Tin Whisker Growth Results on Tin Surface Finished Products Rev. B, 18 November 2014 Whisker growth test methods and conditions per JESD-201 and JEDEC22a121.01. In case of deviation between the two methods, JESD-201 was used. Definitions per JESD-201 and JEDEC22a121.01 Whisker Class Level Class 3: Mission / Life critical applications such as military, aerospace and medical applications. Pure tin and high tin content alloys are not typically acceptable. Class 2: Business critical aplications such as Telecom Infrastructure equipment, High-end Servers, Automotive, etc. (long product lifetimes). Class 1: Industrial / consumer products (medium product lifetimes). Class 1A: Consumer products (short product lifetimes). Maximum Whisker Density Range Low: < 10 whiskers per (mm2) Medium: 10 - 45 whiskers per (mm2) High: > 45 whiskers per (mm2) Whisker Definition Spontaneous columnar or cylindrical filament emanating from the surface Length ≥ 10μm. Aspect ratio (l/w) > 2. Configuration Applicable Products Rectangular / Square 5 Side Termination Preconditioning Exposure A: No preconditioning C: SnPb reflow conditions, 220°C peak D: Pb-free reflow conditions, 260°C peak Inward Formed L-Shaped Leadframe Ceramic Two Lead Radial Configuration Ceramic Chips Aluminum (AO-CAP), Conductive Polymer (KO CAP), Tantalum MnO2 Chips Conductive Polymer (KO CAP), Tantalum MnO2 Chips C3xx, C6xx, C052 and C062 Ceramic Through-Hole Product Series C 100% Matte Tin 100 - 400 μ-inch Nickel 50 μ-inch min. 18 3.4 mm2 SEM / 3000X A C D 0 0 0 n/a n/a n/a 2 2 2 Low Low Low 0 3 4 n/a 26μm 20μm 2 2 2 Low Low Low 0 >45 0 n/a 43μm n/a 2 2 2 Low High Low T 100% Matte Tin 160 - 320 μ-inch Nickel 30 - 80 μ-inch 18 3.6 mm2 SEM / 3000X A C D 0 0 0 n/a n/a n/a 2 2 2 Low Low Low 0 1 5 n/a 34 22μm 2 2 2 Low Low Low 0 0 0 n/a n/a n/a 2 2 2 Low Low Low T 100% Matte Tin 160 - 320 μ-inch Copper 80 - 120 μ-inch 18 3.6 mm2 SEM / 3000X A C D 0 0 0 n/a n/a n/a 2 2 2 Low Low Low 0 11 6 n/a 35 34μm 2 2 2 Low Low Low 0 0 0 n/a n/a n/a 2 2 2 Low Low Low C or T 100% Matte Tin 160 - 480 μ-inch Nickel 50 μ-inch min. 18 20.4 mm2 SEM / 3000X A C D 0 0 0 n/a n/a n/a 2 2 2 Low Low Low 0 2 4 n/a 25μm 20μm 2 2 2 Low Low Low 0 6 0 n/a 30μm n/a 2 2 2 Low Low Low Example Exposure Temperature / Humidity Storage 30°C, 60% RH, 4000 hours High Temp / Humidity Storage 55°C and 85% RH, 4000 hours Temperature Cycling -55°C to +85°C, 1000 cycles Termination Code Termination Finish Finish Thickness Barrier Plating Barrier Thickness Terminals Inspected Inspection Area per Terminal Inspection Equipment / Mag Preconditioning Whisker Count Longest Whisker Meets Class Level Whisker Density Range Whisker Count Longest Whisker Meets Class Level Whisker Density Range Whisker Count Longest Whisker Meets Class Level Whisker Density Range