Standard Ceramic Memory Product Selector Guide Product Line Overview Memory SRAM, DRAM, SDRAM, VRAM, UVEPROM, EEPROM & Flash Micross Components has been supplying high-reliability memory products for over twenty-five years. As a QML supplier fully certified to AS9100:2009 and ISO 9001:2008, Micross Components meets and exceeds the demands of the military, aerospace, transportation, industrial-embedded, and medical diagnostic markets. Benefits • Off-the-shelf standard products in full hermetic ceramic packages. • SMD 5962 listed • Industry standard packages • Upgradeable families Quality Levels & Programs • DSCC QML • MIL-PRF-38534, class H (class K in process) • MIL-PRF-38535, class Q • MIL-PRF-38535, class V (Assembly Only) • Laboratory suitability (MIL-STD-883) • SMD, M level and Q level • NSTS 5300.4 • Capabilities for class S manufacturing • AS9100:2009, ISO 9001:2008 certified • Customer specific, Source Control Drawing (SCD) 7725 N. Orange Blossom Trail • Orlando, FL 32810 • As the first, non-OEM QML supplier to be certified by DSCC, Micross Components is certified to MIL-PRF-38535 class Q and MIL-PRF-38534 class H. Micross encourages customers to engage on special requirements, and will work with customers with changes to standard specifications as needed to suit their application. At Micross, specification revision control is key, and is managed by our Quality organization. All manufacturing operations and qualification tests are performed at Micross’ facility in Orlando. Micross has over 1600 part numbers listed with DSCC, on various SMDs. Our standard package offerings include: • • • • • • • • • • Ceramic 400/600 mil DIP SOJ 2 and 4-sided LCC ZIP Gull-Wing CQFP CPGA Flat Pack Formed Lead Flat Pack Metal Can It is our goal to continue providing our customers with a full service solution, while upholding to our pedigree and tradition of strict quality and reliability standards. 407.298.7100 • [email protected] • www.micross.com 13 May 2015 • Revision 5.5 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Standard Ceramic Memory Product Selector Guide Density Config. (KB) Features Part # 5V, /CE1, /CE2, /OE, Fast ASYNC Access, Low Power AS4C1259 SMD 5962- Speed (ns) Package Types/Pin Counts PGA CQFP FP LCC DIP CSOJ ZIP Gull Wing DRAM 256 256K x 1 256K x 4 1,048 SMJ44C256 100-150 90617 5V, Enhanced Page Mode 1M x 1 HK/20 FQ/20 SMJ4C1024 5V, Fast Page Mode 4M x 1 JD/20 80-150 HJ/20 JD/18 MT4C4001J 1M x 4 4,194 EC/18 70-120 ECN/20 C & CN/20 90847 5V, Enhanced Page Mode SMJ44400 5V, Fast Page Mode MT4C1004J 80-120 HR/20 90622 70-120 96743 70-80 HKD/50 SMJ416400 92312 70-100 HKB/28 SMJ626162 97545 12-20 HKD/50 89497 100-120 JD/20 CN/18 SMJ416160 1M x16 16,777 5V, Enhanced Page Mode 4M x 4 SMJ418160 FNC/28 SV/24 SDRAM 16,384 1M x16 3.3V, Bank Interleaving, Pipelined 256K x 4 5V, FPM, Dual Port, Block Write VRAM MT42C4256 1,024 SMJ44C251B EC/28 C/28 DCJ/28 HMM/28 JDM/28 HJM/28 EC & ECA/32 C& CW/32 DCJ & SOJ/32 SVM/28 SRAM 128K x 8 5V, /CE1, /CE2, /OE, Fast ASYNC Access, Low Power MT5C1008 89598 12-70 5V, Single /CE, Fast ASYNC Access, Low Power MT5C1009 89598 & 96691 15-70 MT5C1005 91612 15-20 MT5C1001 92316 20-70 5V, MCM, Byte Selectable Fast SRAM AS8S128K32 93187 & 95595 15-45 3.3V, MCM, Byte Selectable, ASYNC Fast SRAM AS8SLC128K32 5V, Revolutionary Pin-out AS5C512K8 1,024 256K x 4 F/32 C/28 5V, /CE, /OE, Fast ASYNC Access, Low Power 1M x 1 128K x 32 4,096 95600 & 95613 P/66 Q/68 12-55 ECJ/36 AS5LC512K8 5V/CE/OE, Evolutionary Pin-out AS5C4008 95600 & 95613 12-45 5V/CE/OE, Slow, Ultra Low Power AS5C4009LL 95613 55-120 5V, MCM, High Speed, Low Power AS8S512K32 94611 & 95624 17-55 P/66 Q, Q1, Q2 & BQFP/68 3.3V, MCM, /CE,/OE, High Speed, Low Power AS8SLC512K32 10-20 P/66 Q & Q1/68 512K x 32 DCJ/32 P & PN/66 Q & Q1/68 3.3V, Low Power, High Speed 512K x 8 16,384 10-25 F/32 F/36 EC/36 F/32 EC/32 12-20 CW/32 ECJ/32 13 May 2015 • Revision 5.5 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Standard Ceramic Memory Product Selector Guide Density Config. (KB) Features Part # SMD 5962- Speed (ns) Package Types/Pin Counts PGA CQFP FP LCC DIP CSOJ ZIP Gull Wing UVEPROM 256 32K x 8 5V, UV Erasable ROM AS27C256 86063 55-300 ECA/32 J/28 512 64K x 8 5V UV Erasable ROM SMJ27C512 87648 12-25 ECA/32 J/28 1,024 128K x 8 5V, UV Erasable ROM SMJ/AS27C010A 89614 120-200 ECA/32 J/32 4,096 512K x8 5V, UV Erasable ROM SMJ27C040 91752 12-15 5V, Byte Alterable AS28C010 J/32 EEPROM 12-25 F/32 CW/32 38267 1,048 128K x 8 5V, 128 Byte Page Mode, radiation tolerant AS58C1001 150-250 3.3V, 128 Byte Page Mode, radiation tolerant AS58LC1001 250-300 5V, Byte Selectable, Page Mode AS8E128K32 F & SF/32 150-300 P & PN/66 Q & Q3/68 94585 5V, radiation tolerant, w/shielded package, >100K RADS AS8ER128K32 150-250 3.3V, radiation tolerant, w/shielded package, >100K RADS AS8ERLC128K32 250-300 5V,CE/OE, Even Sectored AS29F010 96690 60-150 5V, Even Sectored, Legacy Product SMJ28F010B 90899 120-200 512K x 8 5V, CE/OE, Erase Suspend/Resume AS29F040 96692 55-150 128K x 32 5V, MCM, Even Sectored, Byte Selectable AS8F128K32 94716 60-150 16,384 512K x 32 5V MCM, Even Sectored, Byte Selectable AS8F512K32 94612 70-150 5V, MCM, Even Sectored, Byte Selectable AS8F1M32 32,768 1M x 32 3.3V. Boot Sector, Bottom = B AS8FLC1M32B 5V, Uniform Sector AS8F2M32 3.3V, Boot Sector, Bottom=B, Top=C AS8FLC2M32B 5V, Mixed MCM,128Kx16 SRAM & 512Kx16 FLASH AS8SF384K32 4,096 128K x 32 DCJ/32 SQ, SQB, Q& QB/68 Flash 1,024 F/32 CW/32 SOJ/32 DCG/32 128K x 8 F/32 FE/32 JDD/32 ECA/32 CW/32 DCG/32 4,096 65,528 Q & Q1/68 P/66 Q & Q1/68 90-150 09205 70-120 QT/68 P/66 90-150 Q/68 QT/68 2M x 32 08245 70-120 P/66 Q/68 SRAM & Flash 10,240 640K x 16 35 QT/68 Other Ceramic Products Linear/Mixed Signal Digital Voltage Regulators, Operational Amps, Voltage Comparators, ADC & DAC Devices, Switches, Multiplexers, Supervisory Circuits Radiation Tolerant Linear, Mixed-signal, Memory, Interface, Discrete, Digital 13 May 2015 • Revision 5.5 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com Standard Ceramic Memory Product Selector Guide Prefix Code Memory Product Nomenclature Description AS ASI/Micross MT ASI/Micross/Micron1 MYX Micross SMJ/SM ASI/Micross/TI2 Sample Part Number Device Number Prefix 1. The MT product line was acquired from Micron Technology. In most cases, these industry established part numbers have been retained, but in no way does this indicate or guarantee a die source. Access Time M Y X 5 C 1 0 0 8 C - 3 5 L / 8 8 3 C 2. The SMJ/SM product line was acquired from Texas Instruments. In most cases, these industry established part numbers have been retained. This does not indicate or guarantee a die source. Nomenclature is provided in separate documentation. Product Type/Description Package Options/Processing See individual datasheets for exact part number and option combinations offered. Product Type/Description Code Type Package Description Code Description Access Time Code ns 5V, FPM BG, BG1, BGM1 FBGA 10 10 or 100 5V, EPM C DIP 12 12 or 120 3.3V, SDR CN Narrow DIP 15 15 or 150 CW Wide DIP 17 17 CZ, SV, SVM ZIP 20 DCJ SOJ (Formed) DCG FP Gullwing (Formed) 3.3V DG 5V, Multi-chip Module 8SLC 5SP 4C 41 & 44 DRAM 4SD 4DDR SDRAM CT 0°C to +70°C IT -40°C to +85°C 20 or 200 ET -40°C to +105°C 25 25 or 250 M or XT -55°C to +125°C 30 30 or 300 TSOPII 35 35 L 2V Data Retention DJ PSOJ 45 45 LL Ultra Low Power 3.3V, Multi-chip Module EC, FE, HMM LCC 55 55 E Epi Die Pipelined ECA 450 x 550 LCC 60 60 Q QML Flow-thru ECG Gullwing LCC 70 70 ECJ SOJ (Attached) 75 7.5 or 75 883C MIL-STD-883 (previously listed as “M”) ECN Narrow LCC 85 85 ECW Wide LCC 90 90 SPACE MIL-STD-883, Method 5004, Class Equivalent F, FN, HKD, HR, HK Flat pack 100 100 FNC LCC 120 120 MIL 150 150 MIL-STD-883 equivalent processing compliant to paragraph 1.2.2 -55°C to +125°C 2.5V/1.8V, Double Data Rate 5C 5V 8S 5SS 42C 44C SSRAM VRAM 58C Hitachi Die 58LC 3.3V 28C Byte Alterable J, JD, JDD, JDM Side Brazed DIP Multi-chip Module P PGA 8ER Multi-chip Module, Rad-Tol PBG, PBG1 PBGA 8ERLC 3.3V, Multi-chip Module, Rad-Tol Q CQFP (Gullwing) QB CQFP (w/Tie Bar) Spansion compatible QJ CQFP (J-lead) 3.3V Q1 CQFP (w/special lead) Q2, Q3, SQ CQFP SQB CQFP (Rad-Tol) QT CQFP (Thin) QW CQFP (1.56” sq.) 8E 27C EEPROM UVEPROM 29F 29LV 28F FLASH 8F Multi-chip Module 8FLC 3.3V, Multi-chip Module 6nvLC 3.3V RG TSOPI 5V SF Flat pack (Rad-Tol) 3.3V SOJ, HJM SOJ 8nvC VRAM 8nvLC Description -40°C to +125°C 2.5V/1.8V, Double Data Rate II SRAM Code AT 4DDR2 5LC Options/Processing For more information regarding our products and services, please visit www.micross.com or call +44 (0) 1603788967. 13 May 2015 • Revision 5.5 Micross US (Americas) 407.298.7100 • Micross UK (EMEA & ROW) +44 (0) 1603 788967 • [email protected] • www.micross.com