70 Maxess Road ! Melville, New York 11747 (631) 936-7500 ! Fax (631) 396-7575 RECOMMENDED REFLOW SOLDERING PROFILE (General SMT Products) TEMPERATURE (°C) 250 +235°C 200 +175 ~ +195°C Typical Liquidus Temperature of Common Sn-Pb Solders PREHEAT 150 NATURAL COOLING* 100 50 * - Forced cool down exceeding 2°C/Second may result in thermal stress damage to ceramic components. 0 25 50 75 100 125 150 TIME (SECONDS) TEMPERATURE LIMITS Peak Temperature +260°C +250°C +240°C +230°C Max. Duration 5 SECONDS 15 SECONDS 25 SECONDS 40 SECONDS The above reflow soldering profile and temperature limits applies to the following NIC surface mount products: • • • • • • • NMC series… Ceramic Chip Capacitors NRC and NRSN series… Thick Film Chip Resistors and Resistor Arrays NTC series… Tantalum Chip Capacitors NTHC series… NTC Chip Thermistors NIS series… 0402/0603 Chip Inductors NCB series… Ferrite Chip Beads NRD and NSD series… Silicon and Schottky Barrier Rectifier Diodes 70 Maxess Road ! Melville, New York 11747 (631) 936-7500 ! Fax (631) 396-7575 RECOMMENDED FLOW-WAVE SOLDERING PROFILE (General SMT Products) Max. Temp +250° +200° TEMP ( °C ) +150° NATURAL COOLING* +100° +50° Time in wave * - Forced cool down exceeding 2°C/Second may result in thermal stress damage to ceramic components. 0 TIME** ** - Duration of wave soldering cycle is not component dependent. All products identified below can withstand direct immersion in solder without pre-heat. Maximum time within the wave is identified for each component style below. The above flow-wave soldering profile applies to the following NIC surface mount product series: Series NMC NRC NRSN NIS NTC NIN NCB NRD NSD NTHC NSFC NSPC Type Ceramic Chip Capacitors Thick Film Chip Resistors and Resistor Arrays 0402/0603 Chip Inductors Tantalum Chip Capacitors Wirewound Chip Inductors Ferrite Chip Beads Silicon and Schottky Barrier Rectifier Diodes NTC Chip Thermistors Stacked Film Chip Capacitors Max. Temp. Max. Time in Wave +260°C 10 Seconds +260°C 5 Seconds +250°C 10 Seconds +250°C 5 Seconds