PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 http://www.para.com.tw E-mail: [email protected] DATA SHEET PART NO.: L-C170LGCT REV: B / 5 CUSTOMER’S APPROVAL : _______________ DCC : ____________ DRAWING NO. : DS-72-04-0001 DATE : 2011-07-28 PAGE 1 of 14 PARA-FOR-065 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z PACKAGE OUTLINE DIMENSIONS BACK VIEW TOP VIEW 1.05 1.25 SIDE VIEW MOLDING BODY (LENS) P.C BOARD R0.10 0.45 POLARITY LED DICE SOLDERING TERMINAL CATHODE 2.00 + 1.50 REF. 0.95 0.45 5.00° 0.80 0.28 ~ 0.30 0.35 Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.1mm (.004") unless otherwise noted. z Features ½ ½ ½ ½ ½ ½ ½ ½ Top view, wide view angle, single color Chip LED. Package in 8mm tape on 7" diameter reels. Compatible with automatic Pick & Place equipment. Compatible with Infrared and Wave soldering reflow solder processes. EIA STD package. I.C. compatible. Pb free product. Meet RoHS Green Product. DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 2 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z Chip Materials ½ ½ ½ Dice Material : InGaN Light Color : Super Green Lens Color : Water Clear z Absolute Maximum Ratings(Ta=25℃) Symbol Parameter Rating Unit PD Power Dissipation 100 mW IPF Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) 100 mA IF Continuous Forward Current 25 mA - De-rating Linear From 25℃ 0.25 mA/℃ 5 V 150 V VR Reverse Voltage Note A ESD Electrostatic Discharge Threshold(HBM) Topr Operating Temperature Range -40 ~ +85 ℃ Tstg Storage Temperature Range -40 ~ +85 ℃ Note A : HBM : Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD. z Electro-Optical Characteristics(Ta=25℃) Parameter Luminous Intensity Unit Test Condition 300.0 mcd IF=20mA Symbol Min. Typ. IV 160.0 Max. Viewing Angle 2θ1/2 130 deg Note 2 Peak Emission Wavelength λp 518 nm Measurement @Peak Dominant Wavelength λd 525 nm IF=20mA Spectral Line Half-Width Δλ 15 nm Forward Voltage VF 3.1 Reverse Current IR DRAWING NO. : DS-72-04-0001 PARA-FOR-068 3.6 V IF =20mA 100 μA VR = 5V DATE : 2011-07-28 PAGE 3 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z Bin Code List Luminous Intensity(IV), Unit:mcd@20mA Bin Code Min Max S 180 280 T 280 450 Forward Voltage(VF), Unit:V@20mA Bin Code Tolerance of each bin are±15% Min Max K8 2.8 2.95 K9 2.95 3.10 K10 3.10 3.25 K11 3.25 3.40 Tolerance of each bin are±0.1Volt Dominant Wavelength (Hue),Unit: nm@20mA Bin Code Min Max AP 520 525 AQ 525 530 Tolerance of each bin are±1nm Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model : 2400. DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 4 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z Typical Electro-Optical Characteristics Curves Luminous lntensity(mcd) (25℃Ambient Temperature Unless Otherwise Noted) Fig.2 Forward Current vs.Forward Voltage Fig.3 Luminous Intensity vs.Forward Current Relative luminous intensity(%) Relative Luminous lntensity Normalized of 20mA 1000 100 10 1 -60 -40 -20 -0 20 40 60 80 100 Ambient Temperature Ta(℃) Fig.4 Relative Luminous Intensity vs.Forward Current Fig.5 Luminous Intensity vs.Ambient Temperature 0° Forward Current IF(mA) 50 10° 20° 30° 40 30 25 20 1.0 40° 0.9 50° 0.8 60° 70° 80° 90° 10 0.7 0 0 20 40 60 80 100 0.5 0.3 0.1 0.2 0.4 0.6 Ambient Temperature Ta(℃) Fig.6 Forward Current Derating Curve DRAWING NO. : DS-72-04-0001 PARA-FOR-068 Fig.7 Relative Intensity vs.Angle DATE : 2011-07-28 PAGE 5 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z Label Explanation CUS. PART NO: To be denominated. CUSTOMER: To be denominated. PART NO: Refer to P14 IV --- Luminous Intensity Code VF --- Forward Voltage Code WD --- Dominant Wavelength Code LOT NO: E L S 6 8 0001 A B C D E F A---E: For series number B---L: Local F: Foreign C---S:SMD D---Year E---Month F---SPEC. PACKING QUANTITY OF BAG : 3000pcs for 150、170、110、155、115 series 4000pcs for 191 series 5000pcs for 192 series DATE CODE：2006 06 08 G H I G--- Year H--- Month I --- Day DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 6 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z Typical Electro-Optical Characteristics Curves Fig.1 Relative Intensity vs. Wavelength z Reel Dimensions Notes: 1. Taping Quantity : 3000pcs 2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm. DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 7 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z Package Dimensions Of Tape And Reel Progressive direction Polarity Notes:All dimensions are in millimeters. Label H:\SMD\SMD \SM D包装 \标签 .jpg H:\SMD\SMD \SM D包装 \标签 .jpg 包装 \标签 MD \SMD H :\S MD\S .jpg Moisture Resistant Packaging Reel Label Desiccant Aluminum moistue-proof bag 240 \ SM H :\ SMD D\ SM 装\ D包 pg 标签.j 145 210 255 Label Box 435 Carton Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 8 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z Cleaning ½ ½ ½ If cleaning is required , use the following solutions for less than 1 minute and less than 40℃. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. z Suggest Soldering Pad Dimensions Direction of PWB camber and go to reflow furnace DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 9 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT ● Suggest Sn/Pb IR Reflow Soldering Profile Condition: ● Suggest Pb-Free IR Reflow Soldering Profile Condition: DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 REV:B / 5 PAGE 10 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 z CAUTIONS 1.Application Limitation : The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household application).Consult PARA’s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices). 2.Storage : Before opening the package : The LEDs should be store kept at 5°C to 30°C or less and 85%RH or less. After opening the package : The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours(7 days) after opening the package. Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. LEDs stored out of their original packaging for more than a week should be baked at 30°C for at 24 hours before solder assembly. 3.Soldering Do not apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition. Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. Soldering Iron : (Not recommended) Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 11 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 Wave soldering : Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed consecutively cooling process is required between 1st and 2nd soldering processes. 4. Lead-Free Soldering For Reflow Soldering : 1、Pre-Heat Temp:150-180℃,120sec.Max. 2、Soldering Temp:Temperature Of Soldering Pot Over 230℃,40sec.Max. 3、Peak Temperature:260℃，5sec. 4、Reflow Repetition:2 Times Max. 5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu For Soldering Iron (Not Recommended) : 1、Iron Tip Temp:350℃ Max. 2、Soldering Iron:30w Max. 3、Soldering Time:3 Sec. Max. One Time. For Dip Soldering : 1、Pre-Heat Temp:150℃ Max. 120 Sec. Max. 2、Bath Temp:265℃ Max. 3、Dip Time:5 Sec. Max. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 12 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT REV:B / 5 6.Reliability Test Classification Test Item Test Condition Reference Standard Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) IR-Reflow In-Board, 2 Times Ta= 65±5℃,RH= 90～95% *Test Time= 1000HRS±2HRS MIL-STD-202F:103B(1980) JIS C 7021:B-11(1982) Ta= 105±5℃ Test Time= 1000HRS (-24HRS,72HRS) MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) Ta= -55±5℃ *Test Time=1000HRS (-24HRS,72H RS) JIS C 7021:B-12 (1982) Temperature Cycling 105±5℃ 10mins MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021:A-4(1982) Thermal Shock IR-Reflow In-Board, 2 Times 105±5℃ -55℃±5℃ 10mins 10mins 100 Cycles MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) Tsol= 260 ± 5℃ Dwell Time= 10 ± 1sec MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021:A-1(1982) Tsol= 235 ± 5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) IEC 68 Part 2-20 JIS C 7021:A-2(1982) Operation Life High Temperature Endurance Test High Humidity Storage High Temperature Storage Low Temperature Storage Environmental Test Solder Resistance Solder ability -55±5℃ 10mins 100 Cycles 7.Others: The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO. : DS-72-04-0001 PARA-FOR-068 DATE : 2011-07-28 PAGE 13 of 14 SURFACE MOUNT DEVICE LED Part No. : L-C170LGCT z PART NO. SYSTEM : L–C 1 7 0 X C X X - X X X X REV:B / 5 XXXX : Special specification for customer T : Taping for 7 inch reel TC : Taping for 13 inch reel TH : IV half binning TP : Wavelength binning Lens color C : Water Clear W : White Diffused T : Color Transparent D : Color Diffused G : Gap 570nm Green Y : GaAsp 585 nm Yellow E : GaAsp 620 nm Orange SR : GaAlAs 634 nm Red KG : AlInGap 570nm Super Green KY : AlInGap 590nm Super Yellow KF : AlInGap 605nm Super Amber KR : AlInGap 630 nm Super Red LB : InGaN 470nm Blue LG: InGaN 525nm Green 0 : Single chip 1/2 : Super thin single chip 5/6 : Dual chip F : Three chip(Full color) C : Top View Type S : Side View Type DRAWING NO. : DS-72-04-0001 PARA-FOR-068 150 : 1206 1.1T 170 : 0805 0.8T 191 : 0603 0.6T 192 : 0603 0.4T 110 : 1206 1.0T DATE : 2011-07-28 Type Type Type Type Type PAGE 14 of 14