EEPROM AS58C1001 128K x 8 EEPROM PIN ASSIGNMENT (Top View) Radiation Tolerant 32-Pin CFP (F & SF), 32-Pin CSOJ (DCJ) AVAILABLE AS MILITARY SPECIFICATIONS z z RDY/BUSY\ A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O 0 I/O 1 I/O 2 Vss SMD 5962-38267 MIL-PRF-38535 FEATURES High speed: 150, 200, and 250ns Data Retention: 10 Years z Low power dissipation, active current (20mW/MHz (TYP)), standby current (100μW(MAX)) z Single +5V (+10%) power supply z Data Polling and Ready/Busy Signals z Erase/Write Endurance (10,000 cycles in a page mode) z Software Data protection Algorithm z Data Protection Circuitry during power on/off z Hardware Data Protection with RES pin z Automatic Programming: Automatic Page Write: 10ms (MAX) 128 Byte page size z z OPTIONS z z z 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 Vcc A15 RES\ WE\ A13 A8 A9 A11 OE\ A10 CE\ I/O 7 I/O 6 I/O 5 I/O 4 I/O 3 GENERAL DESCRIPTION MARKINGS The AS58C1001 is a 1 Megabit CMOS Electrically Erasable Programmable Read Only Memory (EEPROM) organized as 131, 072 x 8 bits. The AS58C1001 is capable or in system electrical Byte and Page reprogrammability. The AS58C1001 achieves high speed access, low power consumption, and a high level of reliability by employing advanced MNOS memory technology and CMOS process and circuitry technology and CMOS process and circuitry technology. This device has a 128-Byte Page Programming function to make its erase and write operations faster. The AS58C1001 features Data Polling and a Ready/Busy signal to indicate completion of erase and programming operations. This EEPROM provides several levels of data protection. Hardware data protection is provided with the RES pin, in addition to noise protection on the WE signal and write inhibit during power on and off. Software data protection is implemented using JEDEC Optional Standard algorithm. The AS58C1001 is designed for high reliability in the most demanding applications. Data retention is specified for 10 years and erase/write endurance is guaranteed to a minimum of 10,000 cycles in the Page Mode. Timing 150ns access -15 200ns access -20 250ns access -25 Packages Ceramic Flat Pack F No. 306 Radiation Shielded Ceramic FP* SF No. 305 Ceramic SOJ DCJ No. 508 Operating Temperature Ranges -Military (-55oC to +125oC) XT IT -Industrial (-40oC to +85oC) -Full Military Processing (-55oC to +125oC) 883C *NOTE: Package lid is connected to ground (Vss). 2-sided shielding provided via a Tungsten lid and a Tungsten slug on the underside of package. 6.5X typ. TID boost due to shielding. (Geostationary orbit) Proven typ. total dose 40K to 100K RADS. Contact factory for more information. Micross can perform TID lot testing. For more products and information please visit our web site at www.micross.com AS58C1001 Rev. 5.9 11/10 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Micross Components reserves the right to change products or specifications without notice. 1 EEPROM AS58C1001 FUNCTIONAL BLOCK DIAGRAM Vcc Vss I/O0 High Voltage Generator I/O7 Ready/Busy I/O Buffer and Input Latch OE\ Control Logic and Timing CE\ WE\ RES\ A0 Y Gating Y Decoder A6 Address Buffer and Latch X Decoder Memory Array A7 A16 Data Latch MODE SELECTION 1 MODE CE\ OE\ WE\ RES\ RDY/BUSY\ I/O READ VIL VIL VIH VH High-Z DOUT STANDBY VIH X X X High-Z High-Z WRITE VIL VIH VIL VH High-Z to VOL DIN DESELECT VIL VIH VIH VH High-Z High-Z X X VIH X --- --- X VIL X X --- --- VIL VIL VIH VH VOL Data Out (I/O7) X X X VIL High-Z High-Z WRITE INHIBIT DATA POLLING PROGRAM AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 2 EEPROM AS58C1001 DATA PROTECTION FUNCTIONAL DESCRIPTION To protect the data during operation and power on/off, the AS58C1001 has: 1. Data protection against Noise on Control Pins (CE\, OE\, WE\) during Operation. During readout or standby, noise on the control pins may act as a trigger and turn the EEPROM to programming mode by mistake. To prevent this phenomenon, the AS58C1001 has a noise cancellation function that cuts noise if its width is 20ns or less in programming mode. Be careful not to allow noise of a width of more than 20ns on the control pins. AUTOMATIC PAGE WRITE The Page Write feature allows 1 to 128 Bytes of data to be written into the EEPROM in a single cycle and allows the undefined data within 128 Bytes to be written corresponding to the undefined address (A0 to A6). Loading the first Byte of data, the data load window of 30μs opens for the second. In the same manner each additional Byte of data can be loaded within 30μs. In case CE\ and WE\ are kept high for 100μs after data input, the EEPROM enters erase and write automatically and only the input data can be written into the EEPROM. In Page mode the data can be written and accessed 104 times per page, and in Byte mode 103 times per Byte. DATA\ POLLING Data\ Polling allows the status of the EEPROM to be determined. If the EEPROM is set to Read mode during a Write cycle, and inversion of the last Byte of data to be loaded outputs from I/O, to indicate that the EEPROM is performing a Write operation. WRITE PROTECTION (1) Noise protection: Noise on a write cycle will not act as a trigger with a WE\ pulse of less than 20ns. (2) Write inhibit: Holding OE\ low, WE\ high or CE\ high, inhibits a write cycle during power on/off. WE\ AND CE\ PIN OPERATION During a write cycle, addresses are latched by the falling edge of WE\ or CE\, and data is latched by the rising edge of WE\ or CE\. WRITE/ERASE ENDURANCE AND DATA RETENTION The endurance with page programming is 104 cycles (1% cumulative failure rate) and the data retention time is more than 10 years when a device is programmed less than 104 cycles. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 3 EEPROM AS58C1001 (EXAMPLE) Vcc RES\ *unprogrammable *unprogrammable FUNCTIONAL DESCRIPTION (continued) Write Address DATA PROTECTION (continued) 2. Data protection at Vcc on/off. When RES\ is low, the EEPROM cannot be erased and programmed. Therefore, data can be protected by keeping RES\ low when Vcc is switched. RES\ should be high during programming because it does not provide a latch function. When Vcc is turned on or off, noise on the control pins generated by external circuits (CPU, etc.) may turn the EEPROM to programming mode by mistake. To prevent this unintentional programming, the EEPROM must be kept in an unprogrammable, standby or readout state by using a CPU reset signal to RES\ pin. In addition, when RES\ is kept high at Vcc on/off timing, the input level of control pins (CE\, OE\, WE\) must be held as CE\=Vcc or OE\=LOW or WE\=Vcc level. 5555 AA 2AAA 55 5555 A0 The Software data protection mode can be cancelled by inputting the following 6 Bytes. This changes the AS58C1001 to the Non-Protection mode, for normal operation. 3. Software Data Protection To protect against unintentional programming caused by noise generated by external circuits, AS58C1001 has a Software data protection function. To initate Software data protection mode, 3 bytes of data must be input, followed by a dummy write cycle of any address and any data byte. This exact sequence switches the device into protection mode. AS58C1001 Rev. 5.9 11/10 Write Data (Normal Data Input) Address 5555 Data AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 20 Micross Components reserves the right to change products or specifications without notice. 4 EEPROM AS58C1001 ABSOLUTE MAXIMUM RATINGS* Voltage on Vcc Supply Relative to Vss................-0.5V to +7.0V1 Voltage on any pin Relative to Vss.......................-0.6V to +7.0V1 Storage Temperature ............................................-65°C to +150°C Operating Temperature Range.............................-55oC to +125oC Soldering Temperature Range...............................................260oC Maximum Junction Temperature**....................................+150°C Power Dissipation...................................................................1.0W *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ** Junction temperature depends upon package type, cycle time, loading, ambient temperature and airflow. ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS (-55oC < TA < 125oC; Vcc = 5V +10%) PARAMETER Input High (Logic 1) Voltage 3 Input Low (Logic 0) Voltage Input Voltage (RES\ Pin) 4 Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage PARAMETER CONDITION OV < VIN < Vcc Output(s) disabled, OV < VOUT < Vcc IOH = -400 μA IOL = 2.1 mA CONDITIONS Power Supply Current: Operating SYMBOL VIH VIL VH ILI ILO VOH VOL SYM IOUT=OmA, Vcc = 5.5V Cycle=1μS, Duty=100% MIN 2.2 -0.3 Vcc-0.5 -2 -2 2.4 MAX VCC + 0.3V 0.8 VCC +1.0 2 2 0.4 -15 MAX -20 -25 20 20 20 ICC3 UNITS V V V μΑ μΑ V V NOTES 9 2 UNITS NOTES mA IOUT=OmA, Vcc = 5.5V Cycle=MIN, Duty=100% 65 55 50 CE\=Vcc, Vcc = 5.5V ICC1 350 350 350 μA CE\=VIH, Vcc = 5.5V ICC2 3 3 3 mA Power Supply Current: Standby CAPACITANCE PARAMETER Input Capacitance Output Capactiance AS58C1001 Rev. 5.9 11/10 CONDITIONS o TA = 25 C, f = 1MHz VIN = 0 SYMBOL MAX UNITS CIN 6 pF Co 12 pF NOTES Micross Components reserves the right to change products or specifications without notice. 5 4 EEPROM AS58C1001 AC ELECTRICAL CHARACTERISTICS FOR READ OPERATION (-55oC < TC < 125oC; Vcc = 5V +10%) Test Conditions z z z z Input Pulse Levels: Input rise and fall times: Output Load: Reference levels for measuring timing: 0.0V to 3.0V < 20ns 1 TTL Gate +100pF (including scope and jig) 1.5V, 1.5V AC ELECTRICAL CHARACTERISTICS FOR SOFTWARE DATA PROTECTION CYCLE OPERATION SYMBOL PARAMETER Byte Load Cycle Time Write Cycle Time tBLC MIN 0.55 MAX 30 UNITS μS tWC 10 --- mS AC ELECTRICAL CHARACTERISTICS FOR DATA\ POLLING OPERATION SYMBOL MAX --- UNITS tOEH MIN 0 Output Enable to Write Setup Time tOES 0 --- ns Write Start Time tDW 150 --- ns Write Cycle Time tWC --- 10 ms PARAMETER Output Enable Hold Time AS58C1001 Rev. 5.9 11/10 ns Micross Components reserves the right to change products or specifications without notice. 6 EEPROM AS58C1001 AC ELECTRICAL CHARACTERISTICS FOR PAGE ERASE AND PAGE WRITE OPERATIONS μ μ μ μ AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 7 EEPROM AS58C1001 AC ELECTRICAL CHARACTERISTICS FOR BYTE ERASE AND BYTE WRITE OPERATIONS PARAMETER Address Setup Time Chip Enable to Write Setup Time SYMBOL MIN MAX UNITS tAS 0 --- ns 0 --- ns 250 --- ns 250 --- ns tCS 7 tCW Write Pulse Width tWP 8 7 Address Hold Time tAH 150 --- ns Data Setup Time tDS 100 --- ns Data Hold Time tDH 10 --- ns Chip Enable Hold Time tCH 0 --- ns Out Enable to Write Setup Time tOES 0 --- ns Output Enable Hold Time tOEH 0 --- ns Write Cycle Time tWC 10 --- ms Byte Load Window tBL 100 --- μs Time to Device Busy tDB 120 --- ns RES\ to Write Setup Time tRP 100 --- μs 1 --- μs 7 Vcc to RES\ Setup Time tRES AC TEST CONDITIONS NOTES: Input Pulse Levels............................................0V to 3V Input Rise and Fall Times....................................<20ns Input Timing Reference Level................................1.5V Output Reference Level..........................................1.5V Output Load................................................See Figure 1 1. 2. 3. 4. 5. Relative to Vss VIN min = -3.0V for pulse widths <50ns VIL min = -1.0V for pulse widths <50ns IIL on RES\ = 100ua MAX tOF is defined as the time at which E the output becomes and open circuit and data is no longer driven. 6. Use this device in longer cycle than this value 7. WE\ controlled operation 8. CE\ controlled operation 9. RES\ pin VIH is VH 10. Reference only, not tested Q 100pF 10 1 TTL GATE EQ. Figure 1 OUTPUT LOAD EQUIVALENT AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 8 EEPROM AS58C1001 READ TIMING WAVEFORM Address tACC CE\ OE\ WE\ tOH tCE tDF tOE High-Z tRR Data Out Data Out Valid tDFR RES\ SOFTWARE DATA PROTECTION TIMING WAVEFORM (protection mode) Vcc CE\ WE\ 5555 AA AAAA or 2AAA 55 5555 A0 tWC { Address Data tBLC Write Address Write Data SOFTWARE DATA PROTECTION TIMING WAVEFORM (non-protection mode) Vcc tWC Normal active mode CE\ WE\ Address Data AS58C1001 Rev. 5.9 11/10 AAAA or 2AAA 5555 AA 55 5555 5555 80 AA AAAA or 2AAA 55 5555 20 Micross Components reserves the right to change products or specifications without notice. 9 EEPROM AS58C1001 DATA\ POLLING TIMING WAVEFORM Address An An CE\ WE\ tCE tOES OE\ tDW tOE DIN X I/O7 DOUT DOUT X tWC TOGGLE BIT WAVEFORM Next Mode Address tCE CE\ WE\ tOE OE\ tOES I/O7 DIN DOUT DOUT tWC DOUT DOUT tDW In transition from HI to LOW or LOW to HI. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 10 EEPROM AS58C1001 PAGE WRITE TIMING WAVEFORM (WE\ CONTROLLED) A7 - A16 A0 - A6 WE\ tAS tAH tWP tCS tBL tDL tCH tBLC tWC CE\ tOES OE\ tDH tDS DIN RDY/Busy\ High-Z tDW tDB High-Z tRP tRES VCC In transition from HI to LOW or LOW to HI. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 11 EEPROM AS58C1001 PAGE WRITE TIMING WAVEFORM (CE\ CONTROLLED) Address A0 to A16 CE\ tAS tAH tCW tWS tBL tDL tWH tBLC tWC WE\ tOES OE\ tDH tDS DIN RDY/Busy\ High-Z tDW tDB High-Z tRP tRES VCC In transition from HI to LOW or LOW to HI. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 12 EEPROM AS58C1001 BYTE WRITE TIMING WAVEFORM (WE\ CONTROLLED) tWC Address tCS tAH tCH CE\ tAS tBL tWP WE\ tOES tOEH OE\ tDS tDH DIN RDY/Busy\ tDB High-Z tDW High-Z tRP tRES VCC In transition from HI to LOW or LOW to HI. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 13 EEPROM AS58C1001 BYTE WRITE TIMING WAVEFORM (CE\ CONTROLLED) Address tWS tAH tWC tBL tCW CE\ tAS tWH WE\ tOES tOEH OE\ tDS tDH DIN RDY/Busy\ tDB High-Z tDW High-Z tRP tRES VCC In transition from HI to LOW or LOW to HI. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 14 EEPROM AS58C1001 MECHANICAL DEFINITIONS* Micross Case #305 (Package Designator SF) SMD # 5962-38267, Case Outline N E L e b D H Top View A1 A c D2 D1 Q E1 SYMBOL A A1 b c D D1 D2 E E1 e H L Q SMD SPECIFICATIONS MIN MAX 0.125 0.150 0.090 0.110 0.015 0.019 0.003 0.007 0.810 0.830 0.775 0.785 0.745 0.755 0.425 0.445 0.290 0.310 0.045 0.055 1.000 1.100 0.290 0.310 0.026 0.037 *All measurements are in inches. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 15 EEPROM AS58C1001 MECHANICAL DEFINITIONS* Micross Case #306 (Package Designator F) SMD # 5962-38267, Case Outline M L E e b D H Top View A1 A c D2 Q E1 SYMBOL A A1 b c D D2 E E1 e H L Q SMD SPECIFICATIONS MIN MAX 0.097 0.123 0.090 0.110 0.015 0.019 0.003 0.007 0.810 0.830 0.745 0.755 0.425 0.445 0.330 0.356 0.045 0.055 1.000 1.100 0.290 0.310 0.026 0.037 NOTE: All drawings are per the SMD. Micross’ package dimensional limits may differ, but they will be within the SMD limits. *All measurements are in inches. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 16 EEPROM AS58C1001 MECHANICAL DEFINITIONS* Micross Case #508 (Package Designator DCJ) A A1 D e D1 B E2 b E1 E A2 SYMBOL A A1 A2 B b D D1 E E1 E2 e MICROSSPACKAGESPECIFICATIONS MIN MAX 0.132 0.142 0.076 0.086 0.018 0.028 0.018 0.032 0.015 0.019 0.816 0.834 0.745 0.755 0.430 0.440 0.465 0.485 0.415 0.425 0.045 0.055 *All measurements are in inches. AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 17 EEPROM AS58C1001 ORDERING INFORMATION EXAMPLE: AS58C1001SF-15/IT EXAMPLE: AS58C1001F-25/883C Device Number Package Type Speed ns Process Device Number Package Type Speed ns Process AS58C1001 SF -15 /* AS58C1001 F -15 /* AS58C1001 AS58C1001 SF SF -20 -25 /* /* AS58C1001 AS58C1001 F F -20 -25 /* /* EXAMPLE: AS58C1001DCJ-20/IT AS58C1001 Package Type DCJ Speed ns -15 AS58C1001 DCJ -20 /* AS58C1001 DCJ -25 /* Device Number Process /* *AVAILABLE PROCESSES IT = Industrial Temperature Range XT = Extended Temperature Range 883C = Full Military Processing AS58C1001 Rev. 5.9 11/10 -40oC to +85oC -55oC to +125oC -55oC to +125oC Micross Components reserves the right to change products or specifications without notice. 18 EEPROM AS58C1001 MICROSS TO DSCC PART NUMBER Package Designator F Micross Part # SMD Part# AS58C1001F-25/883C AS58C1001F-20/883C AS58C1001F-15/883C 5962-3826716QMA 5962-3826717QMA 5962-3826718QMA Package Designator SF Micross Part # SMD Part# AS58C1001SF-25/883C AS58C1001SF-20/883C AS58C1001SF-15/883C 5962-3826716QNA 5962-3826717QNA 5962-3826718QNA Package Designators DCJ not currenly available on the SMD AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 19 EEPROM AS58C1001 DOCUMENT TITLE 128K x 8 EEPROM Rev # 5.5 History Removed ECA Package Release Date December 2008 Status Release 5.6 Removed 5962 references November 2009 Release 5.7 Removed DG drawing & references December 2009 Release 5.8 Added Micross Information January 2010 Release 5.9 Updated Military Specifications and note on page 1 November 2010 Release AS58C1001 Rev. 5.9 11/10 Micross Components reserves the right to change products or specifications without notice. 20