PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 E-mail: [email protected] http://www.para.com.tw DATA SHEET PART NO.: L-T670HYCT REV: A / 0 CUSTOMER’S APPROVAL : _______________ DCC : ____________ DRAWING NO. : DS-7A-10-0004 DATE :2010-04-12 PAGE 1 of 15 PARA-FOR-065 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 Features Top view, Wide view angle, Yellow color PLCC 2 package SMD LED . EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001). Compatible with automatic Pick & Place equipment. Compatible with IR Reflow soldering and TTW soldering. Pb free product and acceptable lead-free process! Meet RoHS Green Product. Application Backlighting ( Switches, keys, displays, illuminated advertising) Emergency lighting / Signal and symbol luminaries. Package Outline Dimensions TOP VIEW SIDE VIEW 3.50 2.80 2.70 0.15 c 0.80 2.40 3.20 + POLARITY BACK VIEW - 0.80 2.18 1.90 FRONT VIEW 0.75 0.75 Notes: 1. All dimensions are in millimeters. 2. Tolerance is 0.10mm (.004") unless otherwise noted. DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 2 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 CHIP MATERIALS Dice Material : AlInGaP Light Color : Yellow Lens Color : Water Clear Absolute Maximum Ratings(Ta=25) Symbol PD Parameter Power Dissipation Peak Forward Current IPF (1/10 Duty Cycle, 0.1ms Pulse Width) Rating Unit 75 mW 100 mA IF Continuous Forward Current 20 mA VR Reverse Voltage 5 V ESD Electrostatic Discharge Threshold (HBM)Note A 2000 V Topr Operating Temperature Range -40 ~ + 85 Tstg Storage Temperature Range -40 ~ + 85 Tsld Soldering Temperature (One times MAX.) Reflow Soldering:260 (for 10seconds) Hand Soldering:350 (for 3 seconds) Note A : HBM : Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD. Electro-Optical Characteristics (Ta=25) Parameter Symbol Min. Typ. IV 300 Luminous Intensity Viewing Angle Dominant Wavelength 2 Unit Test Condition 500 mcd IF=20mA 1/2 120 Deg D 590 nm IF=20mA 15 nm IF=20mA 2.4 V IF = 20mA 10 Spectrum Radiation Bandwidth Forward Voltage VF Reverse Current IR DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 2.0 Max. A DATE :2010-04-12 VR = 5V PAGE 3 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model : 2400. Typical Electro-Optical Characteristics Curves Fig.1 Relative Intensity vs. Wavelength DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 4 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 Typical Electro-Optical Characteristics Curves Relative Luminous lntensity Normalized of 20mA (25 Ambient Temperature Unless Otherwise Noted) Ta=25 Ta=25 Fig. Relative Luminous Intensity vs.Forward Current Fig.1 Forward Current vs.Forward Voltage 50 Forward Current IF(mA) IFP=60mA IFP=20mA IFP=5mA 40 30 20 10 0 0 1 0.5 0.2 0.1 -40 -20 0 20 40 80 100 Ambient Temperature Ta( ) Fig.5 Luminous Intensity vs.Ambient Temperature DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 60 80 100 Fig.4 Forward Current Derating Curve Allowable Forward Current IFP(mA) Relative luminous intensity Fig.3 Ambient Temperature vs.Forward Voltage IFP=20mA 40 Ambient Temperature Ta( ) Ambient Temperature Ta( ) 2 20 0 200 100 10 20 Ta=25 30 50 1.0 40 0.9 30 50 0.8 20 10 1 0.7 5 10 20 50 100 0.5 0.3 0.1 0.2 0.4 0.6 60 70 80 90 Ambient Temperature Ta( ) Fig.6 Forward Current Derating Curve DATE :2010-04-12 Fig.7 Spatial Distribution PAGE 5 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 Bin Code List Luminous Intensity(IV), Unit:mcd@20mA Bin Code Min Max P16 280 350 P17 350 P18 P19 Forward Voltage(VF), Unit:V@20mA Min Max 4 1.9 2.0 430 5 2.0 2.1 430 530 6 2.1 2.2 530 650 7 2.2 2.3 Tolerance of each bin are Bin Code % Tolerance of each bin are 0.1Volt Dominant Wavelength (Hue),Unit: nm@20mA Bin Code Min Max YA 587 590 YB 590 593 YC0 593 595 Tolerance of each bin are 1nm DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE 2010-04-12 PAGE 6 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 Label Explanation CUS. PART NO: To be denominated. CUSTOMER: To be denominated. PART NO: Refer to P15 IV--- Luminous Intensity Code VF--- Forward Voltage Code WD--- Dominant Wavelength LOT NO: E L P 7 8 A B C D E 0001 F A---E: For series number B---L: Local F: Foreign C---P:PLCC SMD D---Year E---Month F---SPEC. PACKING QUANTITY OF BAG : 2000pcs max for T670 series 2000pcs max for T650 series 2000pcs max for S020 series DATE CODE 2007 G G--- Year H--- Month I --- Day 08 H 23 I DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 7 of 15 Reel Dimensions SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT Notes: 1. Taping Quantity : 2000pcs max 2. The tolerances unless noted is 0.1mm, Angle 0.5 Suggest Soldering Pad Dimensions DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 REV: A / 0 , Unit: mm. DATE :2010-04-12 PAGE 8 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 Package Dimensions Of Tape And Reel *0.23± 0.03 (.009± .001) Notes: All dimensions are in millimeters. Packaging Of Electronic Components On Continuous Tapes DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 9 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 ? ? .jpg Moisture Resistant Packaging \ ? ? .jpg D\SM D\SM H :\SM D \ ? ? .jpg H:\SMD\SMD\SMD \ H:\SMD\SMD\SMD Label Reel Label Desiccant Aluminum moistue-proof bag 240 H:\SM D\SMD \SMD \ ? ? .jpg 145 210 5 25 Label Box 435 Carton Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. Cleaning If cleaning is required , use the following solutions for less than 1 minute and less than 40 . Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not.) Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be confirm whether any damage to the LEDS will occur. DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 10of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 Suggest Sn/Pb IR Reflow Soldering Profile Condition: Suggest Pb-Free IR Reflow Soldering Profile Condition: DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 11 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 CAUTIONS 1. Static Electricity: * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF>2.0V,at IF=0.5m A ) 2. Storage : * Before opening the package : The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. * After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to reseal the moisture proof bag again. If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should e performed using the following conditions. Baking treatment: more than 24hours at 65±5. * Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3. Soldering: Do not apply any stress to the LED lens during soldering while the LED is at high temperature. Recommended soldering condition. * Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. * Soldering Iron : (Not recommended) Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 12 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT REV: A / 0 4. Lead-Free Soldering For Reflow Soldering : 1Pre-Heat Temp: 150-180,120sec.Max. 2Soldering Temp: Temperature Of Soldering Pot Over 240,40sec.Max. 3Peak Temperature: 26010sec. 4Reflow Repetition: 2 Times Max. 5Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu For Soldering Iron (Not Recommended) : 1Iron Tip Temp: 350 Max. 2Soldering Iron: 30w Max. 3Soldering Time: 3 Sec. Max. One Time. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. 6. Reliability 1 Criteria For Judging The Damage Item Symbol Test Conditions Forward Voltage VF Reverse Current Luminous Intensity Criteria for Judgement MIN. Max. IF=20mA - U.S.L.*) 1.1 IR VR=5V - U.S.L.*) 2.0 IV IF=20mA L.S.L**) 0.7 U.S.L.: Upper Standard Level **) L.S.L: Lower Standard Level - DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 13 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT 2 REV: A / 0 Test Items And Results Test Item Reference Standard Test Condition Note Tsld=260 ,10sec. 2times (Pre treatment 30 ,70%,168hrs) Solder ability (Reflow Tsld=215 ,3sec. 1time JEITA (Lead Solder) over 95% Soldering) ED-4701300 303 JEITA -40 ~ 100 Thermal Shock 100cycles 30min. 30min. ED-4701300 307 JEITA -40 ~ 25 ~100 ~25 Temperature Cycle 100cycles ED-4701100 105 30min. 5min. 30min. 5min JEITA ED-4701200High Temperature Storage Ta=100 1000hrs. 201 JEITA Temperature Humidity Storage Ta=60 ,RH=90% 1000hrs. ED-4701100 103 JEITA Low Temperature Storage Ta=-40 1000hrs. ED-4701200 202 Steady State Operating Life 1000hrs. Ta=25 ,IF=20mA Condition Steady State Operating Life Ta=60 ,RH=90%,IF=15mA 500hrs. of High Humidity Heat Resistance to Soldering Heat JEITA (Reflow Soldering) ED-4701300 301 Number of Damaged 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 7.Others: The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 14 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670HYCT PART NO. SYSTEM : L – T 67 0 X X CT - X X X X REV: A / 0 XXXX : Special specification for customer T : Taping for 7 inch reel TC : Taping for 13 inch reel Lens color C : Water Clear W : White Diffused T : Color Transparent D : Color Diffused KY : 9mil AlInGap 590nm Super Yellow KR : 9mil AlInGap 630 nm Super Red TE : 14mil AlInGap 624 nm Super Red HE 10mil AlInGap 624 nm Super Red TY: 14mil AlInGap590 nm Super Yellow HY: 14mil AlInGap590 nm Super Yellow LB : InGaN ITO rough 470nm Blue LG : InGaN ITO rough520nm Green W : InGaN + YAG White color 0 : Single chip 1/2 : Super thin single chip 5/6 : Dual chip F : Three chip(Full color) 650 : 670 : 020 : 3020 3528 3812 1.3T TYPE 1.9T TYPE 0.6T TYPE C : PCB Top View Type T :PLCC Top View Type S : Side View Type DRAWING NO. : DS-7A-10-0004 PARA-FOR-068 DATE :2010-04-12 PAGE 15 of 15