MICROCHIP 24AA16

24AA16/24LC16B
16K I2C™ Serial EEPROM
Device Selection Table
Description:
Part
Number
Vcc
Range
Max. Clock
Frequency
Temp.
Ranges
24AA16
1.7-5.5
400 kHz(1)
I
2.5-5.5
400 kHz
I, E
24LC16B
Note 1:
100 kHz for VCC <2.5V
Features:
• Single supply with operation down to 1.7V
24AA16 devices, 2.5V for 24LC16B devices
• Low-power CMOS technology:
- Active current 1 mA, typical
- Standby current, 1 μa, typical
• 2-wire serial interface, I2C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (2.5V) and 400 kHz clock compatibility
• Page write time 5 ms max.
• Self-timed erase/write cycle
• 16-byte page write buffer
• Hardware write-protect
• ESD protection > 4,000V
• More than 1 million erase/write cycles
• Data retention > 200 years
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP,
MSOP, DFN and SOT-23-5
• Pb-free and RoHS compliant
• Temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
The Microchip Technology Inc. 24AA16/24LC16B
(24XX16*) is a 16 Kbit Electrically Erasable PROM.
The device is organized as eight blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V with standby
and active currents of only 1 μA and 1 mA,
respectively. The 24XX16 also has a page write
capability for up to 16 bytes of data. The 24XX16 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN and MSOP packages, and is
also available in the 5-lead SOT-23 package.
Package Types
SOIC, TSSOP
PDIP, MSOP
A0
1
8
VCC
A0
1
8
VCC
A1
2
7
WP
A1
2
7
WP
A2
3
6
SCL
A2
3
6
SCL
VSS
4
5
SDA VSS
4
5
SDA
SOT-23-5
SCL
1
DFN
5
WP
A0 1
A1 2
Vss
2
SDA
3
Note:
A2 3
VSS 4
4
8 VCC
7 WP
6 SCL
5 SDA
Vcc
Pins A0, A1 and A2 are not used by the 24XX16 (no
internal connections).
Block Diagram
HV
Generator
WP
I/O
Control
Logic
Memory
Control
Logic
XDEC
EEPROM
Array
Page
Latches
I/O
SCL
YDEC
SDA
*24XX16 is used in this document as a generic part
number for the 24AA16/24LC16B devices.
© 2007 Microchip Technology Inc.
VCC
VSS
Sense Amp.
R/W Control
DS21703G-page 1
24AA16/24LC16B
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
Symbol
No.
Characteristic
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Min.
Typ.
Max.
Units
Conditions
D1
VIH
WP, SCL and SDA pins
—
—
—
—
—
D2
—
High-level input voltage
0.7 VCC
—
—
V
—
D3
VIL
Low-level input voltage
D4
VHYS
Hysteresis of Schmitt
Trigger inputs
—
—
0.3 VCC
V
—
.05 VCC
—
—
V
(Note 1)
D5
VOL
Low-level output voltage
—
—
0.40
V
IOL = 3.0 mA, VCC = 2.5V
D6
D7
ILI
Input leakage current
—
—
±1
μA
VIN = VSS or VCC
ILO
Output leakage current
—
—
±1
μA
VOUT = VSS or VCC
D8
CIN,
COUT
Pin capacitance
(all inputs/outputs)
—
—
10
pF
VCC = 5.0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D9
ICC write Operating current
—
—
3
mA
VCC = 5.5V, SCL = 400 kHz
—
0.01
1
mA
—
—
—
0.3
.01
1
5
μA
μA
Industrial
Automotive
SDA = SCL = VCC
WP = VSS
D10
ICC read
D11
ICCS
Note 1:
2:
Standby current
This parameter is periodically sampled and not 100% tested.
Typical measurements taken at room temperature.
DS21703G-page 2
© 2007 Microchip Technology Inc.
24AA16/24LC16B
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
Automotive (E):
AC CHARACTERISTICS
Param.
Symbol
No.
Characteristic
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Min.
Max.
Units
Conditions
1
FCLK
Clock frequency
—
—
400
100
kHz
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
2
THIGH
Clock high time
600
4000
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
3
TLOW
Clock low time
1300
4700
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
4
TR
SDA and SCL rise time
(Note 1)
—
—
300
1000
ns
2.5V ≤ VCC ≤ 5.5V (Note 1)
1.7V ≤ VCC < 2.5V (24AA16)
(Note 1)
5
TF
SDA and SCL fall time
—
300
ns
(Note 1)
6
THD:STA
Start condition hold time
600
4000
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
7
TSU:STA
Start condition setup time
600
4700
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
8
THD:DAT
Data input hold time
0
—
ns
(Note 2)
9
TSU:DAT
Data input setup time
100
250
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
10
TSU:STO
Stop condition setup time
600
4000
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
11
TAA
Output valid from clock
(Note 2)
—
—
900
3500
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
12
TBUF
Bus free time: Time the bus
must be free before a new
transmission can start
1300
4700
—
—
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA16)
13
TOF
Output fall time from VIH
minimum to VIL maximum
20+0.1CB
—
250
250
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC <2.5V (24AA16)
14
TSP
Input filter spike suppression
(SDA and SCL pins)
—
50
ns
(Notes 1 and 3)
15
TWC
Write cycle time
(byte or page)
—
5
ms
—
16
—
Endurance
1M
—
Note 1:
2:
3:
4:
cycles 25°C, (Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
© 2007 Microchip Technology Inc.
DS21703G-page 3
24AA16/24LC16B
FIGURE 1-1:
BUS TIMING DATA
5
4
2
3
SCL
7
SDA
IN
8
10
9
6
14
12
11
SDA
OUT
FIGURE 1-2:
BUS TIMING START/STOP
D4
SCL
6
7
10
SDA
Start
DS21703G-page 4
Stop
© 2007 Microchip Technology Inc.
24AA16/24LC16B
2.0
FUNCTIONAL DESCRIPTION
The 24XX16 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX16 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
3.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 3-1).
3.1
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
3.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
FIGURE 3-1:
(A)
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically,
unlimited (although only the last sixteen will be stored
when doing a write operation). When an overwrite does
occur it will replace data in a first-in first-out (FIFO)
fashion.
3.5
Acknowledge
Each receiving device, when addressed, is obliged to
generate an Acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Note:
Bus Not Busy (A)
Both data and clock lines remain high.
3.2
3.4
The 24XX16 does not generate any
Acknowledge
bits
if
an
internal
programming cycle is in progress.
The device that acknowledges, has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX16) will leave the data line
high to enable the master to generate the Stop
condition.
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(D)
Start
Condition
Address or
Acknowledge
Valid
(D)
(C)
(A)
SCL
SDA
© 2007 Microchip Technology Inc.
Data
Allowed
to Change
Stop
Condition
DS21703G-page 5
24AA16/24LC16B
3.6
FIGURE 3-2:
Device Addressing
A control byte is the first byte received following the
Start condition from the master device (Figure 3-2).
The control byte consists of a four-bit control code.
For the 24XX16, this is set as ‘1010’ binary for read
and write operations. The next three bits of the control
byte are the block-select bits (B2, B1, B0). They are
used by the master device to select which of the eight
256 word-blocks of memory are to be accessed.
These bits are in effect the three Most Significant bits
of the word address. It should be noted that the
protocol limits the size of the memory to eight blocks
of 256 words, therefore, the protocol can support only
one 24XX16 per system.
CONTROL BYTE
ALLOCATION
Read/Write Bit
Control Code
S
1
0
1
0
Block
Select
Bits
B2 B1 B0 R/W ACK
Slave Address
Start Bit
Acknowledge Bit
The last bit of the control byte defines the operation to
be performed. When set to ‘1’, a read operation is
selected. When set to ‘0’, a write operation is selected.
Following the Start condition, the 24XX16 monitors the
SDA bus, checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code, the
slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX16 will select a read or write operation.
Operation
Control
Code
Block Select
R/W
Read
1010
Block Address
1
Write
1010
Block Address
0
DS21703G-page 6
© 2007 Microchip Technology Inc.
24AA16/24LC16B
4.0
WRITE OPERATION
4.1
Byte Write
4.2
The write control byte, word address and the first data
byte are transmitted to the 24XX16 in the same way as
in a byte write. However, instead of generating a Stop
condition, the master transmits up to 16 data bytes to
the 24XX16, which are temporarily stored in the onchip page buffer and will be written into memory once
the master has transmitted a Stop condition. Upon
receipt of each word, the four lower-order Address
Pointer bits are internally incremented by ‘1’. The
higher-order 7 bits of the word address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received an
internal write cycle will begin (Figure 4-2).
Following the Start condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic-low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmitted by the master is the word address and will be
written into the Address Pointer of the 24XX16. After
receiving another Acknowledge signal from the
24XX16, the master device will transmit the data word
to be written into the addressed memory location. The
24XX16 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX16 will not
generate Acknowledge signals (Figure 4-1).
FIGURE 4-1:
Note:
Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page-size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
BYTE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Control
Byte
1
0
1
Word
Address
S
T
O
P
Data
0 B2 B1 B0 0
P
A
C
K
Block
Select
Bits
Bus Activity
FIGURE 4-2:
Page Write
A
C
K
A
C
K
PAGE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1 0 1 0 B2 B1B0 0
Control
Byte
Bus Activity
© 2007 Microchip Technology Inc.
Block
Select
Bits
Word
Address (n)
Data (n)
S
T
O
P
Data (n + 15)
Data (n + 1)
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
DS21703G-page 7
24AA16/24LC16B
5.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next Read or
Write command. See Figure 5-1 for a flow diagram of
this operation.
FIGURE 5-1:
6.0
WRITE PROTECTION
The WP pin allows the user to write-protect the entire
array (000-7FF) when the pin is tied to VCC. If tied to
VSS the write protection is disabled.
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21703G-page 8
© 2007 Microchip Technology Inc.
24AA16/24LC16B
7.0
READ OPERATION
7.3
Sequential Read
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
Sequential reads are initiated in the same way as a
random read, except that once the 24XX16 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX16 to transmit the next sequentiallyaddressed 8-bit word (Figure 7-3).
7.1
To provide sequential reads, the 24XX16 contains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
Current Address Read
The 24XX16 contains an address counter that maintains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous access
(either a read or write operation) was to address n, the
next current address read operation would access data
from address n + 1. Upon receipt of the slave address
with R/W bit set to ‘1’, the 24XX16 issues an acknowledge and transmits the 8-bit data word. The master will
not acknowledge the transfer, but does generate a Stop
condition and the 24XX16 discontinues transmission
(Figure 7-1).
7.2
7.4
Noise Protection
The 24XX16 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24XX16 as part of a write operation.
Once the word address is sent, the master generates a
Start condition following the acknowledge. This
terminates the write operation, but not before the internal Address Pointer is set. The master then issues the
control byte again, but with the R/W bit set to a ‘1’. The
24XX16 will then issue an acknowledge and transmit
the 8-bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
24XX16 will discontinue transmission (Figure 7-2).
FIGURE 7-1:
CURRENT ADDRESS READ
Bus Activity
Master
S
T
A
R
T
SDA Line
S
Bus Activity
© 2007 Microchip Technology Inc.
Control
Byte
1 0
1
S
T
O
P
Data (n)
P
0 B2 B1 B0 1
Block
Select
Bits
A
C
K
N
o
A
C
K
DS21703G-page 9
24AA16/24LC16B
FIGURE 7-2:
Bus Activity
Master
RANDOM READ
S
T
A
R
T
Control
Byte
S
T
A
R
T
Word
Address (n)
S 1 0 1 0 B2B1B0 0
SDA Line
Block
Select
Bits
Bus Activity
FIGURE 7-3:
Bus Activity
Master
SDA Line
Bus Activity
Control
Byte
S
T
O
P
Data (n)
P
S 1 0 1 0 B2 B1B0 1
A
C
K
A
C
K
Block
Select
Bits
A
C
K
N
o
A
C
K
SEQUENTIAL READ
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + x)
P
1
A
C
K
A
C
K
A
C
K
A
C
K
N
o
A
C
K
DS21703G-page 10
© 2007 Microchip Technology Inc.
24AA16/24LC16B
8.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 8-1.
TABLE 8-1:
PIN FUNCTION TABLE
Name
PDIP
SOIC
TSSOP
DFN
MSOP
SOT-23
A0
1
1
1
1
1
—
Not Connected
A1
2
2
2
2
2
—
Not Connected
8.1
A2
3
3
3
3
3
—
Not Connected
VSS
4
4
4
4
4
2
Ground
SDA
5
5
5
5
5
3
Serial Address/Data I/O
SCL
6
6
6
6
6
1
Serial Clock
WP
7
7
7
7
7
5
Write-Protect Input
VCC
8
8
8
8
8
4
+1.7V to 5.5V Power Supply
Serial Address/Data Input/Output
(SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an opendrain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
8.2
Description
Serial Clock (SCL)
The SCL input is used to synchronize the data transfer
to and from the device.
© 2007 Microchip Technology Inc.
8.3
Write-Protect (WP)
The WP pin must be connected to either VSS or VCC.
If tied to VSS, normal memory operation is enabled
(read/write the entire memory 0007-FF).
If tied to VCC, write operations are inhibited. The entire
memory will be write-protected. Read operations are
not affected.
This feature allows the user to use the 24XX16 as a
serial ROM when WP is enabled (tied to VCC).
8.4
A0, A1, A2
The A0, A1 and A2 pins are not used by the 24XX16.
They may be left floating or tied to either VSS or VCC.
DS21703G-page 11
24AA16/24LC16B
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (3.90 mm)
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP
Example:
24LC16B
I/P e3 13F
0527
Example:
24LC16BI
SN e3 0527
13F
Example:
XXXX
4L16
TYWW
I527
NNN
13F
8-Lead MSOP
Example:
XXXXXT
4L16I
YWWNNN
52713F
8-Lead 2x3 DFN
XXX
YWW
NN
5-Lead SOT-23
XXNN
DS21703G-page 12
Example:
254
527
13
Example:
B53F
© 2007 Microchip Technology Inc.
24AA16/24LC16B
1st Line Marking Codes
Part Number
SOT-23
TSSOP
24AA16
24LC16B
Note:
DFN
MSOP
I Temp.
E Temp.
I Temp.
E Temp.
4A16
4A16T
B5NN
—
251
—
4L16
4L16T
M5NN
N5NN
254
255
T = Temperature grade (I, E)
NN = Alphanumeric traceability code
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
© 2007 Microchip Technology Inc.
DS21703G-page 13
24AA16/24LC16B
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
8
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
b1
.040
.060
.070
b
.014
.018
.022
eB
–
–
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS21703G-page 14
© 2007 Microchip Technology Inc.
24AA16/24LC16B
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
A2
A
c
φ
L
A1
L1
Units
Dimension Limits
Number of Pins
β
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
DS21703G-page 15
24AA16/24LC16B
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
e
c
A
φ
A2
A1
L
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.80
1.00
1.05
Standoff
A1
0.05
–
0.15
1.20
Overall Width
E
Molded Package Width
E1
4.30
6.40 BSC
4.40
Molded Package Length
D
2.90
3.00
3.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
4.50
1.00 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.19
–
0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21703G-page 16
© 2007 Microchip Technology Inc.
24AA16/24LC16B
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
2
1
2
NOTE 1
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
2.00 BSC
Overall Width
E
Exposed Pad Length
D2
1.30
–
Exposed Pad Width
E2
1.50
–
1.90
b
0.18
0.25
0.30
Contact Length
L
0.30
0.40
0.50
Contact-to-Exposed Pad
K
0.20
–
–
Contact Width
0.50 BSC
3.00 BSC
1.75
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
© 2007 Microchip Technology Inc.
DS21703G-page 17
24AA16/24LC16B
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
e
b
A2
A
c
φ
L
L1
A1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
0.65 BSC
–
Molded Package Thickness
A2
0.75
0.85
0.95
Standoff
A1
0.00
–
0.15
Overall Width
E
Molded Package Width
E1
3.00 BSC
Overall Length
D
3.00 BSC
Foot Length
L
Footprint
L1
1.10
4.90 BSC
0.40
0.60
0.80
0.95 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.08
–
0.23
Lead Width
b
0.22
–
0.40
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B
DS21703G-page 18
© 2007 Microchip Technology Inc.
24AA16/24LC16B
5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
N
E
E1
3
2
1
e
e1
D
A2
A
c
φ
A1
L
L1
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
NOM
MAX
N
5
Lead Pitch
e
0.95 BSC
Outside Lead Pitch
e1
Overall Height
A
0.90
–
Molded Package Thickness
A2
0.89
–
1.30
Standoff
A1
0.00
–
0.15
Overall Width
E
2.20
–
3.20
Molded Package Width
E1
1.30
–
1.80
Overall Length
D
2.70
–
3.10
1.90 BSC
1.45
Foot Length
L
0.10
–
0.60
Footprint
L1
0.35
–
0.80
Foot Angle
φ
0°
–
30°
Lead Thickness
c
0.08
–
0.26
Lead Width
b
0.20
–
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-091B
© 2007 Microchip Technology Inc.
DS21703G-page 19
24AA16/24LC16B
APPENDIX A:
REVISION HISTORY
Revision D
Corrections to Section 1.0, Electrical Characteristics.
Revision E
Added DFN package.
Revision F
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 72 Random Read; Figure 7-3 Sequential Read; Section
8.3 Write-Protect (WP).
Revision G (02/2007)
Changed 1.8V to 1.7V; Revised Features Section;
Replaced Package Drawings; Revised Product ID
Section.
DS21703G-page 20
© 2007 Microchip Technology Inc.
24AA16/24LC16B
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2007 Microchip Technology Inc.
DS21703G-page 21
24AA16/24LC16B
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Device: 24AA16/24LC16B
Y
N
Literature Number: DS21703G
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21703G-page 22
© 2007 Microchip Technology Inc.
24AA16/24LC16B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature Package
Range
= 1.7V, 16 Kbit I2C Serial EEPROM
= 1.7V, 16 Kbit I2C Serial EEPROM
(Tape and Reel)
24LC16B: = 2.5V, 16 Kbit I2C Serial EEPROM
24LC16BT: = 2.5V, 16 Kbit I2C Serial EEPROM
(Tape and Reel)
24AA16:
24AA16T:
Temperature I
Range:
E
= -40°C to +85°C
= -40°C to +125°C
Package:
=
=
=
=
=
=
MC
P
SN
ST
MS
OT
Examples:
a)
24AA16-I/P: Industrial Temperature,1.7V,
PDIP package
b)
24AA16-I/SN: Industrial Temperature,1.7V,
SOIC package
c)
24AA16T-I/OT: Industrial Temperature,
1.7V, SOT-23 package, Tape and Reel
d)
24LC16B-I/P: Industrial Temperature, 2.5V,
PDIP package
e)
24LC16B-E/SN: Automotive Temp.,2.5V
SOIC package
f)
24LC16BT-I/OT: Industrial Temperature,
2.5V, SOT-23 package, Tape and Reel
2x3 DFN, 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
SOT-23, 5-lead (Tape and Reel only)
© 2007 Microchip Technology Inc.
DS21703G-page 23
24AA16/24LC16B
NOTES:
DS21703G-page 24
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21703G-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-4182-8400
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Tel: 91-11-4160-8631
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Tel: 86-755-8203-2660
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Tel: 886-7-536-4818
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Tel: 86-757-2839-5507
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Taiwan - Taipei
Tel: 886-2-2500-6610
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Tel: 86-27-5980-5300
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Tel: 66-2-694-1351
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Italy - Milan
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Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS21703G-page 26
© 2007 Microchip Technology Inc.