Part Numbering Nomenclature

PART NUMBERING NOMENCLATURE
PART NUMBERING EXAMPLE: MP1234EK–LF–Z
MP
1234
Monolithic Power
Part
Number
MP###
MP####
MP#####
MPQ####
HF####
NB###
Older
Devices
E
Temperature Grade (TA)
K
–LF
–Z
Package
Lead
Free
Tape &
Reel
–LF
–Z
No LF
Indicator
–Z
C
0C to +70C
C
WLCSP
QM
QFN (6x7)
C
D
-40C to +85C
D
QFN (2x3)
QN
QFN (7x7)
E
Enhanced
C-Spec
E
-20C to +85C
E
SC70
QP
QFN (7x8)
R
Reserve Lead Bend or Top
Exposed Pad
H
-40C to +125C
F
TSSOP w/ EXPOSED PAD
QQ
QFN (8x8)
S
Customer Specific
K
-55C to +125C
FP
QFP
QV
QFN (3x5)
T
Thin Package
G
QFN (2x2)
QW
QFN (4x6)
U
Ultra Thin Package
H
MSOP w/ EXPOSED PAD
QX
QFN (6x10)
J
TSOT23 (0.9mm Height)
QY
QFN (5x8)
K
MSOP
R
QFN (4x4)
L
QFN (3x4)
S
SOIC
M
TSSOP
SD
SOD123
N
SOIC w/ EXPOSED PAD
T
SOT23 (1.1mm Height)
P
PDIP (300 Mil)
U
QFN (5x5)
Q
QFN (3x3)
V
QFN (4x5)
QD
QFN (1x1.5)
W
SOIC - WB w/ EXPOSED PAD
QF
QFN (1.2x1.6)
X
Sorted Wafer
QG
QFN (1.4x1.8)
XN
Unsorted Wafer
QH
QFN (1.5x2)
Y
SOIC-WB (Wide-Body)
QJ
QFN (5x6)
Z
TO220
QK
QFN (6x6)
ZF
TO263
Parts introduced after July 2011
MP###
MP####
MP#####
MPQ####
HF####
NB###
Newer
Devices
Part Numbering Nomenclature Rev 9
©2012 Monolithic Power Systems, Inc.
G
Temperature Internal to
Datasheet
– 40°C to +125°C (TJ)
Standard
Same as Above
2/10/12