Multilayer Ceramic Chip Capacitors Kyocera's series of Multilayer Ceramic Chip Capacitors are designed to meet a wide variety of needs. We offer a complete range of products for both general and specialized applications, including the general-purpose CM series, the high-voltage CF series , the low profile CT series, and the DN series for automotive uses. Features • We have factories worldwide in order to supply our global customer bases quickly and efficiently and to maintain our reputation as one of the highest-volume producers in the industry. • All our products are highly reliable due to their monolithic structure of high-purity and superfine uniform ceramics and their integral internal electrodes. • By combining superior manufacturing technology and materials with high dielectric constants, we produce extremely compact components with exceptional specifications. • Our stringent quality control in every phase of production from material procurement to shipping ensures consistent manufacturing and super quality. • Kyocera components are available in a wide choice of dimensions, temperature characteristics, rated voltages, and terminations to meet specific configurational requirements. CM series General CU CA series Arrays Multilayer Ceramic Chip Capacitors series Low ESR CT series Low Profile DN/DR series Automotive CF series High-Voltage Structure External Termination Electrodes Nickel Barrier Termination Products Internal Electrodes (Pd, Pd/Ag, Ni or Cu) Ni Plating Dielectric Ceramic Layer Temperature compensation :Titanate family High dielectric constant : Barium Titanate family Tape and Reel Ag or Cu or CuNi Sn Plating or Sn/Pb Plating Bulk Cassette Please contact your local AVX, Kyocera sales office or distributor for specifications not covered in this catalog. Our products are continually being improved. As a result, the capacitance range of each series is subject to change without notice. Please contact an sales representative to confirm compatibility with your application. Multilayer Ceramic Chip Capacitors Kyocera Ceramic Chip Capacitors are available for different applications as classified below: Series Dieletric Options Typical Applications Features CM C0G (NP0) X5R X7R X6S X7S Y5V NTC∗ General Purpose Wide Cap Range Nickel Barrier 0201, 0402, 0603 0805, 1206, 1210 1812, 2211, 2220 CF C0G (NP0) X7R High Voltage & Power Circuits High Voltage 250VDC, 630VDC 1000VDC, 2000VDC 3000VDC, 4000VDC Nickel Barrier 0805, 1206, 1210 1812, 2208, 1808 2220 CT C0G (NP0) X5R X7R Y5V PLCC (Decoupling) Low Profile Nickel Barrier 0402, 0603, 0805 1206, 1210 ∗DN/DR C0G (NP0) U (750) X7R Automotive Thermal shock Resistivity High Reliability Nickel Barrier 0603, 0805, 1206 CU C0G (NP0) RF Circuit Low ESR Nickel Barrier 0402, 0603 CA C0G (NP0) X5R Digital Signal Pass line Reduction in Placing Costs Nickel Barrier 0405, 0508, 0612 ∗ NTC: Negative Temperature coefficient types are available on request. ∗ DN Series: Silver Palladium termination is available on request. ∗ CA Series: X7R, Y5V are available on request. Terminations Available Size (EIA) Multilayer Ceramic Chip Capacitors Dimensions W L T P P~P P External Terminations Electrode External Dimensions Tape & Reel Size EIA CODE Dimensions (mm) EIAJ CODE L W P min P max P to P min T max 03 0201 0603 0.6±0.03 0.3±0.03 0.10 0.20 0.20 0.33 05 0402 1005 1.0±0.05 0.5±0.05 0.15 0.35 0.30 0.55 105 0603 1608 1.6±0.10 0.8±0.10 0.20 0.60 0.50 0.90 21 0805 2012 2.0±0.10 1.25±0.10 0.20 0.75 0.70 1.35 316 1206 3216 3.2±0.20 1.60±0.15 0.30 0.85 1.40 1.75 32 1210 3225 3.2±0.20 2.50±0.20 0.30 1.00 1.40 2.70 42 1808 4520 4.5±0.20 2.00±0.20 0.15 0.85 2.60 2.20 43 1812 4532 4.5±0.30 3.20±0.20 0.30 1.10 2.00 3.0 52 2208 5720 5.7±0.40 2.00±0.20 0.15 0.85 4.20 2.20 53 2211 5728 5.7±0.40 2.80±0.20 0.15 0.85 4.20 2.80 55 2220 5750 5.7±0.40 5.00±0.40 0.30 1.40 2.50 2.70 W T • CT21, CT316 : (L) 3.2±0.2mm and (W)1.6±0.2mm • T (Thickness) depends on capacitance value. Standard thickness is shown on the appropriate product pages. • DR series 105, 21 size (L)(W)(T) Tolerance ±0.15mm • CA series (please refer page 19) Bulk Cassette P Size EIA CODE EIAJ CODE L P to P min max min 05 0402 1005 1.0±0.05 0.5±0.05 0.5±0.05 0.15 0.35 0.30 105 0603 1608 1.6±0.07 0.8±0.07 0.8±0.07 0.20 0.60 0.50 21 0805 2012 2.0±0.1 1.25±0.1 0.6±0.1/1.25±0.1 0.20 0.75 0.70 Multilayer Ceramic Chip Capacitors Ordering Information KYOCERA PART NUMBER: CM 21 X7R 104 SERIES CODE CM CF CT DN/DR = = = = General Purpose High Voltage Low Profile Automotive CA = CU = Capacitor Arrays Low ESR SIZE CODE SIZE 03 = 05 = 105 = F12 = F13 = EIA (EIAJ) 0201 (0603) 0402 (1005) 0603 (1608) 0508 (1220)/4cap 0612 (1632)/4cap SIZE 21 316 32 42 43 = = = = = EIA (EIAJ) 0805 (2012) 1206 (3216) 1210 (3225) 1808 (4520) 1812 (4532) SIZE 52 53 55 D11 D12 = = = = = EIA (EIAJ) 2208 (5720) 5728 (2211) 2220 (5750) 0405 (1012)/2cap 0508 (1220)/2cap DIELECTRIC CODE CODE EIA CODE CG = C0G (NPO) X7S = X7S X5R = X5R X6S = X6S (Option) X7R = X7R Y5V = Y5V Negative dielectric types are available on request. CAPACITANCE CODE Capacitance expressed in pF. 2 significant digits plus number of zeros. For Values < 10pF, Letter R denotes decimal point, eg. 100000pF = 104 1.5pF = 1R5 0.1µF = 104 0.5pF = R50 4700pF = 472 100µF = 107 TOLERANCE CODE A = ±0.05pF B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1pF G = ±2% J = ±5% K = ±10% M = ±20% Z = -20 to +80% VOLTAGE CODE 04 06 10 16 25 35 50 = = = = = = = 4VDC 6.3VDC 10VDC 16VDC 25VDC 35VDC 50VDC 100 250 400 630 = = = = 100VDC 250VDC 400VDC 630VDC 1000 2000 3000 4000 = = = = 1000VDC 2000VDC 3000VDC 4000VDC TERMINATION CODE A = Nickel Barrier B = Silver Palladium (∗option) C = Silver (∗option) PACKAGING CODE B = Bulk C = Bulk Cassette T = 7" Reel Taping & 4mm Cavity pitch OPTION Thickness max value is indicated in CT series EX. 125 → 1.25mm max 095 → 0.95mm max L = 13" Reel Taping & 4mm Cavity pitch H = 7" Reel Taping & 2mm Cavity pitch N = 13" Reel Taping & 2mm Cavity pitch K 50 A T Multilayer Ceramic Chip Capacitors Temperature Characteristics and Tolerance High Dielectric Constant EIA Dielectric Temperature Range X5R −55 to 85°C X7R −55 to 125°C X7S −55 to 125°C X6S −55 to 105°C Y5V −30 to 85°C ∆Cmax ±15% ±22% −82 to +22% Temperature Compensation Type Electric Code Value (pF) 1B/C0G P∆ N150 R∆ N220 S∆ N330 T∆ N470 U∆ N750 SL +350 to −1000 0.5-2.7 CK PK RK SK TK UK SL 3.0-3.9 CJ PJ RJ SJ TJ UJ SL 4.0-9.0 CH PH RH SH TH UJ SL ≥10 CG PH RH SH TH UJ SL K = ±250ppm/°C, J = ±120ppm/°C, H = ±60ppm/°C, G = ±30ppm/°C e.g. CG = 0±30ppm/°C, PH = −150±60ppm/°C Note: All parts will be marked as "CG" but will conform to the above table. Available Tolerances E Standard Number Dielectric materials, capacitance values and tolerances are available in the following combinations only: EIA Dielectric Standard Tolerance ∗4 ∗4 E3 Capacitance A=±0.05pF ≤0.5pF B=±0.1pF ≤5pF COG NTC ∗1 J=±5% K=±10% X5R X6R X7R Y5V ∗3 K=±10% M=±20% Z=−20% to +80% E24 (Option) 1.0 1.0 1.1 1.2 1.2 1.3 1.5 1.5 1.6 1.8 1.8 2.0 2.2 2.2 2.4 2.7 2.7 3.0 3.3 3.3 3.6 3.9 3.9 4.3 4.7 4.7 5.1 5.6 5.6 6.2 6.8 6.8 7.5 8.2 8.2 9.1 1.0 1.5 ∗2 <10pF 2.2 F=±1pF G=±2% E12 1.0 C=±0.25pF D=±0.50pF E6 ≥10pF 2.2 E12 Series 3.3 E6 Series 4.7 E3 Series Note: ∗1 NTC : Negative Temperature Compensation types are available on request as shown on product pages. ∗2 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF, 2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF, 10pF. ∗3 J = ±5% for X7R(X5R) is available on request. ∗4 option 4.7 6.8 CM Series Nickel Barrier Terminations Features Application We offer a diverse product line ranging from ultra-compact (0.6×0.3 mm) to large (5.7×5.0 mm) components configured for a variety of temperature characteristics, rated voltages, and packages. We offer the choice and flexibility for almost any applications. This standard type is ideal for use in a wide range of applications, from commercial to industrial equipment. Temperature Compensation Dielectrics CM03 (0603) Size (mm) Temperature Characteristics Rated Voltage (VDC) Capacitance (pF) R20 R50 1R0 1R5 100 120 101 121 102 122 103 123 0.2 0.5 1.0 1.5 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000 12000 15000 18000 CM05 (1005) C∆ 10 16 U∆ 25 16 SL 25 25 A A C∆ 16 25 U∆ SL 50 50 50 B B B CM105 (1608) CM21 (2012) CM316 (3216) CM32 (3225) C∆ C∆ C∆ C∆ 50 100 16 25 50 100 25 50 100 50 A A C A A D B B D C D D D D E D E E E G E G E H F H Thickness and standard package quantity Size 03 05 105 ∗105 21, 316, 32 A B C C D E F G H I J K L 0.3±0.03 0.5±0.05 0.8±0.1 0.8±0.1 0.6±0.1 0.85±0.1 1.15±0.1 1.25±0.1 1.4max 1.6max 1.6±0.15 2.0±0.2 2.5±0.2 Taping(180 dia reel) 15kp(P8) 10kp(P8) 4kp(P8) 8kp(P8) 4kp(P8) 4kp(P8) 3kp(E8) 3kp(E8) 2kp(E8) 1kp(E8) Taping(330 dia reel) ——— 50kp(P8) 10kp(P8) 20kp(P8) 10kp(P8) 10kp(P8) 5kp(E8) ——— Thickness (mm) Size Thickness (mm) 43, 55 J K L M 1.6±0.15 2.0±0.2 2.5±0.2 2.8±0.2 Taping(178 dia reel) 1kp(E12) Taping(330 dia reel) ——— 1kp(E12) 0.5kp(E12) 0.5kp(E12) ——— ——— ——— 10kp(E8) 10kp(E8) 3kp(E8) 2.5kp(E8) 2.5kp(E8) 10kp(E8) Note : P8 = 8mm width paper tape E8 = 8mm width plastic tape E12 = 12mm width plastic tape ∗ Carrier tape 2mm pitch from one capacitor to another. 5kp(E8) 5kp(E8) CM Series Nickel Barrier Terminations X5R Dielectric CM03 (0603) Size (mm) Rated Voltage (VDC) Capacitance (pF) 101 151 102 152 103 153 104 154 105 155 106 10 100 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 47000 68000 100000 150000 220000 330000 470000 680000 1000000 1500000 2200000 3300000 4700000 6800000 10000000 16 CM05 (1005) 25 4 ;; 105 106 107 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 B A C A B ; ∗ B ;; ;; ; ;; ;; 10 16 G C B G C ∗1 ∗1 C C ∗1 ∗1 C C ∗1 25 35 50 6.3 ∗1 ∗1 G G ∗2 10 ∗ ∗ C G 16 25 35 50 H∗ K H K G ∗1 G ∗1 CM32 (3225) CM316 (3216) 6.3 D E C B B Rated Voltage (VDC) Capacitance (pF) 100000 220000 470000 1000000 2200000 4700000 10000000 22000000 47000000 100000000 10 CM21 (2012) A Size (mm) 104 6.3 CM105 (1608) 6.3 CM43 (4532) 10 25 50 F F J ∗ ∗2 J ∗ J ∗2 ∗2 J ∗2 J ∗ Non standard specification, please contact us for further information. Optional Spec. ∗1 Length(L, T) tolerance ±0.15 ∗2 Length(L, T) tolerance ±0.2 ∗2 L K L∗ I L L L L ∗ ∗2 L M L CM Series Nickel Barrier Terminations X7R, X7S Dielectric Size (mm) CM03 (0201) Rated Voltage (VDC) Capacitance (pF) 16 101 151 102 152 103 153 104 154 105 155 100 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 47000 68000 100000 150000 220000 330000 470000 680000 1000000 1500000 2200000 3300000 4700000 CM05 (0402) 6.3 16 104 105 106 50 6.3 10 16 25 B 50 100 C C 4 10 16 25 50 100 D E B B ∗ ∗ ∗ ∗ B G C ∗ ∗ ∗ ∗ G G C G ∗ ∗ ∗ ∗ CM316 (1206) 6.3 10 16 F J F ∗2 ∗ ∗ J G CM32 (1210) 25 G D E C C Rated Voltage (VDC) Capacitance (pF) 10000 22000 47000 100000 220000 470000 1000000 2200000 4700000 10000000 22000000 25 CM21 (0805) A Size (mm) 103 CM105 (0603) 50 100 E F F J 6.3 10 J ∗ 16 I L CM43 (1812) 25 50 16 50 100 J L L H K L H K H K L 100 CM55 (2220) 100 L L L ∗ Only X7S available ∗2 Length(W, T) Tolerance ±0.2, X7S available Y5V Dielectric Size (mm) Rated Voltage (VDC) Capacitance (pF) 102 472 103 473 104 474 105 475 106 476 1000 2200 4700 10000 22000 47000 100000 220000 470000 1000000 2200000 4700000 10000000 22000000 47000000 CM03 (0201) 6.3 10 CM05 (0402) 16 25 CM105 (0603) 50 10 16 25 CM21 (0805) 50 10 16 CM316 (1206) 25 50 D E G E G 10 16 J F J 25 CM32 (1210) 50 10 16 25 J H J 50 A B B A C B C E C C G F G H F K Thickness and standard package quantity Size 03 05 105 ∗105 21, 316, 32 A B C C D E F G H I J K L 0.3±0.03 0.5±0.05 0.8±0.1 0.8±0.1 0.6±0.1 0.85±0.1 1.15±0.1 1.25±0.1 1.4max 1.6max 1.6±0.15 2.0±0.2 2.5±0.2 Taping(180 dia reel) 15kp(P8) 10kp(P8) 4kp(P8) 8kp(P8) 4kp(P8) 4kp(P8) 3kp(E8) 3kp(E8) 2kp(E8) 1kp(E8) Taping(330 dia reel) ——— 50kp(P8) 10kp(P8) 20kp(P8) 10kp(P8) 10kp(P8) 5kp(E8) ——— Thickness (mm) Size Thickness (mm) 43, 55 J K L M 1.6±0.15 2.0±0.2 2.5±0.2 2.8±0.2 Taping(178 dia reel) 1kp(E12) Taping(330 dia reel) ——— 1kp(E12) 0.5kp(E12) 0.5kp(E12) ——— ——— ——— 10kp(E8) 10kp(E8) 3kp(E8) 2.5kp(E8) 2.5kp(E8) 10kp(E8) Note : P8 = 8mm width paper tape E8 = 8mm width plastic tape E12 = 12mm width plastic tape ∗ Carrier tape 2mm pitch from one capacitor to another. 5kp(E8) 5kp(E8) Multilayer Ceramic Chip Capacitors Electrical Characteristics Capacitance-Temperature (temperature compensation) For temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms at 1MHz, 1Vrms 10 5 C∆ P∆ R∆ S∆ T∆ U∆ 0 -5 DCapacitance(%) 10 DCapacitance(%) Aging (change of capacitance over time) C∆ X7R 0 -10 Y5V -20 ∗Initial value should be after 48hr of Heat treatment. -10 -60 -40 -20 0 20 40 60 80 100 -30 10 120 100 1,000 Capacitance-Temperature (high dielectric constant) Y5U, X7R, Y5V 100,000 Impedance-Frequency at 1kHz, 1Vrms 20 X7R(X5R) at 0VDC 0 -20 Impedance(Ω) ∆Capacitance(%) 10,000 Duration(hrs) Temperature(°C) X7R(X5R) at RV/2 -40 -60 Y5V at 0VDC -80 100 W W5 5R( R(B B)/ )10 Y5V 00p 0 .01 F W5 µ 10 F R(B )/Y 5V 0.1 µF 1 W5 R(B )1Y 5V 1µ Y F 0.1 5V 10 µF Y5 V1 00µ 0.01 F at 1Vrms CH CH CH 10 CH 10 pF 1p F 0p F 10 00 pF Y5V at RV/2 -100 -60 -40 -20 0 20 40 60 80 100 0.001 0.1 120 1 Temperature(˚C) 1,000 10,000 AC Voltage For temperature compensation at 1MHz, 1Vrms For high dielectric constant at 1kHz, 1Vrms 20 25 CH 0 For temperature compensation : 1MHz 1 Vrms/for high dielectric constant : 1kHz Rated at 25V : Y5U Rated at 25V : C∆, X7R, Y5V 20 DCapacitance(%) X7R(X5R) −20 ∆C/C(%) 100 Frequency(MHz) DC Bias Rated at 25V : Y5U Rated at 25V : C∆, X7R, Y5V 10 −40 −60 Y5V 15 Y5V X7R 10 5 0 −80 C∆ -5 −100 0 5 10 15 20 25 -10 VDC Please verify individual characteristics at the design stage to ensure total suitability 1 2 3 AC Voltage(Vrms) 4 5 Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test conditions and Specification for Temperature Compensation type(C∗ to U∗ • SL characteristics) Test Items Specification (C: nominal capacitance) Capacitance Value Within tolerance C≤1000pF 1MHz±10% 0.5 to Q C≥30pF: Q≥1000 C<30pF: Q≥400+20C C>1000pF 1kHz±10% 5Vrms Insulation resistance (IR) (∗6) 10,000MΩ or 500MΩ•µF min, whichever is less Measured after the rated voltage is applied for one minute at normal room temperature and humidity. (∗4) Dielectric Resistance No problem observed (∗1) Apply 3 times of the rated voltage for 1 to 5 seconds. (∗6) Appearance No problem observed Microscope(10×magnification) Termination strength (∗2) No problem observed Apply a sideward force of 500g(5N) (∗7) to a PCB-mounted sample. Bending strength (∗2) No mechanical damage at 1mm bent Glass epoxy PCB (t=1.6mm); fulcrum Spacing: 90mm; for 10 seconds. Appearance No significant change is detected. ∆C Within tolerance Q C≥30pF: Q≥1000 C<30pF: Q≥400+20C Vibration frequency: 10 to 55(Hz) Amplitude: 1.5mm Sweeping condition: 10→55→10Hz/min In X, Y and Z directions: 2 hours each Total 6 hours Appearance No significant change is detected. Vibration test Soldering heat resistance ∆C ±2.5% or ±0.25pF max, whichever is larger. Q C≥30pF: Q≥1000 C<30pF: Q≥400+20C IR (∗6) Withstand voltage (∗6) Solderability Temperature cycle (∗3) Humidity test (∗5) Resists without problem No significant change is detected. ∆C ±2.5% or ±0.25pF max, whichever is larger. Q C≥30pF: Q≥1000 C<30pF: Q≥400+20C (∗6) Resists without problem Appearance No significant change is detected. ∆C ±7.5% or ±0.75pF max, whichever is larger. Q C≥30pF: Q≥200 C<30pF: Q≥100+10C/3 (∗6) Time 2minutes 2minutes Soaking Condition Sn63 Solder 235±5°C Sn-3Ag-0.5Cu 245±5°C 2±0.5sec. 3±0.5sec. After five cycles (∗3), measure after 24±2hours. Measure the test sample after storing it 24±2hours at a temperature of 40°C±2°C and a relative humidity of 90-95% Rh. for 500+24/−0hours. 500MΩ or 25MΩ•µF min, whichever is smaller Appearance No significant change is detected. ∆C ±3% or ±0.3pF max, whichever is larger. Q C≥30pF: Q≥350 10pF≤C<30pF: Q≥275+5C/2 C<10pF: Q≥200+10C (∗6) Temperature 80 to 100°C 150 to 200°C (Cycle) Normal room temperature (3min)→ Lowest operation temperature (30min)→ Normal room temperature (3min)→ Highest operation temperature (30min)→ 10,000MΩ or 500MΩ•µF min, whichever is samller Withstand voltage (∗6) IR ∗2 ∗3 ∗4 Order 1 2 10,000MΩ or 500MΩ•µF min, whichever is smaller Appearance IR Hightemperature with loading Soak the sample in 260°C±5°C solder for 10±0.5seconds and place in a room at normal temperature and humidity; measure after 24±2hours. (Preheating Conditions) Ni/Br termination: 90% min IR ∗1 Test Conditions After applying (∗1) twice of the rated voltage at a temperature of 125±3°C for 1000+48/−0hours, measure the sample after storing 24±2hours. 1,000MΩ or 50MΩ•µF min, whichever is smaller For the CF series, use 1.5 times when the rated voltage is 250V; use/1.2 times when the rated voltage exceeds 630V. Except CT series Different specification for Nickel Barrier termination DN/DR series. (Alumina Substrate) Apply 500V for 1minite in case the rated voltage is 1000V or higher. ∗5 ∗6 ∗7 Except CF series. The charge and discharge current of the capacitor must not exceed 50mA. 2N at 0201 Size Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test conditions and Specification for High Dielectric Type (X5R, X7R, Y5V) Specification Test Items X7R/X5R Capacitance Value Within tolerance 2.5%max, 3.5%max (∗2), 7.0%max (∗12) 5.0%max (∗3), 7.5%max (∗17) tanδ(%) Do previous treatment (∗8, ∗14) Capacitance Fire Vol C≤10µF 1kHz±10% 1.0±0.1Vrms C>10µF 120Hz±10% 0.5±0.1Vrms 10,000MΩ or 500MΩ•µF min, whichever is less Measured after the rated voltage is applied for 2minutes at normal room temperature and humidity. (∗10) Dielectric Resistance (∗15) No problem observed (∗1) Apply 2.5 times of the rated voltage for 1 to 5 seconds. Appearance No problem observed Microscope(10×magnification) Termination strength (∗6) No problem observed Apply a sideward force of 500g(5N) (∗16) to a PCB-mounted sample. Bending strength test (∗6) No problem observed at 1mm bent Glass epoxy PCB (t=1.6mm); fulcrum Spacing: 90mm; for 10 seconds. Vibration Appearance No significant change is detected. test ∆C Within tolerance tanδ(%) Satisfies the initial value. Appearance No significant change is detected. ∆C Within ±7.5% IR 10,000MΩ or 500MΩ•µF min, whichever is smaller (∗15) Appearance Within ±20% tanδ(%) Satisfies the initial value. IR 10,000MΩ or 500MΩ•µF min, whichever is smaller (∗15) Withstand voltage (∗15) Resists without problem Appearance No significant change is detected. tanδ(%) IR (∗15) Appearance ∆C IR Within ±12.5% Within ±30% 200% max of initial value 150% max of initial value (∗15) 2±0.5sec. 3±0.5sec. Do previous treatment (∗8) (Cycle) Normal room temperature (3min)→ Lowest operation temperature (30min)→ Normal room temperature (3min)→ Highest operation temperature (30min)→ After five cycles (∗7), measure after 48±4hours. Do previous treatment (∗9) After storing it at a temperature of 40°C±2°C and a relative humidity of 90-95% for 500+24/−0hours, measure the sample after storing 48±4hours. 500MΩ or 25MΩ•µF min, whichever is smaller No significant change is detected. Within ±12.5% tanδ(%) Do previous treatment (∗8) Soak the sample in 260°C±5°C solder for 10±0.5seconds and place in a room at normal temperature and humidity; measure after 48±4hours. (Preheating Conditions) Order Temperature Time 1 80 to 100°C 2minutes 2 150 to 200°C 2minutes Soaking Condition Sn63 Solder 235±5°C Sn-3Ag-0.5Cu 245±5°C No significant change is detected. Within ±7.5% ∆C Hightemperature with loading Resists without problem Ni/Br termination: 90% min ∆C Humidity test (∗11) Within ±20% Satisfies the initial value. Solderability Temperature cycle (∗7) Vibration frequency: 10 to 55(Hz) Amplitude: 1.5mm Sweeping condition: 10→55→10Hz/min In X, Y and Z directions: 2 hours each Total 6 hours tanδ(%) Withstand voltage (∗15) *2 *3 *4 *5 *6 *7 *8 *9 5.0%max, 7.0%max (∗13) 9.0%max (∗4), 12.5%max (∗5) Test Condition Insulation resistance (IR) (∗15) Soldering heat resistance *1 Y5V 200% max of initial value Within ±30% 150% max of initialinitial valuevalue Do previous treatment (∗9) After applying twice (∗18) of the rated voltage at the highest operating temperature for 1000+48/−0hours, measure the sample after storing 48±4hours. 1,000MΩ or 50MΩ•µF min, whichever is smaller Use 1.5 times when the rated voltage is 250V or over. Use 1.2 times when the rated voltage is 630V or over. Apply to X5R 35V type, X7R 16V/25V type. Apply to X5R16V/25V type, X7R/X7S 6.3V/10V type. Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type). Apply to Y5V 6.3V/10V type. Apply 16% to CM21Y5V106/CM316Y5V226. Exclude CT series with thickness of less than 0.66mm and CA series. Different Specification for Nickel Barrier termination DN/DR series. (Alumina Substrate) Keep specimen at 150°C+0/−10°C for one hour, leave specimen at room ambient for 48±4 hours. Apply the same test condition for one hour, then leave the specimen at room ambient for 48±4 hours. *10 *11 *12 *13 *14 *15 *16 *17 *18 For the CF series over 1000V, apply 500V for 1 minutes at room ambient. Except CF series. Apply to X5R 10V type, X7S 4V type. Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over. Measurement condition 1kHz, 1Vrms for Y5V, C < 47µF type. The charge/discharge current of the capacitor must not exceed 50mA. 2N at 0201 Size Apply to X5R 4V and 6.3V type. Use 1.5times when the rated voltage is 4V/6.3V/10V/250V and 100V (32X7R474/43X7R105/55X7R105). Use 1.2times when the rated voltage is 630V or over. Multilayer Ceramic Chip Capacitors Packaging Options Tape and Reel Reel (code : T) • Reel W2 E C B Code Reel A B 7-inch Reel (CODE : T, H) 178±2.0 φ60min 13-inch Reel (CODE : L, N) 330±2.0 φ100±1.0 Code Reel E W1 D R 7-inch Reel (CODE : T, H) A 13-inch Reel (CODE : L, N) W1 (Unit : mm) C D 13±0.5 21±0.8 W2 R 16.5max 1.0 10.0±1.5 2.0±0.5 9.5±1.0 ∗Carrier tape width 8mm. For size 42(1808) or over, Tape width 12mm and W1 : 14±1.5, W2 : 18.4mm max F=2mm(03, 05, 105 Type) Punched rectangular hole to hold capacitor J Feed Hole Carrier Tape (Paper) E A (Unit : mm) Type A B F 03 (0.6×0.3) 0.37±0.03 0.67±0.03 2.0±0.05 D C B F F H 03 Type: 0.5MAX 05 Type: 0.75MAX F=4mm(105, D11, D12, F12, F13, 21, 316, 32, 42, 52 Type) (Plastic) Punched rectangular hole to hold capacitor J Feed Hole 05 (1.0×0.5) 0.65±0.1 1.15±0.1 2.0±0.05 105 (1.6×0.8) 1.0±0.2 1.8±0.2 4.0±0.1 D11 (1.37×1.0) 1.15±0.1 1.55±0.1 4.0±0.1 D12 (1.25×2.0) 1.5±0.2 2.3±0.2 4.0±0.1 (Paper) 2.8MAX E F12 (1.25×2.0) 1.5±0.2 2.3±0.2 4.0±0.1 F13 (1.6×3.2) 2.0±0.2 3.6±0.2 4.0±0.1 1.5±0.2 2.3±0.2 4.0±0.1 A D F H 21 (2.0×1.25) φ1.0 +0.2 −0 C B G 0.6MAX Holes only for plastic carrier tape. 316 (3.2×1.6) 2.0±0.2 3.6±0.2 4.0±0.1 32 (3.2×2.5) 2.9±0.2 3.6±0.2 4.0±0.1 1.1MAX F=8mm(43, 53, 55 Type) (Plastic) Punched rectangular hole to hold capacitor Feed Hole J 2.8MAX 42 (4.5×2.0) 2.4±0.2 4.9±0.2 4.0±0.1 43 (4.5×3.2) 3.6±0.2 4.9±0.2 8.0±0.1 52 (5.7×2.0) 2.4±0.2 6.0±0.2 4.0±0.1 53 (5.7×2.8) 3.2±0.2 6.0±0.2 8.0±0.1 55 (5.7×5.0) 5.3±0.2 6.0±0.2 8.0±0.1 E A D φ1.0 +0.2 −0 C B (Unit : mm) F F H G 2.0 ±0.05 Bulk Cassette (Unit : mm) 12 36 Slider Shutter 110 Connection Area Carrier Tape C D 8.0 ±0.3 3.5 ±0.05 12.0 ±0.3 5.5 ±0.05 E G 1.75 ±0.1 2.0 ±0.05 H J 0.6MAX 4.0 ±0.1 8.0 ±0.1 8mm Paper 8mm Plastic 12mm Plastic 4.0 1.5 ±0.1 +0.1/−0 Multilayer Ceramic Chip Capacitors Precautions Circuit Design 1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause a short, open, smoking, or flaming to occur, etc. 2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical devices; devices which are highly public orientated; and devices which demand a high standard of liability. Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability design different from that of general purpose capacitors. 3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitor’s insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this effect becomes especially pronounced in high frequency circuits, please exercise caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 20ºC. 4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the rated voltage when AC voltage is super-imposed to the DC voltage. In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations, may cause the capacitor to smoke or flame. 5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is within the rated voltage, it is possible capacitor reliability will deteriorate. 6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage. Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage at the time of operation. 7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in the catalog and specifications. In addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to Voltage change. Please contact sales in such case. 8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective product in order that the assembled product function appropriately. Storage 1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are followed. 6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas. Multilayer Ceramic Chip Capacitors Surface Mounting Information Dimensions for recommended typical land Standard Land Pattern Sample capacitor c b a Soldering resist When mounting the capacitor to the substrate, it is important to consider carefully that the amount of solder (size of fillet) used has a direct effect upon the capacitor once it is mounted. a) The greater the amount of solder, the greater the stress to the elements. As this may cause the substrate to break or crack, it is important to establish the appropriate dimensions with regard to the amount of solder when designing the land of the substrate. b) In the situation where two or more devices are mounted onto a common land, separate the device into exclusive pads by using soldering resist (Unit : mm) Size L×W a b c 03 0.6×0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40 05 1.0×0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60 105 1.6×0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80 21 2.0×1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10 316 3.2×1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30 32 3.2×2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30 42 4.5×2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80 43 4.5×3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00 52 5.7×2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80 53 5.7×2.8 4.20 to 4.70 2.00 to 2.50 2.20 to 2.60 55 5.7×5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70 ∗ CA series : Please refer Page 19. DN/DR Automotive Series (Unit : mm) Size L×W a b c 105 1.6×0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00 21 2.0×1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40 316 3.2×1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80 Ideal Solder Thickness T/3 to T/2 Chip Capacitor T Solder ;; ;; ; PCB Typical mounting problems Item Not recommended example Recommended example/Separated by solder resist Solder resist Multiple parts mount Solder resist Mount with leaded parts Leaded parts Leaded parts Soldering iron Solder resist Wire soldering after mounting Wire Solder resist Overview Solder resist Multilayer Ceramic Chip Capacitors Surface Mounting Information Mounting Design The chip could crack if the PCB warps during processing after the chip has been soldered. Recommended chip position on PCB to minimize stress from PCB warpage (Not recommended) (Ideal) Actual Mounting 1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking. 2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf. 3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture. Crack Support pin 4) When the positioning hook begins to wear, unstable mechanical shock may be applied to the chip capacitor, resulting in cracking. 5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case. 6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors. Resin Mold 1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. 2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. 3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself. Multilayer Ceramic Chip Capacitors Surface Mounting Information Soldering Method 1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference (Delta T) to within 130 degree Celsius. 2) The product size 1.0×0.5mm to 3.2×1.6mm can be used in reflow and wave soldering, and the product size of over 3.2×2.5mm, 0.6×0.3mm, and capacitor arrays can be used in reflow. Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution. 3) Please see our recommended soldering conditions. Please contact us if you use lead free solder because the peak temperature of lead free is different from non-lead free. Recommendable Temperature Profile(62Sn Solder) Reflow Recommendable Temperature Profile(Sn-3Ag-0.5Cu) Reflow Peak temperature 230°C±5°C 15seconds maximum 300 250°C±5°C 5 to 10sec. Max. Preheat 300 250 ∆T Temperature 200 150 100 More than180°C, 40seconds maximum 200 1 to 3°C/sec. 170 to 180°C 150 100 50 50 0 0 60seconds Preheat 250 Temperature Cool at normal room temperature after removing from furnace. 60seconds 220°C Max. 90±30sec. q Minimize soldering time. w Ensure that allowable temperature difference does not exceed 130˚C. q Minimize soldering time. w Ensure that allowable temperature difference does not exceed 130˚C. Wave Wave 300 300 Preheat 250 150 230°C to 260°C 100 50 250 Temperature Temperature ∆T 200 ;;;;;;; ;;;;;;; ;;;;;;; ;;;;;;; 245 to 260˚C Cool at normal room temperature 200 150 100 ∆T Preheat 0 90±30sec. 60 to 120sec. q w e r 3sec. max Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference (∆T) does not exceed 150°C. Cool naturally after soldering. Stop wave in more than CM32. q Ensure that the chip capacitor is preheated adequately. w Ensure that the temperature difference (∆T) does not exceed 150°C. e Cool naturally after soldering. Sodering iron 1) Temperature of iron chip 2) Wattage 3) Tip shape of soldering iron 4) Soldering Time 350°C max 30W max φ3.0mm max 3sec. max 5) Cautions a) Pre-heating is necessary Rapid heating must be avoided. Delta T≤130˚C. b) Avoid direct touching to capacitors. c) Avoid rapid cooling after soldering. Natural cooling is recommended.