smd film caPacitors GEnEral tEchnical information MaRKIng

SMD Film Capacitors
General Technical Information
marking of SMD capacitors
The nominal capacitance value is given with 3 digits EIA-code,
Examples: 103 = 10000 pF = 10 nF = 0.01 µF
The capacitance tolerance is expressed with letter codes:
M
K
J
± 20 %
± 10 %
± 5 %
H
G
F
Z
C
D
F
W
50 VDC
63 VDC
100 VDC
160 VDC
12 00 VDC
Capacitance marked
acc. to EIA standard
103
HZM
H
K
M
P
M
S
G
MMC
SMC, SMW
GMC, GMW
103 H
ZSKD
250 VDC
400 VDC
630 VDC
1000 VDC
Rated voltage
Type
Manufacturing year
Testing month
The capacitor type codes are as follows:
Tolerance
± 2.5 %
±2%
± 1 %
The rated voltage is expressed with letter codes:
Chip length ≥ 7.3 mm
Chip length 5.7 mm
The manufacturing year and the testing month are expressed
according to IEC 60062, see table on page 10.
P
D
GPC
SPC
Soldering of wound SMD Capacitors
The recommended soldering land dimensions are:
L Case size
mmHorizontalVertical
WAhAv
mils mm
mils mm
mils mm
5.7
2220 - J31, J91
60
1.5
5.7
2220 - J33, J93
60
1.5
5.7
2220 - J35, J95
60
1.5
7.3
2824 - K31, K91
60
1.5
7.3
2824 - K33, K93
60
1.5
7.3
2824 - K35, K95
60
1.5
7.3
2824 - K37, K97
60
1.5
10.2
4036 - A31
4022 - A31V
80
2.0
12.7
5045 - B31
5026 - B31V
100
2.5
16.5
6560 - C31
6528 - C31V
120
3.0
W
A
X
X
200
200
200
240
240
240
240
360
455
590
5.1
5.1
5.1
6.1
6.1
6.1
6.1
9.1
220
5.6
11.6
260
6.6
15.0
280
7.1
X
mils
118.58
118.58
118.58
148.11
148.11
148.11
148.11
217.15
276.4
355.3
Ah = horizontal mounting
Av = vertical mounting
Land dimensions for PCB design are available in PADS format.
mm
3.0
3.0
3.0
3.8
3.8
3.8
3.8
5.5
7.0
9.0
SMD Film Capacitors
General Technical Information
Soldering of wound SMD Capacitors
Reflow soldering temperature shall be measured on the top body surface of the component.
The profiles below are recommended soldering profiles for convection reflow ovens and IR reflow ovens. If vapour phase reflow oven
is used, please consult Evox Rifa.
The recommended solder paste thickness for the naked SMD (SMW, GMW) parts is at least 0.25 mm (10 mils), for thicknesses below
0.25 mm (10 mils) please consult Evox Rifa.
Soldering curves for Lead containing solder
250
Temperature (°C)
250
Max 220 °C
200
Temperature (°C)
250
Max 235 °C
200
Max 150 °C
150
Max 60 s
over 180 °C
Max 150 °C
150
Max 60 s
over 180 °C
100
50
50
50
0
0
90 120 150 180 210 240 270 300 t(s)
60
Recommended reflow soldering profile
for MMC
0
30
60
Max 160 °C
150
100
30
Max 240 °C
200
100
0
Temperature (°C)
0
90 120 150 180 210 240 270 300 t(s)
Recommended reflow soldering profile
for GMC, GMW, GPC and SMW.
For GMW, max T = 230 °C.
0
30
Max 60 s
over 180 °C
90 120 150 180 210 240 270 300 t(s)
60
Recommended reflow soldering profile
for SMC and SPC
Soldering curves for Lead free solder
Temperature (°C)
280
Temperature (°C)
280
Max 250 °C
Max 240 °C
223 °C
240
223 °C
200
200
170 °C
170 °C
150 °C
150 °C
160
160
120
Min. 30 s,
max 50 s
above 217 °C
80
40
0
0
30
60 90 120 150 180 210 240 270 300 330
120
Min. 30 s,
max 50 s
above 217 °C
80
40
0
0
60 90 120 150 180 210 240 270 300 330
30
Time (s)
Time (s)
Recommended reflow soldering profile
for GMW, MMC, MDC, MDS and SMW
Recommended reflow soldering profile
for GMC, GPC, and SMP253
Temperature (°C)
280
Temperature (°C)
280
Max 255 °C
Max 260 °C
223 °C
223 °C
240
240
200
200
170 °C
170 °C
150 °C
150 °C
160
160
120
Min. 30 s,
max 50 s
above 217 °C
80
40
0
0
30
60 90 120 150 180 210 240 270 300 330
120
Min. 30 s,
max 50 s
above 217 °C
80
40
0
0
30
60 90 120 150 180 210 240 270 300 330
Time (s)
Recommended reflow soldering profile for SPC
These profiles are valid for products in this catalogue. Reflow
recommendations for customised Evox Rifa products may deviate
from the above profiles. Exceeding the manufacturer’s process
recommendations may harm the component and keep the
manufacturer not
��������������������������������������������������
liable for any defect caused by exceeding the
recommendations.
According to international standards, the maximum temperature
capability shall be measured on the top surface of a component.
Any of the international standards do not define how the
thermocouple should be fastened on the component. Our
recommendation for attaching the thermocouple on the top
surface of the component is glueing with high temperature
resistant glue.
Time (s)
Recommended reflow soldering profile for SMC
Soldering curves for Wave solder
250
Temperature (°C)
200
150
Max 145 °C
100
50
0
0
50
100
150
200
250 t(s)
Recommended wave soldering profile for all Evox Rifa
SMD capacitors suitable for wave soldering, total time
in solder wave <5s.
Evox Rifa SMD and DIL Film Capacitors
19
SMD Film Capacitors
General Technical Information
Tape packaging of WOund SMD Capacitors
According to IEC 60286-3
Carrier Tape
Standard taping
1
EIA size code,Size of capacitor,
horizontal
mm
+0.3
mountingL
BH
W –0.0
P1 ± 0.1A0
+2
B 0
K0A ± 2.0
W1 –0
W2 max
Qty/pcs
2220
5.7
5.0 2.5
12.0
8.0
5.5
6.0
2.8
330
12.4
22.0
3100
2220
5.7
5.0 3.0
12.0
8.0
5.5
6.0
3.3
330
12.4
22.0
2400
2220
5.7
5.0 4.0
12.0
8.0
5.5
6.0
4.3
330
12.4
22.0
2100
2824
7.3
6.0 2.5
12.0
8.0
6.5
7.5
2.8
330
12.4
22.0
3100
2824
7.3
6.0 3.0
12.0
8.0
6.5
7.5
3.3
330
12.4
22.0
2500
2824
7.3
6.0 3.5
12.0
8.0
6.5
7.5
3.8
330
12.4
22.0
2300
2824
7.3
6.0 4.5
12.0
8.0
6.5
7.5
4.8
330
12.4
22.0
1700
4036
10.2
9.1 5.5
16.0
16.0
9.5
10.5
5.8
330
16.4
22.0
800
5045
12.7 11.5 6.5
24.0
16.0
11.9
13.1
6.8
330
24.4
30.0
600
6560
16.5 15.0 7.0
24.0
20.0
15.4
16.8
7.3
330
24.4
30.0
500
Vertical taping
Special option
EIA size code,Size of capacitor,
vertical
mm
+0.3
mountingL
B*H*
W –0.0
P1 ± 0.1A0
B 0
K0A ± 2.0
+2
W1 –0
W2 max
Qty/pcs
4022
10.2
5.5 9.1
24.0
16.0
6.0
10.5
9.3
330
24.4
30.0
500
5026
12.7
6.5 11.5
24.0
16.0
6.9
13.1
11.8
330
24.4
30.0
400
6528
16.5
7.0 15.0
44.0
20.0
7.5
17.0
15.3
330
44.5
49.5
200
* Dimensions B and H in vertical mounting correspond H and B in the standard mounting and in the article tables.