PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 E-mail: [email protected] http://www.para.com.tw DATA SHEET PART NO.: L-T670KRCT REV: A / 4 CUSTOMER’S APPROVAL : _______________ DCC : ____________ DRAWING NO. : DS-7A-07-0020 DATE : 2009-10-31 PAGE 1 of 15 PARA-FOR-065 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 Features Top view, Wide view angle, Red color PLCC 2 package SMD LED . EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001). Compatible with automatic Pick & Place equipment. Compatible with IR Reflow soldering and TTW soldering. Pb free product and acceptable lead-free process. Meet RoHS Green Product. Application Backlighting (Switches, keys, displays, illuminated advertising) Emergency lighting / Signal and symbol luminaries. Package Outline Dimensions SIDE VIEW TOP VIEW 3.50 2.70 2.80 0.15 c 0.80 2.40 3.20 - POLARITY + BACK VIEW 0.80 2.18 1.90 FRONT VIEW 0.75 0.75 Notes: 1. All dimensions are in millimeters. 2. Tolerance is ± 0.10mm (.004") unless otherwise noted. DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 DATE : 2009-10-31 PAGE 2 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 CHIP MATERIALS Dice Material : AlInGaP Light Color : Red Lens Color : Water Clear Absolute Maximum Ratings(Ta=25) Symbol PD Parameter Power Dissipation Peak Forward Current IPF (1/10 Duty Cycle, 0.1ms Pulse Width) Rating Unit 55 mW 100 mA IF Continuous Forward Current 20 mA VR Reverse Voltage 5 V ESD Electrostatic Discharge Threshold (HBM)Note A 2000 V Topr Operating Temperature Range -40 ~ + 85 Tstg Storage Temperature Range -40 ~ + 100 Tsld Soldering Temperature (One times MAX.) Reflow Soldering:260 (for 10seconds) Hand Soldering:350 (for 3 seconds) Note A : HBM : Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD. Electro-Optical Characteristics (Ta=25) Parameter Luminous Intensity Viewing Angle Dominant Wavelength Symbol Min. Typ. IV 80 2 1/2 D Spectrum Radiation Bandwidth Forward Voltage VF Reverse Current IR DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 Unit Test Condition 100 mcd IF=20mA 120 Deg 630 nm IF=20mA 15 nm IF=20mA 2.5 V IF = 20mA 10 A VR = 5V 2.0 Max. DATE : 2009-10-31 PAGE 3 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact Array Spectrometer and “KEITHLEY” Source Meter Model : 2400. Typical Electro-Optical Characteristics Curves Fig.1 Relative Intensity vs. Wavelength DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 DATE : 2009-10-31 PAGE 4 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 Typical Electro-Optical Characteristics Curves (25 Ambient Temperature Unless Otherwise Noted) Relative Luminous lntensity Normalized of 20mA 50 Ta=25 30 20 10 0 1.0 1.5 2.0 2.5 3.0 3.5 Re lative luminous intensity Fig.1 Forward Current vs.Forward Voltage 2 IFP=20mA 1 0.5 0.2 0.1 -40 -20 0 20 40 A mbient Tempe rature Ta( Ta=25 Fig. Relative Luminous Intensity vs.Forward Current Allowa ble For ward Current IFP(mA) 40 80 100 ) Fig.3 Luminous Intensity vs.Ambient Temperature Ta=25 100 50 30 20 10 1 5 10 20 50 100 Ambient Te mperature Ta( 0° 10° 20° 30° 40 30 20 10 0 ) Fig.4 Forward Current Derating Curve 50 Forward Current IF(mA ) 200 1.0 40° 0.9 50° 0.8 60° 70° 80° 90° 0.7 0 20 40 60 80 A mbient Temperature Ta( 100 Fig.5 Forward Current Derating Curve DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 0.5 0.3 0.1 0.2 0.4 0.6 ) Fig.6 Spatial Distribution DATE : 2009-10-31 PAGE 5 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 Bin Code List Luminous Intensity(IV), Unit:mcd@20mA Bin Code Min Max P10 80 100 P11 100 125 P12 125 155 P13 155 190 Tolerance of each bin are DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 10% DATE : 2009-10-31 PAGE 6 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 Label Explanation CUS. PART NO: To be denominated. CUSTOMER: To be denominated. PART NO: Refer to P15 P11--- Luminous Intensity Code LOT NO: E L P 7 B 0001 A B C D E F A---E: For series number B---L: Local F: Foreign C---P: PLCC SMD D---Year E---Month F---SPEC. PACKING QUANTITY OF BAG : 2000pcs for T670 series 2000pcs for T650 series 2000pcs for S020 series DATE CODE 2007 G G--- Year H--- Month I --- Day 11 H 01 I DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 DATE : 2009-10-31 PAGE 7 of 15 Reel Dimensions SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT Notes: 1. Taping Quantity : 2000pcs 2. The tolerances unless noted is 0.1mm, Angle 0.5 Suggest Soldering Pad Dimensions DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 REV: A / 4 , Unit: mm. DATE : 2009-10-31 PAGE 8 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 Package Dimensions Of Tape And Reel *0.23 0.03 (.009 .001) Notes: All dimensions are in millimeters. Packaging Of Electronic Components On Continuous Tapes DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 DATE : 2009-10-31 PAGE 9 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 ? ? .jpg Moisture Resistant Packaging \ ? ? .jpg D\SM D\SM H :\SM D \ ? ? .jpg H:\SMD\SMD\SMD \ H:\SMD\SMD\SMD Label Reel Label Desiccant Aluminum moistue-proof bag 240 H:\SM D\SMD \SMD \ ? ? .jpg 145 210 5 25 Label Box 435 Carton Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm. Cleaning If cleaning is required , use the following solutions for less than 1 minute and less than 40 . Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not.) Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be confirm whether any damage to the LEDS will occur. DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 DATE : 2009-10-31 PAGE 10of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 Suggest Sn/Pb IR Reflow Soldering Profile Condition: Suggest Pb-Free IR Reflow Soldering Profile Condition: DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 DATE : 2009-10-31 PAGE 11 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 CAUTIONS 1. Static Electricity: * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF>2.0V,at IF=0.5m A ) 2. Storage : * Before opening the package : The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. * After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to reseal the moisture proof bag again. If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should e performed using the following conditions. Baking treatment: more than 24hours at 65±5. * Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. 3. Soldering: Do not apply any stress to the LED lens during soldering while the LED is at high temperature. Recommended soldering condition. * Reflow Soldering : Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max. * Soldering Iron : (Not recommended) Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering. DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 DATE : 2009-10-31 PAGE 12 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT REV: A / 4 4. Lead-Free Soldering For Reflow Soldering : 1Pre-Heat Temp: 150-180,120sec.Max. 2Soldering Temp: Temperature Of Soldering Pot Over 240,40sec.Max. 3Peak Temperature: 26010sec. 4Reflow Repetition: 2 Times Max. 5Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu For Soldering Iron (Not Recommended) : 1Iron Tip Temp: 350 Max. 2Soldering Iron: 30w Max. 3Soldering Time: 3 Sec. Max. One Time 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. 6. Reliability 1 Criteria For Judging The Damage Item Symbol Test Conditions Forward Voltage VF Reverse Current Luminous Intensity MIN. Max. IF=20mA - U.S.L.*)×1.1 IR VR=5V - U.S.L.*)×2.0 IV IF=20mA L.S.L**)×0.7 - *) U.S.L.: Upper Standard Level **) L.S.L: Lower Standard Level DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 Criteria for Judgement DATE : 2009-10-31 PAGE 13 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT 2 REV: A / 4 Test Items And Results Reference Standard Test Item Resistance to Soldering Heat JEITA (Reflow Soldering) ED-4701300 301 Solder ability (Reflow Soldering) Thermal Shock Temperature Cycle High Temperature Storage Temperature Humidity Storage Low Temperature Storage JEITA ED-4701300 303 JEITA ED-4701300 307 JEITA ED-4701100 105 JEITA ED-4701200201 JEITA ED-4701100 103 JEITA ED-4701200 202 Steady State Operating Life Condition Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Ta=100 Ta=60 ,RH=90% Ta=-40 Number of Damaged 0/50 0/50 0/50 0/50 1000hrs. 0/50 1000hrs. 0/50 1000hrs. 0/50 Ta=25 ,IF=20mA 1000hrs. 0/50 Ta=85 ,IF=5mA 500hrs. 0/50 ,RH=90%,IF=15mA 500hrs. 0/50 ,IF=20mA 500hrs. 0/50 48min 0/50 Ta=-30 JEITA ED-4701400 403 Note Tsld=260 ,10sec. 2times (Pre treatment 30 ,70%,168hrs) Tsld=215 ,3sec. 1time (Lead Solder) over 95% -40 ~ 100 100cycles 30min. 30min. -40 ~ 25 ~100 ~25 100cycles 30min. 5min. 30min. 5min Ta=60 Steady State Operating Life of Low Temperature Vibration Test Condition 100~2000~100HzSweep 4min.200m/s2 3direction,4cycles Substrate Bending JEITA ED-4702 3mm,5 1sec 1time 0/50 Stick JEITA ED-4702 5N,10 1sec 1time 0/50 7.Others: The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 DATE : 2009-10-31 PAGE 14 of 15 SURFACE MOUNT DEVICE LED Part No. : L-T670KRCT PART NO. SYSTEM : L – T 67 0 X X T - X X X X REV: A / 4 XXXX : Special specification for customer T : Taping for 7 inch reel TC : Taping for 13 inch reel Lens color C : Water Clear W : White Diffused T : Color Transparent D : Color Diffused KY : 9mil AlInGap 590nm Super Yellow KR : 9mil AlInGap 630 nm Super Red TE : 14mil AlInGap 624 nm Super Red TY: 14mil AlInGap590 nm Super Yellow LB : InGaN ITO rough 470nm Blue LG : InGaN ITO rough 520nm Green W : InGaN + YAG White color …… 0 : Single chip 1/2 : Super thin single chip 5/6 : Dual chip F : Three chip(Full color) C : PCB Top View Type T :PLCC Top View Type S : Side View Type DRAWING NO. : DS-7A-07-0020 PARA-FOR-068 650 : 670 : 020 : 3020 3528 3812 1.3T TYPE 1.9T TYPE 0.6T TYPE DATE : 2009-10-31 PAGE 15 of 15