concerning unused pins, see Section 3, Unused Interface
Strapping, on page 64.
Table 31: Universal Serial Bus (USB) 2.0 Interface Pin Description
Pin Name
I/ O
Pin
Ty pe
Power Rail
D e s c r i p t io n
USB_AVDD
USB 2.0 Data Differential Pair.
Where <n> represents numbers 0 thru 1
USB<n>_DP/M
I/O
CML
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
2.2.29
Reserved/Not Connected (NC) Pins
Table 32: Reserved/Not Connected (NC) Pins Description
P in N a m e
D e s c r i p t io n
RSVD_VSS
Reserved
Must be connected to VSS ground.
RSVD_VDD
Reserved.
Must be connected to VDD power.
RSVD_18_AVDD
Reserved.
Must be connected to 1.8V analog power.
RSVD_NC
Reserved
Must be not connected.
NC
Not Connected.
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Pin Information
Internal Pull-up and Pull-down Pins
2.3
Internal Pull-up and Pull-down Pins
Table 33 and Table 34 lists the pins of the device package that are connected to internal pull-up and
pull-down resistors. When these pins are Not Connected (NC) on the system board, these resistors
set the default value for input and sample at reset configuration pins.
The internal pull-up and pull-down resistor value is 50 k. An external resistor with a lower value can
override this internal resistor.
Table 33: Internal Pull-up Pins
Pin Name
Pin Name
Pin Name
Pi n N am e
Pi n N am e
Pin Name
CDRn
MPP[6]
MPP[17]
MPP[29]
MPP[44]
MPP[56]
JT_TDI
MPP[8]
MPP[18]
MPP[30]
MPP[47]
MPP[57]
JT_TMS_CORE
MPP[9]
MPP[19]
MPP[31]
MPP[48]
MPP[58]
JT_TMS_CPU
MPP[11]
MPP[22]
MPP[32]
MPP[49]
MPP[60]
MPP[0]
MPP[12]
MPP[23]
MPP[33]
MPP[50]
MPP[62]
MPP[2]
MPP[13]
MPP[25]
MPP[36]
MPP[51]
MPP[64]
MPP[3]
MPP[14]
MPP[26]
MPP[38]
MPP[52]
MPP[65]
MPP[4]
MPP[15]
MPP[27]
MPP[39]
MPP[53]
MRn
MPP[5]
MPP[16]
MPP[28]
MPP[41]
MPP[55]
Table 34: Internal Pull-down Pins
Pin Name
Pin Name
JT_CLK
MPP[37]
JT_RSTn
MPP[40]
MPP[1]
MPP[42]
MPP[7]
MPP[43]
MPP[10]
MPP[45]
MPP[20]
MPP[46]
MPP[21]
MPP[54]
MPP[24]
MPP[59]
MPP[34]
MPP[61]
MPP[35]
MPP[63]
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
3
Unused Interface Strapping
Table 35 lists the unused interface signal strapping for systems in which some of the 88F6710,
88F6707, and 88F6W11 interfaces are unused.
Table 35: Unused Interface Strapping
Unused Interface
Str a p p in g
Adaptive Voltage Scaling
If AVS is not used, AVS_FB can be left floating.
The AVS power signal should be connected.
Device/NAND Flash
Connect VDDO_D, VDDO_E, and VDDO_F to 1.8V, 2.5V, or 3.3V.
NOTE: For the 88F6710/88F6W11, the Device bus signals can be left unconnected.
I2C
Unused I2C<n>_SDA and I2C<n>_SCK signals must be pulled up with a 1–4.7 kohm
resistor to the relevant VDDO power domain.
JTAG
See Table 12, JTAG Interface Pin Description, on page 39 for information on what to do
with each pin when this interface is unused.
MPP
Configure unused signals as GPIO outputs. No external pullups are required.
Connect the power rail driving the unused MPPs as follows:
• VDDO_A to 3.3V.
• VDDO_B to 1.8V or 2.5V or 3.3V.
• VDDO_C to 1.8V or 2.5V or 3.3V.
• VDDO_D to 1.8V or 3.3.
• VDDO_E to 1.8V or 3.3V.
• VDDO_F to 1.8V or 3.3V.
PCI Express Clocks
Unused signals can be left unconnected.
To power down the PECL receiver, write 0 to the Ana Grp Config register
(offset: 0x0001847C) <PU_CLK> bit[10].
If the PCIe_CLKREQ pins are not required, the relevant MPP pins must be configured to a
different mode. For further information, see Section 6.1, Multi Purpose Pins Functional
Summary, on page 69.
RTC
RTC_AVDD, RTC_XIN, and RTC_XOUT can be left unconnected.
SDRAM3
If there are unused clock pairs, use one of the following strapping configurations and
register setting for the unused clock pair(s):
• Leave the unused pair unconnected.
In the DDR Controller Control (Low) register, set <Clk1Drv> to 0 (Hi-Z).
NOTE: M_CLKOUT[0] and M_CLKOUTn[0] cannot be disabled and are always driven.
SERDES
Unused SRD<n>_TX_P/N and SRD<n>_RX_P/N signals can be left unconnected.
Power down any unused SERDES port.
If all the SERDES ports are unused:
• Discard the power filter.
• Connect SRD_AVDD to VSS.
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Unused Interface Strapping
Table 35: Unused Interface Strapping (Continued)
Unused Interface
Str a p p in g
UART
Unused UA<n>_RXD signals must be pulled up with a 1–4.7 kohm resistor to the relevant
VDDO power domain.
Unused UA<n>_TXD signals can be left unconnected.
USB
Unused USB<n>_DP and USB<n>_DM signals can be left unconnected.
Power down any unused USB ports.
If all the USB ports are unused:
• Discard the power filter.
• Connect USB_AVDD to VSS.
• Connect USB_AVDDL to VSS.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
4
88F6710, 88F6707, and 88F6W11 Pin
Maps and Pin Lists
The 88F6710, 88F6707, and 88F6W11 pin lists, trace lengths, MPP, and sample at reset information
are provided as an Excel file attachment.
To open the attached Excel file, double-click the pin icons below:
88F6710 Pin Information
88F6707 Pin Information
88F6W11 Pin Information
File attachments are only supported by Adobe Reader 6.0 and above.
Note
To download the latest version of free Adobe Reader go to http://www.adobe.com.
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Clocking
5
Clocking
The 88F6710/6707/6W11 has multiple clock domains:
PCLK: Marvell® Core Processor CPU clock—up to 1.2 GHz
NBCLK: The L2 cache clock—up to 667 MHz
HCLK: The SDRAM controller internal clock—up to 400 MHz
DRAMCLK: The SDRAM interface clock—up to 666 MHz
TCLK: The device’s core clock, also used as the reference clock for the device bus. Runs at
166 MHz or 200 MHz.
NDCLK: The NAND flash clock frequency is generate by dividing an internal VCOb of 2 GHz by
clock divider and dividing it again by 2.1
PCI Express internal clock:
• Runs at 250 MHz when configured to Gen1.1
• Runs at 500 MHz when configured to Gen2.0
GbE ports clock:
•
•
•
•
125 MHz for 1000 Mbps
25 MHz for 100 Mbps
2.5 MHz for 10 Mbps
312.5 MHz for 2500 Mbps
SMI clock: Up to 33 MHz
SATA internal clock: Runs at 150 MHz
USB clock: Runs up to 480 MHz (at High Speed mode)
UART clock: Up to TCLK frequency divided by 16
SPI clock: Up to 50 MHz
I2C clock: Up to 100 kHz
SDIO clock: Up to 50 MHz
TDM clock: Up to 8.192 MHz
1. To configure the NAND clock to 125 MHz or 200 MHz, set bits[13:8] in register address 0x00018748 as follows:
0x8 = 125 MHz
0x5 = 200 MHz
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
5.1
Clock Frequency Configuration Options
Table 36 lists the supported clock frequency combinations that can be configured via the reset
strapping.
Table 36: Clock Frequency Options
NOTE: The Fabric Frequency Configuration column refers to the setting for the pins used to set the fabric frequnecy, see
Section 7.5, Reset Configuration, on page 80.
C PU C lo c k
Frequency
(P C LK ) [M H z ]
L2 and
Coherency
F a b ri c
Fr e qu e n c y
(N B C L K ) [ M H z ]
DRAM
C o n tr ol le r
Clock
Frequency
(HCLK) [MHz]
DDR Interface
Clock
Fr eq u e n cy
(D C LK ) [M H z ]
F a br ic
Frequency
C o n fi gu ra t io n
VDD_CPU [V]
533
533
266
533
0x13
0.9
667
333
333
333
0x1
0.9
800
533
266
533
0x14
1.1
1000
667
333
667
0x14
1.1
1200
600
300
600
0x5
1.01
1. The AVS unit must be used. The power source must be set to 1.0V. The internal AVS mechanism will drive the power
source to adjust the voltage to 1.1V.
Note
5.2
The 0.9V VDD_CPU voltage can only be used if the CPU clock frequency is configured
to 533 MHz or 667 MHz.
Spread Spectrum Clock Generator (SSCG)
The SSCG (Spread Spectrum Clock Generator) may be used to generate the spread spectrum clock
for the PLL input.
The SSCG block operates in Down Spread mode.
The SSCG block can be configured to perform up spread, down spread and center spread.
The modulation frequency is configurable. The typical frequency is 30 kHz.
The spread percentage can also be configured up to 1%.
For additional details, see the SSCG Configuration Register description in the 88F6710, 88F6707,
and 88F6W11 Functional Specifications.
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Pin Multiplexing
Multi Purpose Pins Functional Summary
6
Pin Multiplexing
6.1
Multi Purpose Pins Functional Summary
The device contains 66 Multi Purpose Pins (MPP).
Each pin can be assigned a different functionality through the configuration of the MPP Control
register. These configuration options include:
GPIO: General Purpose In/Out Port, each of the MPP pins may be configured as a GPIO
signals—see the General Purpose I/O Port section in the 88F6710, 88F6707, and 88F6W11
Functional Specifications.
DEV_A[2:0], DEV_AD[15:0], DEV_ALE[1:0], DEV_BOOTCSn, DEV_CSn[3:0], DEV_OEn,
DEV_READYn, DEV_WEn[1:0]: Device Bus signals that are either used for NOR Flash (88F6W11
only) or NAND Flash interface connectivity—see Section 6.6, Device Bus/NAND Flash
Multiplexing (88F6710/88F6W11 Only), on page 74.
TDM_CODEC_INTn, TDM_CODEC_RSTn, TDM_PCLK, TDM_FS, TDM_DRX, TDM_DTX:
TDM (Voice) interface signals—see the TDM section in the 88F6710, 88F6707, and 88F6W11
Functional Specifications.
SPI0_CSn[3:0], SPI1_CSn[1:0], SPI<n>_SCK, SPI<n>_MISO, SPI<n>_MOSI (n = 0 to 1):
SPI (Serial Peripheral Interface) signals—see the SPI section in the 88F6710, 88F6707, and
88F6W11 Functional Specifications.
I2C0/1_SDA, I2C0/1_SCK: I2C signals.
UA<n>_CTS, UA<n>_RTS, UA<n>_RXD, UA<n>_TXD (n = 0 to 1): UART pins—see the UART
section in the 88F6710, 88F6707, and 88F6W11 Functional Specifications.
SD0_CLK, SD0_CMD, SD0_D[3:0]: SDIO interface—see the SDIO section in the 88F6710,
88F6707, and 88F6W11 Functional Specifications.
GE<n>_TXCLKOUT, GE<n>_TXD[3:0], GE<n>_TXCTL, GE<n>_RXD[3:0], GE<n>_RXCTL,
GE<n>_RXCLK (n = 0 to 1): Ethernet RGMII signals for ports 0 and 1 —see the Gigabit
Ethernet Controller section in the 88F6710, 88F6707, and 88F6W11 Functional Specifications.
GE0_TXD[7:4], GE0_TXCLK, GE0_COL, GE0_RXERR, GE0_TXERR, GE0_CRS,
GE0_RXD[7:4]: GbE port0 signals when configured to GMII interface—see the Gigabit Ethernet
Controller section in the 88F6710, 88F6707, and 88F6W11 Functional Specifications. Also, see
Table 38, Gigabit Ethernet Pins Multiplexing for port mode selections.
SATA<n>_PRESENT_ACTIVEn (n = 0 to 1): Combined SATA active and SATA present
indications—see the Serial-ATA section in the 88F6710, 88F6707, and 88F6W11 Functional
Specifications. (The SATA interface only applies to the 88F6710 and 88F6707.)
VDD_CPU_PD: Voltage enable/disable requests from the external power gating logic. Allows
putting the device in “deep idle” power down mode. See the Power Management section in the
88F6710, 88F6707, and 88F6W11 Functional Specifications.
PCIe_CLKREQ0, PCIe_CLKREQ1: When the port is configured as RC, endpoints may drive
the clock request to high. This causes the PCI clock out to be gated. During normal operations,
the clock out should be driven low, which means the PCI clock out is not held. For further
information, see the PCI Express section in the device’s Functional Specifications.
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Hardware Specifications
PCIe_RST_OUTn: PCIe reset out indication. See the PCI Express section in the 88F6710,
88F6707, and 88F6W11 Functional Specifications.
AU_SPDIFI, AU_SPDIFO, AU_SPDIFRMCLK, AU_I2SBCLK, AU_I2SDO, AU_I2SLRCLK,
AU_I2SMCLK, AU_I2SDI, AU_EXTCLK: Audio Interface signals—see the Audio Interface
section in the 88F6710, 88F6707, and 88F6W11 Functional Specifications. (The Audio interface
only applies to the 88F6710 and 88F6707.)
Note
6.2
The Excel files attached to Section 4, 88F6710, 88F6707, and 88F6W11 Pin Maps and
Pin Lists, on page 66 contain an MPP Table worksheet that lists the MPP pins for the
88F6710, 88F6707, and 88F6W11. For more information, refer to the Pins Multiplexing
Interface Registers section in the 88F6710, 88F6707, and 88F6W11 Functional
Specifications.
Multi Purpose Pins Power Segments
The different power segments for each of the MPP pins is listed in the Power Pins Description table
in Table 4, Power Supply Pins Description, on page 31.
The voltage level of VDDO_D, VDDO_E, and VDDO_F is determined by reset strap SAR[7]. The
voltage level of VDDO_B and VDDO_C is 3.3V by default, with a register configurable option to 1.8V
or 2.5V.
Note
The VDDO_A voltage level is 3.3V and cannot be changed by a reset strap or a
register configuration.
The Excel files attached to Section 4, 88F6710, 88F6707, and 88F6W11 Pin Maps
and Pin Lists, on page 66 contain a Sample at Reset worksheet with the pins that
are sampled during SYSRSTn de-assertion.
To change the VDDO_D, VDDO_E, and VDDO_F voltage level after reset, it is possible to configure
these signals to a different voltage level by configuring IO Configuration 0 register (offset:
0x000184E0) after the boot process is completed, see Table 37.
Table 37: VDDO Voltage Configuration Options
Pi n
On-Board
Vo lta g e
C o n ne c ti o n
R e s e t St r a p
Sett in g
I O C o nf ig u ra ti on
Register
F i e ld s [ B i ts ]
I O C on fi g ur a ti on
R e g i s t e r Vol ta g e
S e tti n gs
VDDO_A
3.3V
NA
NA
NA
VDDO_B
1.8/2.5/3.3V
NA
VDDO B PADS
Voltage [3:2]
1.8V, 0x0
2.5V, 0x1
3.3V, 0x2
VDDO_C
1.8/2.5/3.3V
NA
VDDO C PADS
Voltage [5:4]
1.8V, 0x0
2.5V, 0x1
3.3V, 0x2
VDDO_D
3.3V
3.3V
VDDO D PADS
Voltage [7:6]
1.8V, 0x0
2.5V, 0x1
3.3V, 0x2
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Pin Multiplexing
Multi Purpose Pins Functional Considerations
Table 37: VDDO Voltage Configuration Options (Continued)
Pi n
On-Board
Vo lta g e
C o n ne c ti o n
R e s e t St r a p
Sett in g
I O C o nf ig u ra ti on
Register
F i e ld s [ B i ts ]
I O C on fi g ur a ti on
R e g i s t e r Vol ta g e
S e tti n gs
VDDO_E
1.8V
3.3V
VDDO E PADS
Voltage [9:8]
1.8V, 0x0
2.5V, 0x1
3.3V, 0x2
VDDO_F
1.8V
3.3V
VDDO F PADS
Voltage [11:10]
1.8V, 0x0
2.5V, 0x1
3.3V, 0x2
Refer to the System Considerations section in the 88F6710, 88F6707, and 88F6W11 Functional
Specifications for more information about voltage setting.
6.3
Multi Purpose Pins Functional Considerations
When configuring MPP pins note the following issues, also refer to the attached Multi Purpose Pin
Functional Summary Table:
For MPPs assigned as NOR or SPI flash, the wake-up mode after reset depends on the Boot
mode.
There are a few options for the boot device as listed in the attached reset configuration
information (see Section 4, 88F6710, 88F6707, and 88F6W11 Pin Maps and Pin Lists,
on page 66). The value set in field Boot Device Type Selection determines the type of the boot
select during reset.
UART0 and UART1 signals are duplicated on some MPP pins. The UART0 signals must not be
configured to more than one MPP option.
All other MPP interface pins wake up after reset in 0x0 mode (GPIO). By default, these pins are
set to Data Output disabled (Tri-State). Therefore, these MPPs are in fact inputs.
Some of the MPP pins are sampled during SYSRSTn de-assertion to set the device
configuration. These pins must be driven to the correct value during reset.
Pins that are left as GPIO and are not connected must be configured as outputs via the GPIO
registers after SYSRSTn de-assertion (see General Purpose I/O section in the 88F6710,
88F6707, and 88F6W11 Functional Specifications).
6.4
Gigabit Ethernet Pins Multiplexing on the MPP
There are two Gigabit Ethernet ports that are multiplexed on the MPP pins.
Each of these Gigabit Ethernet ports can operate in RGMII mode.
Port 0 also supports GMII/MII signaling.
The device also contains a SERDES interface that can be used as SGMII interfaces for port 0 and
port 1. Once a port is configured as an SGMII port, it cannot be selected as an RGMII/GMII/MII port
on the MPP pins. The SGMII interface may be selected on various SERDES options (see
Section 6.5, High-Speed SERDES Multiplexing, on page 73. Do not select more than one SERDES
option for the same GbE port.
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88F6710, 88F6707, and 88F6W11
Hardware Specifications
Table 38 lists the Gigabit Ethernet multiplexing pin configuration options for Port0 and Port1, when
the port is not used as SGMII.
Table 38: Gigabit Ethernet Pins Multiplexing
M PP P i n
G E 0 G M I I, G E1
is SG M II or
N /A
G E0 M II , G E1
is SGMII or
N/A
G E0 R G M II ,
GE1 either
SG M I I or N /A
MPP[5]
GE0_TXCLKOUT
(out)
N/A
GE0_TXCLKOUT
(out)
N/A
GE0_TXCLKOUT
(out)
MPP[6]
GE0_TXD[0] (out)
GE0_TXD[0] (out)
GE0_TXD[0] (out)
N/A
GE0_TXD[0] (out)
MPP[7]
GE0_TXD[1] (out)
GE0_TXD[1] (out)
GE0_TXD[1] (out)
N/A
GE0_TXD[1] (out)
MPP[8]
GE0_TXD[2] (out)
GE0_TXD[2] (out)
GE0_TXD[2] (out)
N/A
GE0_TXD[2] (out)
MPP[9]
GE0_TXD[3] (out)
GE0_TXD[3] (out)
GE0_TXD[3] (out)
N/A
GE0_TXD[3] (out)
MPP[10]
GE0_TXEN (out)
GE0_TXEN (out)
GE0_TXCTL (out)
N/A
GE0_TXCTL (out)
MPP[11]
GE0_RXD[0] (in)
GE0_RXD[0] (in)
GE0_RXD[0] (in)
N/A
GE0_RXD[0] (in)
MPP[12]
GE0_RXD[1] (in)
GE0_RXD[1] (in)
GE0_RXD[1] (in)
N/A
GE0_RXD[1] (in)
MPP[13]
GE0_RXD[2] (in)
GE0_RXD[2] (in)
GE0_RXD[2] (in)
N/A
GE0_RXD[2] (in)
MPP[14]
GE0_RXD[3] (in)
GE0_RXD[3] (in)
GE0_RXD[3] (in)
N/A
GE0_RXD[3] (in)
MPP[15]
GE0_RXDV (in)
GE0_RXDV (in)
GE0_RXCTL (in)
N/A
GE0_RXCTL (in)
MPP[16}
GE0_RXCLK (in)
GE0_RXCLK (in)
GE0_RXCLK (in)
N/A
GE0_RXCLK (in)
MPP[19]
N/A
GE0_TXCLK (in)
N/A
GE1_TXCLKOUT
(out)
GE1_TXCLKOUT
(out)
MPP[20]
GE0_TXD[4] (out)
GE0_TXERR
(out)
N/A
GE1_TXD[0] (out)
GE1_TXD[0] (out)
MPP[21]
GE0_TXD[5] (out)
N/A
N/A
GE1_TXD[1] (out)
GE1_TXD[1] (out)
MPP[22]
GE0_TXD[6] (out)
N/A
N/A
GE1_TXD[2] (out)
GE1_TXD[2] (out)
MPP[23]
GE0_TXD[7] (out)
N/A
N/A
GE1_TXD[3] (out)
GE1_TXD[3] (out)
MPP[24]
N/A
GE0_COL (in)
N/A
GE1_TXCTL (out)
GE1_TXCTL (out)
MPP[25]
GE0_RXERR (in)
GE0_RXERR (in)
N/A
GE1_RXD[0] (in)
GE1_RXD[0] (in)
MPP[26]
GE0_CRS (in)
GE0_CRS (in)
N/A
GE1_RXD[1] (in)
GE1_RXD[1] (in)
MPP[27]
GE0_RXD[4] (in)
N/A
N/A
GE1_RXD[2] (in)
GE1_RXD[2] (in)
MPP[28]
GE0_RXD[5] (in)
N/A
N/A
GE1_RXD[3] (in)
GE1_RXD[3] (in)
MPP[29]
GE0_RXD[6] (in)
N/A
N/A
GE1_RXCTL (in)
GE1_RXCTL (in)
MPP[30]
GE0_RXD[7] (in)
N/A
N/A
GE1_RXCLK (in)
GE1_RXCLK (in)
Doc. No. MV-S107978-00 Rev. G
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GE1 RGMII,
G E0 e it h e r
S G M II o r N / A
B o th G E 0 a n d
G E1 a r e R G M II
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Pin Multiplexing
High-Speed SERDES Multiplexing
Table 38: Gigabit Ethernet Pins Multiplexing (Continued)
M PP P i n
G E 0 G M I I, G E1
is SG M II or
N /A
MPP[31]
GE0_TXERR
(out)
Note
6.5
G E0 M II , G E1
is SGMII or
N/A
G E0 R G M II ,
GE1 either
SG M I I or N /A
N/A
N/A
GE1 RGMII,
G E0 e it h e r
S G M II o r N / A
N/A
B o th G E 0 a n d
G E1 a r e R G M II
N/A
When using GbE signals on MPPs, all relevant GbE signals (except those marked
as N/A) must be implemented. For example, if using MII, and the chosen PHY does not
have an MII_RXERR out signal, the GE0_RXERR on the MPP pin must still be
configured accordingly and must have a pull-down resistor.
High-Speed SERDES Multiplexing
The 88F6710/6707/6W11 integrates four high-speed SERDES lanes.
The SERDES lanes provide a physical SERDES link to the following interfaces:
The following PCI Express operational modes:
• Gen2.0 up to 5 Gbps
• Gen1.1 up to 2.5 Gbps
SGMII interface:
• SGMII0 can operate at 1.25 Gbps or 3.125 Gbps.
• SGMII1 operate at 1.25 Gbps.
SATA Gen1 (1.5 Gbps) and SATA Gen2 (3 Gbps)
Table 39 lists the different modes available for each SERDES lane. Each lane can be configured
independently for the required link type, according to the specified application. If a lane is unused, it
can be turned off.
Table 39: 88F6710, 88F6707, and 88F6W11 SERDES Lanes Multiplex Options
8 8 F 6 7 1 0 , 8 8 F 6 7 0 7 , a n d 8 8 F 6 W 11 S E R D E S L a n e s
0
PCIe port 0
(RC or EP1)
1
3
PCIe port 1
(RC)
SATA02
SGMII1
2
SGMII0
SATA0
SATA1
SGMII0
SGMII1
1. Root Complex (RC), EndPoint (EP)
2. Only the 88F6710 and 88F6707 supports the SATA interface.
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Hardware Specifications
6.6
Device Bus/NAND Flash Multiplexing
(88F6710/88F6W11 Only)
If a NAND Flash interface is used, it is necessary to configure this interface through the Device Bus
pins.
Table 40 lists the MPP pins used for the Device Bus and their corresponding NAND Flash pins.
Table 40: Device Bus/NAND Flash Multiplexing
MPP #
Device Bus
NAND Flash
(88F6710/88F6W11 only)
MPP[33]
DEV_BOOTCSn (out)
NF_CSn[0] (out)
MPP[34]
DEV_WEn[0] (out)
NF_WEn (out)
MPP[35]
DEV_Oen (out)
NF_Ren (out)
MPP[36]
DEV_A[1] (out)
NF_ALE (out)
MPP[37]
DEV_A[0] (out)
NF_CLE (out)
MPP[38]
DEV_READYn (in)
NF_RDY (in)
MPP[39]
DEV_AD[0]
NF_IO[0]
MPP[40]
DEV_AD[1]
NF_IO[1]
MPP[41]
DEV_AD[2]
NF_IO[2]
MPP[42]
DEV_AD[3]
NF_IO[3]
MPP[43]
DEV_AD[4]
NF_IO[4]
MPP[44]
DEV_AD[5]
NF_IO[5]
MPP[45]
DEV_AD[6]
NF_IO[6]
MPP[46]
DEV_AD[7]
NF_IO[7]
MPP[47]
DEV_AD[8]
NF_IO[8]
MPP[48]
DEV_AD[9]
NF_IO[9]
MPP[49]
DEV_AD[10]
NF_IO[10]
MPP[50]
DEV_AD[11]
NF_IO[11]
MPP[51]
DEV_AD[12]
NF_IO[12]
MPP[52]
DEV_AD[13]
NF_IO[13]
MPP[53]
DEV_AD[14]
NF_IO[14]
MPP[54]
DEV_AD[15]
NF_IO[15]
MPP[55]
DEV_CSn[1] (out)
NF_CSn[1] (out)
MPP[56]
DEV_CSn[2] (out)
NF_CSn[2] (out)
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Pin Multiplexing
Device Bus/NAND Flash Multiplexing (88F6710/88F6W11 Only)
Table 40: Device Bus/NAND Flash Multiplexing (Continued)
MPP #
Device Bus
NAND Flash
(88F6710/88F6W11 only)
MPP[57]
DEV_CSn[3] (out)
NF_CSn[3] (out)
MPP[58]
DEV_CSn[0] (out)
NF_CSn[0] (out)
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Hardware Specifications
7
Reset and Initialization
This section details the device’s reset sequence and initialization procedure.
7.1
Power Up/Down Sequence
7.1.1
Power-Up Sequence
These requirements must be applied to meet the device power-up sequence (see Figure 4):
The Non-Core voltages (I/O and Analog) as listed in Table 41 must reach 70% of their voltage
level before the Core voltages reach 70% of their voltage level.
The order of the power up sequence between the Non-Core voltages is unimportant.
POR (Power On Reset) is triggered by VDD, when SYSRST_OUTn is de-asserted 20 ms after
VDD starts power up.
• When AVS is used:
After VDD power up, VDD_CPU power good state must be reached within 5 ms.
• When AVS is not used:
The VDD and VDD_CPU power must be in a power good state at least 5 ms before
SYSRSTn is de-asserted. Therefore, VDD_CPU must reach power good up to 15 ms after
VDD power up (20–5).
Each input reference clock must be active for several cycles before reset de-assertion.
Table 41: I/O and Core Voltages
N on -C o r e Vol ta g e s
I/ O Vo lta ge s
A n a l og Po w e r S up p li e s
VDDO_A
VDDO_B
VDDO_C
VDDO_D
VDDO_E
VDDO_F
VDDO_M
RTC_AVDD
SRD_AVDD
MISC_PLL_AVDD
CPU_PLL_AVDD
XTAL_AVDD
USB_AVDD
USB_AVDDL
AVS_AVDD
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C o r e Vo lta g e s
VDD
VDD_CPU
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Reset and Initialization
Power Up/Down Sequence
Figure 4: Power Up Sequence Example
tVDDO
Analog / IO Non-Core
VDD_CPU
(where applicable)
VDD
tVDDPG
tSYSRTS
SYSRSTn
REFCLK_XIN
Note
Figure 4 does not apply if the CPU is configured to operate at 667 MHz. In this case,
the CPU and Core can be implemented on the same 0.9V power rail.
Table 42: Power-Up Sequence Symbols
Sy m b o ls
Ti m i ng Va l u e s
D e s c r i p t io n
tVDDO
100 ms (maximum)
Maximum time between the first non-core voltage
power-up and the last core voltage power-up.
tVDDPG1
5 ms (with AVS enabled and
CPU frequency at 1.2 GHz)
Maximum time between VDD power-good and
VDD_CPU power-good.
(Power is within the recommended operating condition
range.)
15 ms (with AVS disabled)
tSYSRST
20 ms (minimum)
Minimum time between VDD power-up and SYSRST
de-assertion.
1. Only relevant when SYSRST_OUTn is connected to SYSRSTn.
It is the designer's responsibility to verify that the power sequencing requirements of
other components are also met.
Note
7.1.2
Power-Down Sequence
Allow a reasonable time limit (for example 100 ms) between the first and last voltage power-down.
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Hardware Specifications
When using the AVS, it is necessary to first power down the VDD_CPU power supply and then the
VDD power supply, before powering down the AVDD analog power supplies listed in Table 41 on
page 76.
7.2
Hardware Reset
The device has three reset inputs pin: SYSRSTn, CDRn, MRn. The following sections describe the
functionality of these signals
7.2.1
Global System Reset (SYSRSTn)
When asserted, the entire chip is placed in its initial state. Most outputs are placed in High-Z.
The following output pins are still active during SYSRSTn assertion:
M_CLKOUT[1:0], M_CLKOUTn[1:0]
M_CKE[1:0]
M_ODT[3:0]
M_RESET
SRD<n>_TX_P
SRD<n>_TX_N
USB<n>_DM
USB<n>_DP
PEX<n>_CLK_P
PEX<n>_CLK_N
The device has an optional SYSRST_OUTn open drain output signal, that is used as a reset request
from the device to the board reset logic. This signal is set when one of the following maskable events
occurs. In each of these cases, SYSRST_OUTn is asserted for a duration of 100 ms:
Received a hot reset indication from the PCI Express Port 0 link, when used as a PCI Express
endpoint, and bit <PexRstOutEn> is set to 1 in the RSTOUTn Mask Register (see the
Miscellaneous Registers and Tables section of the 88F6710, 88F6707, and 88F6W11
Functional Specifications).
PCI Express Port 0 link failure, when used as a PCI Express endpoint, and bit <PexRstOutEn>
is set to 1 in the RSTOUTn Mask Register (see the Miscellaneous Registers and Tables section
of the 88F6710, 88F6707, and 88F6W11 Functional Specifications).
One of the Watchdog timers expires and bit <WDRstOutEn> of the relevant watchdog counter is
set to 1 in the RSTOUTn Mask Register (see the Miscellaneous Registers and Tables section of
the 88F6710, 88F6707, and 88F6W11 Functional Specifications).
Bit <SystemSoftRst> is set to 1 in System Soft Reset Register and bit <SoftRstOutEn> is set to
1 in RSTOUTn Mask Register. (see the Miscellaneous Registers and Tables section of the
88F6710, 88F6707, and 88F6W11 Functional Specifications).
An assertion of the internal power-on-reset (POR) circuit (see Section 7.4, Power On Reset
(POR), on page 80 for further details). This assertion is not maskable. The duration of this
assertion is for at least 100 ms.
SYSRST_OUTn is asserted as long as the MRn input signal is asserted low, and for an
additional at least 100 ms after MRn de-assertion (This is useful for implementations that
include a manual reset button).
Note
SYSRSTn must be active for a minimum length of 100 ms. Core power, I/O power, and
analog power must be stable (VDD +/- 5%) during that time and onward.
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Reset and Initialization
PCI Express Reset
7.2.1.1
SYSRSTn Duration Counter
When SYSRSTn is asserted low, a SYSRSTn duration counter starts counting. It continues to count
as long as the SYSRSTn signal remains asserted.
The counter clock is the 25 MHz reference clock.
It is a 29-bit counter, yielding a maximum counting duration of 2^29/25 MHz (21.4 seconds).
The host software can read the counter value and reset the counter.
When the counter reaches its maximum value, it remains at this value until the counter reset is
triggered by software.
See the 88F6710, 88F6707, and 88F6W11 Functional Specifications for details on how to configure
the SYSRSTn duration counter.
Note
7.2.2
The SYSRSTn duration counter is useful for implementing manufacturer/factory reset.
Upon a long reset assertion, greater than a pre-configured threshold, the host software
may reset all settings to the factory default values.
Manual Reset (MRn)
The Manual Reset pin (MRn) provide the user the ability to reset the device without powering down
the device. This is useful for implementations that include a reset button. Once MRn pin is asserted
low, the device’s reset logic, that includes a bouncer circuit to avoid false reset spikes, will propagate
a reset indication to the SYSRST_OUTn pin. The SYSRST_OUTn will be asserted as long as the
MRn pin is kept asserted and for additional 100ms. The external (on board) logic may drive this
indication back to the SYSRSTn pin to reset the device, and in addition use the SYSRST_OUTn pin
to reset the entire board.
7.2.3
Marvell® Core Processor CPU Debugger Reset
Connect the CPU debugger reset to the CDRn pin.
When the CPU Debugger reset is asserted, the device returns to its default value. The device
mechanisms related to the debugger are excluded from the reset event. This includes the PLLs, the
SSCG, the XTAL, and the registers controlling those mechanisms.
In general, the CDRn is de-asserted after all processes on the TAP controller are completed (refer to
the specific Debugger specifications).
CPU debugger reset should be fed into two separate circuits:
The device’s CDRn pin (the reset pin for the debugger).
The board reset for all other devices (not including the device’s SYSRSTn pin), since
SYSRST_OUTn will not be forced by the CDR pin.
7.3
PCI Express Reset
As a Root Complex, the device can generate a Hot Reset to the PCI Express port. Upon CPU
setting of the PCI Express Control register’s <conf_mstr_hot_reset> bit, the PCI Express unit sends
a Hot Reset indication to the Endpoint (see the PCI Express Interface section in the 88F6710,
88F6707, and 88F6W11 Functional Specifications).
When the device works as an Endpoint, and a Hot Reset packet is received:
A maskable interrupt is asserted.
If the PCI Express Debug Control register’s <dis_hot_rst_reg_rst> is cleared, the device also
resets the PCI Express register file to its default values.
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Hardware Specifications
The device triggers an internal reset, if not masked by PCI Express Debug Control register’s
<ConfMskHotReset> bit.
Link failure is detected if the PCI Express link was up (LTTSSM L0 state) and dropped back to an
inactive state (LTSSM Detect state). When Link failure is detected:
A maskable interrupt is asserted
If the PCI Express Debug Control register’s <conf_dis_link_fail_reg_rst> is cleared, the device
also resets the PCI Express register file to its default values.
The device triggers an internal reset, if not masked by PCI Express Debug Control register’s
<ConfMskLinkFail> bit.
Whether initiated by a hot reset or link failure, this internal reset indication can be routed to the
PCIe_RST_OUTn signal (multiplexed on MPP[60]) to reset components on the board without
resetting the entire device (e.g reset only the endpoint card).
Note
7.4
Only the PCIe 0 port can act as a PCI Express endpoint, and only this port can
generate the PCI Express internal reset indication.
Power On Reset (POR)
The device integrates a Power On Reset (POR) circuit. The circuit is triggered when VDD power up
(digital core voltage) reaches a VDD threshold (with a threshold maximum value of 0.8V).
Hysteresis: Another trigger will only occur after the power first drops to 50 mV, and then a power up
occurs.
Once the POR logic was triggered the SYSRST_OUTn output signal is asserted low for 100 ms.
The SYSRST_OUTn signal may be connected externally to the device’s SYSRSTn input signal
asserting the device’s internal reset signal. In addition, the SYSRST_OUTn signal may be used in
this case as the POR generator for the entire board.
7.5
Reset Configuration
The device uses certain pins as configuration inputs to set certain critical parameters following a
reset. The definition of the sampled at reset configuration pins revert immediately after reset to their
regular function.
Note
The Excel files attached to Section 4, 88F6710, 88F6707, and 88F6W11 Pin Maps and
Pin Lists, on page 66 contain a Sample at Reset worksheet with the pins that are
sampled during SYSRSTn de-assertion.
Some of the device’s pins integrate an internal pull-up/pull-down resistors to set a default mode.
Smaller external pull-up/pull-down resistors are required to change the default mode of operation, if
required. These signals must remain pulled up or down until SYSRSTn de-assertion (zero Hold time
in respect to SYSRSTn de-assertion).
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Reset and Initialization
Serial ROM Initialization
Note
7.6
If external logic is used instead of pull-up and pull-down resistors, the logic must
drive all of these signals to the desired values during SYSRSTn assertion. To
prevent bus contention on these pins, the external logic must float the bus no later
than the third TCLK cycle after SYSRSTn de-assertion.
All reset sampled values are registered in the Sample at Reset register (see the
MPP Registers in the 88F6710, 88F6707, and 88F6W11 Functional
Specifications). This is useful for board debug purposes and identification of board
and system settings for the host software.
If a signal is pulled up on the board for reset sampling, it must be pulled to the
appropriate voltage level of the power domain that the signal is assigned to. For
example, if MPP[X] should be pulled up for reset sampling, it should be pulled to
the voltage level of the VDDO who is feeding MPP[X] according to the pin
description table.
If an external device is driving any of the pins that are used as sampled at reset
signals, make sure to keep this external device in reset state (prevent it from
driving) or use glue logic to disconnect it from the device as long as the device
SYSRSTn input is asserted.
Serial ROM Initialization
The device supports initialization of ALL of its internal and configuration registers through the I2C
master interface. If serial ROM initialization is enabled by pulling up I2C Serial ROM Initialization
during SYSRSTn assertion, the device I2C master starts reading initialization data from serial ROM
and writes it to the appropriate registers.
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Hardware Specifications
7.6.1
Serial ROM Data Structure
The Serial ROM data structure consists of a sequence of 32-bit address and 32-bit data pairs, as
shown in Figure 5.
Figure 5: Serial ROM Data Structure
Start
MSB
LSB
address0[31:24]
address0[23:16]
address0[15:8]
address0[7:0]
data0[31:24]
data0[23:16]
data0[15:8]
data0[7:0]
address1[31:24]
address1[23:16]
address1[15:8]
address1[7:0]
data1[31:24]
data1[23:16]
data1[15:8]
data1[7:0]
The serial ROM initialization logic reads eight bytes at a time. It performs address decoding on the
32-bit address being read, and based on address decoding result, writes the next four bytes to the
required target.
The Serial Initialization Last Data Register contains the expected value of last serial data item
(default value is 0xFFFFFFFF). When the device reaches last data, it stops the initialization
sequence.
Note
7.6.2
Users must not generate requests through the I2C0 auto-loader to addresses that are
not 32-bit aligned.
Serial ROM Initialization Operation
On SYSRSTn de-assertion, the device starts the initialization process. It first performs a dummy
write access to the serial ROM, with data byte(s) of 0x0, to set the ROM byte offset to 0x0. Then, it
performs a sequence of reads, until it reaches last data item, as shown in Figure 6.
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Reset and Initialization
Boot Sequence
Figure 6: Serial ROM Read Example
w
r
i
t
e
s
t
a
r
t
s 1 0 1 0 0 0 0 0
0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
Data from
ROM
r
e
a
d
s 1 0 1 0 0 0 0 1
a
c
k
a
c
k
a
c
k
s
t
a
r
t
Lower Byte Offset
Upper Byte Offset
A A A A A A A A
a
c
k
A A A A
a
c
k
ROM
Address
ROM
Address
Last Data
from ROM
1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1
a
c
k
1 1 1 1 1 1 1 1
a
c
k
s
t
o
p
1 1 1 1 1 1 1 1
a
c
k
x x x x x x x x
a
c
k
p
n
a
c
k
Implementation Notes:
Initialization data must be programmed in the serial ROM starting at offset 0x0.
The device assumes 7-bit serial ROM address of ‘b1010000.
After receiving the last data identifier (default value is 0xFFFFFFFF), the device receives an
additional byte of dummy data. It responds with no-ack, and then asserts the stop bit.
For a detailed description of I2C implementation, see the Two-Wire Serial Interface section in the
88F6710, 88F6707, and 88F6W11 Functional Specifications.
7.7
Boot Sequence
The device requires that SYSRSTn stay asserted for at least 100 ms after power and clocks are
stable. The following procedure describes the boot sequence starting with SYSRSTn assertion:
1. While SYSRSTn is asserted, the CPU PLL and the core PLL are locked.
2. Upon SYSRSTn de-assertion, the pad drive auto-calibration process starts and the DRAM PHY
DLL starts to lock on the target frequency speed. It requires 3ms to gain lock indication and be
ready for normal operation.
3. If Serial ROM initialization is enabled, an initialization sequence is started.
Upon completing the above sequence, the internal CPU reset is de-asserted, and the CPU starts
executing boot code from the internal Boot ROM, according to sample at reset setting of Boot
Device Type Selection.
For boot sequence details, see the BootROM Firmware section in the device’s Functional
Specifications.
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Hardware Specifications
8
JTAG Interface
The JTAG interface is used for chip boundary scan, as defined by the IEEE JTAG standard 1149.1,
and for CPU CoreSight™ debugging and tracing.
The device supports the following test modes:
Boundary Scan
The JT_TMS_CPU is kept high.
This state resets the CPU TAP and the CoreSight Debug Access Port
(DAP) controllers, and multiplexes the boundary scan TDO signal on
the JT_TDO pin.
CPU debugger and trace The JT_TMS_CORE is kept high.
This state resets the device TAP controller, and multiplexes the
CPU TAP and the CoreSight Debug Access Port (DAP) controllers TDO
signal on the JT_TDO pin.
The device’s TAP, CPU TAP, and the CoreSight DAP controllers have different JT_TMS signals.
The JT_TMS_CPU signal is used for the CPU TAP and CoreSight DAP controllers.
The JT_TMS_CORE is used for device’s TAP controller.
However, all of the controllers share the JT_RSTn, JT_TCK, and JT_TDI JTAG signals. The
JT_TDO signal is the output of the multiplexing between the CoreSight DAP and the device’s TAP
controllers’ TDO pins.
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JTAG Interface
CoreSight™ Subsystem ARMv7 Mode
8.1
CoreSight™ Subsystem ARMv7 Mode
The JTAG signals are only being used by the TAP and the CoreSight DAP controllers (see Figure 7).
Figure 7: CoreSight Subsystem ARMv7 Mode
JT_TDI
JT_RSTn
JT_CLK
JT_TMS_CPU
CoreSight™
DAP Controller
Debug TDO
JT_RSTn
JT_TDO
JT_CLK
Core
TAP Controller
JT_TMS_CORE
Boundary Scan TDO
JT_TDI
8.2
Instruction Register
The Instruction register (IR) is a 4-bit, two-stage register. It contains the command that is shifted in
when the TAP FSM is in the Shift-IR state. When the TAP FSM is in the Capture-IR state, the IR
outputs all four bits in parallel.
Table 43 lists the instructions supported by the device.
Table 43: Supported JTAG Instructions
In s t r u c t io n
C o de
D es c r ip t i o n
HIGH-Z
00011
Select the single bit Bypass register between TDI and TDO.
Sets the device output pins to high-impedance state.
IDCODE
00010
Selects the Identification register between TDI and TDO. This 32-bit
register is used to identify the device.
EXTEST
00000
Selects the Boundary Scan register between TDI and TDO. Outputs the
boundary scan register cells to drive the output pins of the device. Inputs
the boundary scan register cell to sample the input pin of the device.
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Hardware Specifications
Table 43: Supported JTAG Instructions (Continued)
8.3
In s t r u c t io n
C o de
D es c r ip t i o n
SAMPLE/
PRELOAD
00001
Selects the Boundary Scan register between TDI and TDO. Samples
input pins of the device to input boundary scan register cells.
Preloads the output boundary scan register cells with the Boundary Scan
register value.
BYPASS
11111
Selects the single bit Bypass register between TDI and TDO. This allows
for rapid data movement through an untested device.
Bypass Register
The Bypass register (BR) is a single bit serial shift register that connects TDI to TDO, when the IR
holds the Bypass command, and the TAP FSM is in Shift-DR state. Data that is driven on the TDI
input pin is shifted out one cycle later on the TDO output pin. The Bypass register is loaded with 0
when the TAP FSM is in the Capture-DR state.
8.4
JTAG Scan Chain
The JTAG Scan Chain is a serial shift register used to sample and drive all of the device pins during
the JTAG tests. It is a 2-bit per pin shift register in the device, thereby allowing the shift register to
sequentially access all of the data pins both for driving and strobing data. For further details, refer to
the BSDL Description file for the device.
8.5
ID Register
The ID register is a 32-bit deep serial shift register. The ID register is loaded with vendor and device
information when the TAP FSM is in the Capture-DR state. The Identification code format of the ID
register is shown in Table 44, which describes the various ID Code fields.
Table 44: IDCODE Register Map
B i ts
Va l u e
Description
31:28
0x0 (A0)
0x1 (A1)
Version
27:12
0x6710
Device ID
11:1
0x1AB
Manufacturer ID
0
1
Mandatory
Doc. No. MV-S107978-00 Rev. G
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Electrical Specifications
Absolute Maximum Ratings
9
Electrical Specifications
9.1
Absolute Maximum Ratings
Table 45: Absolute Maximum Ratings
Parameter
Min
Max
Units
C o m m e n ts
VDD
-0.5
1.4
V
Core voltage
VDD_CPU
-0.5
1.4
V
CPU voltage
VDD_CPU_AON
-0.5
1.4
V
Power supply input for AVS operation during
VDD_CPU power down.
MISC_PLL_AVDD
-0.5
2.2
V
Analog supply for the internal PLL
CPU_PLL_AVDD
-0.5
2.2
V
Analog supply for the CPU PLL
VDDO_M
-0.5
2.2
V
I/O voltage for:
SDRAM interface
VDDO_A
VDDO_B
VDDO_C
VDDO_D
VDDO_E
VDDO_F
-0.5
4.0
V
I/O voltage for:
JTAG interfaces and the following signals:
• SYSRSTn
• SYSRST_OUTn
• MRn
• CDRn
• MPP[65:0]
AVS_AVDD
-0.5
2.2
V
I/O voltage for:
AVS
USB_AVDD
-0.5
4.0
V
Analog input voltage for:
USB interface
USB_AVDDL
-0.5
2.2
V
Analog input voltage for:
USB interface
SRD_AVDD
-0.5
2.2
V
Analog input voltage for:
SERDES interface
RTC_AVDD
-0.5
2.2
V
Analog input voltage for:
RTC interface
XTAL_AVDD
-0.5
2.2
V
Analog input voltage for:
XTAL interface
TC
-40
125
°C
Case temperature
TSTG
-40
125
°C
Storage temperature
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Hardware Specifications
Caution
Note
Exposure to conditions at or beyond the maximum rating can damage the device.
Operation beyond the recommended operating conditions (Table 46) is neither
recommended nor guaranteed.
Before designing a system, it is recommended that you read application note AN-63:
Thermal Management for Marvell® Technology Products. This application note
presents basic concepts of thermal management for Integrated Circuits (ICs) and
includes guidelines to ensure optimal operating conditions for Marvell Technology's
products.
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Electrical Specifications
Recommended Operating Conditions
9.2
Recommended Operating Conditions
Table 46: Recommended Operating Conditions
Parameter
M in
Ty p
Max
Units
C o m m e n ts
VDD
0.85
0.9
0.95
V
Core voltage
VDD_CPU
0.85
0.9
0.95
V
CPU voltage, up to 667 MHz
1.05
1.1
1.15
V
CPU voltage, 800 MHz–1.0 GHz
V
CPU voltage at 1.2 GHz
1.0
NOTE: The AVS unit must be used if the
CPU frequency is 1.2 GHz.
The power source must be set to
1.0V ±5%. The AVS unit will drive
the power source to adjust the
voltage to 1.1V.
VDD_CPU_AON
0.85
0.9
0.95
V
CPU voltage, up to 667 MHz.
Always on power supply input for AVS
operation during VDD_CPU power down.
NOTE: For VDD_CPU_AON connectivity
information, see the device Design
Guideline.
1.05
1.1
1.15
1.0
V
CPU voltage, 800 MHz–1.0 GHz
V
CPU voltage at 1.2 GHz
NOTE: The AVS unit must be used if the
CPU frequency is 1.2 GHz.
MISC_PLL_AVDD
1.7
1.8
1.9
V
Analog supply for the internal PLL
CPU_PLL_AVDD
1.7
1.8
1.9
V
Analog supply for the CPU PLL
VDDO_M
1.283
1.35
1.45
V
I/O voltage for:
SDRAM DDR3 1.5 / DDR3L 1.35V
1.425
1.5
1.575
V
3.15
3.3
3.45
V
VDDO_A
I/O voltage for:
JTAG interfaces and the following signals:
• SYSRSTn
• SYSRST_OUTn
• MRn
• CDRn
• MPP[4:0]
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Hardware Specifications
Table 46: Recommended Operating Conditions (Continued)
Parameter
M in
Ty p
Max
Units
C o m m e n ts
VDDO_B
1.7
1.8
1.9
V
I/O voltage for:
MPP[16:5] pins
2.375
2.5
2.625
3.15
3.3
3.45
1.7
1.8
1.9
V
I/O voltage for:
MPP[31:17] pins
2.375
2.5
2.625
3.15
3.3
3.45
1.7
1.8
1.9
V
I/O voltage for:
for MPP[65:63] and MPP[46:32]
3.15
3.3
3.45
1.7
1.8
1.9
V
I/O voltage for:
for MPP[52:47]
3.15
3.3
3.45
1.7
1.8
1.9
V
I/O voltage for:
for MPP[62:53]
3.15
3.3
3.45
AVS_AVDD
1.7
1.8
1.9
V
I/O voltage for:
AVS
USB_AVDD
3.15
3.3
3.45
V
Analog input voltage for:
USB interface
USB_AVDDL
1.7
1.8
1.9
V
Analog input voltage for:
USB interface
SRD_AVDD
1.7
1.8
1.9
V
Analog input voltage for:
SERDES interface
RTC_AVDD
1.7
1.8
1.9
V
Analog input voltage for:
RTC interface
XTAL_AVDD
1.7
1.8
1.9
V
Analog input voltage for:
XTAL interface
TJ
0
105
°C
Junction Temperature
-40
105
°C
Junction Temperature
Temperature for the Industrial grade device
VDDO_C
VDDO_D
VDDO_E
VDDO_F
Caution
Operation beyond the recommended operating conditions is neither recommended nor
guaranteed.
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Electrical Specifications
Thermal Power Dissipation
9.3
Thermal Power Dissipation
Note
Before designing a system, it is recommended that you read application note AN-63:
Thermal Management for Marvell Technology Products. This application note presents
basic concepts of thermal management for integrated circuits (ICs) and includes
guidelines to ensure optimal operating conditions for Marvell Technology's products.
The device was characterized and tested for production at 105°C. The 85°C and 65°C
data points are for reference purposes only.
The purpose of the Thermal Power Dissipation table is to support system engineering in thermal
design.
Table 47: Core and CPU Thermal Power Dissipation
In t e r f a c e
Sy m b o l
P a r a m e te r
Power
U ni ts
Core (VDD 0.9V)
PVDD
TCLK @ 200 MHz, 0.9V, 105°C
570
mW
TCLK @ 200 MHz, 0.9V, 85°C
515
mW
TCLK @ 200 MHz, 0.9V, 65°C
470
mW
CPU @ 1200 MHz, 1.1V
1650
mW
CPU @ 1000 MHz, 1.1V
1530
mW
CPU @ 800 MHz, 1.1V
1380
mW
CPU @ 667 MHz, 0.9V
710
mW
CPU @ 1200 MHz, 1.1V
1500
mW
CPU @ 1000 MHz, 1.1V
1400
mW
CPU @ 800 MHz, 1.1V
1260
mW
CPU @ 667 MHz, 0.9V
650
mW
CPU @ 1200 MHz, 1.1V
1400
mW
CPU @ 1000 MHz, 1.1V
1300
mW
CPU @ 800 MHz, 1.1V
1150
mW
CPU @ 667 MHz, 0.9V
600
mW
CPU @ 105°C
Active State (100% load),
including L2 power
PVDD_CPU
CPU @ 85°C
Active State (100% load),
including L2 power
CPU @ 65°C
Active State (100% load),
including L2 power
CPU, Idle State, includes
L2 power
PVDD_CPU
450
mW
CPU, Deep Idle State,
includes L2 power
PVDD_CPU
0
mW
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Hardware Specifications
Table 48: I/O Interface Thermal Power Dissipation
In t e r f a c e
Sy m b o l
P a r a m e te r
Power
U ni ts
DDR3 SDRAM On Board
16-bit up to 667 MHz
PDDR3_16C
1.35V I/O
130
mW
1.5V I/O
160
mW
Single Serial interfaces
(USB/SATA/SGMII/PCIe)
PSER
Per SERDES
100
mW
PCI Express Clock Out
PPCIe
Per PCIe clock
30
mW
XTAL
PPCIe
15
mW
2 x RGMII Interface
PRGMII
60
mW
Miscellaneous
(GMII/MII, I2S, S/PDIF,
JTAG, Device, NAND
Flash, SDIO, SMI, SPI,
TDM, I2C, UART)
PMISC
50
mW
Notes:
1.
On-board DRAM (one chip select), two x8 devices with one differential clock pair.
2.
PDDR3_16C:
• 2 x 8bit memory devices @ a 1 inch distance for data and 2 inches distance for
Address/control
• ODT on memory and on controller: 120 ohm
• Drive strength of controller: 50 ohm
• Drive strength of memory: 40 ohm
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Electrical Specifications
Current Consumption
9.4
Current Consumption
.
Table 49: Current Consumption
In t e r f a c e
Sy m b o l
Te s t C on d it io n s
Max
Units
Core
IVDD
TCLK @ 200 MHz, 0.9V, 105°C
660
mA
CPU and L2 cache
IVDD_CPU
CPU @ 1200 MHz, 1.1V, 105°C,
256 KB L2 @ 600 MHz
1930
mA
CPU @ 1000 MHz, 1.1V, 105°C,
256 KB L2 @ 667 MHz
1780
mA
CPU @ 800 MHz, 1.1V, 105°C,
256 KB L2 @ 400 MHz
1550
mA
CPU @ 667 MHz, 0.9V, 105°C,
256 KB L2 @ 333 MHz,
900
mA
16-bit, 600 MHz, 1.35V
500
mA
16-bit, 600MHz, 1.5V
600
mA
One Port, VDDO = 3.3V
60
mA
RGMII 2.5V interface
One Port, VDDO = 2.5V
50
mA
RGMII 1.8V interface
One Port, VDDO = 1.8V
40
mA
10
uA
DDR3 interface
IVDDO_M
RGMII 3.3V interface
IRGMII
RTC interface
IRTC_AVDD
SERDES interface
ISRD_AVDD
For a single Serdes port
60
mA
USB interface
IUSB_AVDD
For two USB ports
20
mA
60
mA
20
mA
IUSB_AVDDL
For a single PLL
PLL
IPLL_AVDD
AVS
IAVS_AVDD
10
mA
IVDD_CPU_AON
5
mA
XTAL
IXTAL_AVDD
10
mA
Miscellaneous
(GMII/MII, I2S, S/PDIF, JTAG,
Device, NAND Flash, SDIO, SMI,
SPI, TDM, I2C, UART)
IMISC
50
mA
Notes:
1.
2.
3.
4.
Trace is 3 inches, unless otherwise specified.
Current in mA is calculated using maximum recommended voltage specification for each power
rail.
All output clocks toggling at their specified rate.
Maximum drawn current from the power supply.
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Hardware Specifications
9.5
DC Electrical Specifications
See the Pin Description Section for internal pullup/pulldown information.
Note
9.5.1
General 3.3V (CMOS) DC Electrical Specifications
The DC electrical specifications in Table 50 are applicable for the following interfaces and signals:
GMII/RGMII/MI/SMI
SDIO
I2S
S/PDIF
SPI
JTAG
I2C
UART
MPP
Note
VDDIO can refer to the VDDO_A/B/C/D/E/F pins, depending on the interface/pin
(see Section 2.2, Pin Descriptions, on page 29).
Table 50: General 3.3V Interface (CMOS) DC Electrical Specifications
Param eter
Sym bol
Test Condition
Min
Typ
Max
Units Notes
Input low level
VIL
-0.3
0.8
V
-
Input high level
VIH
2.0
VDDIO+0.3
V
-
Output low level
VOL
IOL = 8 mA
-
0.6
V
-
Output high level
VOH
IOH = -8 mA
2.2
-
V
-
0 < VIN < VDDIO
-10
10
uA
1, 2
pF
-
Input leakage current
Pin capacitance
IIL
Cpin
5
Notes:
1. While I/O is in High-Z.
2. This current does not include the current flow ing through the pullup/pulldow n resistor.
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Electrical Specifications
DC Electrical Specifications
9.5.2
General 2.5V (CMOS) DC Electrical Specifications
The DC electrical specifications in Table 51 are applicable for the following interface and signals:
RGMII/SMI
Note
VDDIO can refer to the VDDO_B/C pins, depending on the interface/pin
(see Section 2.2, Pin Descriptions, on page 29).
Table 51: General 2.5V Interface (CMOS) DC Electrical Specifications
Param eter
Sym bol
Test Condition
Min
Typ
Max
Units Notes
Input low level
VIL
-0.3
0.7
V
-
Input high level
VIH
1.7
VDDIO+0.3
V
-
Output low level
VOL
IOL = 8 mA
-
0.6
V
-
Output high level
VOH
IOH = -8 mA
1.8
-
V
-
Input leakage current
IIL
0 < VIN < VDDIO
-10
10
uA
1, 2
Pin capacitance
Cpin
pF
-
5
Notes:
1. While I/O is in High-Z.
2. This current does not include the current flow ing through the pullup/pulldow n resistor.
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Hardware Specifications
9.5.3
General 1.8V (CMOS) DC Electrical Specifications
The DC electrical specifications in Table 52 are applicable for the following interfaces and signals:
RGMII/SMI
Device Bus
SDIO/MMC
Note
VDDIO can refer to the VDDO_B/C/D/E/F pins, depending on the interface/pin
(see Section 2.2, Pin Descriptions, on page 29).
Table 52: General 1.8V Interface (CMOS) DC Electrical Specifications
Param eter
Sym bol
Test Condition
Min
Typ
Max
Units Notes
Input low level
VIL
-0.3
0.35*VDDIO
V
-
Input high level
VIH
0.65*VDDIO
VDDIO+0.3
V
-
Output low level
VOL
IOL = 8 mA
-
0.45
V
-
Output high level
VOH
IOH = -8 mA
VDDIO-0.45
-
V
-
Input leakage current
IIL
0 < VIN < VDDIO
10
uA
1, 2
Pin capacitance
Cpin
pF
-
-10
5
Notes:
1. While I/O is in High-Z.
2. This current does not include the current flow ing through the pullup/pulldow n resistor.
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DC Electrical Specifications
9.5.4
SDRAM DDR3 (1.5V) Interface DC Electrical Specifications
In this table, VDDIO refers to the VDDO_M pin.
Note
Table 53: SDRAM DDR3 (1.5V) Interface DC Electrical Specifications
Param eter
Sym bol
Single ended input low level
Test Condition
Min
Typ
Max
VDDIO/2 0.100
Units Notes
VIL
-0.3
Single ended input high level
VIH
VDDIO/2 +
0.100
VDDIO + 0.3
V
-
Differential input low level
VDIL
Note 6
-0.2
V
6
Differential input high level
VDIH
0.2
Note 6
V
6
0.2*VDDIO
V
7
V
7
70
ohm
1,2
V
-
VOL
IOL = 8.8 mA
Output high level
VOH
IOH = -8.8 mA
Rtt effective impedance value
RTT
See note 2
50
Deviation of VM w ith respect to VDDIO/2
dVm
See note 3
-5
5
%
3
0 < VIN < VDDIO
-10
10
uA
4, 5
pF
-
Output low level
Input leakage current
IIL
Pin capacitance
Cpin
0.8*VDDIO
-
60
5
Notes:
1. See SDRAM functional description section for ODT configuration.
2. Measurement definition for RTT: Apply (VDDIO/2) +/- 0.15 to input pin separately,
then measure current I(VDDIO/2 + 0.15) and I(VDDIO/2 - 0.15) respectively.
RTT
0 .30
I
I
(
VDDIO
0 . 15 )
2
(
VDDIO
0 . 15 )
2
3. Measurement definition for VM: Measured voltage (VM) at input pin (midpoint) w ith no load.
2 Vm
dVM
1 100 %
VDDIO
4. While I/O is in High-Z.
5. This current does not include the current flow ing through the pullup/pulldow n resistor.
6. Limitations are same as for single ended signals.
7. Defined w hen driver impedance is calibrated to 35 ohms.
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Hardware Specifications
9.5.5
SDRAM DDR3L (1.35V) Interface DC Electrical
Specifications
In this table, VDDIO refers to the VDDO_M pin.
Note
Table 54: SDRAM DDR3L (1.35V) Interface DC Electrical Specifications
Param eter
Sym bol
Single ended input low level
Test Condition
Min
Typ
Max
VDDIO/2 0.09
VIL
-0.3
Single ended input high level
VIH
VDDIO/2 +
0.09
VDDIO + 0.3
Differential input low level
VDIL
Note 6
Differential input high level
VDIH
0.16
Output low level
VOL
IOL = 8.8 mA
Output high level
VOH
IOH = -8.8 mA
Rtt effective impedance value
RTT
See note 2
Deviation of VM w ith respect to VDDIO/2
dVm
Input leakage current
IIL
Pin capacitance
Cpin
V
-
V
-
-0.16
V
6
Note 6
V
6
0.2*VDDIO
V
7
V
7
ohm
1,2
0.8*VDDIO
50
60
Units Notes
70
See note 3
-5
5
%
3
0 < VIN < VDDIO
-10
10
uA
4, 5
pF
-
-
5
Notes:
1. See SDRAM functional description section for ODT configuration.
2. Measurement definition for RTT: Apply (VDDIO/2) +/- 0.15 to input pin separately,
then measure current I(VDDIO/2 + 0.15) and I(VDDIO/2 - 0.15) respectively.
RTT
I
(
VDDIO
2
0 .30
I
0 . 15 )
(
VDDIO
2
0 . 15 )
3. Measurement definition for VM: Measured voltage (VM) at input pin (midpoint) w ith no load.
2 Vm
dVM
1 100 %
VDDIO
4. While I/O is in High-Z.
5. This current does not include the current flow ing through the pullup/pulldow n resistor.
6. Limitations are same as for single ended signals.
7. Defined w hen driver impedance is calibrated to 35 ohms.
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DC Electrical Specifications
I2C Interface 3.3V DC Electrical Specifications
9.5.6
Note
VDDIO can refer to the VDDO_A/E pins, depending on the interface/pin (see
Section 2.2, Pin Descriptions, on page 29).
Table 55: I2C Interface 3.3V DC Electrical Specifications
Param eter
Sym bol
Test Condition
Input low level
VIL
Input high level
VIH
Output low level
VOL
IOL = 3 mA
Input leakage current
IIL
0 < VIN < VDDIO
Pin capacitance
Cpin
Min
Typ
Max
Units Notes
-0.5
0.3*VDDIO
V
-
0.7*VDDIO
VDDIO+0.5
V
-
-
0.4
V
-
-10
10
uA
1, 2
pF
-
5
Notes:
1. While I/O is in High-Z.
2. This current does not include the current flow ing through the pullup/pulldow n resistor.
9.5.7
Serial Peripheral Interface (SPI) 3.3V DC Electrical
Specifications
Note
VDDIO can refer to the VDDO_B/C/D/E/F pins, depending on the interface/pin (see
Section 2.2, Pin Descriptions, on page 29).
Table 56: SPI Interface 3.3V DC Electrical Specifications
Param eter
Sym bol
Test Condition
Min
Typ
Max
Units Notes
Input low level
VIL
-0.5
0.3*VDDIO
V
-
Input high level
VIH
0.7*VDDIO
VDDIO+0.5
V
-
Output low level
VOL
IOL = 4 mA
-
0.4
V
-
Output high level
VOH
IOH = -4 mA
VDDIO-0.6
-
V
-
Input leakage current
IIL
0 < VIN < VDDIO
10
uA
1, 2
Pin capacitance
Cpin
pF
-
-10
5
Notes:
1. While I/O is in High-Z.
2. This current does not include the current flow ing through the pullup/pulldow n resistor.
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Hardware Specifications
9.5.8
Time Division Multiplexing (TDM) 3.3V DC Electrical
Specifications (88F6710/88F6W11 Only)
Note
VDDIO can refer to the VDDO_B/C/F pins, depending on the interface/pin (see
Section 2.2, Pin Descriptions, on page 29).
Table 57: TDM Interface 3.3V DC Electrical Specifications
Param eter
Sym bol
Test Condition
Input low level
VIL
Input high level
VIH
Output low level
VOL
IOL = 4 mA
Output high level
VOH
IOH = -4 mA
Input leakage current
IIL
0 < VIN < VDDIO
Pin capacitance
Cpin
Min
Typ
Max
Units Notes
-0.5
0.3*VDDIO
V
-
0.7*VDDIO
VDDIO+0.5
V
-
-
0.4
V
-
VDDIO-0.6
-
V
-
-10
10
uA
1, 2
pF
-
5
Notes:
1. While I/O is in High-Z.
2. This current does not include the current flow ing through the pullup/pulldow n resistor.
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Electrical Specifications
DC Electrical Specifications
9.5.9
NAND Flash 1.8V DC Electrical Specification
In this table, VDDIO refers to the VDDO_D/E/F pin.
Note
Table 58: NAND Flash 1.8V DC Electrical Specification
Param eter
Sym bol
Test Condition
Min
Typ
Max
Units Notes
Input low level
VIL
-0.3
0.35*VDDIO
V
-
Input high level
VIH
0.65*VDDIO
VDDIO+0.3
V
-
Output low level
VOL
IOL = 2 mA
-
0.45
V
-
Output high level
VOH
IOH = -2 mA
0.85 * VDDIO
-
V
-
Input leakage current
IIL
0 < VIN < VDDIO
-10
10
uA
1, 2
Pin capacitance
Cpin
pF
-
5
Notes:
1. While I/O is in High-Z.
2. This current does not include the current flow ing through the pullup/pulldow n resistor.
9.5.10
NAND Flash 3.3V DC Electrical Specification
In this table, VDDIO refers to the VDDO_D/E/F pin.
Note
Table 59: NAND Flash 3.3V DC Electrical Specification
Param eter
Sym bol
Test Condition
Min
Typ
Max
Units Notes
Input low level
VIL
-0.3
0.8
V
-
Input high level
VIH
2.0
VDDIO+0.3
V
-
Output low level
VOL
IOL = 2 mA
-
0.4
V
-
Output high level
VOH
IOH = -2 mA
0.85 * VDDIO
-
V
-
10
uA
1, 2
pF
-
Input leakage current
Pin capacitance
IIL
Cpin
0 < VIN < VDDIO
-10
5
Notes:
1. While I/O is in High-Z.
2. This current does not include the current flow ing through the pullup/pulldow n resistor.
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9.5.11
Adaptive Voltage Scaling (AVS) DC Electrical Specification
Table 60: AVS DC Electrical Specification
Param eter
Sym bol
Min
Max
Units Notes
Output voltage level
VOUT
VDD - 200
VDD + 200
mV
1
Output current drive/sink
IOUT
-1
1
mA
2
Allow ed load capacitance
CLOAD
100
pF
3
Notes:
1. VDD is the actual voltage supplied to the device.
2. Actual current is determined by the external resistor (RAVS) and the output voltage.
3. This load includes board routing and regulator capacitance.
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9.6
AC Electrical Specifications
See Section 9.7, Differential Interface Electrical Characteristics, on page 137 for differential interface
specifications.
9.6.1
Reference Clock and Reset AC Timing Specifications
Table 61: Reference Clock and Reset AC Timing Specifications
D e s c r i p t io n
S y m b ol
M in
Max
U n i ts
Frequency
FREF_CLK_XIN
2.5
25
MHz
Accuracy
PPMREF_CLK_XIN
-50
50
PPM
Duty cycle
DCREF_CLK_XIN
40
60
%
Slew rate
SRREF_CLK_XIN
Notes
CPU and Core Reference Clock
Pk-Pk jitter
0.5
V/ns
1
0.7
V/ns
1, 2
120
ps
2, 4
200
ps
2.5
50
MHz
-100
100
PPM
35
65
%
JRREF_CLK_XIN
E t h er n e t I n t e r f a c e ( M I I m o d e )
Frequency
FGE0_TXCLK
FGE0_RXCLK
Accuracy
PPMGE0_TXCLK
PPMGE0_RXCLK
Duty cycle
DCGE0_TXCLK
DCGE0_RXCLK
Slew rate
SRGE0_TXCLK
0.7
V/ns
1
SRGE0_RXCLK
SM I Cl ock
SMI output MDC clock
FGE_MDC
TCLK/128
TCLK/8
MHz
100
kHz
I2C Master Mode Clock
SCK output clock
FI2C0_SCK
FI2C1_SCK
SP I O ut pu t C l o c k
SPI output clock
FSPI0_SCK
FSPI1_SCK
TCLK/1920 TCLK/4
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5
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Table 61: Reference Clock and Reset AC Timing Specifications (Continued)
D e s c r i p t io n
S y m b ol
M in
Max
U n i ts
Notes
Frequency
FTCLK_OUT
TCLK/7
TCLK/2
MHz
Duty cycle
DCTCLK_OUT
40
60
%
3
kHz
7
T C L K _ O U T R e fe r e n c e C lo c k
RTC Reference Clock
RTC_XIN crystal frequency
FRTC_XIN
32.768
M M C R ef e r e n c e C lo c k
Frequency
FSD_CLK
50
MHz
FJT_CLK
30
MHz
J TA G R e f e r e n c e C lo c k
Frequency
I 2S R e fe r e n c e C lo c k ( 88F6710/88F6W11 only)
I2S clock
FAU_I2SBCLK
64 X Fs
kHz
6
256 X Fs
kHz
6
256 X Fs
kHz
6
A u d io E x te r na l R e fe r e n c e C lo c k ( 88F6710/88F6W11 only)
Audio external reference clock
FAU_EXTCLK
S / P D I F R e c o v e r e d M a s t e r C lo c k ( 88F6710/88F6W11 only)
S/PDIF recovered master clock
FAU_SPDIFRMCLK
R e s e t Sp e c if ic a t i o n s
Refer to Section 7, Reset and Initialization, on page 76.
Notes:
1.
2.
3.
4.
5.
6.
7.
Slew rate is defined from 20% to 80% of the reference clock signal.
This value is required when using the internal PLL to drive the SERDES.
The load is CL = 15 pF.
This value is assumed to contain above 95% random components characterized by 1/f
behavior, defined with a BER = 1e-12.
For additional information regarding configuring this clock, see the Serial Memory Interface
Control Register in the 88F6710, 88F6707, and 88F6W11 Functional Specification.
Fs is the audio sample rate, which can be configured to 44.1 kHz, 48 kHz, or 96 kHz (see the
Audio (I2S / S/PDIF) Interface section in the device Functional Specifications).
The RTC design was optimized for a standard CL = 12.5 pF crystal. No passive components
are provided internally. Connect the crystal and the passive network as recommended by the
crystal manufacturer.
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Figure 8: TCLK_OUT Reference Clock Test Circuit
Test Point
CL
Figure 9: TCLK_OUT AC Timing Diagram
Cycle Time
VDDIO/2
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9.6.2
Reduced Gigabit Media Independent Interface (RGMII) AC
Timing
9.6.2.1
RGMII AC Timing Table
Table 62: RGMII AC Timing Table
Description
Sym bol
Clock frequency
fCK
Min
Max
Units Notes
MHz
-
-0.50
0.50
ns
2
Tskew R
1.00
2.60
ns
-
Tcyc
7.20
8.80
ns
1,2
Duty cycle for Gigabit
Duty_G
0.45
0.55
tCK
2
Duty cycle for 10/100 Megabit
Duty_T
0.40
0.60
tCK
2
Data to Clock output skew
Tskew T
Data to Clock input skew
Clock cycle duration
125.0
Notes:
General comment: All values w ere measured from vddio/2 to vddio/2, unless otherw ise specified.
General comment: tCK = 1/fCK.
General comment: If the PHY does not support internal-delay mode, the PC board design requires
routing clocks so that an additional trace delay of greater than 1.5 ns and less
than 2.0 ns is added to the associated clock signal.
For 10/100 Mbps RGMII, the Max value is unspecified.
1. For RGMII at 10 Mbps and 100 Mbps, Tcyc w ill scale to 400 ns +/-40 ns and 40 ns +/-4 ns, respectively.
2. For all signals, the load is CL = 5 pF.
9.6.2.2
RGMII Test Circuit
Figure 10: RGMII Test Circuit
Test Point
CL
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9.6.2.3
RGMII AC Timing Diagram
Figure 11: RGMII AC Timing Diagram
TX
CLOCK
(At Transmitter)
TX
DATA
TskewT
RX
CLOCK
(At Receiver)
RX
DATA
TskewR
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9.6.3
Gigabit Media Independent Interface (GMII) AC Timing
9.6.3.1
GMII AC Timing Table
Table 63: GMII AC Timing Table
125 MHz
Description
GTX_CLK cycle time
Sym bol
Min
Max
Units
Notes
tCK
7.5
8.5
ns
-
RX_CLK cycle time
tCKrx
7.5
-
ns
-
GTX_CLK and RX_CLK high level w idth
tHIGH
2.5
-
ns
1
GTX_CLK and RX_CLK low level w idth
tLOW
2.5
-
ns
1
tR
-
1.0
ns
1, 2
GTX_CLK and RX_CLK rise time
GTX_CLK and RX_CLK fall time
tF
-
1.0
ns
1, 2
Data input setup time relative to RX_CLK rising edge
tSETUP
2.0
-
ns
-
Data input hold time relative to RX_CLK rising edge
tHOLD
0.0
-
ns
-
Data output valid before GTX_CLK rising edge
tOVB
2.5
-
ns
1
Data output valid after GTX_CLK rising edge
tOVA
0.5
-
ns
1
Notes:
General comment: All values w ere measured from VIL(max) to VIH(min), unless otherw ise specified.
1. For all signals, the load is CL = 5 pF.
2. Rise time measured from VIL(max) to VIH(min), fall time measured from VIH(min) to VIL(max).
9.6.3.2
GMII Test Circuit
Figure 12: GMII Test Circuit
Test Point
CL
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9.6.3.3
GMII AC Timing Diagrams
Figure 13: GMII Output AC Timing Diagram
tLOW
tHIGH
VIH(min)
GTX_CLK
VIL(max)
VIH(min)
TXD, TX_EN, TX_ER
VIL(max)
tOVB
tOVA
Figure 14: GMII Input AC Timing Diagram
tLOW
tHIGH
VIH(min)
RX_CLK
VIL(max)
VIH(min)
RXD, RX_EN, RX_ER
VIL(max)
tSETUP
tHOLD
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9.6.4
Media Independent Interface (MII) AC Timing
9.6.4.1
MII MAC Mode AC Timing Table
Table 64: MII MAC Mode AC Timing Table
Sym bol
Min
Max
Units
Notes
Data input setup relative to RX_CLK rising edge
Description
tSU
3.5
-
ns
-
Data input hold relative to RX_CLK rising edge
tHD
2.0
-
ns
-
Data output delay relative to MII_TX_CLK rising edge
tOV
0.0
10.0
ns
1
Notes:
General comment: All values w ere measured from VIL(max) to VIH(min), unless otherw ise specified.
1. For all signals, the load is CL = 5 pF.
9.6.4.2
MII MAC Mode Test Circuit
Figure 15: MII MAC Mode Test Circuit
Test Point
CL
9.6.4.3
MII MAC Mode AC Timing Diagrams
Figure 16: MII MAC Mode Output Delay AC Timing Diagram
Vih(min)
MII_TX_CLK
Vil(max)
Vih(min)
TXD, TX_EN, TX_ER
Vil(max)
TOV
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Figure 17: MII MAC Mode Input AC Timing Diagram
Vih(min)
RX_CLK
Vih(min)
RXD, RX_EN, RX_ER
Vil(max)
tSU
tHD
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9.6.5
Serial Management Interface (SMI) AC Timing
9.6.5.1
SMI Master Mode AC Timing Table
Table 65: SMI Master Mode AC Timing Table
Description
Sym bol
Min
Max
Units
Notes
MHz
2
MDC clock frequency
fCK
MDC clock duty cycle
tDC
0.4
0.6
tCK
-
MDIO input setup time relative to MDC rise time
tSU
12.0
-
ns
-
MDIO input hold time relative to MDC rise time
tHO
0.0
-
ns
3
MDIO output valid before MDC rise time
tOVB
12.0
-
ns
1
MDIO output valid after MDC rise time
tOVA
12.0
-
ns
1
See note 2
Notes:
General comment: All timing values w ere measured from VIL(max) and VIH(min) levels, unless otherw ise specified.
General comment: tCK = 1/fCK.
1. For all signals, the load is CL = 10 pF.
2. See "Reference Clocks" table for more details.
3. For this parameter, the load is CL = 2 pF.
9.6.5.2
SMI Master Mode Test Circuit
Figure 18: MDIO Master Mode Test Circuit
VDDIO
Test Point
2 kilohm
MDIO
CL
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Figure 19: MDC Master Mode Test Circuit
Test Point
MDC
CL
9.6.5.3
SMI Master Mode AC Timing Diagrams
Figure 20: SMI Master Mode Output AC Timing Diagram
VIH(min)
MDC
VIH(min)
MDIO
VIL(max)
tOVB tOVA
Figure 21: SMI Master Mode Input AC Timing Diagram
VIH(min)
MDC
VIH(min)
MDIO
VIL(max)
tSU
tHO
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9.6.6
SDRAM DDR3 Interface AC Timing
9.6.6.1
SDRAM DDR3 Interface Timing Tables
Table 66: SDRAM DDR3 Interface AC Timing Table
667 MHz
Description
Sym bol
Clock frequency
Min
fCK
DQ and DM valid output time before DQS transition
Max
667.0
-
Units
Notes
MHz
-
ps
-
tDOVB
190
DQ and DM valid output time after DQS transition
tDOVA
170
-
ps
-
CLK-CLKn Period Jitter
tJIT(per)
-80
80
ps
1
DQS falling edge setup time to CLK-CLKn rising edge
tDSS
0.34
-
tCK(avg)
-
DQS falling edge hold time from CLK-CLKn rising edge
tDSH
0.34
-
tCK(avg)
-
DQS latching rising transitions to associated clock edges
tDQSS
-0.11
0.11
tCK(avg)
-
Address and Control valid output time before CLK-CLkn rising edge
tAOVB
440
-
ps
2
Address and Control valid output time after CLK-CLKn rising edge
tAOVA
340
-
ps
2
DQ input setup time relative to DQS in transition
tDSI
-150
-
ps
-
DQ input hold time relative to DQS in transition
tDHI
400
-
ps
-
Notes:
General comment: All timing values are defined from VREF to VREF, unless otherw ise specified.
General comment: All input timing values assume minimum slew rate of 1 V/ns (slew rate defined from VREF +/-100 mV).
General comment: All timing parameters w ith DQS signal are defined on DQS-DQSn crossing point.
General comment: All timing parameters w ith CLK signal are defined on CLK-CLKn crossing point.
General comment: For all signals, the load is CL = 10 pF.
General comment: tCK = 1/fCK.
1. tJIT(per) = Min/max of {tCKi - tCK w here i = 1 to 200}.
2. This timing value is defined w hen Address and Control signals are output on CLK-CLKn falling edge.
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9.6.6.2
SDRAM DDR3 Interface Test Circuit
Figure 22: SDRAM DDR3 Interface Test Circuit
VDDIO/2
Test Point
50 ohm
CL
9.6.6.3
SDRAM DDR3 Interface AC Timing Diagrams
Figure 23: SDRAM DDR3 Interface Write AC Timing Diagram
tDQSS
CLK
tCH
tCL
CLKn
DQSn
DQS
DQ
tDOVB tDOVA
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Figure 24: SDRAM DDR3 Interface Address and Control AC Timing Diagram
CLK
tCH
tCL
CLKn
ADDRESS/
CONTROL
tAOVB
tAOVA
Figure 25: SDRAM DDR3 Interface Read AC Timing Diagram
DQS
DQSn
DQ
tDSI
tDHI
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9.6.7
Secure Digital Input/Output (SDIO) Interface AC Timing
9.6.7.1
Secure Digital Input/Output (SDIO) AC Timing Table
Table 67: SDIO Host in High-Speed Mode AC Timing Table
Description
Symbol
Min
Max
Units
Notes
fCK
0
50
MHz
-
Clock high/low level pulse w idth
tWL/tWH
0.35
-
tCK
1, 3
Clock rise/fall time
tTLH/tTHL
-
3.0
ns
1, 3
CMD, DAT output valid before CLK rising edge
tDOVB
6.5
-
ns
2, 3
CMD, DAT output valid after CLK rising edge
tDOVA
2.5
-
ns
2, 3
CMD, DAT input setup relative to CLK rising edge
tISU
7.0
-
ns
2
CMD, DAT input hold relative to CLK rising edge
tIHD
0.0
-
ns
2, 4
Clock frequency in Data Transfer Mode
Notes:
General comment: tCK = 1/fCK.
1. Defined on VIL(max) and VIH(min) levels.
2. Defined on VDDIO/2 for Clock signal, and VIL(max) / VIH(min) for CMD & DAT signals.
3. For all signals, the load is CL = 10 pF.
4. For this parameter, the load is CL = 2 pF.
9.6.7.2
Secure Digital Input/Output (SDIO) Test Circuit
Figure 26: Secure Digital Input/Output (SDIO) Test Circuit
VDDIO
Test Point
50 KOhm
CL
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9.6.7.3
Secure Digital Input/Output (SDIO) AC Timing Diagrams
Figure 27: SDIO Host in High Speed Mode Output AC Timing Diagram
tWL
tWH
VIH(min)
VDDIO/2
CLK
VIL(max)
VIH(min)
DAT,
CMD
VIL(max)
tDOVB tDOVA
Figure 28: SDIO Host in High Speed Mode Input AC Timing Diagram
tWL
tWH
VIH(min)
VDDIO/2
CLK
VIL(max)
VIH(min)
DAT,
CMD
VIL(max)
tISU
tIHD
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9.6.8
Multimedia Card (MMC) Interface AC Timing
9.6.8.1
MMC AC Timing Table
Table 68: MMC High Speed Host AC Timing Table
Description
Sym bol
Clock frequency in Data Transfer mode
fCK
Clock high/low level pulse w idth
tWL/tWH
Clock rise/fall time
Min
Max
See note 5
Units
Notes
MHz
5
0.34
-
tCK
1, 3
tTLH/tTHL
-
3.0
ns
1, 3
CMD, DAT output valid before CLK rising edge
tDOVB
3.5
-
ns
2, 3
CMD, DAT output valid after CLK rising edge
tDOVA
3.5
-
ns
2, 3
CMD, DAT input setup relative to CLK rising edge
tISU
6.5
-
ns
2
CMD, DAT input hold relative to CLK rising edge
tIHD
0.0
-
ns
2, 4
Notes:
General comment: tCK = 1/fCK.
1. Defined on VIL(max) and VIH(min) levels.
2. Defined on VDDIO/2 for Clock signal, and VIL(max) / VIH(min) for CMD and DAT signals.
3. For all signals, the load is CL = 10 pF.
4. For this parameter, the load is CL = 2 pF.
5. See "Reference Clocks" table for more details.
9.6.8.2
MMC Test Circuit
Figure 29: MMC Test Circuit
Test Point
CL
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9.6.8.3
MMC AC Timing Diagrams
Figure 30: MMC High-Speed Host Output AC Timing Diagram
tWL
tWH
VIH(min)
VDDIO/2
CLK
VIL(max)
VIH(min)
DAT,
CMD
VIL(max)
tDOVB tDOVA
Figure 31: MMC High-Speed Host Input AC Timing Diagram
tWL
tWH
VIH(min)
VDDIO/2
CLK
VIL(max)
VIH(min)
DAT,
CMD
VIL(max)
tISU
tIHD
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9.6.9
Device Bus Interface AC Timing (88F6710/88F6W11 only)
9.6.9.1
Device Bus Interface AC Timing Table
Table 69: Device Bus Interface AC Timing Table
Description
Sym bol
Min
Max
Units
Notes
Data/READYn input setup relative to clock rising edge
tSU
5.0
-
ns
-
Data/READYn input hold relative to clock rising edge
tHD
1.0
-
ns
-
Address/Data output delay relative to clock rising edge
tOV
0.8
6.0
ns
1
Address output valid before ALE signal falling edge
tAOAB
9.0
-
ns
1,2
Address output valid after ALE signal falling edge
tAOAA
5.0
-
ns
1,2
Notes:
General comment: All timing values are for interfacing synchronous devices.
General comment: All values w ere measured from VIL(max) to VIH(min), unless otherw ise specified.
1. For all signals, the load is CL = 10 pF.
2. The AD bus is normally loaded w ith high capacitance. Make sure to w ork according to HW design guidelines
or simulations to meet the latch AC timing requirements.
9.6.9.2
Device Bus Interface Test Circuit
Figure 32: Device Bus Interface Test Circuit
Test Point
CL
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9.6.9.3
Device Bus Interface AC Timing Diagram
Figure 33: Device Bus Interface Output Delay AC Timing Diagram
Vih(min)
CLOCK
Vil(max)
Vih(min)
DATA
Vil(max)
TOV(min)
TOV(max)
Vih(min)
ALE
Vil(max)
Vih(min)
AD Bus
Vil(max)
TAOAB
TAOAA
Figure 34: Device Bus Interface Input AC Timing Diagram
Vih(min)
CLOCK
Vil(max)
Vih(min)
DATA
Vil(max)
tSU
tHO
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Electrical Specifications
AC Electrical Specifications
9.6.10
Serial Peripheral Interface (SPI) AC Timing
9.6.10.1
SPI (Master Mode) AC Timing Table
Table 70: SPI (Master Mode) AC Timing Table
SPI
Description
Sym bol
Min
Max
Notes
MHz
3
SCLK clock frequency
fCK
SCLK high time
tCH
0.46
-
tCK
1, 2
SCLK low time
tCL
0.46
-
tCK
1, 2
SCLK slew rate
tSR
0.5
-
V/ns
1
tDOV
-2.5
2.5
ns
1
Data out valid relative to SCLK falling edge
See Note 3
Units
CS active before first SCLK rising edge
tCSB
0.4
-
tCK
1, 4
CS not active after SCLK rising edge
tCSA
0.4
-
tCK
1, 4
Data in setup time relative to SCLK rising edge
tSU
0.2
-
tCK
2
Data in hold time relative to SCLK rising edge
tHD
5.0
-
ns
2
Notes:
General comment: All values w ere measured from 0.3*vddio to 0.7*vddio, unless otherw ise specified.
General comment: tCK = 1/fCK.
1. For all signals, the load is CL = 10 pF.
2. Defined from vddio/2 to vddio/2.
3. See "Reference Clocks" table for more details.
4. When w orking w ith CPOL=1 mode, the CS is relative to first SCLK falling edge.
9.6.10.2
SPI (Master Mode) Test Circuit
Figure 35: SPI (Master Mode) Test Circuit
Test Point
CL
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9.6.10.3
SPI (Master Mode) Timing Diagrams
Figure 36: SPI (Master Mode) AC Timing Diagram
tCL
tCH
CPOL=1
SCLK
CPOL=0
CS
tCSB
MOSI
tCSA
CPHA=0
tDOVmin
tDOVmax
MOSI
CPHA=1
tDOVmin
tDOVmax
MISO
CPHA=0
tSU
tHD
MISO
CPHA=1
tSU
tHD
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AC Electrical Specifications
9.6.11
Inter-integrated Circuit Interface (I2C) AC Timing
9.6.11.1
I2C AC Timing Table
Table 71: I2C Master AC Timing Table
Description
Sym bol
SCK clock frequency
fCK
Min
Max
See note 1
Units
Notes
kHz
1
SCK minimum low level w idth
tLOW
0.47
-
tCK
2
SCK minimum high level w idth
tHIGH
0.40
-
tCK
2
SDA input setup time relative to SCK rising edge
tSU
250.0
-
ns
-
SDA input hold time relative to SCK falling edge
tHD
0.0
-
ns
4
SDA and SCK rise time
tr
-
1000.0
ns
2, 3
SDA and SCK fall time
tf
-
300.0
ns
2, 3
tOV
0.0
0.4
tCK
2
SDA output delay relative to SCK falling edge
Notes:
General comment: All values referred to VIH(min) and VIL(max) levels, unless otherw ise specified.
General comment: tCK = 1/fCK.
1. See "Reference Clocks" table for more details.
2. For all signals, the load is CL = 100 pF, and RL value can be 500 ohm to 8 kilohm.
3. Rise time measured from VIL(max) to VIH(min), fall time measured from VIH(min) to VIL(max).
4. For this parameter, the load is CL = 10 pF.
Table 72: I2C Slave AC Timing Table
100 kHz (Max)
Description
Sym bol
Min
Max
Units
Notes
SCK minimum low level w idth
tLOW
4.7
-
us
1
SCK minimum high level w idth
tHIGH
4.0
-
us
1
SDA input setup time relative to SCK rising edge
tSU
250.0
-
ns
-
SDA input hold time relative to SCK falling edge
tHD
0.0
-
ns
-
tr
-
1000.0
ns
1, 2
tf
-
300.0
ns
1, 2
tOV
0.0
4.0
us
1
SDA and SCK rise time
SDA and SCK fall time
SDA output delay relative to SCK falling edge
Notes:
General comment: All values referred to VIH(min) and VIL(max) levels, unless otherw ise specified.
1. For all signals, the load is CL = 100 pF, and RL value can be 500 ohm to 8 kilohm.
2. Rise time measured from VIL(max) to VIH(min), fall time measured from VIH(min) to VIL(max).
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9.6.11.2
I2C Test Circuit
Figure 37: I2C Test Circuit
VDDIO
Test Point
RL
CL
9.6.11.3
I2C AC Timing Diagrams
Figure 38: I2C Output Delay AC Timing Diagram
tHIGH
tLOW
Vih(min)
SCK
Vil(max)
Vih(min)
SDA
Vil(max)
tOV(min)
tOV(max)
Figure 39: I2C Input AC Timing Diagram
tLOW
tHIGH
Vih(min)
SCK
Vil(max)
Vih(min)
SDA
Vil(max)
tSU
tHD
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AC Electrical Specifications
9.6.12
JTAG Interface AC Timing
9.6.12.1
JTAG Interface AC Timing Table
Table 73: JTAG Interface AC Timing Table
Description
Sym bol
JTClk frequency
Min
Max
See Note 3
fCK
Units
Notes
MHz
-
JTClk minimum pulse w idth
Tpw
0.45
0.55
tCK
-
JTClk rise/fall slew rate
Sr/Sf
0.5
-
V/ns
2
JTRSTn active time
Trst
1.0
-
ms
-
Tsetup
0.2*tCK
-
ns
-
TMS, TDI input hold relative to JTClk rising edge
Thold
0.4*tCK
-
ns
-
JTClk falling edge to TDO output delay
Tprop
1.0
0.25*tCK
ns
1
TMS, TDI input setup relative to JTClk rising edge
Notes:
General comment: All values w ere measured from vddio/2 to vddio/2, unless otherw ise specified.
General comment: tCK = 1/fCK.
1. For TDO signal, the load is CL = 10 pF.
2. Defined from VIL to VIH for rise time, and from VIH to VIL for fall time.
3. See "Reference Clocks" table for more details.
9.6.12.2
JTAG Interface Test Circuit
Figure 40: JTAG Interface Test Circuit
Test Point
CL
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9.6.12.3
JTAG Interface AC Timing Diagrams
Figure 41: JTAG Interface Output Delay AC Timing Diagram
Tprop
(max)
JTCK
VIH
VIL
TDO
Tprop
(min)
Figure 42: JTAG Interface Input AC Timing Diagram
JTCK
TMS,TDI
Tsetup
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AC Electrical Specifications
9.6.13
NAND Flash Interface AC Timing
9.6.13.1
NAND Flash AC Timing Table
Table 74: NAND Flash AC Timing Table
Sym bol
Min
Max
Units
Notes
WEn cycle time
Description
tWC
30
-
ns
1
WEn minimum low pulse w idth
tWP
10
-
ns
1, 2
WEn minimum high pulse w idth
tWH
15
-
ns
1, 2
ALE to WEn skew factor
tASK
-3
3
ns
2, 3
CLE to WEn skew factor
tCLSK
-3
3
ns
2, 3
CEn to WEn skew factor
tCSK
-3
3
ns
2, 3
Data output bus to WEn skew factor
tDSK
-3
3
ns
2, 3
REn cycle time
tRC
30
-
ns
1
REn minimum low pulse w idth
tRP
10
-
ns
1, 2
REn minimum high pulse w idth
tREH
15
-
ns
1, 2
Data input to REn rising edge skew factor
tISK
-3
3
ns
2, 3
Notes:
General comment: All values w ere measured from VIL(max) to VIH(min), unless otherw ise specified.
1. See functional specifications for configuration options.
2. For all signals, the load is CL = 10 pF.
3. Skew factor should be taken into consideration as a timing degradation in addition to register settings.
Refer to functional specifications for more information about timing adjustment possibilities.
9.6.13.2
NAND Flash Test Circuit
Figure 43: NAND Flash Test Circuit
Test Point
CL
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9.6.13.3
NAND Flash AC Timing Diagrams
Figure 44: NAND Flash Input AC Timing Diagram
tRC
tRP
tREH
VIH(min)
REn
VIL(max)
VIH(min)
Data
VIL(max)
tIS
tIH
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9.6.14
Time Division Multiplexing (TDM) Interface AC Timing
(88F6710/88F6W11 only)
9.6.14.1
TDM Interface AC Timing Table
Table 75: TDM Interface AC Timing Table
8.192 MHz
Description
Sym bol
Min
Max
Units
Notes
PCLK frequency
1/tC
0.256
PCLK accuracy
tPPM
-50
8.192
MHz
1, 3
50
ppm
1
PCLK period jitter
tCJIT
-8
8
ns
1
PCLK duty cycle
tDTY
0.4
0.6
tC
1
PCLK rise/fall time
tR/tF
-
FSYNC period
tFS
FSYNC period jitter
tFJIT
-120
tD
DRX and FSYNC setup time relative to PCLK falling edge
DRX and FSYNC hold time relative to PCLK falling edge
DTX and FSYNC valid after PCLK rising edge
3
ns
1, 2, 8
us
1
120
ns
1
0
20
ns
1, 4, 6
tSU
10
-
ns
5, 7
tHD
10
-
ns
5, 7
125
Notes:
General comment: All values w ere measured from vddio/2 to vddio/2, unless otherw ise specified.
1. For all signals, the load is CL = 20 pF.
2. Rise and Fall times are referenced to the 20% and 80% levels of the w aveform.
3. PCLK can be configured to several frequency options. Refer to the Functional Specifications
or to the Clock settings for details.
4. This parameter is relevant for the FSYNC signal in Master mode only.
5. This parameter is relevant for the FSYNC signal in Slave mode only.
6. In negative-mode, the DTX signal is relative to PCLK falling edge.
7. In negative-mode, the DRX signal is relative to PCLK rising edge.
8. This parameter is relevant w hen the PCLK pin is output.
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9.6.14.2
TDM Interface Test Circuit
Figure 45: TDM Interface Test Circuit
Test Point
CL
9.6.14.3
TDM Interface Timing Diagrams
Figure 46: TDM Interface Output Delay AC Timing Diagram
tC
PCLK
DTX
tD
tD
Figure 47: TDM Interface Input Delay AC Timing Diagram
tC
PCLK
DRX
tSU
tHD
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AC Electrical Specifications
9.6.15
Inter-IC Sound Interface (I2S) AC Timing
(88F6710/88F6W11 Only)
9.6.15.1
Inter-IC Sound (I2S) AC Timing Table
Table 76: Inter-IC Sound (I2S) AC Timing Table
Description
Sym bol
I2SBCLK clock frequency
fCK
I2SBCLK clock high/low level pulse w idth
Min
Max
See note 2
Units
Notes
MHz
2
tCH/tCL
0.37
-
tCK
1
I2SDI input setup time relative to I2SBCLK rise time
tSU
0.10
-
tCK
-
I2SDI input hold time relative to I2SBCLK rise time
tHO
0.0
-
ns
3
I2SDO, I2SLRCLK output delay relative to I2SBCLK rise time
tOD
0.10
0.70
tCK
1
Notes:
General comment: All timing values w ere measured from VIL(max) and VIH(min) levels, unless otherw ise specified.
General comment: tCK = 1/fCK.
1. For all signals, the load is CL = 15 pF.
2. See "Reference Clocks" table for more details.
3. For this parameter, the load is CL = 2 pF.
9.6.15.2
Inter-IC Sound (I2S) Test Circuit
Figure 48: Inter-IC Sound (I2S) Test Circuit
Test Point
CL
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9.6.15.3
Inter-IC Sound (I2S) AC Timing Diagrams
Figure 49: Inter-IC Sound (I2S) Output Delay AC Timing Diagram
tCL
tCH
VIH(min)
I2SBCLK
VIL(max)
VIH(min)
I2SDO,
I2SLRCLK
VIL(max)
tODmin
tODmax
Figure 50: Inter-IC Sound (I2S) Input AC Timing Diagram
tCL
tCH
VIH(min)
I2SBCLK
VIL(max)
VIH(min)
I2SDI
VIL(max)
tSU
tHO
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AC Electrical Specifications
9.6.16
Sony/Philips Digital Interface (S/PDIF) AC Timing
(88F6710/88F6W11 Only)
9.6.16.1
S/PDIF AC Timing Table
Table 77: S/PDIF AC Timing Table
Description
Sym bol
Min
Max
Units
Notes
Output frequency accuracy
Ftxtol
-50.0
50.0
ppm
1
Input frequency accuracy
Frxtol
-100.0
100.0
ppm
-
Txjit
-
0.05
UI
1, 2
Txjitgain
-
3.0
dB
3
-
10.0
UI
4
-
0.25
UI
5
-
0.2
UI
6
Output jitter (total peak-to-peak)
Jitter transfer gain
Input jitter (total peak-to-peak)
Rxjit
Notes:
General comment: All values w ere measured from VIL(max) to VIH(min), unless otherw ise specified.
General comment: For more information, refer to the Digital Audio Interface - Part 3: Consumer Applications,
IEC 60958-3:2003(E), Chapter 7.3, January 2003.
1. For all signals, the load is CL = 10 pF.
2. Using intrinsic jitter filter.
3. Refer to Figure-8 in IEC 60958-3:2003(E), Chapter 7.3, January 2003.
4. Defined for up to 5 Hz.
5. Defined from 200 Hz to 400 kHz.
6. Defined for above 400 kHz.
Note
For additional information about working with a coax connection, see the Hardware
Design Guide.
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9.6.16.2
S/PDIF Test Circuit
Figure 51: S/PDIF Test Circuit
Test Point
CL
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Differential Interface Electrical Characteristics
9.7
Differential Interface Electrical Characteristics
This section provides the reference clock, AC, and DC characteristics for the following differential
interfaces:
PCI Express (PCIe) Interface Electrical Characteristics
SATA Interface Electrical Characteristics (88F6710/88F6707 Only)
USB Electrical Characteristics
Serial Gigabit Media Independent Interface (SGMII) Interface Electrical Characteristics
Double Rated-SGMII (DR-SGMII) Electrical Characteristics
Note
The Tx and Rx timing parameters are defined with the relevant reference clock
specifications as specified in the Hardware Specifications.
9.7.1
Differential Interface Reference Clock Characteristics
9.7.1.1
PCI Express Interface Differential Reference Clock Characteristics
Table 78 is relevant for PEX0_CLK_P/N and PEX1_CLK_P/N.
Note
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Table 78: PCI Express Interface Differential Reference Clock Characteristics
Description
Sym bol
Clock frequency
Min
fCK
Max
Units
Notes
MHz
-
100
Clock duty cycle
DCrefclk
0.4
0.6
tCK
-
Differential rising/falling slew rate
SRrefclk
0.6
4
V/ns
3
Differential high voltage
VIHrefclk
150
-
mV
-
Differential low voltage
VILrefclk
-
-150
mV
-
Vcross
250
550
mV
1
Variation of Vcross over all rising clock edges
Vcrs_dlta
-
140
mV
1
Rise-Fall matching
dTRrefclk
-
20
%
1
Average differential clock period accuracy
Tperavg
-300
2800
ppm
-
Absolute differential clock period
Tperabs
9.8
10.2
ns
2
Tccjit
-
150
ps
-
Clock high frequency RMS jitter
Thfrms
-
3.1
ps RMS
4
Clock low frequency RMS jitter
Tlfrms
-
3
ps RMS
4
Absolute crossing point voltage
Differential clock cycle-to-cycle jitter
Notes:
General Comment: The reference clock timings are based on 100 ohm test circuit.
General Comment: Refer to the PCI Express Card Electromechanical Specification, Revision 2.0,
April 2007, section 2.1.3 for more information.
1. Defined on a single-ended signal.
2. Including jitter and spread spectrum.
Table 79: PCI Express Interface Spread Spectrum Requirements
Sym bol
Min
Max
Units
Notes
Fmod
0.0
33.0
kHz
1
Fspread
-0.5
0.0
%
1
Notes:
1. Defined on linear sw eep or “Hershey’s Kiss” (US Patent 5,631,920) modulations.
Note
The PCIe Spread-Spectrum Clocking (SSC) only works with PEX0_CLK_P/N reference
clock input, and the PCIe clock is supplied with an SSC effect. The PEX1_CLK_P/N
pins are used for output only.
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9.7.2
PCI Express (PCIe) Interface Electrical Characteristics
9.7.2.1
PCI Express Interface Driver and Receiver Characteristics
Table 80: PCI Express 1.1 Interface Driver and Receiver Characteristics
Description
Sym bol
Baud rate
BR
Unit interval
UI
Baud rate tolerance
Bppm
Min
Max
Units
Notes
2.5
Gbps
-
400
ps
-
-300
300
ppm
2
Driver parameters
Differential peak to peak output voltage
VTXpp
0.8
1.2
V
-
Minimum TX eye w idth
TTXeye
0.75
-
UI
-
Differential return loss
TRLdiff
10
-
dB
1
Common mode return loss
TRLcm
6
-
dB
1
DC differential TX impedance
ZTXdiff
80
120
Ohm
-
1.2
V
-
Receiver parameters
Differential input peak to peak voltage
VRXpp
0.175
Minimum receiver eye w idth
TRXeye
0.4
-
UI
-
Differential return loss
RRLdiff
10
-
dB
1
Common mode return loss
RRLcm
6
-
dB
1
DC differential RX impedance
ZRXdiff
80
120
Ohm
-
DC single-ended input impedance
ZRXcm
40
60
Ohm
-
Notes:
General Comment: For more information, refer to the PCI Express Base Specification, Revision 1.1, March, 2005.
1. Defined from 50 MHz to 1.25 GHz.
Return loss includes contributions from on-chip circuitry, chip packaging,
and off-chip optimized components related to the driver/receiver breakout.
2. Does not account for SSC dictated variations.
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Table 81: PCI Express 2.0 Interface Driver and Receiver Characteristics
Description
Sym bol
Baud rate
Min
Max
BR
Unit interval
5
UI
Baud rate tolerance
Bppm
200
Units
Notes
Gbps
-
ps
-
-300
300
ppm
1
V
-
Driver parameters
Differential peak to peak output voltage
VTXpp
0.8
1.2
Minimum TX eye w idth
TTXeye
0.75
-
UI
-
Differential return loss [50 MHz to 1.25 GHz]
TRLdiff
10
-
dB
-
Differential return loss [1.25 GHz to 2.5 GHz]
TRLdiff
8
-
dB
-
Common mode return loss
TRLcm
6
-
dB
2
ZTXdiff
-
120
Ohm
-
DC differential TX impedance
Receiver parameters
Differential input peak to peak voltage
VRXpp
0.1
1.2
V
-
Minimum receiver eye w idth
TRXeye
0.4
-
UI
-
Differential return loss [50 MHz to 1.25 GHz]
RRLdiff
10
-
dB
-
Differential return loss [1.25 GHz to 2.5 GHz]
RRLdiff
8
-
dB
-
Common mode return loss
RRLcm
6
-
dB
2
DC single-ended input impedance
ZRXcm
40
60
Ohm
-
Notes:
General Comment: For more information, refer to the PCI Express Base Specification, Revision 2.0, December 2007.
1. Does not account for SSC dictated variations.
2. Defined from 50 MHz to 2.5 GHz.
Return loss includes contributions from on-chip circuitry, chip packaging,
and off-chip optimized components related to the driver/receiver breakout.
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9.7.2.2
PCI Express InterfaceTest Circuit
Figure 52: PCI Express Interface 1.1 Test Circuit
Test Points
- +
C_TX
D+
D-
C_TX
50 ohm
50 ohm
When measuring Transmitter output parameters, C_TX is an optional portion of the
Test/Measurement load. When used, the value of C_TX must be in the range of 75 nF to 200 nF.
C_TX must not be used when the Test/Measurement load is placed in the Receiver package
reference plane.
Figure 53: PCI Express Interface 2.0 Test Circuit
Test Points
+ C_TX
D+
D-
C_TX
50 ohm
50 ohm
When measuring Transmitter output parameters, C_TX is an optional portion of the
Test/Measurement load. When used, the value of C_TX must be in the range of 75 nF to 200 nF.
C_TX must not be used when the Test/Measurement load is placed in the Receiver package
reference plane.
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9.7.3
SATA Interface Electrical Characteristics
(88F6710/88F6707 Only)
Note
9.7.3.1
The tables below specify the SATA electrical characteristics at the SATA connector.
Refer to the device design guide for connectivity and layout guidelines of the SATA
interface.
SATA I Interface Gen1 Mode Driver and Receiver
Characteristics
Table 82: SATA I Interface Gen1i Mode Driver and Receiver Characteristics
Description
Sym bol
Baud Rate
Min
Max
1.5
BR
Baud rate tolerance
Bppm
-350.0
350.0
Units
Notes
Gbps
-
ppm
-
Spread spectrum modulation frequency
Fssc
30.0
33.0
kHz
-
Spread spectrum modulation Deviation
SSCtol
-5000.0
0.0
ppm
-
ps
-
Unit Interval
666.67
UI
Driver Parameters
Differential impedance
Zdifftx
85.0
115.0
Ohm
-
Single ended impedance
Zsetx
40.0
-
Ohm
-
Differential return loss (75 MHz-150 MHz)
RLOD
14.0
-
dB
-
Differential return loss (150 MHz-300 MHz)
RLOD
8.0
-
dB
-
Differential return loss (300 MHz-1.2 GHz)
RLOD
6.0
-
dB
-
Differential return loss (1.2 GHz-2.4 GHz)
RLOD
3.0
-
dB
-
Differential return loss (2.4 GHz-3.0 GHz)
RLOD
1.0
-
dB
-
Output differential voltage
Vdifftx
400.0
600.0
mV
2
Total jitter at connector data-data, 5UI
TJ5
-
0.355
UI
1, 3
Deterministic jitter at connector data-data, 5UI
DJ5
-
0.175
UI
3
Total jitter at connector data-data, 250UI
TJ250
-
0.470
UI
1, 3
Deterministic jitter at connector data-data, 250UI
DJ250
-
0.220
UI
3
Receiver Parameters
Differential impedance
Zdiffrx
85.0
115.0
Ohm
-
Single ended impedance
Zsetx
40.0
-
Ohm
-
Differential return loss (75 MHz-150 MHz)
RLID
18.0
-
dB
-
Differential return loss (150 MHz-300 MHz)
RLID
14.0
-
dB
-
Differential return loss (300 MHz-600 MHz)
RLID
10.0
-
dB
-
Differential return loss (600 MHz-1.2 GHz)
RLID
8.0
-
dB
-
Differential return loss (1.2 GHz-2.4 GHz)
RLID
3.0
-
dB
-
Differential return loss (2.4 GHz-3.0 GHz)
RLID
1.0
-
dB
-
Vdiffrx
325.0
600.0
mV
-
TJ5
-
0.430
UI
1, 3
Input differential voltage
Total jitter at connector data-data, 5UI
Deterministic jitter at connector data-data, 5UI
DJ5
-
0.250
UI
3
Total jitter at connector data-data, 250UI
TJ250
-
0.600
UI
1, 3
Deterministic jitter at connector data-data, 250UI
DJ250
-
0.350
UI
3
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Electrical Specifications
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Notes:
General Comment: For more information, refer to SATA II Revision 2.6 Specification, February, 2007.
General Comment: The load is 100 ohm differential for these parameters, unless otherw ise specified.
General Comment: To comply w ith the values presented in this table, refer to your local
Marvell representative for register settings.
1. Total jitter is defined as TJ = (14 * RJσ) + DJ w here Rjσ is random jitter.
2. Output Differential Amplitude and Pre-Emphasis are configurabile. See the functional register description
for more details.
3. The value is informative only, and it can be achieved by using a proper board layout.
Refer to the hardw are design guidelines for more information.
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Hardware Specifications
9.7.3.2
SATA II Interface Gen2 Mode Driver and Receiver Characteristics
Table 83: SATA II Interface Gen2i Mode Driver and Receiver Characteristics
Description
Sym bol
Baud Rate
Min
Max
3.0
BR
Baud rate tolerance
Bppm
-350.0
350.0
Units
Notes
Gbps
-
ppm
-
Spread spectrum modulation frequency
Fssc
30.0
33.0
kHz
-
Spread spectrum modulation deviation
SSCtol
-5000.0
0.0
ppm
-
ps
1,2
Unit Interval
333.33
UI
Driver Parameters
Output differential voltage
Vdifftx
400.0
700.0
mV
Differential return loss (150 MHz-300 MHz)
RLOD
14.0
-
dB
-
Differential return loss (300 MHz-600 MHz)
RLOD
8.0
-
dB
-
Differential return loss (600 MHz-2.4 GHz)
RLOD
6.0
-
dB
-
Differential return loss (2.4 GHz-3.0 GHz)
RLOD
3.0
-
dB
-
Differential return loss (3.0 GHz-5.0 GHz)
RLOD
1.0
-
dB
-
Total jitter at connector clock-data
TJ
-
0.37
UI
4, 5
Deterministic jitter at connector clock-data
DJ
-
0.19
UI
5
Receiver Parameters
Input differential voltage
Vdiffrx
275.0
750.0
mV
3
Differential return loss (150 MHz-300 MHz)
RLID
18.0
-
dB
-
Differential return loss (300 MHz-600 MHz)
RLID
14.0
-
dB
-
Differential return loss (600 MHz-1.2 GHz)
RLID
10.0
-
dB
-
Differential return loss (1.2 GHz-2.4 GHz)
RLID
8.0
-
dB
-
Differential return loss (2.4 GHz-3.0 GHz)
RLID
3.0
-
dB
-
Differential return loss (3.0 GHz-5.0 GHz)
RLID
1.0
-
dB
-
Total jitter at connector clock-data
TJ
-
0.60
UI
4, 5
Deterministic jitter at connector clock-data
DJ
-
0.42
UI
5
Notes:
General Comment: For more information, refer to SATA II Revision 2.6 Specification, February, 2007.
General Comment: The load is 100 ohm differential for these parameters, unless otherw ise specified.
General Comment: To comply w ith the values presented in this table, refer to your local
Marvell representative for register settings.
1. 0.45-0.55 UI is the range w here the signal meets the minimum level.
2. Output Differential Amplitude and Pre-Emphasis are configurabile. See the functional register description
for more details.
3. 0.5 UI is the point w here the signal meets the minimum level.
4. The jitter is defined using a recovered clock w ith characteristics that meet the desired Jitter Transfer
Function (JTF). The JTF is the ratio betw een the jitter defined using the recovered clock and the jitter
defined using an ideal clock. It should have a high pass function w ith the follow ing characteristics:
- The -3 dB corner frequency of the JTF shall be 2.1 MHz +/- 1 MHz.
- The magnitude peaking of the JTF shall be 3.5 dB maximum.
- The attenuation at 30 KHz +/- 1% shall be 72 dB +/- 3 dB.
5. The value is informative only, and it can be achieved by using a proper board layout.
Refer to the hardw are design guidelines for more information.
Doc. No. MV-S107978-00 Rev. G
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Electrical Specifications
Differential Interface Electrical Characteristics
Table 84: SATA II Interface Gen2m Mode Driver and Receiver Characteristics
Description
Sym bol
Baud Rate
Min
Max
3.0
BR
Units
Notes
Gbps
-
Baud rate tolerance
Bppm
-350.0
350.0
ppm
-
Spread spectrum modulation frequency
Fssc
30.0
33.0
kHz
-
Spread spectrum modulation deviation
SSCtol
-5000.0
0.0
ppm
-
ps
1,2
Unit Interval
333.33
UI
Driver Parameters
Output differential voltage
Vdifftx
400.0
700.0
mV
Differential return loss (150 MHz-300 MHz)
RLOD
14.0
-
dB
-
Differential return loss (300 MHz-600 MHz)
RLOD
8.0
-
dB
-
Differential return loss (600 MHz-2.4 GHz)
RLOD
6.0
-
dB
-
Differential return loss (2.4 GHz-3.0 GHz)
RLOD
3.0
-
dB
-
Total jitter at connector clock-data
TJ
-
0.37
UI
4, 5
Deterministic jitter at connector clock-data
DJ
-
0.19
UI
5
Receiver Parameters
Input differential voltage
Vdiffrx
240.0
750.0
mV
3
Differential return loss (150 MHz-300 MHz)
RLID
18.0
-
dB
-
Differential return loss (300 MHz-600 MHz)
RLID
14.0
-
dB
-
Differential return loss (600 MHz-1.2 GHz)
RLID
10.0
-
dB
-
Differential return loss (1.2 GHz-2.4 GHz)
RLID
8.0
-
dB
-
Differential return loss (2.4 GHz-3.0 GHz)
RLID
3.0
-
dB
-
Total jitter at connector clock-data
TJ
-
0.60
UI
4, 5
Deterministic jitter at connector clock-data
DJ
-
0.42
UI
5
Notes:
General Comment: For more information, refer to SATA II Revision 2.6 Specification, February, 2007.
General Comment: The load is 100 ohm differential for these parameters, unless otherw ise specified.
General Comment: To comply w ith the values presented in this table, refer to your local
Marvell representative for register settings.
1. 0.45-0.55 UI is the range w here the signal meets the minimum level.
2. Output Differential Amplitude and Pre-Emphasis are configurabile. See the functional register description
for more details.
3. 0.5 UI is the point w here the signal meets the minimum level.
4. The jitter is defined using a recovered clock w ith characteristics that meet the desired Jitter Transfer
Function (JTF). The JTF is the ratio betw een the jitter defined using the recovered clock and the jitter
defined using an ideal clock. It should have a high pass function w ith the follow ing characteristics:
- The -3 dB corner frequency of the JTF shall be 2.1 MHz +/- 1 MHz.
- The magnitude peaking of the JTF shall be 3.5 dB maximum.
- The attenuation at 30 KHz +/- 1% shall be 72 dB +/- 3 dB.
5. The value is informative only, and it can be achieved by using a proper board layout.
Refer to the hardw are design guidelines for more information.
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Hardware Specifications
9.7.4
USB Electrical Characteristics
9.7.4.1
USB Driver and Receiver Characteristics
Table 85: USB Low Speed Driver and Receiver Characteristics
Low Speed
Description
Baud Rate
Baud rate tolerance
Ouput single ended high
Ouput single ended low
Output signal crossover voltage
Data fall time
Data rise time
Rise and fall time matching
Source jitter total: to next transition
Source jitter total: for paired transitions
Input single ended high
Input single ended low
Differential input sensitivity
Sym bol
BR
Bppm
Driver Parameters
VOH
VOL
VCRS
TLR
TLF
TLRFM
TUDJ1
TUDJ2
Receiver Parameters
VIH
VIL
VDI
Min
Max
1.5
-15000.0 15000.0
Units
Mbps
ppm
Notes
-
2.8
0.0
1.3
75.0
75.0
80.0
-95.0
-150.0
3.6
0.3
2.0
300.0
300.0
125.0
95.0
150.0
V
V
V
ns
ns
%
ns
ns
1
2
3
3, 4
3, 4
5
5
2.0
0.2
0.8
-
V
V
V
-
Notes:
General Comment: For more information, refer to Universal Serial Bus Specification, Revision 2.0, April 2000.
General Comment: The load is 100 ohm differential for these parameters, unless otherw ise specified.
General Comment: To comply w ith the values presented in this table, refer to your local
Marvell representative for register settings.
1. Defined w ith 1.425 kilohm pull-up resistor to 3.6V.
2. Defined w ith 14.25 kilohm pull-dow n resistor to ground.
3. See "Data Signal Rise and Fall Time" w aveform.
4. Defined from 10% to 90% for rise time and 90% to 10% for fall time.
5. Including frequency tolerance. Timing difference betw een the differential data signals.
Defined at crossover point of differential data signals.
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Differential Interface Electrical Characteristics
Table 86: USB Full Speed Driver and Receiver Characteristics
Full Speed
Description
Sym bol
BR
Bppm
Driver Parameters
Ouput single ended high
VOH
Ouput single ended low
VOL
Output signal crossover voltage
VCRS
Output rise time
TFR
Output fall time
TFL
Source jitter total: to next transition
TDJ1
Source jitter total: for paired transitions
TDJ2
Source jitter for differential transition to SE0 transition
TFDEOP
Receiver Parameters
Input single ended high
VIH
Input single ended low
VIL
Differential input sensitivity
VDI
Receiver jitter : to next transition
tJR1
Receiver jitter: for paired transitions
tJR2
Baud Rate
Baud rate tolerance
Min
Max
12.0
-2500.0
2500.0
Units
Mbps
ppm
Notes
-
2.8
0.0
1.3
4.0
4.0
-3.5
-4.0
-2.0
3.6
0.3
2.0
20.0
20.0
3.5
4.0
5.0
V
V
V
ns
ns
ns
ns
ns
1
2
4
3, 4
3, 4
5, 6
5, 6
6
2.0
0.2
-18.5
-9.0
0.8
18.5
9.0
V
V
V
ns
ns
6
6
Notes:
General Comment: For more information, refer to Universal Serial Bus Specification, Revision 2.0, April 2000.
General Comment: The load is 100 ohm differential for these parameters, unless otherw ise specified.
General Comment: To comply w ith the values presented in this table, refer to your local
Marvell representative for register settings.
1.. Defined w ith 1.425 kilohm pull-up resistor to 3.6V.
2.. Defined w ith 14.25 kilohm pull-dow n resistor to ground.
3. Defined from 10% to 90% for rise time and 90% to 10% for fall time.
4. See "Data Signal Rise and Fall Time" w aveform.
5. Including frequency tolerance. Timing difference betw een the differential data signals.
6. Defined at crossover point of differential data signals.
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Hardware Specifications
Table 87: USB High Speed Driver and Receiver Characteristics
High Speed
Description
Baud Rate
Baud rate tolerance
Data signaling high
Data signaling low
Data rise time
Data fall time
Data source jitter
Sym bol
BR
Bppm
Driver Parameters
VHSOH
VHSOL
THSR
THSF
Min
Max
480.0
-500.0
500.0
Units
Mbps
ppm
Notes
-
360.0
440.0
-10.0
10.0
500.0
500.0
See note 2
mV
mV
ps
ps
1
1
2
Receiver Parameters
Differential input signaling levels
Data signaling common mode voltage range
Receiver jitter tolerance
VHSCM
See note 3
-50.0
500.0
See note 3
3
3
mV
Notes:
General Comment: For more information, refer to Universal Serial Bus Specification, Revision 2.0, April 2000.
General Comment: The load is 100 ohm differential for these parameters, unless otherw ise specified.
General Comment: To comply w ith the values presented in this table, refer to your local
Marvell representative for register settings.
1. Defined from 10% to 90% for rise time and 90% to 10% for fall time.
2. Source jitter specified by the "TX eye diagram pattern template" figure.
3. Receiver jitter specified by the "RX eye diagram pattern template" figure.
9.7.4.2
USB Interface Driver Waveforms
Figure 54: Low/Full Speed Data Signal Rise and Fall Time
Rise Time
Fall Time
90%
90%
VCRS
10%
Differential
Data Lines
10%
TR
Doc. No. MV-S107978-00 Rev. G
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TF
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Electrical Specifications
Differential Interface Electrical Characteristics
Figure 55: High Speed TX Eye Diagram Pattern Template
+525mV
+475mV
+400mV
Differential
+300mV
0 Volts
Differential
-300mV
- 400mV
Differential
-475mV
-525mV
7.5%
37.5%
92.5%
62.5%
0%
100%
Figure 56: High Speed RX Eye Diagram Pattern Template
+525mV
+475mV
+400mV
Differential
+175mV
0 Volts
Differential
-175mV
- 400mV
Differential
-475mV
-525mV
12.5%
35
65
0%
Copyright © 2014 Marvell
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87.5%
100%
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9.7.5
Serial Gigabit Media Independent Interface (SGMII) Interface
Electrical Characteristics
9.7.5.1
SGMII Driver and Receiver Characteristics
Table 88: SGMII Interface Driver and Receiver Characteristics (1000BASE-X)
Description
Sym bol
Baud rate
Min
BR
Baud rate tolerance
Bppm
Unit interval
Max
1.25
-100
UI
100
Units
Notes
Gbps
-
ppm
1
ps
-
800
Driver parameters for 1000BASE-X Backplane M ode
Output differential minimum eye opening
Vodppe
850
-
mV
-
Output differential maximum peak-to-peak
Vodpp
-
1350
mV
-
Absolute output limits
Vos
-0.4
1.6
V
-
Output differential skew
Tosk
-
20
ps
2
Return loss differential output
RLOD
10
-
dB
3, 9
Jttx
-
0.1
UI
4
Jttxpp
-
0.24
UI
6
Output jitter - deterministic, peak-to-peak
Output jitter - total, peak-to-peak
Receiver parameters for 1000BASE-X Backplane M ode
Input differential sensitivity
Vidppe
180
-
mV
8
Input differential voltage
Vidpp
-
2000
mV
8
Input differential skew
Tisk
-
180
ps
5
Return loss differential input
RLID
10
-
dB
3, 9
Return loss common mode input
RLIC
6
-
dB
7, 9
Input jitter - deterministic, peak-to-peak
Jtrx
-
0.462
UI
4
Jtrxpp
-
0.749
UI
6
Input jitter - total, peak-to-peak
Notes:
General Comment: The load is 100 ohm differential for these parameters, unless otherw ise specified.
1. Defines the allow able reference clock difference from nominal.
2. This is a single ended parameter and is defined at the 50% point on the signal sw ing.
3. Defined from 50 MHz to 625 MHz.
For 650 MHz - 1.25 GHz: -10dB+10log(Freq/625) (Freq defined in MHz).
4. Jitter specifications include all but 10^-12 of the jitter population.
5. This value assumes total eye jitter budget is still maintained.
6. Total jitter is composed of both deterministic and random components.
The allow ed random jitter equals the allow ed total jitter minus the actual deterministic at that point.
7. Defined from 50 MHz to 625 MHz.
For 650 MHz - 1.25 GHz: -6dB+10log(Freq/625) (Freq defined in MHz).
8. Vidppe refers to the internal eye opening w hile Vidpp refers to the peak-to-peak.
9. Return loss includes contributions from on-chip circuitry, chip packaging,
and off-chip optimized components related to the driver/receiver breakout.
Doc. No. MV-S107978-00 Rev. G
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Differential Interface Electrical Characteristics
Table 89: SGMII Interface Settings and Configuration (1000 BASE-X)
P ar a m e te r
S e tt in g /C on fi g ur a ti on
Vods
The Vods is the output differential amplitude configurable range.
When driving a test load, the minimum value of 420 mV is achieved with
txamp[4:0]= 0, and the maximum value of 1350 mV is achieved with
txamp[4:0]=23.
Differential amplitude accuracy is +/-50 mV.
Vodppe
The Vodppe is the output differential minimum eye opening.
When driving a test load, these values are achieved with txamp[4:0]=18.
Vidpp
The Vidpp is the input differential voltage.
The maximum single-ended voltage (common mode voltage and swing voltage)
must not exceed 1.8V.
NOTE: For further information, refer to the Functional Specifications.
9.7.5.2
SGMII Interface Driver Waveforms
Figure 57: Tri-Speed Interface Driver Output Voltage Limits And Definitions
V [Single Ended]
Max Absolute Output
Output Common
Min Absolute Output
Ground
V [Differential]
Differential Peak-to-Peak
Time
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Hardware Specifications
Figure 58: Driver Output Differential Amplitude and Eye Opening
Differential Amplitude
Differential Eye Opening
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Differential Interface Electrical Characteristics
9.7.6
Double Rated-SGMII (DR-SGMII) Electrical Characteristics
9.7.6.1
DR-SGMII Driver and Receiver Characteristics
Table 90: DR-SGMII Driver and Receiver Characteristics
Description
Baud Rate
Baud rate tolerance
Unit Interval
Sym bol
Min
BR
Bppm
Max
3.125
-100.0
100.0
320.0
UI
Units
Notes
Gbps
-
ppm
1
ps
-
Driver parameters
Output differential minimum eye opening
Vodppe
800.0
-
mV
-
Output differential maximum peak-to-peak
Vodpp
-
1600.0
mV
-
Absolute output limits
Vos
-0.4
2.3
V
-
Output differential skew
Tosk
-
15.0
ps
2
Output differential transition time
Tr/Tf
-
130.0
ps
3
Return loss differential output
RLOD
10.0
-
dB
4
Jttx
-
0.17
UI
-
Jttxpp
-
0.35
UI
5, 8
Output jitter - Deterministic, peak-to-peak
Output jitter - Total, peak-to-peak
Receiver parameters
Input differential sensitivity
Vidpps
200.0
-
mV
9
Input differential voltage
Vidpp
-
1600.0
mV
9
Input differential skew
Tisk
-
75.0
ps
6
Return loss differential input
RLID
10.0
-
dB
7
Return loss common mode input
RLIC
6.0
-
dB
7
Input jitter - Deterministic, peak-to-peak
Jtrx
-
0.47
UI
10
Input jitter - Sinusoidal, low frequency
Jtrlsx
-
8.50
UI
11
Input jitter - Sinusoidal, high frequency
Jtrsx
-
0.10
UI
12
Input jitter - Total, peak-to-peak
Jtrxpp
-
0.65
UI
5, 8
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Hardware Specifications
Notes:
General Comment: The load is 100 ohm differential for these parameters, unless otherw ise specified.
1. Defines the allow able reference clock difference from nominal.
2. This is a single ended parameter and is defined at the 50% point on the signal sw ing.
3. Defined from 20% to 80% of the signal's voltage levels.
4. Defined from 312.5 MHz to 625 MHz.
5. Defined w ith a BER of 10^-12.
6. This value assumes total eye jitter budget is still maintained.
7. Relative to 100 ohm differential and 25 ohm common mode. Defined from 100 MHz to 2.5 GHz.
Return loss includes contributions from on-chip circuitry, chip packaging,
and off-chip optimized components related to the driver/receiver breakout.
8. Total jitter is composed of both deterministic and random components.
The allow ed random jitter equals the allow ed total jitter minus the actual deterministic at that point.
9. Vidpps refers to the internal eye opening w hile Vidpp refers to the peak-to-peak.
10. Deterministic jitter includes sinusoidal, high frequency (Jtrsx), component.
11. Defined below 22.1 kHz.
12. Defined from 1.875 MHz to 20 MHz.
Table 91: DR-SGMII Settings and Configuration
P ar a m e te r
S e tt in g /C on fi g ur a ti on
Vods
The Vods is the output differential amplitude configurable range.
When driving a test load, the minimum value of 850 mV is achieved with
txamp[4:0]= 11 and the maximum value of 1500 mV is achieved with
txamp[4:0]=26.
Differential amplitude accuracy is +/-75 mV.
Output differential amplitude and pre-emphasis are configurable.
Vodppe
The Vodppe is the output differential minimum eye opening.
When driving a test load, these values are achieved with txamp[4:0]= 22
PEr
The PEr is the pre-emphasis range.
When driving a test load, the minimum is 0 and the maximum is -7.4 dB.
Defined as PEr[dB] = 20*Log(Vodp/Vodd).
NOTE: For further information, refer to the Functional Specifications.
Doc. No. MV-S107978-00 Rev. G
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Differential Interface Electrical Characteristics
DR-SGMII Driver Output Waveforms
9.7.6.2
Figure 59: DR-SGMII Driver Output Voltage Limits and Definitions
V [Single Ended]
Max Absolute Output
Output Common
Min Absolute Output
Ground
V [Differential]
Differential Peak-to-Peak
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Hardware Specifications
Figure 60: DR-SGMII Driver Output Differential Voltage under Pre-emphasis
Vodp
Vodd
Vodd
Vodp
Bit Time
Bit Time
Figure 61: DR-SGMII Driver Output Differential Amplitude and Eye Opening
Differential Amplitude
Differential Eye Opening
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Thermal Data
10
Thermal Data
Table 92 provides the package thermal data for the 88F6710, 88F6707, and 88F6W11. This data is
derived from simulations that were run according to the JEDEC standard.
The documents listed below provide a basic understanding of thermal management of integrated
circuits (ICs) and guidelines to ensure optimal operating conditions for Marvell products. Before
designing a system it is recommended to refer to these documents:
Application Note, AN-63 Thermal Management for Selected Marvell® Products, Document
Number MV-S300281-00
White Paper, ThetaJC, ThetaJA, and Temperature Calculations, Document Number
MV-S700019-00.
Table 92: Thermal Data for the 88F6710, 88F6707, and 88F6W11 in HSBGA Package
Sy m b o l
D e fin i ti on
A ir fl ow Va l ue (° C / W )
JA
Thermal resistance: junction to ambient
JT
Thermal characterization parameter: junction to top center
JB
Thermal characterization parameter: junction to board
JC
Thermal resistance: junction to case
(not air-flow dependent)
9.5
JB
Thermal resistance: junction to board
(not air-flow dependent)
13.5
Copyright © 2014 Marvell
April 3, 2014, Preliminary
0 [ m /s ]
1 [ m / s]
2[m/s]
20.1
17.9
17.2
8.4
11.8
11.4
11.3
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Hardware Specifications
11
Package
The 88F6710, 88F6707, and 88F6W11 uses a 286-pin 19mm x 19 mm HSBGA package with a 1.00
mm ball pitch.
Figure 62: HSBGA 19x19 mm, 286-pin Package and Dimensions
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April 3, 2014, Preliminary
Part Order Numbering/Package Marking
Part Order Numbering
12
Part Order Numbering/Package Marking
12.1
Part Order Numbering
Figure 63 shows the part order numbering scheme for the 88F6710, 88F6707, and 88F6W11. Refer
to Marvell Field Application Engineers (FAEs) or representatives for further information when
ordering parts.
Figure 63: Sample Part Number
88F6707 –xx–BMI2C000–xxxx
Custom code (optional)
Part number
88F6710
88F6707
88F6W11
Frequency
080 (800 MHz)
100 (1000 MHz)
120 (1200 MHz)
Die revision
Temperature code
C = Commercial
I = Industrial
Package code
BMI = 286-pin HSBGA
Environmental code
2 = Green (RoHS 6/6 and
Halogen-free)
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Hardware Specifications
Table 93: 88F6710, 88F6707, and 88F6W11 Commercial Grade Part Order Options
P a c k a g e Ty p e
Part Order Number
88F6710
286-pin 19 mm x 19 mm HSBGA
88F6710-xx-BMI2C120-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1.2 GHz)
88F6707
286-pin 19 mm x 19 mm HSBGA
88F6707-xx-BMI2C080-xxxx
(Green, RoHS 6/6 and Halogen-free package, 800 MHz)
286-pin 19 mm x 19 mm HSBGA
88F6707-xx-BMI2C100-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1 GHz)
286-pin 19 mm x 19 mm HSBGA
88F6707-xx-BMI2C120-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1.2 GHz)
88F6W11
286-pin 19 mm x 19 mm HSBGA
88F6W11-xx-BMI2C080-xxxx
(Green, RoHS 6/6 and Halogen-free package, 800 MHz)
286-pin 19 mm x 19 mm HSBGA
88F6W11-xx-BMI2C100-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1 GHz)
286-pin 19 mm x 19 mm HSBGA
88F6W11-xx-BMI2C120-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1.2 GHz)
Table 94: 88F6710, 88F6707, and 88F6W11 Industrial Grade Part Order Options
P a c k a g e Ty p e
Part Order Number
88F6710
286-pin 19 mm x 19 mm HSBGA
88F6710-xx-BMI2I120-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1.2 GHz)
88F6707
286-pin 19 mm x 19 mm HSBGA
88F6707-xx-BMI2I080-xxxx
(Green, RoHS 6/6 and Halogen-free package, 800 MHz)
286-pin 19 mm x 19 mm HSBGA
88F6707-xx-BMI2I100-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1 GHz)
88F6W11
286-pin 19 mm x 19 mm HSBGA
88F6W11-xx-BMI2I100-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1 GHz)
286-pin 19 mm x 19 mm HSBGA
88F6W11-xx-BMI2I120-xxxx
(Green, RoHS 6/6 and Halogen-free package, 1.2 GHz)
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Part Order Numbering/Package Marking
Package Marking
12.2
Package Marking
Figure 64 shows a sample Commercial package marking and pin 1 location for the 88F6710,
88F6707, and 88F6W11.
Figure 64: Sample Package Marking and Pin 1 Location
Country of origin
(Contained in the
mold ID or marked as
the last line on the
package.)
Part number and
custom code
Marvell logo
88F6-BMIe
Lot Number
YYWW xx@
Country of Origin
88F6707-xx
C000
Temperature code
C = Commercial
000 = Custom
Pin 1 location
Part number prefix, Package code,
environmental code
88F6 = Part number prefix
BMI = Package code
e = Environmental code (2 = Green)
Date code, custom code, assembly plant code
YYWW = Date code (YY = year, WW = Work Week)
xx = Custom code/Die revision
@ = Assembly plant code
Note: The above drawing is not drawn to scale. Location of markings is approximate.
88F6-BMIe
Lot Number
YYWW xx@
Country of Origin
88F6710-xx
C000
88F6-BMIe
Lot Number
YYWW xx@
Country of Origin
88F6W11-xx
C000
88F6-BMIe
Lot Number
YYWW xx@
Country of Origin
88F6707-xx
I000
88F6-BMIe
Lot Number
YYWW xx@
Country of Origin
88F6710-xx
I000
88F6-BMIe
Lot Number
YYWW xx@
Country of Origin
88F6W11-xx
I000
Temperature code
I = Industrial
000 = Custom
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Contact Information
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5488 Marvell Lane
Santa Clara, CA 95054, USA
Tel: 1.408.222.2500
Fax: 1.408.988.8279
www.marvell.com
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