SMD Film Capacitors General Technical Information marking of SMD capacitors The nominal capacitance value is given with 3 digits EIA-code, Examples: 103 = 10000 pF = 10 nF = 0.01 µF The capacitance tolerance is expressed with letter codes: M K J ± 20 % ± 10 % ± 5 % H G F Z C D F W 50 VDC 63 VDC 100 VDC 160 VDC 12 00 VDC Capacitance marked acc. to EIA standard 103 HZM H K M P M S G MMC SMC, SMW GMC, GMW 103 H ZSKD 250 VDC 400 VDC 630 VDC 1000 VDC Rated voltage Type Manufacturing year Testing month The capacitor type codes are as follows: Tolerance ± 2.5 % ±2% ± 1 % The rated voltage is expressed with letter codes: Chip length ≥ 7.3 mm Chip length 5.7 mm The manufacturing year and the testing month are expressed according to IEC 60062, see table on page 10. P D GPC SPC Soldering of wound SMD Capacitors The recommended soldering land dimensions are: L Case size mmHorizontalVertical WAhAv mils mm mils mm mils mm 5.7 2220 - J31, J91 60 1.5 5.7 2220 - J33, J93 60 1.5 5.7 2220 - J35, J95 60 1.5 7.3 2824 - K31, K91 60 1.5 7.3 2824 - K33, K93 60 1.5 7.3 2824 - K35, K95 60 1.5 7.3 2824 - K37, K97 60 1.5 10.2 4036 - A31 4022 - A31V 80 2.0 12.7 5045 - B31 5026 - B31V 100 2.5 16.5 6560 - C31 6528 - C31V 120 3.0 W A X X 200 200 200 240 240 240 240 360 455 590 5.1 5.1 5.1 6.1 6.1 6.1 6.1 9.1 220 5.6 11.6 260 6.6 15.0 280 7.1 X mils 118.58 118.58 118.58 148.11 148.11 148.11 148.11 217.15 276.4 355.3 Ah = horizontal mounting Av = vertical mounting Land dimensions for PCB design are available in PADS format. mm 3.0 3.0 3.0 3.8 3.8 3.8 3.8 5.5 7.0 9.0 SMD Film Capacitors General Technical Information Soldering of wound SMD Capacitors Reflow soldering temperature shall be measured on the top body surface of the component. The profiles below are recommended soldering profiles for convection reflow ovens and IR reflow ovens. If vapour phase reflow oven is used, please consult Evox Rifa. The recommended solder paste thickness for the naked SMD (SMW, GMW) parts is at least 0.25 mm (10 mils), for thicknesses below 0.25 mm (10 mils) please consult Evox Rifa. Soldering curves for Lead containing solder 250 Temperature (°C) 250 Max 220 °C 200 Temperature (°C) 250 Max 235 °C 200 Max 150 °C 150 Max 60 s over 180 °C Max 150 °C 150 Max 60 s over 180 °C 100 50 50 50 0 0 90 120 150 180 210 240 270 300 t(s) 60 Recommended reflow soldering profile for MMC 0 30 60 Max 160 °C 150 100 30 Max 240 °C 200 100 0 Temperature (°C) 0 90 120 150 180 210 240 270 300 t(s) Recommended reflow soldering profile for GMC, GMW, GPC and SMW. For GMW, max T = 230 °C. 0 30 Max 60 s over 180 °C 90 120 150 180 210 240 270 300 t(s) 60 Recommended reflow soldering profile for SMC and SPC Soldering curves for Lead free solder Temperature (°C) 280 Temperature (°C) 280 Max 250 °C Max 240 °C 223 °C 240 223 °C 200 200 170 °C 170 °C 150 °C 150 °C 160 160 120 Min. 30 s, max 50 s above 217 °C 80 40 0 0 30 60 90 120 150 180 210 240 270 300 330 120 Min. 30 s, max 50 s above 217 °C 80 40 0 0 60 90 120 150 180 210 240 270 300 330 30 Time (s) Time (s) Recommended reflow soldering profile for GMW, MMC, MDC, MDS and SMW Recommended reflow soldering profile for GMC, GPC, and SMP253 Temperature (°C) 280 Temperature (°C) 280 Max 255 °C Max 260 °C 223 °C 223 °C 240 240 200 200 170 °C 170 °C 150 °C 150 °C 160 160 120 Min. 30 s, max 50 s above 217 °C 80 40 0 0 30 60 90 120 150 180 210 240 270 300 330 120 Min. 30 s, max 50 s above 217 °C 80 40 0 0 30 60 90 120 150 180 210 240 270 300 330 Time (s) Recommended reflow soldering profile for SPC These profiles are valid for products in this catalogue. Reflow recommendations for customised Evox Rifa products may deviate from the above profiles. Exceeding the manufacturer’s process recommendations may harm the component and keep the manufacturer not �������������������������������������������������� liable for any defect caused by exceeding the recommendations. According to international standards, the maximum temperature capability shall be measured on the top surface of a component. Any of the international standards do not define how the thermocouple should be fastened on the component. Our recommendation for attaching the thermocouple on the top surface of the component is glueing with high temperature resistant glue. Time (s) Recommended reflow soldering profile for SMC Soldering curves for Wave solder 250 Temperature (°C) 200 150 Max 145 °C 100 50 0 0 50 100 150 200 250 t(s) Recommended wave soldering profile for all Evox Rifa SMD capacitors suitable for wave soldering, total time in solder wave <5s. Evox Rifa SMD and DIL Film Capacitors 19 SMD Film Capacitors General Technical Information Tape packaging of WOund SMD Capacitors According to IEC 60286-3 Carrier Tape Standard taping 1 EIA size code,Size of capacitor, horizontal mm +0.3 mountingL BH W –0.0 P1 ± 0.1A0 +2 B 0 K0A ± 2.0 W1 –0 W2 max Qty/pcs 2220 5.7 5.0 2.5 12.0 8.0 5.5 6.0 2.8 330 12.4 22.0 3100 2220 5.7 5.0 3.0 12.0 8.0 5.5 6.0 3.3 330 12.4 22.0 2400 2220 5.7 5.0 4.0 12.0 8.0 5.5 6.0 4.3 330 12.4 22.0 2100 2824 7.3 6.0 2.5 12.0 8.0 6.5 7.5 2.8 330 12.4 22.0 3100 2824 7.3 6.0 3.0 12.0 8.0 6.5 7.5 3.3 330 12.4 22.0 2500 2824 7.3 6.0 3.5 12.0 8.0 6.5 7.5 3.8 330 12.4 22.0 2300 2824 7.3 6.0 4.5 12.0 8.0 6.5 7.5 4.8 330 12.4 22.0 1700 4036 10.2 9.1 5.5 16.0 16.0 9.5 10.5 5.8 330 16.4 22.0 800 5045 12.7 11.5 6.5 24.0 16.0 11.9 13.1 6.8 330 24.4 30.0 600 6560 16.5 15.0 7.0 24.0 20.0 15.4 16.8 7.3 330 24.4 30.0 500 Vertical taping Special option EIA size code,Size of capacitor, vertical mm +0.3 mountingL B*H* W –0.0 P1 ± 0.1A0 B 0 K0A ± 2.0 +2 W1 –0 W2 max Qty/pcs 4022 10.2 5.5 9.1 24.0 16.0 6.0 10.5 9.3 330 24.4 30.0 500 5026 12.7 6.5 11.5 24.0 16.0 6.9 13.1 11.8 330 24.4 30.0 400 6528 16.5 7.0 15.0 44.0 20.0 7.5 17.0 15.3 330 44.5 49.5 200 * Dimensions B and H in vertical mounting correspond H and B in the standard mounting and in the article tables.