1.6 x 0.8 x 0.6mm SMD OSXX0603C1E Ver.A.1 ■Features ■Outline ● Single chip ● Super high brightness of surface mount LED ● Sorting for Iv and Vf @ 5mA of If ● Compact package outline Dimension Recommended Solder Pad Top (LxWxT) of 1.6mm x 0.8mm x 0.6mm ● Side Compatible to IR reflow soldering. ■Applications ● Anode Backlighting (switches, keys, etc.) Bottom Cathode Notes: 1. All dimensions are in millimeters ; 2. Tolerance is ± 0.10 mm unless otherwise noted. Marker lights (e.g. steps, exit ways, etc.) ● ■Absolute Maximum Rating Symbo Item ■Directivity (Ta=25℃) Value WT/BL/TG/ YG YL/OR/HR DC Forward Current IF 20 20 mA Pulse Forward Current* IFP 100 100 mA Reverse Voltage VR 5 5 V Power Dissipation PD 68 48 mW Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40~ +85 Lead Soldering Temperature Tsol 0 Unit l 0 ℃ ℃ ℃/5sec 260 - *Pulse width Max 0.1ms, Duty ratio max 1/10 ■Electrical -Optical Characteristics (Ta=25℃ (Ta=25℃) VF (V) Part Number Min. Color Typ. IR(µA) Max. IF=5mA OSM50603C1E Warm White M5 Max. λD(nm) Iv(mcd) Min. Typ. Max. VR=5V Min. Typ. 2θ1/2(deg) Max. Typ. IF=5mA ■ 2.5 2.8 3.4 100 60 - 160 X=0.44, Y=0.41 120 X=0.27, Y=0.28 120 OSW50603C1E White W5 ■ 2.5 2.8 3.4 100 100 - 200 OSB50603C1E Blue B5 ■ 2.5 2.8 3.4 100 14 - 40 455 470 475 120 OSG50603C1E True Green G5 ■ 2.5 2.8 3.4 100 120 - 220 520 525 530 120 Yellow Green G8 ■ 1.6 1.8 2.4 100 5 - 15 565 570 575 120 OSG80603C1E OSY50603C1E Yellow Y5 ■ 1.6 1.8 2.4 100 15 - 50 585 590 595 120 OSO50603C1E Orange O5 ■ 1.6 1.8 2.4 100 15 - 50 600 605 610 120 OSR50603C1E Red R5 ■ 1.6 1.8 2.4 100 15 - 50 617 625 630 120 Note: * Vf tolerance: ±0.05V * Dominant wavelength tolerance: ±1nm * Luminous intensity is NIST reading. Luminous intensity tolerance:±10% LED & Application Technologies 1.6 x 0.8 x 0.6mm SMD OSXX0603C1E Ver.A.1 ■ Optical and electrical characteristics TYPICAL ELECTRICAL/OPTICAL CHARACTERISTIC CURVES Relative luminous intensity - If IF-V F YG YL 60 ) A m ( 50 fI tn40 er ru C30 dr a 20 rw oF10 BL WT TG O R /H R 0 0.5 1.5 1.0 2.0 2.5 4.0 3.5 3.0 Forw ard V oltage V f (V ) If_Ta ) 40 A m ( fI 30 tn er ru 20 C dr a 10 w ro F 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) Wavelength Characteristics Ta=25°C OR HR BL TG YG YL 100 tyis 80 ne tn 60 Is uo in 40 m uL ev 20 tia le R 0 400 450 500 550 7 6 ) A m 5 @ d ez il a m ro N ( WT 50 -30 -20 tyis ne tn Is uo ni m uL ev it al eR 600 Wavelength (nm) LED & Application Technologies 650 700 YG YL BL 5 4 WT 3 2 OR/HR TG 1 0 0 10 20 30 40 50 Forward current IF(mA) 60 1.6 x 0.8 x 0.6mm SMD OSXX0603C1E Ver.A.1 ■ Recommended Soldering Temperature – Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -We cannot guarantee the LEDs after they have been assembled using the solder dipping method. LED & Application Technologies 1.6 x 0.8 x 0.6mm SMD OSXX0603C1E Ver.A.1 3) Manual Soldering conditions. - Lead Solder Max. 300 for Max. 3sec, and only one time. ℃ - Lead-free Solder Max. 350 for Max. 3sec, and only one time. ℃ - There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method. - After LEDs have been soldered, repair should not be done. As repair is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not. - Reflow soldering should not be done more than two times. LED & Application Technologies 1.6 x 0.8 x 0.6mm SMD OSXX0603C1E Ver.A.1 ■ Material : White/ Blue/ Yellow green/ Yellow/ Orange/ Red LED & Application Technologies 1.6 x 0.8 x 0.6mm SMD OSXX0603C1E Ver.A.1 ■ Taping and Orientation. Quantity: 4,000 units/reel Diameter: 178 mm General Tolerance : ± 0.1 ■ Cautions: 1. After open the package, the LED should be kept at 30°C, 30%RH or less. The LED should be soldered within 24 hours (1 day) after opening the package. 2. Heat generation must be taken into design consideration when using the LED. 3. Power must be applied resistors for protection, over current would be caused the optic damage to the devices and wavelength shift. 4. Manual tip solder may cause the damage to Chip devices, so advised that heat of iron should be lower than 15W with temperature control under 5 seconds at 230-260 deg. C. ( The device would be got damage in re working process, recommended under 5 seconds at 230-260 deg. C) 5. All equipment and machinery must be properly grounded. It is recommended to use a wristband or anti-electrostatic glove when handing the LED. 6. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED package and the epoxy, Ultrasonic cleaning should not be done. 7. Damaged LED will show unusual characteristics such as leak current remarkably increase, turn-on voltage becomes lower and the LED get unlight at low current. LED & Application Technologies 1.6 x 0.8 x 0.6mm SMD OSXX0603C1E Ver.A.1 ■ Reliability Test : Conclusions: The reliability tests were designed to evaluate both package integrity as well as workability of product performance over time. All samples have done well by completed test requirement and passed all the qualification criteria with zero failure. From design standpoint, the package is robust enough to meet its datasheet conditions. Based on the good result shows on the above test, this product is qualified and released for market. LED & Application Technologies