5053 series Crystal Oscillator Module ICs OVERVIEW The 5053 series are miniature crystal oscillator module ICs supported 80MHz to 170MHz fundamental oscillation mode. The Oscillator circuit stage has voltage regulator drive, significantly reducing current consumption and crystal current, compared with existing devices, and significantly reducing the oscillator characteristics supply voltage dependency. There are 3 pad layout package options available for optimized mounting, making these devices ideal for miniature crystal oscillators. FEATURES ▪ Wide range of operating supply voltage: 1.60 to 3.63V ▪ Regulated voltage drive oscillator circuit for reduced power consumption and crystal drive current ▪ Optimized low crystal drive current oscillation for miniature crystal units ▪ 3 pad layout options for mounting 5053Ax: for Flip Chip Bonding 5053Bx: for Wire Bonding (Type I) 5053Cx: for Wire Bonding (Type II) ▪ Recommended oscillation frequency range (fundamental oscillator): 80 to 133MHz (x1 ver.) 100 to 170MHz (xP ver.) ▪ -40 to 105°C operating temperature range ▪ Standby function High impedance in standby mode, oscillator stops ▪ CMOS output ▪ 50±5% output duty (1/2VDD) ▪ ±8mA output drive capability ▪ 15pF output load capacitance ▪ Wafer form (WF5053xx) ▪ Chip form (CF5053xx) APPLICATIONS ▪ 3.2×2.5, 2.5×2.0, 2.0×1.6 size miniature crystal oscillator modules SERIES CONFIGURATION Version*1*2 Operating supply Recommended oscillation C0 cancellation circuit / voltage range [V] frequency range*3 [MHz] Recommended C0 value [pF] (5053A1) (5053B1) Flip Chip Bonding 1.60 to 3.63 80 to 133 Yes/1 to 2 5053C1 Wire Bonding TypeⅠ Wire Bonding TypeⅡ (5053AP) (5053BP) PAD layout Flip Chip Bonding 2.25 to 3.63 100 to 170 Yes/1 to 2 5053CP Wire Bonding TypeⅠ Wire Bonding TypeⅡ *1. The version name in parentheses is being developed. *2. It becomes WF5053xx in case of the wafer form and CF5053xx in case of the chip form. *3. The oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated. ORDERING INFORMATION Device Package Version name WF5053□□-□ WF5053xx-x Wafer form CF5053xx-x Chip form Form WF : Wafer form CF : Chip(Die) form Chip thickness 5: 100μm 4: 130μm Oscillation frequency range PAD layout (A: for Flip Chip Bonding)*1 (B: for Wire Bonding (Type I))*1 C: for Wire Bonding (Type II) *1. 5053Ax, Bx are under development. SEIKO NPC CORPORATION - 1 5053 series PAD LAYOUT ▪ WF5053Ax (for Flip Chip Bonding) ▪ CF5053Bx (for Wire Bonding (Type I)) (300,285) 5 VSS INHN 4 (0,0) 6 Y 3 (-300,-285) (300,285) 5 Q Q VDD VDD XT 4 (0,0) 6 Y 3 (-300,-285) XTN (300,285) VDD VSS INHN 5 INHN XTN 4 (0,0) 6 Y 2 1 2 1 ▪ CF5053Cx (for Wire Bonding (Type II)) (-300,-285) XT X X VSS 2 1 XT 3 Q XTN X Chip size: 0.60×0.57mm Chip size: 0.60×0.57mm Chip size: 0.60×0.57mm Chip thickness : 100μm (WF5053Ax-5) Chip thickness : 100μm (CF5053Bx-5) Chip thickness : 100μm (CF5053Cx-5) 130μm (WF5053Ax-4) 130μm (CF5053Bx-4) 130μm (CF5053Cx-4) PAD size: 80μm PAD size: 80μm PAD size: 80μm Chip base: Vss level Chip base: Vss level Chip base: Vss level · Coordinates at the chip center are (0,0). The chip size is the value measured between scribe line centers. PAD COORDINATES PAD No. PIN DESCRIPTION PAD coordinates[μm] PAD No. Pin X Y (5053Ax)*1 (5053Bx)*1 5053Cx 1 -145.2 -193.5 1 2 1 XT 2 145.2 -193.5 2 1 2 XTN 3 208.5 -1.1 3 6 5 VDD 4 208.5 193.5 4 5 4 Q 5 -208.5 193.5 5 4 3 VSS 6 -208.5 -1.1 6 3 6 INHN Function Crystal connection pins. Crystal is connected between XT and XTN. (+) supply voltage Output pin (-) ground Input pin controlled output state (oscillator stops when LOW), Power-saving pull-up resistor built-in *1. 5053Ax, Bx are under development. BLOCK DIAGRAM RPU INHN VRG C0 Cancel RF CMOS XT CG RD CD Q VDD VSS XTN SEIKO NPC CORPORATION - 2 5053 series SPECIFICATIONS Absolute Maximum Ratings VSS=0V Parameter Symbol Condition Rating Unit -0.3 to +4.0 V Input pins -0.3 to VDD+0.3 V -0.3 to VDD+0.3 V ±20 mA 150 °C -55 to +150 °C *1 VDD Between VDD and VSS *1*2 VIN Supply voltage range Input voltage range *1*2 Output voltage range VOUT Output pins Output current*3 IOUT Q pin Junction temperature*3 Tj *4 Storage temperature range TSTG Chip form, Wafer form *1. This parameter rating is the values that must never exceed even for a moment. This product may suffer breakdown if this parameter rating is exceeded. Operation and characteristics are guaranteed only when the product is operated at recommended operating conditions. *2. VDD is a VDD value of recommended operating conditions. *3. Do not exceed the absolute maximum ratings. If they are exceeded, a characteristic and reliability will be degraded. *4. When stored in nitrogen or vacuum atmosphere applied to IC itself only (excluding packaging materials). Recommended Operating Conditions VSS=0V Parameter Symbol Rating Condition MIN VDD=1.60 to 3.63V 5053x1 ver. 80 VDD=2.25 to 3.63V 5053xP ver. 100 Oscillator frequency*1 fOSC Output frequency fOUT Operating supply voltage VDD Between VDD and VSS*2 Input voltage VIN Input pins Operating temperature Ta Output load capacitance CL VDD=1.60 to 3.63V, CL≤15pF 5053x1 ver. 80 VDD=2.25 to 3.63V, CL≤15pF 5053xP ver. 100 5053x1 ver. 1.60 5053xP ver. 2.25 Q output TYP - MAX 133 170 133 170 3.63 Unit MHz MHz V VSS - VDD V -40 - +105 °C - - 15 pF *1. The oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscillation frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated. *2. Mount a ceramic chip capacitor that is larger than 0.01μF proximal to IC (within approximately 3mm) between VDD and VSS in order to obtain stable operation of 5053 series. In addition, the wiring pattern between IC and capacitor should be as wide as possible. Note. Since it may influence the reliability if it is used out of range of recommended operating conditions, this product should be used within this range. SEIKO NPC CORPORATION - 3 5053 series Electrical Characteristics DC Characteristics VDD=1.60 to 3.63V, VSS=0V, Ta=-40 to +105°C unless otherwise noted. Parameter Symbol Condition Q pin, measurement circuit 3, IOH=-8mA HIGH-level output voltage VOH Rating TYP MAX VDD -0.4 - VDD VDD -0.45 - - - 0.4 - 0.45 MIN Ta=-40 to +85°C Q pin, measurement circuit 3, IOH=-8mA Q pin, measurement circuit 3, IOL=8mA LOW-level output voltage VOL Ta=-40 to +85°C 0 Q pin, measurement circuit 3, IOL=8mA Unit V V HIGH-level input voltage VIH INHN pin, measurement circuit 4 0.7VDD - - V LOW-level input voltage VIL INHN pin, measurement circuit 4 - - 0.3VDD V Output leakage current Current consumption*1 IZ IDD Q pin, measurement circuit 5, VOH=VDD - - 10 INHN=“Low”, Ta=-40 to +85°C VOL=VSS -10 - - Q pin, measurement circuit 5, VOH=VDD - - 100 INHN=“Low” VOL=VSS -100 - - 5053x1(fOSC), measurement circuit 1, VDD=3.3V - 6.3 11.0 no load, INHN=“OPEN”, VDD=2.5V - 4.7 8.5 fOSC=125MHz, fOUT=125MHz VDD=1.8V - 3.8 7.0 5053xP(fOSC), measurement circuit 1, VDD=3.3V - 9.8 17.5 VDD=2.5V - 8 15 - - 10 - - 100 μA mA no load, INHN=“OPEN”, f0SC=155MHz, fOUT=155MHz Measurement circuit 1, INHN=“Low” Standby current IST Ta=-40 to +85°C Measurement circuit 1, INHN=“Low” INHN pull-up resistance Oscillator feedback resistance μA RPU1 Measurement circuit 6 0.8 3 24 MΩ RPU2 Measurement circuit 6 30 70 150 kΩ Rf Design value 50 100 200 kΩ CG 5053x1 ver. 0.8 1.0 1.2 CD Excluding parasitic capacitance. 2.4 3.0 3.6 CG 5053xP ver. 0.8 1.0 1.2 2.4 3.0 3.6 Oscillator capacitance CD Design value (a monitor pattern on a wafer is tested), pF Design value (a monitor pattern on a wafer is tested), Excluding parasitic capacitance. pF *1. The consumption current IDD(CL) with a load capacitance(CL) connected to the Q pin is given by the following equation, where IDD is the no load consumption current and fOUT is the output frequency. IDD(CL)[mA] = IDD[mA]+CL[pF]×VDD[V]×fOUT[MHz]×10-3 SEIKO NPC CORPORATION - 4 5053 series AC Characteristics VDD=1.60 to 3.63V, VSS=0V, Ta=-40 to +105°C unless otherwise noted Parameter tr1 Output rise time tr2 tf1 Output fall time tf2 Output duty cycle DUTY Output disable delay time Rating Condition Symbol MIN TYP MAX Measurement circuit 1, CL=15pF, 0.1VDD → 0.9VDD, VDD=2.25 to 3.63V - 1.0 2.0 Measurement circuit 1, CL=15pF, Ta=-40 to +85°C 0.1VDD → 0.9VDD, VDD=1.60 to 2.25V - 1.5 2.5 Measurement circuit 1, CL=15pF, 0.1VDD → 0.9VDD, VDD=1.60 to 2.25V - 1.5 3.0 Measurement circuit 1, CL=15pF, 0.9VDD → 0.1VDD, VDD=2.25 to 3.63V - 1.0 2.0 Measurement circuit 1, CL=15pF, Ta=-40 to +85°C 0.9VDD → 0.1VDD, VDD=1.60 to 2.25V - 1.5 2.5 Measurement circuit 1, CL=15pF, 0.9VDD → 0.1VDD, VDD=1.60 to 2.25V - 1.5 3.0 5053x1 ver. Measurement circuit 1, Ta=25°C, CL=15pF, VDD=1.60 to 3.63V 45 50 55 5053xP ver. Measurement circuit 1, Ta=25°C, CL=15pF, VDD=2.25 to 3.63V 45 50 55 - - 200 ns ns % Measurement circuit 2, Ta=25°C, CL≤15pF tOD Unit ns The ratings above are values obtained by measurements using NPC evaluation standard crystal element on a standards testing jig. Ratings may have wide tolerances due to crystal element characteristics; thorough evaluation is recommended. Timing Chart 0.9VD D 0.9VDD Q 0.1VD D DUTY measurement voltage 0.5VDD DUTY = Tw/T×100 (%) 0.1VD D Tw T tr tf Figure 1.Output switching waveform VDD VIH INHN VSS VIL tOD VDD 0.1V 0.5VDD Q VSS 0.1V fOUT Hi-Z Low fOUT Figure 2.Output disable and oscillation start timing chart SEIKO NPC CORPORATION - 5 5053 series FUNCTIONAL DESCRIPTION INHN Function Q output is stopped and becomes high impedance. INHN Q Oscillator HIGH(Open) fOUT Operating LOW Hi-Z Stopped Power Saving Pull-up Resistor The INHN pin pull-up resistance changes its value to RPU1 or RPU2 in response to the input level (HIGH or LOW). When INHN is tied to LOW level, the pull-up resistance becomes large (RPU1), thus reducing the current consumed by the resistance. When INHN is left open circuit or tied to HIGH level, the pull-up resistance becomes small (RPU2), thus internal circuit of INHN becomes HIGH level. Consequently, the IC is less susceptible to the effects of noise, helping to avoid problems such as the output stopping suddenly. Oscillation Detection Function The 5053 series incorporate an oscillation detection circuit. The oscillation detection circuit disables the output until the oscillator circuit starts up. This function avoids the problem where the oscillator does not start, due to abnormal oscillation conditions, where power is applied or when the oscillator is restarted using INHN. C0 cancellation circuit Oscillation circuit with a built-in C0 cancellation circuit provides a fixed compensation amount to cancel the effect of the crystal C0. It reduces the C0 parameter in the equivalent circuit, reducing the shallow negative resistance for increasing values of C0. This cancellation circuit makes it easier to maintain the oscillation margin. SEIKO NPC CORPORATION - 6 5053 series MEASUREMENT CIRCUITS MEASUREMENT CIRCUIT 1 Measurement Parameter: IDD, IST, DUTY, tr, tf A *AC characteristics observed on the Q pin using an oscilloscope. IDD, IST VDD 0.1μF SW1 XT X'tal Q Parameter SW1 SW2 IDD OFF OFF IST ON or OFF ON DUTY, tr, tf ON OFF XTN INHN VSS CL=15pF (Including probe capacitance) SW2 MEASUREMENT CIRCUIT 2 Measurement Parameter: tOD Input signal : 1Vp-p, sine wave 0.1μF VDD 0.001μF Signal Generator RL1=1kΩ XTN Q 50Ω INHN 15pF VSS RL2=1kΩ Input signal ：VDD→VSS Function Generator 50Ω MEASUREMENT CIRCUIT 3 Measurement Parameter: VOH, VOL Input signal : 1Vp-p, sine wave 0.1μF VDD 0.001μF Signal Generator XTN 50Ω Q 50Ω VOH VOL VSS Q ΔV VS adjusted so that ΔV=50×IOH VOH VS Q 0.1μF V ΔV VS VS VOL VS adjusted so that ΔV=50×IOL SEIKO NPC CORPORATION - 7 5053 series MEASUREMENT CIRCUIT 4 Measurement Parameter: VIH, VIL VDD 0.1μF XT Q X'tal XTN VSS INHN VIH, VIL V VIH: VSS→VDD voltage that changes output state VIL: VDD→VSS voltage that changes output state MEASUREMENT CIRCUIT 5 Measurement Parameter: IZ VDD 0.1μF IZ VSS INHN VDD or VSS A Q MEASUREMENT CIRCUIT 6 Measurement Parameter: RPU1, RPU2 VDD 0.1μF VSS INHN VIN V A RPU1 = IPU RPU2 = VDD (VIN = 0V) IPU VDD 0.7VDD IPU (VIN = 0.7VDD) SEIKO NPC CORPORATION - 8 5053 series REFERENCE DATA The following characteristics are measured using the crystal below. Note that the characteristics will vary with the crystal used. Crystal used for measurement Crystal parameters Parameter 125MHz 155MHz C0(pF) 2.8 1.7 R1(Ω) 10 10 C1 L1 R1 C0 Current Consumption Current Consumption Characteristics Ta =25°C,No load Current consumption [mA] __ 14 xP ver. 12 10 8 x1 ver. 6 4 VDD=3.3V VDD=2.5V VDD=1.8V 2 0 80 90 100 110 120 130 140 Frequency[MHz] 150 160 170 Negative Resistance Negative Resistance Characteristics 5053x1 version, Ta=25℃ 0 -100 -100 -200 -200 -300 -400 -500 -600 -700 -800 C0=2pF C0=1pF C0=0pF(None) -900 VDD=1.8V VDD=2.5V VDD=3.3V Negative Resistace [Ω] Negative Resistace [Ω] 0 Negative Resistance Characteristics 5053xP version, Ta=25℃ -300 -400 -500 -600 C0=2pF C0=1pF C0=0pF(None) -700 -800 VDD=2.5V VDD=3.3V -900 -1000 -1000 0 20 40 60 80 100 120 140 160 180 200 Frequency [MHz] 0 20 40 60 80 100 120 140 160 180 200 Frequency [MHz] The figures show the measurement result of the crystal equivalent circuit C0 capacitance, connected between the XT and XTN pins. They were performed with Agilent 4396B using the NPC test jig. They may vary in a measurement jig, and measurement environment. SEIKO NPC CORPORATION - 9 5053 series Frequency Deviation by Voltage Frequency Deviation Characteristics 5053xP version. fosc=155MHz,Ta=25℃ 0ppm:VDD=3.3V 5 5 4 4 Frequency Deviation[ppm]_ Frequency Deviation[ppm]_ Frequency Deviation Characteristics 5053x1 version. fosc=125MHz,Ta=25℃ 0ppm:VDD=2.5V 3 2 1 0 -1 -2 -3 -4 3 2 1 0 -1 -2 -3 -4 -5 -5 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 1.6 1.8 2.0 2.2 2.4 VDD[V] 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD[V] Drive Level Drive Level Characteristics 5053xP version, fosc=155MHz,Ta=25℃ 600 600 500 500 DriveLevel[ μ W] DriveLevel[ μ W] Drive Level Characteristics 5053x1 version, fosc=125MHz,Ta=25℃ 400 300 200 100 400 300 200 100 0 0 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VDD [V] VDD [V] Phase Noise Characteristics 5053x1 version,VDD=3.63V,fosc=125MHz,Ta =25℃ Phase Noise Characteristics 5053xP version,VDD=3.63V,fosc=155MHz,Ta=25℃ Phase Noise -40 -40 -60 Phase Noise [dBc/Hz] Phase Noise [dBc/Hz] -60 -80 -100 -120 -140 -80 -100 -120 -140 -160 -160 -180 -180 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 Offset Frequency [Hz] Offset Frequency [Hz] Measurement equipment: Signal Source Analyzer Agilent E5052B SEIKO NPC CORPORATION - 10 5053 series Output Waveform x1 ver., VDD=3.3V, fOUT=125MHz, CL=15pF, Ta=R.T. xP ver., VDD=3.3V, fOUT=155MHz, CL=15pF, Ta=R.T. Measurement equipment: Oscilloscope Agilent 54855A SEIKO NPC CORPORATION - 11 5053 series Please pay your attention to the following points at time of using the products shown in this document. 1. The products shown in this document (hereinafter ”Products”) are designed and manufactured to the generally accepted standards of reliability as expected for use in general electronic and electrical equipment, such as personal equipment, machine tools and measurement equipment. The Products are not designed and manufactured to be used in any other special equipment requiring extremely high level of reliability and safety, such as aerospace equipment, nuclear power control equipment, medical equipment, transportation equipment, disaster prevention equipment, security equipment. The Products are not designed and manufactured to be used for the apparatus that exerts harmful influence on the human lives due to the defects, failure or malfunction of the Products. If you wish to use the Products in that apparatus, please contact our sales section in advance. In the event that the Products are used in such apparatus without our prior approval, we assume no responsibility whatsoever for any damages resulting from the use of that apparatus. 2. NPC reserves the right to change the specifications of the Products in order to improve the characteristics or reliability thereof. 3. The information described in this document is presented only as a guide for using the Products. No responsibility is assumed by us for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of the third parties. Then, we assume no responsibility whatsoever for any damages resulting from that infringements. 4. The constant of each circuit shown in this document is described as an example, and it is not guaranteed about its value of the mass production products. 5. In the case of that the Products in this document falls under the foreign exchange and foreign trade control law or other applicable laws and regulations, approval of the export to be based on those laws and regulations are necessary. Customers are requested appropriately take steps to obtain required permissions or approvals from appropriate government agencies. SEIKO NPC CORPORATION 1-9-9, Hatchobori, Chuo-ku, Tokyo 104-0032, Japan Telephone: +81-3-5541-6501 Facsimile: +81-3-5541-6510 http://www.npc.co.jp/ Email:[email protected] ND13016-E-01 2014.06 SEIKO NPC CORPORATION - 12