Datasheet - NIC Components Corp.

NSWC Series
(High Voltage)
Stacked Film Capacitor Chips
FEATURES
NSWC IS
RECOMMENDED
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM
FOR NEW DESIGNS
• STANDARD EIA 1913, 2416 and 2420 SIZES
• HIGH HEAT AND MOISTURE RESISTANT
RoHS
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
Compliant
nDIELECTRIC ABSORPTION CHARACTERISTICS
includes all homogeneous materials
• REFLOW SOLDERING ONLY
*See Part Number System for Details
• TAPE AND REEL PACKAGING
SPECIFICATIONS
Case Sizes
2416
0.012 ~ 0.068µF
250Vdc
±5%(J)
-55°C ~ +85°C
1.0% max. @ 1KHz
1913
0.001 ~ 0.015µF
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor
Insulation Resistance (20°C)
Through 2K Ohm Resistor
Dielectric Withstanding
Voltage
Temperature Characteristic
Dielectric Absorption
2420
0.027 ~ 0.12µF
3 Gigohms @ 100Vdc
150% of Rated Voltage
±3% ∆C Maximum Over Temperature Range
0.05 ~ 0.10% Typical
ENVIRONMENTAL CHARACTERISTICS
Life Test At +85°C
1,000 Hours at 125% of Rated Voltage
Resistance to Soldering Heat:
+240°C Peak
Humidity Load Life (90 ~ 95% RH)
1,000 Hours, +40°C
Resistance to Soldering Heat
240°C for 5 seconds
Solderability with
25% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±1%/-6% of Initial Value
1.1% Maximum
1 GigΩ Minimum
Within ±5% of Initial Value
1.1% Maximum
1 GigΩ Minimum or 300Ω/F whichever is lower
(1) +8%/-5%
(1) ±1.5%
(1) 100MegΩ
Within ±5%
Maximum 1.1%
1GigΩ
95% Minimum Coverage After 2.5 Second Dip into 245°C Solder Pot
RECOMMENDED LAND
PATTERN (mm)
RECOMMENDED REFLOW PROFILE
Temperature - Deg. C
300
Standard: +240 °C Peak Temperature
+250°C Special Order
(see part numbering system)
250
200
150
EIA Size
1913
2416
2420
A
2.6
3.8
3.8
B
6.6
7.8
7.8
C
3.0
3.8
4.6
Cool Down
100
Time above 220°C
60 sec. max.
50
25
Ramp-up
25°C ~ 150°C
90 sec. max.
0
Pre-heat
150°C ~ 180°C
120 sec. max.
Time
PART NUMBER SYSTEM
NSWC 822 J 250 TR D1 N F
RoHS Compliant
Optional High Temp. Reflow (+250°C)*
Size Code
Tape & Reel
Voltage
Tolerance Code: J=±5%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
®
NIC COMPONENTS CORP.
Series
www.niccomp.com
*Special packaging and handling required.
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
51
NSWC Series
High Voltage
Stacked Film Capacitor Chips
DIMENSION (mm) AND CASE CODE
STANDARD PRODUCTS AND SIZE CODE
Working Voltage
(Vdc)
Cap. Code
250
D1
0.001
102
D1
0.0012 122
D1
0.0015 152
D1
0.0022 222
D1
0.0027 272
D1
0.0033 332
D1
0.0039 392
D1
0.0047 472
D1
0.0056 562
D1
0.0068 682
D1
0.0082 822
D1
0.010
103
D1
0.012
123
D1
0.015
153
D2
0.018
183
D2
0.022
223
D3
0.027
273
D4
0.033
333
E2
0.039
393
E3
0.047
473
E4
0.056
563
E5
0.068
683
F2
0.082
823
F4
0.10
104
F5
0.12
124
Fig. 1
Stacked Element Terminations:
95.5% Sn, 4% Ag and
0.5% Cu over phosphorus
copper barrier over copper
base
H
L2
p
W
p
L1
Case Length Width
Height
p
Code L±0.2
W
H±0.3
D1
1.4
D2
2.0
4.8
3.3 ± 0.3
D3
2.4
D4
2.8
E2
2.0
E3
2.4
6.0
4.1±0.3
0.35
E4
2.8
±0.2
E5
3.2
F1
3.0
F2
3.2
F3
6.0
5.0 ± 0.4
3.6
F4
3.8
F5
4.5
EIA
Code
1913
2416
2420
TAPE DIMENSIONS (mm)
Case Code A±0.1 B±0.1 C±0.2
D1
2.0
D2
3.8
5.1
2.6
D3, D4
3.4
E1, E2
2.7
4.6
6.3
E3, E4
3.5
F1 ~ F5
6.3
5.5
4.7
t
W±0.3
F
12.0
5.5
±0.05
P±0.1 D+0.2/-0
1.5
0.3
±0.05
8.0
-
Qty/Reel
3,000
3,000
2,000
3,000
2,000
1,500
4.0 ±0.1
13
±0 .0
.5
2.0
±0.5
B
W
F
330
±2.0
1.5 +0.1
-0
t
80
±1.0
EMBOSSED PLASTIC CARRIER
1.75 ±0.1
17.4
±1.0
.0
21 0.8
±
D∅
A
P
C
13.4
±1.0
®
52
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com