NJG1684ME2 HIGH POWER SP4T SWITCH GaAs MMIC I GENERAL DESCRIPTION The NJG1684ME2 is a GaAs SP4T switch MMIC suitable for LTE/UMTS/CDMA/GSM applications. The NJG1684ME2 features very low insertion loss, high isolation and excellent linearity performance down to 1.8V control voltage at high frequency up to 2.7GHz. In addition, this switch is able to handle high power signals. The NJG1684ME2 has ESD protection devices to achieve excellent ESD performances. No DC Blocking capacitors are required for all RF ports unless DC is biased externally. And the ultra small & ultra thin EQFN12-E2 package is adopted. I PACKAGE OUTLINE NJG1684ME2 I APPLICATIONS LTE, UMTS, CDMA, GSM applications Post PA Switching, Antenna Switching and Bands Switching applications General Purpose Switching applications I FEATURES G Low voltage logic control G Low voltage operation G Low distortion VCTL(H)=1.8V typ. VDD=2.7V typ. IIP3=+70dBm typ. @f=829+849MHz, PIN=24dBm IIP3=+69dBm typ. @f=1870+1910MHz, PIN=24dBm 2nd harmonics=-80dBc typ. @f=0.9GHz, PIN=35dBm 3rd harmonics=-77dBc typ. @f=0.9GHz, PIN=35dBm G Low insertion loss 0.25dB typ. @f=0.9GHz, PIN=35dBm, VDD=2.7V 0.30dB typ. @f=1.9GHz, PIN=33dBm, VDD=2.7V 0.35dB typ. @f=2.7GHz, PIN=27dBm, VDD=2.7V G P-0.1dB 36dBm min. G Ultra small & ultra thin package EQFN12-E2 (Package size: 1.8 x 1.8 x 0.397mm) G RoHS compliant and Halogen Free, MSL1 I PIN CONFIGURATION (TOP VIEW) VCT VCT 6 5 VDD 4 DECODER 3 GND P4 8 2 P2 P3 9 1 P1 GND 7 10 GND 11 12 PC GND Pin connection 1. P1 7. GND 2. P2 8. P4 3. GND 9. P3 4. VDD 10. GND 5. VCTL2 11. PC 6. VCTL1 12. GND Exposed PAD: GND I TRUTH TABLE VCTL1 L H L H “H”=VCTL(H), “L”=VCTL(L) VCTL2 L L H H Path PC-P1 PC-P2 PC-P3 PC-P4 NOTE: Please note that any information on this catalog will be subject to change. Ver.2013-12-25 -1- NJG1684ME2 I ABSOLUTE MAXIMUM RATINGS Ta=+25°C, Z s=Zl=50ohm PARAMETER SYMBOL CONDITIONS RATINGS UNITS RF Input Power PIN VDD =2.7V, VCTL=0/1.8V 37 dBm Supply Voltage VDD VDD terminal 5.0 V Control Voltage VCTL VCTL1, VCTL2 terminal 5.0 V 1200 mW Four-layer FR4 PCB with through-hole (101.5x114.5mm), Tj=150°C Power Dissipation PD Operating Temp. Topr -40~+85 °C Storage Temp. Tstg -55~+150 °C I ELECTRICAL CHARACTERISTICS 1 (DC) (General conditions: Ta=+25°C, Z s=Zl=50ohm, VDD=2.7V, VCTL(H)=1.8V, VCTL(L)=0V, with application circuit) PARAMETERS SYMBOL CONDITIONS MIN TYP MAX UNITS 2.375 2.7 5.0 V Supply Voltage VDD VDD Terminal Operating Current IDD No RF input - 180 400 µA Control Voltage (LOW) VCTL(L) VCTL1, VCTL2 Terminal 0 - 0.45 V Control Voltage (HIGH) VCTL(H) VCTL1, VCTL2 Terminal 1.35 1.8 5.0 V - 4 10 µA Control Current -2- ICTL VCTL(H)=1.8V NJG1684ME2 I ELECTRICAL CHARACTERISTICS 2 (RF) (General conditions: Ta=+25°C, Z s=Zl=50ohm, VDD=2.7V, VCTL(H)=1.8V, VCTL(L)=0V, with application circuit) PARAMETERS CONDITIONS SYMBOL MIN TYP MAX UNITS Insertion Loss 1 LOSS1 f=0.9GHz, PIN=35dBm - 0.25 0.40 dB Insertion Loss 2 LOSS2 f=1.9GHz, PIN=33dBm - 0.30 0.45 dB Insertion Loss 3 LOSS3 f=2.7GHz, PIN=27dBm - 0.35 0.50 dB Isolation 1 ISL1 f=0.9GHz, PIN=35dBm 30 37 - dB Isolation 2 ISL2 f=1.9GHz, PIN=33dBm 25 29 - dB Isolation 3 ISL3 f=2.7GHz, PIN=27dBm 22 25 - dB Input Power at 0.1dB Compression Point P-0.1dB f=0.9GHz, 1.9GHz, 2.7GHz 36 - - dBm 2nd Harmonics 1 2fo(1) f=0.9GHz, PIN=35dBm - -80 -70 dBc 2nd Harmonics 2 2fo(2) f=1.9GHz, PIN=33dBm - -80 -70 dBc 2nd Harmonics 3 2fo(3) f=2.7GHz, PIN=27dBm - -90 -70 dBc 3rd Harmonics 1 3fo(1) f=0.9GHz, PIN=35dBm - -77 -70 dBc 3rd Harmonics 2 3fo(2) f=1.9GHz, PIN=33dBm - -77 -70 dBc 3rd Harmonics 3 3fo(3) f=2.7GHz, PIN=27dBm - -90 -70 dBc Input 3rd order intercept point1 IIP3(1) f=829+849MHz, PIN=24dBm each *1 +65 +70 - dBm Input 3rd order intercept point2 IIP3(2) f=1870+1910MHz, PIN=24dBm each *1 +63 +69 - dBm VSWR VSWR On-state ports, f=2.7GHz - 1.2 1.4 TSW 50% VCTL to 10/90% RF - 1.0 5.0 Switching time µs *1: IIP3 are defined by the following equations. IIP3=(3 x Pout-IM3)/2+LOSS -3- NJG1684ME2 I TERMINAL INFORMATION No. SYMBOL 1 P1 RF transmitting/receiving port. 2 P2 RF transmitting/receiving port. 3 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 4 VDD Positive voltage supply terminal. The positive voltage (+2.375~+5V) has to be supplied. Please connect a bypass capacitor with GND terminal for excellent RF performance. 5 VCTL2 Control signal input terminal. This terminal is set to High-Level (+1.35~+5.0V) or Low-Level (0~+0.45V). 6 VCTL1 Control signal input terminal. This terminal is set to High-Level (+1.35~+5.0V) or Low-Level (0~+0.45V). 7 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 8 P4 RF transmitting/receiving port. 9 P3 RF transmitting/receiving port. 10 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. 11 PC RF transmitting/receiving port. Please connect an inductor with GND terminal for ESD protection. 12 GND Ground terminal. Please connect this terminal with ground plane as close as possible for excellent RF performance. Exposed Pad GND Ground terminal. -4- DESCRIPTION NJG1684ME2 I ELECTRICAL CHARACTERISTICS (With Application circuit, Loss of external circuit are excluded) Loss, ISL vs Frequency Loss, ISL vs Frequency (PC-P1 ON, V =2.7V) DD 0.0 -0.2 -5 -0.2 -0.4 -10 -0.4 -0.6 -15 -0.6 -15 -0.8 -20 -0.8 -20 -1.0 -25 -1.0 -25 -1.2 -30 -1.2 -30 -1.4 -35 -1.4 -35 -1.6 -40 -1.6 -40 -1.8 -45 PC-P2 ISL PC-P3 ISL PC-P4 ISL -2.2 -2.4 0.0 0.5 1.0 1.5 2.0 -2.0 -55 -2.2 PC-P1 ISL PC-P3 ISL PC-P4 ISL -2.4 0.0 0.5 1.0 Frequency (GHz) 2.5 -55 -60 3.0 (PC-P4 ON, V =2.7V) DD -0.2 0 0.0 -5 -0.2 DD 0 -5 -0.6 -15 -0.8 -20 -0.8 -20 -1.0 -25 -1.0 -25 -1.2 -30 -1.2 -30 -1.4 -35 -1.4 -35 -1.6 -40 -1.6 -40 -1.8 -45 PC-P1 ISL PC-P2 ISL PC-P4 ISL -2.0 -2.2 -2.4 0.0 0.5 1.0 1.5 2.0 -2.0 -55 -2.2 -10 PC-P4 LOSS -1.8 -50 -60 3.0 2.5 Insertion Loss (dB) -0.4 -15 PC-P3 LOSS Isolation (dB) -10 -0.6 PC-P1 ISL PC-P2 ISL PC-P3 ISL -2.4 0.0 0.5 1.0 Frequency (GHz) 1.5 2.0 2.5 -45 -50 -55 -60 3.0 Frequency (GHz) Switching Time VSWR vs Frequency (V =2.7V) (PC-P1/P2, V =2.7V, VCTL1=0/1.8V, VCTL2=0V) DD DD 2.0 VCTL1 1.8 Voltage (arb. unit) PC-P1 ON PC-P2 ON PC-P3 ON PC-P4 ON 1.9 VSWR :PC Port Insertion Loss (dB) 2.0 -50 Loss, ISL vs Frequency (PC-P3 ON, V =2.7V) -0.4 1.5 -45 Frequency (GHz) Loss, ISL vs Frequency 0.0 -10 PC-P2 LOSS -1.8 -50 -60 3.0 2.5 -5 Isolation (dB) -2.0 0 Isolation (dB) PC-P1 LOSS Insertion Loss (dB) 0 Isolation (dB) Insertion Loss (dB) (PC-P2 ON, V =2.7V) DD 0.0 1.7 1.6 1.5 1.4 1.3 0.60us 0.96µ µs P1 1.2 1.1 1.0 0.0 0.5 1.0 1.5 2.0 Frequency (GHz) 2.5 3.0 Time (1us/div) -5- NJG1684ME2 I ELECTRICAL CHARACTERISTICS (With Application circuit, Loss of external circuit are excluded) Loss, ISL vs Input Power vs Input Power (P1-PC ON, f=0.9GHz) (P1-PC ON, f=0.9GHz) 38 450 Output Power (dBm) DDDD 34 V VDD=2.7V =2.7V 32 V DD=5.0V 350 DD =3.5V V VDD=3.5V DD V =5.0V 300 DD 30 250 28 200 26 150 24 100 22 50 20 Insertion Loss (dB) 400 DD =2.375V Operation Current I DD V V VDD=2.5V =2.5V (µ µ A) V =2.375V 36 22 24 26 28 30 32 34 36 0 -0.2 -5 -0.4 -10 V =2.375V -0.6 DD -0.8 DD DD DD DD -1.0 VV =5.0V =3.5V -25 -1.2 V =5.0V -30 DD DD DD -1.4 -35 -1.6 -40 -1.8 -45 -50 20 38 22 24 26 vs Input Power DD DD V =3.5V V DD =2.7V 350 V DD =5.0V VDD =3.5V DD 300 V =5.0V DD 30 250 28 200 26 150 24 100 22 Insertion Loss (dB) DD DD 400 V DD =2.5V V =2.5V V =2.7V Operation Current I V =2.375V (µ µ A) VDD=2.375V Output Power (dBm) 32 34 36 38 (P1-PC ON, f=1.9GHz) 450 32 30 Loss, ISL vs Input Power (P1-PC ON, f=1.9GHz) 34 28 Input Power (dBm) 38 36 -20 DD DD V =2.7V VV =3.5V =2.7V Input Power (dBm) Output Power, I -15 VDD =2.375V VV =2.5V =2.5V -2.0 0 20 0.0 PC-P2 Isolation (dB) DD 0.0 0 -0.2 -5 -0.4 -10 -0.6 -15 -0.8 -20 -1.0 -25 -1.2 -30 -1.4 -35 =2.375V V V =2.375V -1.6 DD DD V =5.0V DD DD -1.8 DD -40 DD V =2.5V DD V =2.7V V =2.5V 50 V =3.5V V =3.5V DD PC-P2 Isolation (dB) Output Power, I V =5.0V -45 V =2.7V DD DD 20 -2.0 0 22 24 26 28 30 32 34 36 -50 20 38 22 24 26 DD vs Input Power DD Output Power (dBm) DD V =2.7V V =5.0V 350 32 V =3.5V 300 V =3.5V DD DD DD DD V =5.0V DD 250 28 200 26 150 24 100 22 20 22 24 26 28 30 32 34 Input Power (dBm) -6- 36 38 Insertion Loss (dB) V =2.5V V =2.7V 34 (µ µ A) DD DD 400 DD V DD =2.5V Operation Current I V =2.375V V =2.375V 20 34 36 38 (P1-PC ON, f=2.7GHz) 450 30 32 Loss, ISL vs Input Power (P1-PC ON, f=2.7GHz) 38 36 30 Input Power (dBm) Input Power (dBm) Output Power, I 28 0.0 0 -0.2 -5 -0.4 -10 -0.6 -15 -0.8 -20 -1.0 -25 -1.2 -30 V =2.375V DD VV =2.375V =2.5V -1.4 -35 DD DD VV =2.5V =2.7V DD VDD =2.7V -1.6 -40 DD VV =3.5V =3.5V DD DD 50 -1.8 0 -2.0 -45 V =5.0V V =5.0V DD DD -50 20 22 24 26 28 30 32 34 Input Power (dBm) 36 38 PC-P2 Isolation (dB) 20 NJG1684ME2 I ELECTRICAL CHARACTERISTICS (With Application circuit, Loss of external circuit are excluded) Loss, ISL vs Temperature Loss, ISL vs Temperature (f=1.9GHz, P =33dBm, PC-P1 ON) IN -0.2 -5 -0.2 -5 -0.4 -10 -0.4 -10 -0.6 -15 -0.8 -20 -1.0 -25 -1.2 -30 -0.6 -15 V =2.375V DD V =2.375V V =2.5V -0.8 -20 DD V DD =2.5V V =2.7V V =2.7V DD DD DD -1.0 V =3.5V V =5.0V -25 V =5.0V -30 V =3.5V DD DD DD -1.2 DD -1.4 -35 -1.6 -40 Insertion Loss (dB) 0.0 PC-P2 Isolation (dB) Insertion Loss (dB) IN 0 0.0 -1.4 -35 V =2.375V -1.6 V =3.5V DD V =2.375V DD DD =2.5V V V=2.5V -2.0 -50 0 50 -2.0 -50 50 -50 100 o Ambient Temperature ( C) VSWR vs Temperature (f=2.7GHz, P =27dBm, PC-P1 ON) -0.2 -45 0 Loss, ISL vs Temperature IN DD V =2.7V Ambient Temperature ( C) 0.0 DD DD DD -50 100 o V =5.0V V =5.0V V =2.7V -1.8 -45 -40 DD V =3.5V DDDD -1.8 0 PC-P2 Isolation (dB) (f=0.9GHz, P =35dBm, PC-P1 ON) (f=2.7GHz, P1-PC ON) 0 2.0 -5 1.9 V =2.375V DD -10 -0.6 -15 -0.8 -20 -1.0 -25 -1.2 -30 V =2.375V DD -1.4 -1.6 V V =2.5V =2.375V -35 DDDD =2.5V V V =2.7V DD -40 DD V =2.7V V V =3.5V =3.5V V =2.7V DD V =3.5V 1.7 DD V =5.0V DD 1.6 1.5 1.4 1.3 1.2 DD DDDD -1.8 DD 1.8 VSWR:PC Port -0.4 PC-P2 Isolation (dB) Insertion Loss (dB) V =2.5V 1.1 -45 =5.0V V V =5.0V DD DD -2.0 -50 0 1.0 -50 -50 100 50 I ,I DD CTL (P2-PC ON, V 300 (PC-P1, VCTL1=H/L, VCTL2=L) =1.8V, No RF signal input) 3.0 12 VV =2.375V =2.375V 8 V =5.0V DD 150 6 100 I CTL 50 4 2 2.5 Switching Time (µ µ s) DD (µ µ A) DD V =3.5V CTL 10 DD Control Current I (µ µ A) V =2.5V V =2.5V V =2.7V DD Operationg Current I DD DD DD 200 100 Switching Time vs Temperature V =2.375V 250 50 Ambient Temperature ( C) vs Temperature CTL(H) 0 o o Ambient Temperature ( C) VV =2.7V =2.5V DD DD DD V =3.5V V =2.7V DD VDD =5.0V DD 2.0 V =3.5V DD V =5.0V DD 1.5 rise 1.0 0.5 fall 0 -50 0 0 100 50 o Ambient Temperature ( C) 0.0 -50 0 50 100 o Ambient Temperature ( C) -7- NJG1684ME2 I APPLICATION CIRCUIT (TOP VIEW) C1 VCTL1 VCTL2 VDD 6 8 P3 9 4 DECODER 7 P4 5 3 2 P2 1 P1 C1 10 11 12 L1 PC PRECAUTIONS [1] The Inductor L1 is required for enhancing ESD protection level. [2] All RF terminals are biased DC GND level. [3] No DC block capacitors are required for RF ports unless DC is biased externally. I PARTS LIST -8- No. Parameters C1 1000pF L1 68nH Note MURATA (GRM15) TAIYO-YUDEN (HK1005) NJG1684ME2 I PCB LAYOUT (TOP VIEW) GND VCTL2 GND VCTL1 VDD P2 P4 PCB: Capacitor Size: Strip Line Width: PCB Size: FR-4, t=0.2mm 1005 0.4mm 26 x 26mm C1 Losses of PCB and connectors, Ta=+25°C P1 P3 1pin mark Frequency (GHz) Loss (dB) 0.9 0.27 1.9 0.50 2.7 0.61 PC <PCB LAYOUT GUIDELINE> (TOP VEIW) PCB PKG Terminal PKG Outline GND Via Hole Diameter: φ= 0.2mm I PRECAUTIONS [1] No DC block capacitors are required for RF ports unless DC is biased externally. When the other device is biased at certain voltage and connected to the NJG1684ME2, a DC block capacitor is required between the device and the switch IC. This is because the each RF port of NJG1684ME2 is biased at 0 V (GND). [2] For good RF performance, all GND terminals must be connected to PCB ground plane of substrate, and via-holes for GND should be placed near the IC. [3] For good RF performance, through-holes for GND should be placed close to the GND pin 6 and pin 13. One of the ways to do this is to place a via-hole at the TAB pad under this IC. -9- NJG1684ME2 I RECOMMENDED FOOTPRINT PATTERN (EQFN12-E2 PACKAGE Reference) : Land : Mask (Open area) *Metal mask thickness : 100um PKG : 1.8mm x 1.8mm Pin pitch : 0.4mm : Resist(Open area) Detail A - 10 - NJG1684ME2 I PACKAGE OUTLINE (EQFN12-E2) Terminal Treat Board Molding Material Weight : SnBi : Copper : Epoxy resin : 3.7mg Unit : mm Exposed PAD Ground connection is required. Cautions on using this product This product contains Gallium-Arsenide (GaAs) which is a harmful material. • Do NOT eat or put into mouth. • Do NOT dispose in fire or break up this product. • Do NOT chemically make gas or powder with this product. • To waste this product, please obey the relating law of your country. [CAUTION] The specifications on this databook are only given for information, without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. This product may be damaged with electric static discharge (ESD) or spike voltage. Please handle with care to avoid these damages. - 11 -