7.0 x 2.0 x 0.8mm SMD OSXX7020C1A Ver.A.1 ■Features ■Outline ● Top view white LED (7.0 x 2.0 x 0.8mm) ● Super high brightness of surface mount LED ● Lead frame package with individual 2 pins ● Compatible to IR reflow soldering. ● 4000Pcs/Reel Dimension 1 2 ■Applications 2 1 2, Anode 1, Cathode Unit:mm Tolerances: ±0.1mm Back View ● General lighting ● Decoration lighting ● Indicator Side View Cathode mark Top View Recommended soldering Pad ■Absolute Maximum Rating Item ■Directivity (Ta=25℃) Symbol Value Unit DC Forward Current IF 75 mA Pulse Forward Current* IFP 150 mA Reverse Voltage VR 10 V Power Dissipation PD 540 mW Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol 0 0 ℃ ℃ ℃/5sec 260 - *Pulse width Max 0.1ms, Duty ratio max 1/10 ■Electrical -Optical Characteristics (Ta=25℃ (Ta=25℃) VF (V) Part Number Min. Color OSW47020C1A White W OSM57020C1A Warm White M ■ ■ Typ. Φv(lm)* IR(µA) Max. IF=75mA Max. Min. Typ. CCT Max. VR=10V Min. Typ. 2θ1/2(deg) Max. Typ. IF=75mA 5.8 6.0 7.2 10 50 55 - 5500K - 7000K 120 5.8 6.0 7.2 10 45 50 - 2800K - 3500K 120 Note: * Vf tolerance: ±0.05V * Luminous flux measurement allowance is:±10% LED & Application Technologies http://www.optosupply.com 1 VER A.0 7.0 x 2.0 x 0.8mm SMD OSXX7020C1A Ver.A.1 RELIABILITY TEST REPORT CLASSIFICATION TEST ITEM TEST CONDTION OPERATION If:75mA LIFE Ta:25+5 TEST TIME=1000HRS(-24HRS,+72HRS) ENDURANCE TEST HIGH R.H:90~95% TEMPERTURE Ta:65+5 HIGH HUMIDITY TEST TIME=240HRS(+2HRS) ℃ STORAGE ℃ HIGH Ta:105+5 TEMPERTURE TEST TIME=500HRS(-24HRS,+48HRS) STORAGE ℃ LOW Ta:-55+5 TEMPERTURE TEST TIME=500HRS(-24HRS,+48HRS) STORAGE ℃~25℃~-55℃~25℃ TEMPERTURE 105 CYCLING 60min 10min 60min 10min 20cycles ENVIRONMENTAL ℃~-55℃ THERMAL 105 SHOCK 10min 10min 10cycles ℃ TEST SOLDER Ta:260+5 RESISTANCE TEST TIME=10+1sec SOLDERABILITY Ta:230+5 ℃ TEST TIME=5+1sec JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY MEASURING ITME SYMBOL CONDITIONS LUMINOUS INTENSITY IV IF=75mA FORWARD VOLTAGE VF IF=75mA FAILURE IV<0.5*INITIAL VALUE VF>1.2*INITIAL VALUE REVERSE CURRENT IR Vr=10V IR>2*SPEC LED & Application Technologies http://www.optosupply.com 2 VER A.0 7.0 x 2.0 x 0.8mm SMD OSXX7020C1A Ver.A.1 ■Recommended Reflow Soldering Profile Surface mounting condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for reflow soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -Wellypower can’t guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies http://www.optosupply.com 3 VER A.0 7.0 x 2.0 x 0.8mm SMD OSXX7020C1A Ver.A.1 3) Manual soldering. - Lead solder ℃for max. 3sec, and only one time. Max. 300 - Lead-free solder ℃for max. 3sec, and only one time. Max. 350 - There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method use the nitrogen reflow method. - After LEDs have been soldered, repairs should not be done. As repair is unavoidable, a doublehead soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not. - Reflow soldering should not be done more than two times. LED & Application Technologies http://www.optosupply.com 4 VER A.0