EM78P173N 8-Bit Microcontroller with OTP ROM Product Specification DOC. VERSION 1.1 ELAN MICROELECTRONICS CORP. July 2011 Trademark Acknowledgments: IBM is a registered trademark and PS/2 is a trademark of IBM. Windows is a trademark of Microsoft Corporation. ELAN and ELAN logo are trademarks of ELAN Microelectronics Corporation. Copyright © 2010 ~ 2011 by ELAN Microelectronics Corporation All Rights Reserved Printed in Taiwan The contents of this specification are subject to change without further notice. ELAN Microelectronics assumes no responsibility concerning the accuracy, adequacy, or completeness of this specification. ELAN Microelectronics makes no commitment to update, or to keep current the information and material contained in this specification. Such information and material may change to conform to each confirmed order. In no event shall ELAN Microelectronics be made responsible for any claims attributed to errors, omissions, or other inaccuracies in the information or material contained in this specification. ELAN Microelectronics shall not be liable for direct, indirect, special incidental, or consequential damages arising from the use of such information or material. The software (if any) described in this specification is furnished under a license or nondisclosure agreement, and may be used or copied only in accordance with the terms of such agreement. ELAN Microelectronics products are not intended for use in life support appliances, devices, or systems. Use of ELAN Microelectronics product in such applications is not supported and is prohibited. NO PART OF THIS SPECIFICATION MAY BE REPRODUCED OR TRANSMITTED IN ANY FORM OR BY ANY MEANS WITHOUT THE EXPRESSED WRITTEN PERMISSION OF ELAN MICROELECTRONICS. ELAN MICROELECTRONICS CORPORATION Hong Kong: USA: No. 12, Innovation 1 Road Hsinchu Science Park Hsinchu, TAIWAN 30076 Tel: +886 3 563-9977 Fax: +886 3 563-9966 [email protected] http://www.emc.com.tw Elan (HK) Microelectronics Corporation, Ltd. Flat A, 19F., World Tech Centre 95 How Ming Street, Kwun Tong Kowloon, HONG KONG Tel: +852 2723-3376 Fax: +852 2723-7780 Elan Information Technology Group (U.S.A.) PO Box 601 Cupertino, CA 95015 U.S.A. Tel: +1 408 366-8225 Fax: +1 408 366-8225 Korea: Shenzhen: Shanghai: Elan Korea Electronics Company, Ltd. Elan Microelectronics Shenzhen, Ltd. ELAN Microelectronics Shanghai, Ltd. 301 Dong-A Building 632 Kojan-Dong, Namdong-ku Incheon City, KOREA Tel: +82 32 814-7730 Fax: +82 32 813-7730 3F, SSMEC Bldg., Gaoxin S. Ave. I Shenzhen Hi-tech Industrial Park (South Area), Shenzhen CHINA 518057 Tel: +86 755 2601-0565 Fax: +86 755 2601-0500 [email protected] Rm101, #3 Lane 289, Bisheng Rd., Zhangjiang Hi-Tech Park Pudong New Area, Shanghai, CHINA 201204 Tel: +86 21 5080-3866 Fax: +86 21 5080-0273 [email protected] Headquarters: st Contents Contents 1 General Description .................................................................................................. 1 2 Features ..................................................................................................................... 1 3 Pin Assignment ......................................................................................................... 2 4 Pin Description.......................................................................................................... 3 4.1 EM78P173N-14PIN............................................................................................ 3 4.2 EM78P173N-10PIN............................................................................................ 4 5 Block Diagram ........................................................................................................... 5 6 Functional Description ............................................................................................. 6 6.1 Operational Registers......................................................................................... 6 6.1.1 6.1.2 6.1.3 6.1.4 6.1.5 6.1.6 6.1.7 6.1.8 6.1.9 6.1.10 6.1.11 6.1.12 6.1.13 6.2 R0 (Indirect Addressing Register) .......................................................................6 R1 (Timer Clock/Counter) ...................................................................................6 R2 (Program Counter and Stack)........................................................................6 R3 (Status Register) ............................................................................................8 R4 (RAM Select Register)...................................................................................8 R5 ~ R6 (Port 5 ~ Port 6) ....................................................................................8 Bank 0 RE (LVD Control Register)......................................................................9 Bank 0 RF (Interrupt Status Register) .................................................................9 Bank 1 R5 (TBHP: Table Point Register for Instruction TBRD) ........................10 Bank 1 R6 (TBLP: Table Point Register for Instruction TBRD) .........................10 Bank 1 RE (LVD Interrupt and Wake-up Register)............................................10 Bank 1 RF (System Control Register)...............................................................11 R10 ~ R3F .........................................................................................................14 Special Function Registers............................................................................... 15 6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.2.6 6.2.7 6.2.8 A (Accumulator).................................................................................................15 CONT (Control Register)...................................................................................15 IOC5 ~ IOC6 (I/O Port Control Register) ..........................................................16 IOCB (Pull-down Control Register) ...................................................................16 IOCC (Open-drain Control Register).................................................................16 IOCD (Pull-high Control Register).....................................................................17 IOCE (WDT Control Register) ...........................................................................17 IOCF (Interrupt Mask Register).........................................................................18 6.3 TCC/WDT and Prescaler.................................................................................. 18 6.4 I/O Ports ........................................................................................................... 19 6.5 Reset and Wake-up.......................................................................................... 22 6.5.1 6.5.2 6.5.3 6.5.4 6.6 Reset .................................................................................................................22 Wake-up and Interrupt Modes Operation Summary .........................................24 Summary of Registers Initialized Values...........................................................25 Status of RST, T, and P of the Status Register..................................................27 Interrupt ............................................................................................................ 29 Product Specification (V1.1) 07.08.2011 • iii Contents 6.7 Oscillator .......................................................................................................... 30 6.7.1 6.7.2 6.7.3 6.7.4 6.8 Code Option Register....................................................................................... 35 6.8.1 6.8.2 6.8.3 6.9 Oscillator Modes................................................................................................30 Crystal Oscillator/Ceramic Resonators (Crystal)...............................................31 External RC Oscillator Mode.............................................................................33 Internal RC Oscillator Mode ..............................................................................34 Code Option Register (Word 0).........................................................................35 Code Option Register (Word 1).........................................................................36 Customer ID Register (Word 2).........................................................................38 Power-on Consideration................................................................................... 38 6.10 Programmable Oscillator WDT Time-out Period .............................................. 38 6.11 External Power-on Reset Circuits..................................................................... 39 6.12 Residue-Voltage Protection .............................................................................. 40 6.13 Low Voltage Detector ....................................................................................... 41 6.13.1 Low Voltage Reset (LVR) ..................................................................................41 6.13.2 Low Voltage Detector (LVD) ..............................................................................41 6.13.2.1 Bank 0 RE (LVD Control Register)....................................................41 6.13.2.2 Bank 1 RE (LVD Interrupt and Wake-up Register) ...........................42 6.13.3 Programming Process.......................................................................................43 6.14 Instruction Set .................................................................................................. 44 7 Absolute Maximum Ratings ................................................................................... 47 8 Electrical Characteristics ....................................................................................... 47 9 8.1 DC Characteristics ........................................................................................... 47 8.2 AC Characteristics............................................................................................ 49 Timing Diagrams ..................................................................................................... 51 APPENDIX A Package Type........................................................................................................... 52 B Package Information............................................................................................... 53 C Quality Assurance and Reliability ......................................................................... 56 C.1 Address Trap Detect......................................................................................... 56 Specification Revision History Doc. Version iv • Revision Description Date 0.9 Preliminary version 2010/03/24 1.0 Initial version 2010/04/20 1.1 Modified the Electrical Characteristics 2011/07/08 Product Specification (V1.1) 07.08.2011 EM78P173N 8-Bit Microcontroller with OTP ROM 1 General Description The EM78P173N is an 8-bit microprocessor designed and developed with low-power and high-speed CMOS technology. It has an on-chip 1K×13-bit Electrical One Time Programmable Read Only Memory (OTP-ROM). This device provides a protection bit to prevent intrusion of user’s OTP memory code. Three Code option words are also available to meet user’s requirements. With its enhanced OTP-ROM features, the EM78P173N provides a convenient way of developing and verifying user’s programs. Moreover, this OTP device offers the advantages of easy and effective program updates, using development and programming tools. Users can avail of the ELAN Writer to easily program their development code. 2 Features • IRC mode: CPU configuration • 1K×13 bits on-chip ROM Internal RC Frequency Temperature (-40°C~85°C) • 48×8 bits on-chip registers (SRAM, General purpose) • 5-level stacks for subroutine nesting 4 MHz ± 1% 16 MHz ± 1% • 3 programmable level voltage reset LVR : 4.0, 3.5, 2.7V 8 MHz ± 1% • Less than 1.5mA at 5V/4 MHz 1 MHz ± 1% • 4 programmable level voltage detector LVD : 4.5, 4.0, 3.3, 2.2V • Typically 15 µA, at 3V/32kHz • Typically 1 µA, during Sleep mode I/O port configuration • 2 bidirectional I/O ports : P5, P6 • 12 I/O pins • Wake-up port : P6 • 7 Programmable pull-down I/O pins • 7 programmable pull-high I/O pins • 7 programmable open-drain I/O pins • External interrupt with wake-up: P60 Operating voltage range: • 2.1V~5.5V at 0~70°C (Commercial) • 2.3V~5.5V at -40~85°C (Industrial) Operating frequency range (base on 2 clocks): • Crystal mode: DC~20MHz/2clks @ 5V DC~8MHz/2clks @ 3V DC~4MHz/2clks @ 2.1V • ERC mode: DC~2 MHz/2clks @ 2.1V Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) Drift Rate Voltage ± 3% *(2.1~5.5V) ± 1% *(4.0~5.5V) ± 2% *(3.0~5.5V) ± 3% *(2.1~5.5V) Process Total ± 2% ± 6% ± 2% ± 4% ± 2% ± 5% ± 2% ± 6% * Operating Voltage Range Peripheral configuration • 8-bit real time clock/counter (TCC) with selective signal sources, trigger edges, and overflow interrupt • External interrupt input pin • 2/4 clocks per instruction cycle selected by code option • Power down (Sleep) mode • High EFT immunity Four available interrupts: • TCC overflow interrupt • Input-port status changed interrupt • External interrupt • Low voltage detect interrupt Special features • Programmable free running watchdog timer • Power-on voltage detector available Package type: • 14-pin DIP 300mil : EM78P173ND14J/S • 14-pin SOP 150mil : EM78P173NSO14J/S • 10-pin MSOP 118mil : EM78P173NMS10J/S Note: These are all Green products which do not contain hazardous substances. •1 EM78P173N 8-Bit Microcontroller with OTP ROM 3 Pin Assignment (1) 14-Pin DIP/SOP Figure 3-1 14-pin EM78P173N (2) 10-Pin MSOP Figure 3-2 10-pin EM78P173N 2• Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 4 Pin Description 4.1 EM78P173N-14PIN Function Input Type Output Type P50~P52 P50~P52 ST CMOS Bidirectional I/O pin with programmable pull-down. P53 P53 ST CMOS Bidirectional I/O pin P60 ST CMOS Bidirectional I/O pin with programmable pull-down, open-drain, pull-high and pin change wake-up. /INT ST − P61 ST CMOS Bidirectional I/O pin with programmable pull-down, open-drain, pull-high and pin change wake-up. P62 ST CMOS Bidirectional I/O pin with programmable pull-down, open-drain, pull-high and pin change wake-up. TCC ST − P63 ST CMOS /RESET ST − P64 ST CMOS Bidirectional I/O pin with programmable open-drain, pull-high and pin change wake-up. − XTAL Clock output of crystal/ resonator oscillator − CMOS Clock output of internal RC oscillator Clock output of external RC oscillator (open-drain) ST CMOS Bidirectional I/O pin with programmable open-drain, pull-high and pin change wake-up OSCI XTAL − Clock input of crystal/resonator oscillator ERCin AN − External RC input pin P66~P67 P66~P67 ST CMOS VDD VDD Power − Power VSS VSS Power − Ground Name P60//INT P61 P62/TCC P63//RESET P64/OSCO/RCOUT OSCO RCOUT P65 P65/OSCI/ERCin Legend: ST: Schmitt Trigger input AN: analog pin Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) Description External interrupt pin Real Time Clock/Counter clock input Bidirectional I/O pin with programmable pull-down and pin change wake-up. (open-drain) External pull-high reset pin Bidirectional I/O pin with programmable open-drain, pull-high and pin change wake-up CMOS: CMOS output XTAL: oscillation pin for crystal / resonator •3 EM78P173N 8-Bit Microcontroller with OTP ROM 4.2 EM78P173N-10PIN Name P60//INT P61 P62/TCC P63//RESET Input Type Output Type P60 ST CMOS /INT ST − P61 ST CMOS P62 ST CMOS TCC ST − P63 ST CMOS /RESET ST − Function Bidirectional I/O pin with programmable pull-down, open-drain, pull-high and pin change wake-up. External interrupt pin Bidirectional I/O pin with programmable pull-down, open-drain, pull-high and pin change wake-up. Bidirectional I/O pin with programmable pull-down, open-drain, pull-high and pin change wake-up. Real Time Clock/Counter clock input Bidirectional I/O pin with programmable pull-down and pin change wake-up. (open-drain) External pull-high reset pin ST CMOS Bidirectional I/O pin with programmable open-drain, pull-high and pin change wake-up. − XTAL Clock output of crystal/ resonator oscillator − CMOS ST CMOS OSCI XTAL − Clock input of crystal/resonator oscillator ERCin AN − External RC input pin P66~P67 P66~P67 ST CMOS VDD VDD Power − Power VSS VSS Power − Ground P64 P64/OSCO/RCOUT OSCO RCOUT P65 P65/OSCI/ERCin Legend: ST: Schmitt Trigger input AN: analog pin 4• Description Clock output of internal RC oscillator Clock output of external RC oscillator (open-drain) Bidirectional I/O pin with programmable open-drain, pull-high and pin change wake-up. Bidirectional I/O pin with programmable open-drain, pull-high and pin change wake-up. CMOS: CMOS output XTAL: oscillation pin for crystal / resonator Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 5 Block Diagram Figure 5-1 EM78P173N Functional Block Diagram Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) •5 EM78P173N 8-Bit Microcontroller with OTP ROM 6 Functional Description 6.1 Operational Registers 6.1.1 R0 (Indirect Addressing Register) R0 is not a physically implemented register. It is used as an indirect addressing pointer. Any instruction using R0 as a pointer actually accesses data pointed by the RAM Select Register (R4). 6.1.2 R1 (Timer Clock/Counter) Incremented by an external signal edge, which is defined by TE bit (CONT-4) through the TCC pin, or by the instruction cycle clock. Writable and readable as any other registers. Defined by resetting PAB (CONT-3). The prescaler is assigned to TCC, if the PAB bit (CONT-3) is reset. The contents of the prescaler counter will be cleared only when the TCC register is written with a value. 6.1.3 R2 (Program Counter and Stack) Depending on the device type, R2 and hardware stack are 10-bit wide. The structure is depicted in the following figure. PC (A9 ~ A0) 000H 008H User Memory Space Stack Level 1 Stack Level 2 Stack Level 3 Stack Level 4 Stack Level 5 Reset Vector Interrupt Vector On-chip Program Memory 3FFH Figure 6-1 Program Counter Organization 6• When ICE300N tries to simulate the stack of EM78P173N, and when the simulated stacks exceed 5 levels, the simulated result will be inconsistent with the EM78P173N. The configuration structure generates 1024×13 bits on-chip OTP ROM addresses to the relative programming instruction codes. One program page is 1024 words long. R2 is set as all "0" when under Reset condition. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM "JMP" instruction allows direct loading of the lower 10 program counter bits. Thus, "JMP" allows the PC to go to any location within a page. "CALL" instruction loads the lower 10 bits of the PC, and then PC+1 are pushed onto the stack. Thus, the subroutine entry address can be located anywhere within a page. "RET" ("RETLk", "RETI") instruction loads the program counter with the contents of the top-level stack. "ADD R2, A" allows a relative address to be added to the current PC, and the ninth and tenth bits of the PC will increase progressively. "MOV R2, A" allows loading of an address from the "A" register to the lower 8 bits of the PC, and the ninth and tenth bits (A8 ~ A9) of the PC will remain unchanged. Any instruction (except “ADD R2,A”) that is written to R2 (e.g., "MOV R2, A", "BC R2, 6" etc.) will cause the ninth bit and above bits of the PC to remain unchanged. All instructions are single instruction cycle (fclk/2 or fclk/4) except for instructions that would change the contents of R2. Such instructions will need one more instruction cycle. Figure 6-2 Data Memory Configuration Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) •7 EM78P173N 8-Bit Microcontroller with OTP ROM 6.1.4 R3 (Status Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 RST GP1 GP0 T P Z DC C Bit 7 (RST): Bit for reset type 0 : Set to 0 if the device wakes up from other reset type 1 : Set to 1 if the device wakes up from sleep mode on a pin change, external interrupt or low voltage detector interrupt. Bits 6 ~ 5 (GP1 ~ GP0): General-purpose read/write bits Bit 4 (T): Time-out bit Set to “1” with the "SLEP" and "WDTC" commands, or during power up; and reset to “0” by WDT time-out. Bit 3 (P): Power down bit Set to “1” during power on or by a "WDTC" command; and reset to “0” by a "SLEP" command. Bit 2 (Z): Zero flag Set to "1" if the result of an arithmetic or logic operation is zero. Bit 1 (DC): Auxiliary carry flag Bit 0 (C): Carry flag 6.1.5 R4 (RAM Select Register) Bit 7: General-purpose read/write bits Bit 6: Used to select Banks 0~1 See the Data Memory Configuration in Figure 6-2. 6.1.6 R5 ~ R6 (Port 5 ~ Port 6) R5 and R6 are I/O registers. Only the lower 4 bits of R5 are available. The upper 4 bits of R5 can be R/W. 8• Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 6.1.7 Bank 0 RE (LVD Control Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 /LVD LVDIF - - - - - LVDWE Bit 7 (/LVD): Low voltage Detector state. When the VDD pin voltage is lower than LVD voltage interrupt level (selected by LVD1 and LVD0), this bit will be cleared. 0: Low voltage is detected 1: Low voltage is not detected or LVD function is disabled Bit 6 (LVDIF): LVD Interrupt Flag bit. 0: No interrupt occurs 1: With interrupt request Bits 5 ~ 1: Not used. Set to “0” at all time. Bit 0 (LVDWE): Low Voltage Detect wake-up. 0: Disable Low Voltage Detect wake-up 1: Enable Low Voltage Detect wake-up 6.1.8 Bank 0 RF (Interrupt Status Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 - - - - - EXIF ICIF TCIF NOTE “ 1 ” means with interrupt request “ 0 ” means no interrupt occurs Bits 7 ~ 3: Not used. Set to “0” at all time. Bit 2 (EXIF): External Interrupt Flag. Set by a falling edge on the /INT pin, reset by software. Bit 1 (ICIF): Port 6 input status changed interrupt flag. Set when Port 6 input changes, reset by software. Bit 0 (TCIF): TCC Overflow Interrupt Flag. Set when TCC overflows, reset by software. RF can be cleared by instruction but cannot be set. IOCF is the interrupt mask register. NOTE The result of reading RF is the "logic AND" of RF and IOCF. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) •9 EM78P173N 8-Bit Microcontroller with OTP ROM 6.1.9 Bank 1 R5 (TBHP: Table Point Register for Instruction TBRD) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 MLB - - - - - RBit9 RBit8 Bit 7 (MLB): Chooses the MSB or LSB machine code to move into the register. The machine code is pointed by TBLP and TBHP register. Bits 6 ~ 2: Not used. Set to “0” at all time. Bits 1 ~ 0: These are the most 2 significant bits of address for program code 6.1.10 Bank 1 R6 (TBLP: Table Point Register for Instruction TBRD) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 RBit7 RBit6 RBit5 RBit4 RBit3 RBit2 RBit1 RBit0 Bits 7 ~ 0: These are the least 8 significant bits of address for program code. 6.1.11 Bank 1 RE (LVD Interrupt and Wake-up Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 LVDIE LVDEN LVD1 LVD0 - - - EXWE Bit 7 (LVDIE): Low voltage detector interrupt enable bit 0: Disable the low voltage detector interrupt 1: Enable the low voltage detector interrupt Bit 6 (LVDEN): Low voltage detector enable bit 0: Disable Low voltage detector function 1: Enable Low voltage detector function Bits 5 ~ 4: Low voltage detector level bits LVDEN LVD1, LVD0 1 11 1 10 1 01 1 00 0 ×× LVD Voltage Interrupt Level /LVD Vdd ≤ 2.2V 0 Vdd > 2.2V 1 Vdd ≤ 3.3V 0 Vdd > 3.3V 1 Vdd ≤ 4.0V 0 Vdd > 4.0V 1 Vdd ≤ 4.5V 0 Vdd > 4.5V 1 N/A 1 NOTE IF Vdd has crossover at LVD voltage in interrupt level as VDD varies, LVD interrupt will occur. 10 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM Bits 3 ~ 1: Not used. Set to “0” at all time. Bit 0 (EXWE): External /INT wake-up enable bit 0: Disable External /INT pin wake-up 1: Enable External /INT pin wake-up 6.1.12 Bank 1 RF (System Control Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 - TIMERSC CPUS IDLE - - RCM1 RCM0 Bits 7, 3 ~ 2: not used, fixed to "0" at all time. Bit 6 (TIMERSC): TCC clock source select 0 : Fs is used as Fc 1 : Fm is used as Fm/2 or Fm/4 (default) Bit 5 (CPUS): CPU Oscillator Source Select 0 : Fs : sub frequency for WDT internal RC time base 16kHz 1 : Fm : Main oscillator (Fm) (default) When CPUS=0, the CPU oscillator selects the sub-oscillator and the main oscillator is stopped. Bit 4 (IDLE): Idle Mode Enable Bit From SLEP instruction, this bit will determine as to which mode to choose. 0 : IDLE = ‘0’ + SLEP instruction → sleep mode (default) 1 : IDLE = ‘1’ + SLEP instruction → idle mode Figure 6-3 CPU Operation Mode Diagram Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 11 EM78P173N 8-Bit Microcontroller with OTP ROM Oscillator (Normal Mode Source) Crystal 1M ~ 20 MHz Oscillator Stable Time CPU Mode Status (S) Sleep/Idle → Normal Green → Normal 2 MHz IRC 1M, 4M, 8M, 16 MHz 1 0.5 ms ~ 2 ms Sleep/Idle → Green ERC Count from Normal/Green < 100 µs Sleep/Idle → Normal < 5 µs Green → Normal Sleep/Idle → Green (CLK) 2 510 CLK 510 CLK 8 CLK 8 CLK < 100 µs Sleep/Idle → Normal < 2 µs Green → Normal Sleep/Idle → Green 8 CLK < 100 µs NOTE 1 ■ The oscillator stable time depends on the oscillator characteristics. 2 ■ After the oscillator has stabilized, the CPU will count 510/8 CLK in Normal/Green mode and continue to work in Normal/Green mode. Ex 1 : The 4 MHz IRC wakes-up from Sleep mode to Normal mode, the total wake-up time is 2 µs + 8 CLK @ 4 MHz. Ex 2 : The 4 MHz IRC wakes-up from Sleep mode to Green mode, the total wake-up time is 100 µs + 8 CLK @ 16kHz. Bits 1 ~ 0 (RCM1 ~ RCM0): IRC mode select bits. 12 • RCM 1 RCM 0 Frequency (MHz) 1 1 4 1 0 16 0 1 8 0 0 1 Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM Bank 1 RF<1, 0> will be enabled. Writer Trim IRC Bank 1 RF<1, 0> Frequency Operating Voltage Stable Time Range RCM1 RCM0 1 1 4 MHz ± 2% 2.1V ~ 5.5V < 5 µs 1 0 16 MHz ± 10% 4.5V ~ 5.5V < 1.5 µs 0 1 8 MHz ± 10% 3.0V ~ 5.5V < 3 µs 0 0 1 MHz ± 10% 2.1V ~ 5.5V < 24 µs 1 1 4 MHz ± 10% 2.1V ~ 5.5V < 6 µs 1 0 16 MHz ± 2% 4.5V ~ 5.5V < 1.25 µs 0 1 8 MHz ± 10% 3.0V ~ 5.5V < 3 µs 0 0 1 MHz ± 10% 2.1V ~ 5.5V < 24 µs 1 1 4 MHz ± 10% 2.1V ~ 5.5V < 6 µs 1 0 16 MHz ± 10% 4.5V ~ 5.5V < 1.5 µs 0 1 8 MHz ± 2% 3.0V ~ 5.5V < 2.5 µs 0 0 1 MHz ± 10% 2.1V ~ 5.5V < 24 µs 1 1 4 MHz ± 10% 2.1V ~ 5.5V < 6 µs 1 0 16 MHz ± 10% 4.5V ~ 5.5V < 1.5 µs 0 1 8 MHz ± 10% 3.0V ~ 5.5V < 3 µs 0 0 1 MHz ± 2% 2.1V ~ 5.5V < 20 µs 4 MHz 16 MHz 8 MHz 1 MHz NOTE The initial values of Bank 1 RF<1,0> will be kept the same as Word 1<6,5>. If user changes the IRC frequency from A-frequency to B-frequency, the MCU needs to wait for some time for it to work. The waiting time corresponds to the B-frequency. For Example: 1st step When user selects the 4 MHz at the Writer, the initial values of Bank 1 RF<1,0> would be “11”, the same as the value of Word 1<6,5> which is “11”. If the MCU is free-running, it will work at 4 MHz ± 2%. Refer to the table below. Writer Trim IRC Bank 1 RF<1, 0> Frequency Operating Voltage Stable Time Range RCM1 RCM0 1 1 4 MHz ± 2% 2.1V ~ 5.5V < 5 µs 1 0 16 MHz ± 10% 4.5V ~ 5.5V < 1.5 µs 0 1 8 MHz ± 10% 3.0V ~ 5.5V < 3 µs 0 0 1MHz ± 10% 2.1V ~ 5.5V < 24 µs 4 MHz Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 13 EM78P173N 8-Bit Microcontroller with OTP ROM 2nd step If it is desired to set Bank 1 RF<1,0> = “10” while the MCU is working at 4 MHz ± 2%, the MCU needs to hold for 1.5 µs, then it will continue to work at 16 MHz ± 10%. Writer Trim IRC 4 MHz Bank 1 RF<1, 0> Frequency Operating Voltage Stable Time Range RCM1 RCM0 1 1 4 MHz ± 2% 2.1V ~ 5.5V < 5 µs 1 0 16 MHz ± 10% 4.5V ~ 5.5V < 1.5 µs 0 1 8 MHz ± 10% 3.0V ~ 5.5V < 3 µs 0 0 1 MHz ± 10% 2.1V ~ 5.5V < 24 µs 3rd step If it is desired to set Bank 1 RF<1,0> = “00” while the MCU is working at 16 MHz ± 10%, the MCU needs to hold for 24 µs, then it will continue to work at 1 MHz ± 10%. Writer Trim IRC 4 MHz Bank 1 RF<1, 0> Frequency Operating Voltage Stable Time Range RCM1 RCM0 1 1 4 MHz ± 2% 2.1V ~ 5.5V < 5 µs 1 0 16 MHz ± 10% 4.5V ~ 5.5V < 1.5 µs 0 1 8 MHz ± 10% 3.0V ~ 5.5V < 3 µs 0 0 1 MHz ± 10% 2.1V ~ 5.5V < 24 µs 4th step If it is desired to set Bank 1 RF<1,0> = “11” while the MCU is working at 1 MHz ± 10%, the MCU needs to hold for 5 µs, then it will continue to work at 4 MHz ± 2%. Writer Trim IRC 4 MHz Bank 1 RF<1, 0> Frequency Operating Voltage Stable Time Range RCM1 RCM0 1 1 4 MHz ± 2% 2.1V ~ 5.5V < 5 µs 1 0 16 MHz ± 10% 4.5V ~ 5.5V < 1.5 µs 0 1 8 MHz ± 10% 3.0V ~ 5.5V < 3 µs 0 0 1 MHz ± 10% 2.1V ~ 5.5V < 24 µs 6.1.13 R10 ~ R3F These are all 8-bit general-purpose registers. 14 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 6.2 Special Function Registers 6.2.1 A (Accumulator) Internal data transfer operation, or instruction operand holding usually involves the temporary storage function of the Accumulator, which is not an addressable register. 6.2.2 CONT (Control Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 GP INT TS TE PAB PSR2 PSR1 PSR0 Bit 7 (GP): General purpose register. Bit 6 (INT): Interrupt Enable flag 0 : Masked by DISI or hardware interrupt 1 : Enabled by ENI/RETI instructions Bit 5 (TS): TCC signal source 0 : Internal instruction cycle clock, P62 is a bidirectional I/O pin 1 : Transition on the TCC pin Bit 4 (TE): TCC Signal Edge 0 : Increment if the transition from low to high takes place on the TCC pin 1 : Increment if the transition from high to low takes place on the TCC pin Bit 3 (PAB): Prescaler Assigned Bit 0 : TCC 1 : WDT Bit 2 ~ Bit 0 (PSR2 ~ PSR0): TCC/WDT prescaler bits PSR2 PSR1 PSR0 TCC Rate WDT Rate 0 0 0 1:2 1:1 0 0 1 1:4 1:2 0 1 0 1:8 1:4 0 1 1 1:16 1:8 1 0 0 1:32 1:16 1 0 1 1:64 1:32 1 1 0 1:128 1:64 1 1 1 1:256 1:128 The CONT register is both readable and writable. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 15 EM78P173N 8-Bit Microcontroller with OTP ROM 6.2.3 IOC5 ~ IOC6 (I/O Port Control Register) 0 : defines the relative I/O pin as output 1 : puts the relative I/O pin into high impedance Only the lower 4 bits of IOC5 are available to be defined, IOC54~57 registers are fixed to “0” 6.2.4 IOCB (Pull-down Control Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 /PD63 /PD62 /PD61 /PD60 - /PD52 /PD51 /PD50 Bit 7(/PD63): Control bit used to enable pull-down of the P63 pin. 0 : Enable internal pull-down 1 : Disable internal pull-down Bit 6 (/PD62): Control bit used to enable pull-down of the P62 pin. Bit 5 (/PD61): Control bit used to enable pull-down of the P61 pin. Bit 4 (/PD60): Control bit used to enable pull-down of the P60 pin. Bit 3: Not used. Set to “1” at all time (R/W). Bit 2 (/PD52): Control bit used to enable pull-down of the P52 pin. Bit 1 (/PD51): Control bit used to enable pull-down of the P51 pin. Bit 0 (/PD50): Control bit used to enable pull-down of the P50 pin. The IOCB Register is both readable and writable. 6.2.5 IOCC (Open-drain Control Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 OD67 OD66 OD65 OD64 - OD62 OD61 OD60 Bit 7 (OD67): Control bit used to enable open-drain of the P67 pin. 0 : Disable open-drain output 1 : Enable open-drain output Bit 6 (OD66): Control bit used to enable open-drain of the P66 pin. Bit 5 (OD65): Control bit used to enable open-drain of the P65 pin. Bit 4 (OD64): Control bit used to enable open-drain of the P64 pin. Bit 3: Not used. Set to “0” at all time (R/W). Bit 2 (OD62): Control bit used to enable open-drain of the P62 pin. Bit 1 (OD61): Control bit used to enable open-drain of the P61 pin. Bit 0 (OD60): Control bit used to enable open-drain of the P60 pin. The IOCC Register is both readable and writable. 16 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 6.2.6 IOCD (Pull-high Control Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 /PH67 /PH66 /PH65 /PH64 - /PH62 /PH61 /PH60 Bit 7 (/PH67): Control bit is used to enable pull-high of the P67 pin. 0 : Enable internal pull-high 1 : Disable internal pull-high Bit 6 (/PH66): Control bit used to enable pull-high of the P66 pin. Bit 5 (/PH65): Control bit used to enable pull-high of the P65 pin. Bit 4 (/PH64): Control bit used to enable pull-high of the P64 pin. Bit 3: Not used. Set to “1” at all time (R/W). Bit 2 (/PH62): Control bit used to enable pull-high of the P62 pin. Bit 1 (/PH61): Control bit used to enable pull-high of the P61 pin. Bit 0 (/PH60): Control bit used to enable pull-high of the P60 pin. The IOCD Register is both readable and writable. 6.2.7 IOCE (WDT Control Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 WDTE EIS GP GP GP GP GP GP Bit 7 (WDTE): Control bit used to enable the Watchdog timer. 0 : Disable WDT 1 : Enable WDT Bit 6 (EIS): Control bit is used to define the function of P60 (/INT) pin. 0 : P60, bidirectional I/O pin. 1 : /INT, external interrupt pin. When EIS is "0," the path of /INT is masked. When EIS is "1," the status of /INT pin can also be read by way of reading Port 6 (R6). See Figure 6-6 under Section 6.4 for reference. EIS is both readable and writable. WDTE is both readable and writable. Bits 5 ~ 0: General purpose register. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 17 EM78P173N 8-Bit Microcontroller with OTP ROM 6.2.8 IOCF (Interrupt Mask Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 - - - - - EXIE ICIE TCIE Bits 7 ~ 3: Not used. Set to “1” at all time. Individual interrupt is enabled by setting its associated control bit in the IOCF to "1". Global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. Refer to Figure 6-10. Bit 2 (EXIE): EXIF interrupt enable bit 0 : disable EXIF interrupt 1 : enable EXIF interrupt Bit 1 (ICIE): ICIF interrupt enable bit 0 : disable ICIF interrupt 1 : enable ICIF interrupt Bit 0 (TCIE): TCIF interrupt enable bit 0 : disable TCIF interrupt 1 : enable TCIF interrupt The IOCF register is both readable and writable. 6.3 TCC/WDT and Prescaler An 8-bit counter is available as prescaler for the TCC or WDT. The prescaler is available for the TCC only or the WDT only, one at a time and the PAB bit of the CONT register is used to determine the prescaler assignment. The PSR0 ~ PSR2 bits determine the ratio. The prescaler is cleared each time an instruction is written to TCC under TCC mode. The WDT and prescaler, when assigned to WDT mode, are cleared by the “WDTC” or “SLEP” instructions. Figure 6-4 depicts the TCC / WDT circuit diagram. 18 • R1 (TCC) is an 8-bit timer/counter. The TCC clock source can be internal or external clock input (edge selectable from TCC pin). If the TCC signal source is from an internal clock, the TCC will be incremented by 1 at Fm/2 or Fm/4 (without prescaler). Referring to Figure 6-4, CLK=Fm/2 or CLK=Fm/4, depends on the Code Option bit CLK. CLK=Fm/2 is used if CLK bit is "0", and CLK=Fm/4 is used if CLK bit is "1". If the TCC signal source is from an external clock input, TCC is incremented by 1 at every falling edge or rising edge of the TCC pin. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM The watchdog timer is a free running on-chip RC oscillator. The WDT will keep running even when the oscillator driver has been turned off (i.e. in sleep mode). During normal operation or sleep mode, a WDT time-out (if enabled) will cause the device to reset. The WDT can be enabled or disabled any time during normal mode by software programming. Refer to WDTE bit of the IOCE register. Without prescaler, the WDT time-out period is approximately 18 ms 1 (default). Fm/2 or Fm/4 Fs TIMERSC (BANK1-RF) 1 0 Data Bus MUX TCC Pin 1 0 1 MUX MUX 0 TCC (R1) TE (CONT) 0 WDT 1 TCC overflow interrupt PAB TS 8-Bit Counter MUX 8 to 1 MUX PAB 1 WDTE (IOCE) 0 MUX PAB WDT Time Out Figure 6-4 TCC and WDT Block Diagram 6.4 I/O Ports The I/O registers, both Port 5 and Port 6, are bidirectional tri-state I/O ports. Port 6 can be pulled-high internally by software except P63. In addition, Port 6 can also have open-drain output by software except P63. Input status changed interrupt (or wake-up) function is available from Port 6. P50 ~ P52 and P60 ~ P63 pins can be pulled-down by software. Each I/O pin can be defined as "input" or "output" pin by the I/O control register (IOC5 ~ IOC6). The I/O registers and I/O control registers are both readable and writable. The I/O interface circuits for Port 5 and Port 6 are shown in Figure 6-5, Figure 6-6 and Figure 6-7 respectively. 1 Vdd = 5V, WDT time-out period = 16.8ms ± 30% at 25°C Vdd = 3V, WDT time-out period = 18ms ± 30% at 25°C Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 19 EM78P173N 8-Bit Microcontroller with OTP ROM PCRD Port Q P R _ Q C L Q P R _ Q C L D CLK PCWR IOD D CLK PDWR PDRD 0 M U X 1 Note: Pull-down is not shown in the figure. Figure 6-5 I/O Port and I/O Control Register Circuit for Port 5, 6 PCRD Q P R D _ C LK Q C L Q P R D _ C LK Q C L P o rt B it 6 o f IO C E D P R Q C LK _ C Q L 0 1 PCW R IO D PDW R M U X PDRD T10 P D R Q C LK _ C Q L Note: Pull-high (down) and open-drain are not shown in the figure. Figure 6-6 I/O Port and I/O Control Register Circuit for P60 (/INT) 20 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM PORT 0 1 Q _ Q P R D CLK C L PCWR Q _ Q P D R CLK C L PDWR IOD M U X TIN PDRD P R CLK C L D Q _ Q Note: Pull-high (down) and open-drain are not shown in the figure. Figure 6-7 I/O Port and I/O Control Register Circuit for P61~P67 ICIE D P R Q Interrupt CLK C L _ Q ICIF ENI Instruction P D R P60 P61 P62 P63 Q CLK _ C Q L P64 P65 P66 P67 Q P R D CLK _ Q C L DISI Instruction /SLEP Interrupt (Wake-up from SLEEP) Next Instruction (Wake-up from SLEEP) Figure 6-8 Block Diagram of I/O Port 6 with Input Change Interrupt/Wake-up Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 21 EM78P173N 8-Bit Microcontroller with OTP ROM Table 6-1 Usage of Port 6 Input Change Wake-up/Interrupt Function Usage of Port 6 Input Status Change Wake-up/Interrupt (I) Wake-up from Port 6 Input Status Change (II) Port 6 Input Status Change Interrupt (a) Before Sleep 1. Read I/O Port 6 (MOV R6,R6) 1. Disable WDT 2. Execute “ENI” 2. Read I/O Port 6 (MOV R6,R6) 3. Enable interrupt (Set IOCF.1) 3. Execute "ENI" or "DISI" 4. IF Port 6 change (interrupt) → Interrupt Vector (008H) 4. Enable interrupt (Set IOCF.1) 5. Execute "SLEP" instruction (b) After Wake-up 1. IF "ENI" → Interrupt Vector (008H) 2. IF "DISI" → Next instruction 6.5 Reset and Wake-up 6.5.1 Reset A Reset is initiated by one of the following events: 1) Power-on reset 2) /RESET pin input "low" 3) WDT time-out (if enabled). 4) Low Voltage Reset The device is kept under reset condition for a period of approximately 18 ms or 150 µs (Events 1 and 4 are approximately 18 ms and Events 2, 3 are approximately 150 µs) after a reset is detected. The oscillator is running, or will be started. The Program Counter (R2) is set to all "0." All I/O port pins are configured as input mode (high-impedance state) The Watchdog timer and prescaler are cleared. When power is switched on, the upper 3 bits of R3 are cleared. The bits of the CONT register are set to all "1" except for Bit 6 (INT flag). The bits of the IOCB register are set to all "1." The IOCC register is cleared. The bits of the IOCD register are set to all "1." Bit 7 of the IOCE register is set to "1," and Bit 6 is cleared. Bits 0 ~ 2 of RF and Bits 0 ~ 2 of IOCF registers are cleared. Sleep (power down) mode is asserted by executing the “SLEP” instruction. While entering Sleep mode, WDT (if enabled) is cleared but keeps on running. After a wake-up in IRC mode (IRC 4 MHz / 5V), wake-up time is 1.5 µs, XT mode (4 MHz / 5V) wake-up time is 1.5 ms. 22 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM The controller can be awakened by: 1) External reset input on /RESET pin 2) WDT time-out (if enabled) 3) Port 6 Input Status changed (if enabled) 4) External (P60, /INT) pin changes (if EXWE is enabled) 5) Low voltage detector (if LVDWE is enabled) The first two cases will cause the EM78P173N to reset. The T and P flags of R3 are used to determine the source of the reset (wake-up). The last case is considered the continuation of program execution and the global interrupt ("ENI" or "DISI" being executed) determines whether or not the controller branches to the interrupt vector following a wake-up. If ENI is executed before SLEP, the instruction will begin to execute from Address 008H after wake-up. If DISI is executed before SLEP, the operation will restart from the succeeding instruction right next to SLEP after a wake-up. After a wake-up in IRC mode (IRC 4MHz / 5V), the wake-up time is 1.5 µs, XT mode (4 MHz / 5V) wake-up time is 1.5 ms. One or more of Cases 2 and 5 can be enabled before going into Sleep mode. That is, [a] if WDT is enabled before SLEP, Port 6 Input Status Change Interrupt must be disabled. Hence, the EM78P173N can be awakened only by Case 1 or Case 2. Refer to Section 6.6, Interrupt for further details. [b] if Port 6 Input Status Change Interrupt is enabled before SLEP, WDT must be disabled. However, the EM78P173N can be awakened only by Case 3. [c] if External (P60, INT) pin change is used to wake-up the EM78P173N and the EXWE bit of the Bank 1-RE register is enabled before SLEP, the WDT must be disabled. Hence, the EM78P173N can be waken-up only by Case 4. [d] if Low voltage detector is used to wake up the EM78P173N and the LVDWE bit of the Bank 0-RE register is enabled before SLEP, the WDT must be disabled by software. Hence, the EM78P173N can be awakened only by Case 5. If Port 6 Input Status Change Interrupt is used to wake-up the EM78P173N (Case [a] above), the following instructions must be executed before SLEP: MOV A, @xxxx1110b CONTW WDTC MOV A, @0xxxxxxxb IOW RE MOV R6, R6 MOV A, @00000x1xb IOW RF ENI (or DISI) SLEP ; Select the WDT prescaler, it must be ; set over 1:1 ; Clear WDT and prescaler ; Disable WDT ; Read Port 6 ; Enable Port 6 input change interrupt ; Enable (or disable) global interrupt ; Sleep Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 23 EM78P173N 8-Bit Microcontroller with OTP ROM NOTE 1. After waking up from sleep mode, WDT is automatically enabled. The WDT enable/disable operation after waking up from sleep mode should be appropriately defined in the software. 2. To avoid a reset from occurring when the Port 6 Input Status Changed Interrupt enters into interrupt vector or is used to wake-up the MCU, the WDT prescaler must be set above the 1:1 ratio. 6.5.2 Wake-up and Interrupt Modes Operation Summary The controller can be awakened from sleep mode and idle mode. The wake-up signals are listed as follows. Wake-up Signal Condition Signal Sleep Mode DISI ENI Idle Mode DISI ENI Green Mode DISI ENI Normal Mode DISI ENI EXWE = 0 EXIE = 0 Wake-up is invalid Wake-up is invalid Interrupt is invalid Interrupt is invalid EXWE = 0 EXIE = 1 External INT EXWE = 1 EXIE = 0 EXWE = 1 EXIE = 1 Port 6 ICIE = 0 Pin Change ICIE = 1 Interrupt Interrupt Next + Next + Wake-up is invalid Wake-up is invalid Instruction Interrupt Instruction Interrupt Vector Vector Wake up Wake up + + Interrupt is invalid Interrupt is invalid Next Instruction Next Instruction Wake up Wake up Wake up Wake up Interrupt Interrupt + + + + Next + Next + Next Interrupt Next Interrupt Instruction Interrupt Instruction Interrupt Instruction Vector Instruction Vector Vector Vector Wake-up is invalid Overflow Low Voltage Detector 24 • Wake-up is invalid Wake-up is invalid TCIE = 1 LVDWE = 0 LVDIE = 0 Interrupt is invalid Interrupt is invalid Wake up Wake up Wake up Wake up Interrupt Interrupt + + + + Next + Next + Next Interrupt Next Interrupt Instruction Interrupt Instruction Interrupt Instruction Vector Instruction Vector Vector Vector TCIE = 0 TCC Wake-up is invalid Wake-up is invalid Interrupt is invalid Interrupt is invalid Wake up Wake up Interrupt Interrupt + + Next + Next + Next Interrupt Instruction Interrupt Instruction Interrupt Instruction Vector Vector Vector Wake-up is invalid Interrupt is invalid Interrupt is invalid Interrupt Interrupt Next + Next + Wake-up is invalid Instruction Interrupt Instruction Interrupt Vector Vector Wake up Wake up LVDWE = 1 + + Interrupt is invalid Interrupt is invalid LVDIE = 0 Next Instruction Next Instruction Wake up Wake up Wake up Wake up Interrupt Interrupt LVDWE = 1 + + + + Next + Next + Next Interrupt Next Interrupt Instruction Interrupt Instruction Interrupt LVDIE = 1 Instruction Vector Instruction Vector Vector Vector LVDWE = 0 Wake-up is invalid LVDIE = 1 Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 6.5.3 Summary of Registers Initialized Values Address N/A N/A 0×05 0×06 N/A 0×00 0×01 0×02 Name IOC5 IOC6 P5 P6 CONT R0 (IAR) R1 (TCC) R2 (PC) Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit Name × × × × C53 C52 C51 C50 Power-on 0 0 0 0 1 1 1 1 /RESET and WDT 0 0 0 0 1 1 1 1 Wake-up from Pin Change P P P P P P P P Bit Name C67 C66 C65 C64 C63 C62 C61 C60 Power-on 1 1 1 1 1 1 1 1 /RESET and WDT 1 1 1 1 1 1 1 1 Wake-up from Pin Change P P P P P P P P Bit Name × × × × P53 P52 P51 P50 Power-on 1 1 1 1 1 1 1 1 /RESET and WDT P P P P P P P P Wake-up from Pin Change P P P P P P P P Bit Name P67 P66 P65 P64 P63 P62 P61 P60 Power-on 1 1 1 1 1 1 1 1 /RESET and WDT P P P P P P P P Wake-up from Pin Change P P P P P P P P Bit Name GP INT TS TE PAB Power-on 1 0 1 1 1 1 1 1 /RESET and WDT 1 0 1 1 1 1 1 1 Wake-up from Pin Change P P P P P P P P Bit Name - - - - - - - - Power-on U U U U U U U U /RESET and WDT P P P P P P P P Wake-up from Pin Change P P P P P P P P Bit Name - - - - - - - - Power-on 0 0 0 0 0 0 0 0 /RESET and WDT 0 0 0 0 0 0 0 0 Wake-up from Pin Change P P P P P P P P Bit Name - - - - - - - - Power-on 0 0 0 0 0 0 0 0 /RESET and WDT 0 0 0 0 0 0 0 0 Wake-up from Pin Change Jump to Address 0x08 or continue to execute next instruction. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) PSR2 PSR1 PSR0 • 25 EM78P173N 8-Bit Microcontroller with OTP ROM Address 0×03 0×04 Name R3 (SR) R4 (RSR) Bank 0 0×0E RE (LVDCR) 0×0F Bank 0 RF (ISR) Bank 1 0×05 R5 (TBHP) Bank 1 0×06 R6 (TBLP) Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Bit Name RST GP1 GP0 T P Z DC C Power-on 0 0 0 1 1 U U U /RESET and WDT 0 0 0 * * P P P Wake-up from Pin Change 1 P P * * P P P Bit Name GP Bank 0 - - - - - - Power-on 0 0 U U U U U U /RESET and WDT 0 0 P P P P P P Wake-up from Pin Change P P P P P P P P Bit Name /LVD LVDIF × × × × × LVDWE Power-on 1 0 0 0 0 0 0 0 /RESET and WDT 1 0 0 0 0 0 0 0 Wake-up from Pin Change P P P P P P P P Bit Name × × × × × EXIF ICIF TCIF Power-on 0 0 0 0 0 0 0 0 /RESET and WDT 0 0 0 0 0 0 0 0 Wake-up from Pin Change 0 0 0 0 0 P P P Bit Name MLB × × × × × RBit 9 RBit 8 Power-on 0 0 0 0 0 0 0 0 /RESET and WDT 0 0 0 0 0 0 0 0 Wake-up from Pin Change P P P P P P P P Bit Name RBit7 Power-on 0 0 0 0 0 0 0 0 /RESET and WDT 0 0 0 0 0 0 0 0 Wake-up from Pin Change P P P P P P P P × × × EXWE Bit Name Bank 1 0×0E RE (LVD ICR) Bank 1 0×0F 26 • RF (SC and COCR) RBit 6 RBit 5 RBit 4 RBit 3 RBit 2 RBit 1 LVDIE LVDEN LVD1 LVD0 RBit 0 Power-on 0 0 1 1 0 0 0 0 /RESET and WDT 0 0 1 1 0 0 0 0 Wake-up from Pin Change P P P P P P P P Bit Name × × × RCM1 RCM0 Power-on 0 1 1 0 0 0 Word 1 /RESET and WDT 0 1 1 0 0 0 <6,5> Wake-up from Pin Change P P P P P P TIMERSC CPUS IDLE P P Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM Address Name Reset Type Bit 7 Bit Name 0×0B 0×0C IOCB IOCC 0×0E 0×0F 0×10 ~ 0×3F IOCD IOCE IOCF R10~R3F Bit 5 Bit 4 /PD63 /PD62 /PD61 /PD60 Bit 3 x Bit 2 Bit 1 Bit 0 /PD52 /PD51 /PD50 Power-on 1 1 1 1 1 1 1 1 /RESET and WDT 1 1 1 1 1 1 1 1 Wake-up from Pin Change P P P P P P P P Bit Name OD67 OD66 Power-on 0 0 0 0 0 0 0 0 /RESET and WDT 0 0 0 0 0 0 0 0 Wake-up from Pin Change P P P P P P P P Bit Name 0×0D Bit 6 OD65 OD64 /PH67 /PH66 /PH65 /PH64 × × OD62 OD61 OD60 /PH62 /PH61 /PH60 Power-on 1 1 1 1 1 1 1 1 /RESET and WDT 1 1 1 1 1 1 1 1 Wake-up from Pin Change P P P P P P P P Bit Name WDTE EIS GP GP GP GP GP GP Power-on 1 0 1 1 1 1 1 1 /RESET and WDT 1 0 1 1 1 1 1 1 Wake-up from Pin Change 1 P P P P P P P Bit Name × × × × × EXIE ICIE TCIE Power-on 1 1 1 1 1 0 0 0 /RESET and WDT 1 1 1 1 1 0 0 0 Wake-up from Pin Change 1 1 1 1 1 P P P Bit Name - - - - - - - - Power-on U U U U U U U U /RESET and WDT P P P P P P P P Wake-up from Pin Change P P P P P P P P Legend: ×: Not used U: Unknown or don’t care P: Previous value before reset * Refer to the tables provided in the next section (Section 6.5.4). 6.5.4 Status of RST, T, and P of the Status Register A Reset condition is initiated by the following events 1) A power-on condition 2) A high-low-high pulse on /RESET pin 3) Watchdog timer time-out The values of T and P listed in the table below are used to check how the processor wakes up. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 27 EM78P173N 8-Bit Microcontroller with OTP ROM Table 6-2 Values of RST, T, and P after a Reset Reset Type RST T P Power on 0 1 1 /RESET during Operation mode 0 *P *P /RESET wake-up during Sleep mode 0 1 0 WDT during Operation mode 0 0 *P WDT wake-up during Sleep mode 0 0 0 Wake-up on pin change during Sleep mode 1 1 0 * P: Previous status before reset The following table shows the events that may affect the status of T and P. Table 6-3 Status of T and P Being Affected by Events Event RST T P Power on 0 1 1 WDTC instruction *P 1 1 WDT time-out 0 0 *P SLEP instruction *P 1 0 Wake-up on pin change during Sleep mode 1 1 0 * P: Previous status before reset VDD D Q CLK CLR Oscillator CLK Power-on Reset Voltage Detector W DTE W DT W DT Timeout Setup Time RESET /RESET Figure 6-9 Controller Reset Block Diagram 28 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 6.6 Interrupt The EM78P173N has four interrupts as listed below: 1) TCC overflow interrupt 2) Port 6 Input Status Change Interrupt 3) External interrupt [(P60, /INT) pin] 4) Low Voltage Detect Interrupt Before the Port 6 Input Status Changed Interrupt is enabled, reading Port 6 (e.g. "MOV R6,R6") is necessary. Each pin of Port 6 will have this feature if its status changes. Any pin configured as output or P60 pin configured as /INT is excluded from this function. The Port 6 Input Status Changed Interrupt can wake up the EM78P173N from Sleep mode if Port 6 is enabled prior to going into Sleep mode by executing SLEP instruction. When the chip wakes-up, the controller will continue to execute the program in-line if the global interrupt is disabled. If the global interrupt is enabled, it will branch to the Interrupt Vector 008H. RF is the interrupt status register that records the interrupt requests in the relative flags/bits. IOCF is an interrupt mask register. The global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. When one of the interrupts (enabled) occurs, the next instruction will be fetched from Address 008H. Once in the interrupt service routine, the source of an interrupt can be determined by polling the flag bits in RF. The interrupt flag bit must be cleared by instructions before leaving the interrupt service routine and before interrupts are enabled to avoid recursive interrupts. The flag (except ICIF bit) in the Interrupt Status Register (RF) is set regardless of the status of its mask bit or the execution of ENI. Note that the outcome of RF will be the logic AND of RF and IOCF (refer to Figure 6-10). The RETI instruction ends the interrupt routine and enables the global interrupt (the execution of ENI). Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 29 EM78P173N 8-Bit Microcontroller with OTP ROM VCC P D R CLK C L RF /IR Q n IR Q n Q _ Q RFRD IN T IR Q m E N I/D IS I IO C F /R E S E T Q _ Q P D R CLK C L IO D IO C F W R IO C F R D RFW R Figure 6-10 Interrupt Input Circuit Before an interrupt subroutine is executed, the contents of ACC and the R3 and R4 registers will be saved by the hardware. If another interrupt occurs, the ACC, R3, and R4 will be replaced by the new interrupt. After the interrupt service routine is completed, the ACC, R3, and R4 registers are restored. Interrupt sources ACC Interrupt occurs STACKACC ENI/DISI R3 RETI R4 STACKR3 STACKR4 Figure 6-11 Interrupt Backup Diagram 6.7 Oscillator 6.7.1 Oscillator Modes The EM78P173N can be operated in four different oscillator modes, such as External RC oscillator mode (ERC), Internal RC oscillator mode (IRC), High Crystal oscillator mode (XT, HXT1,2), and Low Crystal oscillator mode (LXT1, 2). The desired mode can be selected by programming OSC3, OSC2, OSC1, and OSC0 in the Code Option register. Table 6-4 describes how these four oscillator modes are defined. 30 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM Table 6-4 Oscillator Modes Defined by OSC Oscillator Modes OSC3 OSC2 OSC1 OSC0 1 0 0 0 0 1 0 0 0 1 0 0 1 0 ERC (External RC oscillator mode); P64/RCOUT act as P64 ERC (External RC oscillator mode); P64/RCOUT act as RCOUT 2 IRC (Internal RC oscillator mode); P64/RCOUT act as P64 2 IRC (Internal RC oscillator mode); P64/RCOUT act as RCOUT 0 0 1 1 3 0 1 0 0 3 0 1 0 1 3 0 1 1 0 3 HXT2 (Frequency range of HXT2 mode is 12 MHz~6 MHz) 0 1 1 1 XT (Frequency range of XT mode is 6 MHz~1 MHz) (default) 1 1 1 1 LXT1 (Frequency range of LXT1 mode is 1MHz~100kHz) HXT1 (Frequency range of HXT1 mode is 20 MHz~12 MHz) LXT2 (Frequency range of LXT2 mode is 32.768kHz) 1 In ERC mode, ERCin is used as oscillator pin. RCOUT/P64 is defined by code option Word 1 Bit 4 ~ Bit 1. 2 In IRC mode, P65 is normal I/O pin. RCOUT/P64 is defined by code option Word 1 Bit 4 ~ Bit 1. 3 In LXT1, LXT2, HXT1, HXT2 and XT modes; OSCI and OSCO are used as oscillator pins. These pins cannot and should not be defined as normal I/O pins. The maximum operational frequency of the crystal/resonator under different VDD is listed below. Table 6-5 Summary of Maximum Operating Speeds Conditions Two cycles with two clocks VDD Max Freq. (MHz) 2.1 4.0 3.0 8.0 5.0 20.0 6.7.2 Crystal Oscillator/Ceramic Resonators (Crystal) The EM78P173N can be driven by an external clock signal through the OSCI pin as shown in the following figure. OSCI Ext. Clock OSCO EM78P173N Figure 6-12 Circuit for External Clock Input Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 31 EM78P173N 8-Bit Microcontroller with OTP ROM In most applications, Pin OSCI and Pin OSCO can be connected with a crystal or ceramic resonator to generate oscillation. Figure 6-13 depicts such a circuit. The same thing applies whether it is in the HXT mode or in the LXT mode. In Figure 6-14, when the connected resonator in OSCI and OSCO is used in applications, the 1 MΩ R1 needs to be shunted with resonator. C1 OSCI EM78P173N Crystal OSCO RS C2 Figure 6-13 Circuit for Crystal/Resonator C1 OSCI Resonator EM78P173N R1 OSCO C2 Figure 6-14 Circuit for Crystal/Resonator Table 6-6 provides the recommended values of C1 and C2. Since each resonator has its own attribute, refer to its specification for appropriate values of C1 and C2. RS, a serial resistor, may be necessary for AT strip cut crystal or low frequency mode. 32 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM Table 6-6 Capacitor Selection Guide for Crystal Oscillator or Ceramic Resonator Oscillator Type Frequency Mode Frequency LXT1 (100K~1 MHz) Ceramic Resonators XT (1M~6 MHz) LXT2 (32.768kHz) LXT1 (100K~1 MHz) Crystal Oscillator XT (1~6 MHz) HXT2 (6~12 MHz) HXT1 (12~20 MHz) C1 (pF) C2 (pF) 100kHz 200kHz 455kHz 1 MHz 1.0 MHz 2.0 MHz 4.0 MHz 60pF 60pF 40pF 30pF 30pF 30pF 20pF 60pF 60pF 40pF 30pF 30pF 30pF 20pF 32.768kHz 40pF 40pF 100kHz 200kHz 455kHz 1 MHz 455kHz 1.0 MHz 2.0 MHz 4.0 MHz 6.0 MHz 6.0 MHz 8.0 MHz 10.0 MHz 12.0 MHz 12.0 MHz 16.0 MHz 60pF 60pF 40pF 30pF 30pF 30pF 30pF 20pF 30pF 30pF 20pF 30pF 30pF 30pF 20pF 60pF 60pF 40pF 30pF 30pF 30pF 30pF 20pF 30pF 30pF 20pF 30pF 30pF 30pF 20pF 20.0 MHz 15pF 15pF 6.7.3 External RC Oscillator Mode For some applications that do not require a very precise timing calculation, the RC oscillator (Figure 6-15) offers a cost-effective oscillator configuration. Nevertheless, it should be noted that the frequency of the RC oscillator is influenced by the supply voltage, the values of the resistor (Rext), the capacitor (Cext), and even by the operation temperature. Moreover, the frequency also changes slightly from one chip to another due to manufacturing process variations. In order to maintain a stable system frequency, the values of the Cext should not be less than 20pF, and that the value of Rext should not be greater than 1 MΩ. If they cannot be kept in this range, the frequency can be easily affected by noise, humidity, and leakage. The smaller the Rext in the RC oscillator is, the faster its frequency will be. On the contrary, for very low Rext values, for instance, 1 KΩ, the oscillator becomes unstable because the NMOS cannot discharge the current of the capacitance correctly. Based on the above reasons, it must be kept in mind that all of the supply voltage, the operation temperature, the components of the RC oscillator, the package types, the way the PCB is layout, will affect the system frequency. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 33 EM78P173N 8-Bit Microcontroller with OTP ROM Vcc Rext ERCin Cext EM78P173N Figure 6-15 External RC Oscillator Mode Circuit Table 6-7 RC Oscillator Frequencies Cext 20pF 100pF 300pF Rext Average Fosc 5V, 25°C Average Fosc 3V, 25°C 3.3k 2.064 MHz 1.901 MHz 5.1k 1.403 MHz 1.316 MHz 10k 750kHz 719.7kHz 100k 81.45kHz 81.33kHz 3.3k 647.3kHz 615.1 MHz 5.1k 430.8kHz 414.3kHz 10k 225.8kHz 219.8kHz 100k 23.88kHz 23.96kHz 3.3k 256.6kHz 245.3kHz 5.1k 169.5kHz 163.0kHz 10k 88.53kHz 86.14kHz 100k 9.283kHz 9.255kHz Note: 1: These are measured in DIP packages 2. The values are for design reference only 3. The frequency drift is ± 30% 6.7.4 Internal RC Oscillator Mode EM78P173N offers a versatile internal RC mode with default frequency value of 4 MHz. The Internal RC oscillator mode has other frequencies (1 MHz, 8 MHz, and 16 MHz) that can be set by Code Option (Word 1), RCM1, and RCM0. All these four main frequencies can be calibrated by programming the Option Bits C0 ~ C4. Table 6-8 describes the EM78P173N internal RC drift with variation of voltage, temperature, and process. 34 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM Table 6-8 Internal RC Drift Rate Drift Rate Internal RC Temperature (-40°C~85°C) 4 MHz ± 1% 16 MHz ± 1% 8 MHz ± 1% 1 MHz ± 1% Voltage ± 3% (2.1~5.5V) ± 1% (4.0~5.5V) ± 2% (3.0~5.5V) ± 3% (2.1~5.5V) Process Total ± 2% ± 6% ± 2% ± 4% ± 2% ± 5% ± 2% ± 6% Note: These are theoretical values provided for reference only. Actual values may vary depending on the actual process. 6.8 Code Option Register The EM78P173N has a Code Option word that is not part of the normal program memory. The option bits cannot be accessed during normal program execution. Code Option Register and Customer ID Register Arrangement Distribution: Word 0 Word 1 Word 2 Bit 12 ~ Bit 0 Bit 12 ~ Bit 0 Bit 12 ~ Bit 0 6.8.1 Code Option Register (Word 0) Word 0 Bit Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Mnemonic RESETEN ENWDT CLKS LVR1 LVR0 − Bit 6 Bit 5 Bit 4 Bit 3 Bits 2~ 0 WDTPS1 WDTPS0 NRHL NRE Protect 1 Disable Disable 4 clocks High High − High High 32/fc Enable Disable 0 Enable Enable 2 clocks Low Low − Low Low 8/fc Disable Enable Bit 12 (RESETEN): Define Pin 63 as a reset pin 0 : /RESET enable 1 : /RESET disable Bit 11 (ENWDT): Watchdog timer enable bit 0 : Enable 1 : Disable Bit 10 (CLKS): Instruction period option bit. 0 : two oscillator periods 1 : four oscillator periods Refer to the Instruction Set section. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 35 EM78P173N 8-Bit Microcontroller with OTP ROM Bits 9 ~ 8 (LVR1 ~ LVR0): Low Voltage Reset control bits VDD Reset Level LVR1, LVR0 VDD Release Level 11 NA (Power-on Reset) (default) 10 2.7V 2.9V 01 3.5V 3.7V 00 4.0V 4.0V Bit 7: Set to “1” at all time. Bit 6 and Bit 5 (WDTPS1 and WDTPS0): WDT Time-out Period of device bits. Table 6-9 WDT Time-out Period of Device Programming WDTPS1 WDTPS0 *WDT Time-out Period 1 1 18 ms 1 0 4.5 ms 0 1 288 ms 0 0 72 ms * These are theoretical values, provided for reference only Bit 4 (NRHL): Noise rejection high/low pulse define bit. The INT pin has a falling edge trigger. 0 : Pulses equal to 8/fc is regarded as signal 1 : Pulses equal to 32/fc is regarded as signal (Default) Bit 3 (NRE): Noise rejection enable 0 : disable noise rejection 1 : enable noise rejection (default). However in Low Crystal oscillator (LXT2) mode, the noise rejection circuit is always disabled. Bits 2 ~ 0 (Protect): Protect Bits. Each protect status is as follows: Protect Bits Protect 0 1 Enable Disable (Default) 6.8.2 Code Option Register (Word 1) Word 1 Bit Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 HLP C4 C3 C2 C1 C0 1 High High High High High High High High High High High High System-clock 0 Low Low Low Low Low Low Low Low Low Low Low Low Mne monic 36 • Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 RCM1 RCM0 OSC3 OSC2 OSC1 OSC0 Bit 0 RCOUT Open-drain Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM Bit 12 (HLP): power consumption mode 0 : Low power consumption mode, applies to operating frequency at 400kHz or below 400kHz 1 : High power consumption mode, applies to operating frequency above 400kHz (default) Bits 11 ~ 7 (C4 ~ C0): Internal RC mode Calibration bits. These bits must always be set to “1” only (auto calibration). Bit 6 and Bit 5 (RCM1, RCM0): RC mode selection bits RCM 1 RCM 0 *Frequency (MHz) 1 1 4 1 0 16 0 1 8 0 0 1 * Theoretical values, for reference only Bits 4 ~ 1 (OSC3, OSC2, OSC1 and OSC0): Oscillator Mode Select bits Oscillator Modes OSC3 OSC2 OSC1 OSC0 1 ERC (External RC oscillator mode); P64/RCOUT act as P64 1 ERC (External RC oscillator mode); P64/RCOUT act as RCOUT 2 IRC (Internal RC oscillator mode); P64/RCOUT act as P64 2 IRC (Internal RC oscillator mode); P64/RCOUT act as RCOUT 0 0 0 0 0 0 0 1 0 0 1 0 0 0 1 1 3 0 1 0 0 LXT1 (Frequency range of LXT1 mode is 1MHz~100kHz) 3 0 1 0 1 3 0 1 1 0 HXT2 (Frequency range of HXT2 mode is 12 MHz~6 MHz) 3 0 1 1 1 XT (Frequency range of XT mode is 6 MHz~1 MHz) (default) 1 1 1 1 HXT1 (Frequency range of HXT1 mode is 20 MHz~12 MHz) LXT2 (Frequency range of LXT2 mode is 32.768kHz) 1 In ERC mode, ERCin is used as oscillator pin. RCOUT/P64 is defined by Code Option Word 1 Bit 4 ~ Bit 1. 2 In IRC mode, P65 is normal I/O pin. RCOUT/P64 is defined by Code Option Word 1 Bit 4 ~ Bit 1. 3 In LXT1, LXT2, HXT1, HXT2 and XT modes; OSCI and OSCO are used as oscillator pins. These pins cannot and should not be defined as normal I/O pins. Bit 0 (RCOUT): System clock or open-drain enable bit in IRC or ERC mode 0 : RCOUT pin is open drain 1 : RCOUT output System clock (Default) Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 37 EM78P173N 8-Bit Microcontroller with OTP ROM 6.8.3 Customer ID Register (Word 2) Word 2 Bit Mne Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 − SFS ID9 ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 1 − 16K 14 PIN High High High High High High High High High High 0 − 128K 10 PIN Low Low Low Low Low Low Low Low Low Low monic TYPE Bit 12: Not used. Set to “1” at all time. Bit 11 (SFS): Sub Frequency Select for Green mode. (Not included WDT time-out and POR release setup-up time) 0 : 128kHz 1 : 16kHz (default) Bit 10 (TYPE): Type selection for EM78P173N Type MCU Type 0 EM78P173N-10Pin 1 EM78P173N-14Pin (Default) Bits 9 ~ 0: Customer’s ID code 6.9 Power-on Consideration Any microcontroller is not guaranteed to start to operate properly before the power supply stabilizes at its steady state. Under customer application, when power is OFF, Vdd must drop to below 1.8V and remains OFF for 10 µs before power can be switched ON again. This way, the EM78P173N will reset and operate normally. The extra external reset circuit will work well if Vdd can rise at very fast speed (50 ms or less). However, under most cases where critical applications are involved, extra devices are required to assist in solving the power-up problems. 6.10 Programmable Oscillator WDT Time-out Period The Option word contains WDTPS0 and WDTPS1 which can be used to define the oscillator WDT time-out Period. Theoretically, the range is from 4.5 ms to 288 ms. For most of crystal or ceramic resonators, the lower the operation frequency, the longer the set-up time may be required. Table 12 describes the values of the Oscillator WDT Time. 38 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 6.11 External Power-on Reset Circuits The circuitry in the figure implements an external RC Vdd to produce the reset pulse. R The pulse width (time /RESET D constant) should be kept EM78P173N long enough for Vdd to Rin reach minimum operation C voltage. This circuit is used when the power supply has a slow rise Figure 6-16 External Power-up Reset Circuit time. Since the current leakage from the /RESET pin is ± 5 μA, it is recommended that R should not be greater than 40K. In this way, the /RESET pin voltage is held below 0.2V. The diode (D) acts as a short circuit at the moment of power down. The capacitor C will discharge rapidly and fully. Rin, the current-limited resistor, will prevent high current or ESD (electrostatic discharge) from flowing to pin /RESET. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 39 EM78P173N 8-Bit Microcontroller with OTP ROM 6.12 Residue-Voltage Protection When the battery is replaced, the device power (Vdd) is cut off but residue-voltage remains. The residue-voltage may trip below the minimum Vdd, but not to zero. This condition may cause a poor power-on reset. The following figures illustrate two recommended methods on how to build a residue-voltage protection circuit for the EM78P173N. Vdd Vdd 33K EM78P173N Q1 10K /RESET 100K 1N4684 Figure 6-17 Residue Voltage Protection Circuit 1 Vdd Vdd R1 EM78P173N Q1 /RESET R2 R3 Figure 6-18 Residue Voltage Protection Circuit 2 NOTE Figure 6-17 and Figure 6-18 should be designed to ensure that the voltage of the /RESET pin is larger than VIH (min). 40 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 6.13 Low Voltage Detector When an unstable power source condition occurs, such as external power noise interference or EMS test condition, a violent power vibration is generated. At the same time, the Vdd becomes unstable as it could be operating below the working voltage. When the system supply voltage (Vdd) is below the operating voltage, the IC kernel will automatically keep all register status. 6.13.1 Low Voltage Reset (LVR) LVR property is set at Bits 9 and 8 of Code Option Word 0. Detailed operation mode is as follows: Word 0 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 − RESETEN ENWDT CLKS LVR1 LVR0 Bit 6 Bit 5 WDTPS1 WDTPS0 Bit 4 Bit 3 Bit 2 ~ Bit 0 NRHL NRE Protect Bits 9 ~ 8 (LVR1 ~ LVR0): Low Voltage Reset enable bits LVR1, LVR0 VDD Reset Level 11 VDD Release Level N/A (Power-on Reset) 10 2.7V 2.9V 01 3.5V 3.7V 00 4.0V 4.2V 6.13.2 Low Voltage Detector (LVD) LVD property is set at Registers Bank 0-RE and Bank 1-RE. Detailed operation mode is explained below. 6.13.2.1 Bank 0 RE (LVD Control Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 /LVD LVDIF - - - - - LVDWE Bit 7 (/LVD): Low voltage Detector state. This is a read only bit. When the VDD pin voltage is lower than the LVD voltage interrupt level (selected by LVD1 and LVD0), this bit will be cleared. 0: Low voltage is detected. 1: Low voltage is not detected or LVD function is disabled. Bit 6 (LVDIF): Low Voltage Detector Interrupt Flag LVDIF is reset to “0” by software or hardware “1” means there’s interrupt request “0” means no interrupt occurs Bit 0 (LVDWE): Low Voltage Detect wake-up enable bit 0: Disable Low Voltage Detect wake-up 1: Enable Low Voltage Detect wake-up Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 41 EM78P173N 8-Bit Microcontroller with OTP ROM When the Low Voltage Detect is used to enter an interrupt vector or to wake-up the IC from Sleep/Idle mode with the Low Voltage Detect running, the LVDWE bit must be set to “Enable.“ 6.13.2.2 Bank 1 RE (LVD Interrupt and Wake-up Register) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 LVDIE LVDEN LVD1 LVD0 - - - EXWE NOTE The Bank 1-RE <7> register is both readable and writable. Individual interrupt is enabled by setting its associated control bit in the Bank 1-RE<7> to "1." Global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. Refer to Figure 6-10 (Interrupt Input Circuit) in Section 6.6 (Interrupt). Bit 7 (LVDIE): Low voltage Detector interrupt enable bit 0: Disable Low Voltage Detector interrupt 1: Enable Low Voltage Detector interrupt When a detected low level voltage state is used to enter an interrupt vector or enter the next instruction, the LVDIE bit must be set to “Enable.” Bit 6 (LVDEN): Low Voltage Detector enable bit 0: Disable Low voltage detector 1: Enable Low voltage detector Bits 5 ~ 4 (LVD1 ~ 0): Low Voltage Detector level bits LVDEN LVD1, LVD0 1 11 1 10 1 01 1 00 0 ×× LVD Voltage Interrupt Level /LVD Vdd ≤ 2.2V 0 Vdd > 2.2V 1 Vdd ≤ 3.3V 0 Vdd > 3.3V 1 Vdd ≤ 4.0V 0 Vdd > 4.0V 1 Vdd ≤ 4.5V 0 Vdd > 4.5V 1 NA 1 NOTE IF Vdd has crossover at LVD voltage in interrupt level as VDD varies, LVD interrupt will occur. 42 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 6.13.3 Programming Process Follow these steps to obtain data from the LVD: 1. Write to the two bits (LVD1: LVD0) on the Bank 1-RE (LVDCR) register to define the LVD level 2. Set the LVDWE bit if the wake-up function is in use. 3. Set the LVDIE bit if the interrupt function is in use. 4. Write “ENI” instruction if the interrupt function is in use. 5. Set LVDEN bit to “1” 6. Write “SLEP” instruction or Polling /LVD bit 7. Clear the interrupt flag bit (LVDIF) when Low Voltage Detect occurs. NOTE The internal LVD module uses an internal circuit, and when the code option is set to enable the LVD module, the current consumption will increase to about 5 µA. During Sleep mode, the LVD module continues to operate. If the device voltage drops slowly and crosses the detection point, the LVDIF bit will be set and the device will wake up from Sleep mode. The LVD interrupt flag will remain set at priority status. When the system resets, the LVD flag is cleared. The following figure shows the LVD module detection point in an external voltage condition. LVDIF is cleared by software Vdd VLVD VRESET LVDIF Internal Reset <LVR Voltage drop >LVR Voltage drop Vdd < Vreset not longer than 80us, the system still keeps on operating 18ms System occur reset Figure 6-19 LVD/LVR Waveform with the Detection Point in an External Voltage Condition When Vdd drops, but above VLVD, the LVDIF is kept at “0”. When Vdd drops below VLVD, the LVDIF is set to “1”. If global ENI is enabled, the LVDIF is also set to “1” and the next instruction will branch to an interrupt vector. The LVD interrupt flag is cleared to “0” by software. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 43 EM78P173N 8-Bit Microcontroller with OTP ROM When Vdds drops below VRESET at less than 80 µs, the system will keep all the registers’ status and halts its operation, but the oscillation remains active. When Vdd drops below VRESET at more than 80 µs, a system reset will occur. Refer to Section 6.5.1 Reset and Wake-up Operation, for detailed Reset description. 6.14 Instruction Set Each instruction in the instruction set is a 13-bit word divided into an OP code and one or more operands. Normally, all instructions are executed within one single instruction cycle (one instruction consists of two oscillator periods), unless the program counter is changed by instruction "MOV R2,A", "ADD R2,A", or by instructions of arithmetic or logic operation on R2 (e.g., "SUB R2,A", "BS(C) R2,6", "CLR R2", etc.). In this case, execution takes two instruction cycles. If for some reasons, the specification of the instruction cycle is not suitable for certain applications, try modifying the instruction as follows: A) Modify one instruction cycle to consist of four oscillator periods. B) "JMP", "CALL", "RET", "RETL", "RETI" or the conditional skip ("JBS", "JBC", "JZ", "JZA", "DJZ”, "DJZA") commands which were tested to be true, are executed within one instruction cycle. The instructions that are written to the program counter also take one instruction cycle. Case (A) is selected by the Code Option bit, called CLK. One instruction cycle consists of two oscillator clocks if CLK is low; and four oscillator clocks if CLK is high. Note that once the four oscillator periods within one instruction cycle is selected as in Case (A), the internal clock source to TCC should be CLK=Fosc/4, instead of Fosc/2. Moreover, the instruction set has the following features: 1) Every bit of any register can be set, cleared, or tested directly. 2) The I/O register can be regarded as general register. That is, the same instruction can operate on the I/O register. 44 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM The following symbols are used in the Instruction Set table: Convention: R = Register designator that specifies which one of the registers (including operation and general purpose registers) is to be utilized by the instruction. Bit 6 in R4 determine the selected register bank. b = Bit field designator that selects the value for the bit located in the register R and which affects the operation. k = 8 or 10-bit constant or literal value Binary Instruction 1 Hex Mnemonic Operation Status Affected 0 0000 0000 0000 0000 NOP No Operation None 0 0000 0000 0001 0001 DAA Decimal Adjust A 0 0000 0000 0010 0002 CONTW A → CONT None 0 0000 0000 0011 0003 SLEP 0 → WDT, Stop oscillator T, P 0 0000 0000 0100 0004 WDTC 0 → WDT T, P 0 0000 0000 rrrr 000r IOW R A → IOCR None 1 0 0000 0001 0000 0010 ENI Enable Interrupt None 0 0000 0001 0001 0011 DISI Disable Interrupt None 0 0000 0001 0010 0012 RET [Top of Stack] → PC None 0 0000 0001 0011 0013 RETI [Top of Stack] → PC, Enable Interrupt None 0 0000 0001 0100 0014 CONTR CONT → A None 0 0000 0001 rrrr 001r IOR R IOCR → A None 1 0 0000 01rr rrrr 00rr MOV R,A A→R None 0 0000 1000 0000 0080 CLRA 0→A Z 0 0000 11rr rrrr 00rr CLR R 0→R Z 0 0001 00rr rrrr 01rr SUB A,R R-A → A Z, C, DC 0 0001 01rr rrrr 01rr SUB R,A R-A → R Z, C, DC 0 0001 10rr rrrr 01rr DECA R R-1 → A Z 0 0001 11rr rrrr 01rr DEC R R-1 → R Z 0 0010 00rr rrrr 02rr OR A,R A∨R→A Z 0 0010 01rr rrrr 02rr OR R,A A∨R→R Z 0 0010 10rr rrrr 02rr AND A,R A&R→A Z 0 0010 11rr rrrr 02rr AND R,A A&R→R Z 0 0011 00rr rrrr 03rr XOR A,R A⊕R→A Z 0 0011 01rr rrrr 03rr XOR R,A A⊕R→R Z 0 0011 10rr rrrr 03rr ADD A,R A+R→A Z, C, DC 0 0011 11rr rrrr 03rr ADD R,A A+R→R Z, C, DC C This instruction is applicable to IOC5~IOC6, IOCB ~ IOCF only. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 45 EM78P173N 8-Bit Microcontroller with OTP ROM (Continuation) Binary Instruction Hex Mnemonic Operation Status Affected 0 0100 00rr rrrr 04rr MOV A,R R→A Z 0 0100 01rr rrrr 04rr MOV R,R R→R Z 0 0100 10rr rrrr 04rr COMA R /R → A Z 0 0100 11rr rrrr 04rr COM R /R → R Z 0 0101 00rr rrrr 05rr INCA R R+1 → A Z 0 0101 01rr rrrr 05rr INC R R+1 → R Z 0 0101 10rr rrrr 05rr DJZA R R-1 → A, skip if zero None 0 0101 11rr rrrr 05rr DJZ R R-1 → R, skip if zero None 0 0110 00rr rrrr 06rr RRCA R R(n) → A(n-1), R(0) → C, C → A(7) C 0 0110 01rr rrrr 06rr RRC R R(n) → R(n-1), R(0) → C, C → R(7) C 0 0110 10rr rrrr 06rr RLCA R R(n) → A(n+1), R(7) → C, C → A(0) C 0 0110 11rr rrrr 06rr RLC R R(n) → R(n+1), R(7) → C, C → R(0) C 0 0111 00rr rrrr 07rr SWAPA R R(0-3) → A(4-7), R(4-7) → A(0-3) None 0 0111 01rr rrrr 07rr SWAP R R(0-3) ↔ R(4-7) None 0 0111 10rr rrrr 07rr JZA R R+1 → A, skip if zero None 0 0111 11rr rrrr 07rr JZ R R+1 → R, skip if zero None 0 100b bbrr rrrr 0xxx BC R,b 0 → R(b) None 2 0 101b bbrr rrrr 0xxx BS R,b 1 → R(b) None 3 0 110b bbrr rrrr 0xxx JBC R,b if R(b)=0, skip None 0 111b bbrr rrrr 0xxx JBS R,b if R(b)=1, skip None 1 00kk kkkk kkkk 1kkk CALL k PC+1 → [SP], (Page, k) → PC None 1 01kk kkkk kkkk 1kkk JMP k (Page, k) → PC None 1 1000 kkkk kkkk 18kk MOV A,k k→A None 1 1001 kkkk kkkk 19kk OR A,k A∨k→A Z 1 1010 kkkk kkkk 1Akk AND A,k A&k→A Z 1 1011 kkkk kkkk 1Bkk XOR A,k A⊕k→A Z 1 1100 kkkk kkkk 1Ckk RETL k k → A, [Top of Stack] → PC 1 1101 kkkk kkkk 1Dkk SUB A,k k-A → A Z, C, DC 1 1111 kkkk kkkk 1Fkk ADD A,k k+A → A Z, C, DC 1 1110 1001 kkkk 1E9k BANK k k → R4(6) None None 2 Note: This instruction is not recommended for interrupt status register operation. 3 46 • This instruction cannot operate under interrupt status register. Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM (Continuation) Binary Instruction Hex Mnemonic Operation Status Affected If Bank 1 R5.7=0, machine code(7:0) → R Else 1 1110 11rr rrrr 1Err TBRD R None Bank 1 R5.7 = 1 Machine Code (12:8) → R(4:0), R(7:5)=(0,0,0) 7 Absolute Maximum Ratings EM78P173N Items Rating Temperature under bias -40°C to 85°C Storage temperature -65°C to 150°C Input voltage Vss-0.3V to Vdd+0.5V Output voltage Vss-0.3V to Vdd+0.5V Working Voltage 2.1V to 5.5V Working Frequency DC to 20 MHz NOTE These parameters are theoretical values and have not been tested. 8 Electrical Characteristics 8.1 DC Characteristics Ta=25°C, VDD=5V, VSS=0V Symbol Parameter Condition Min. Typ. Max. Unit Crystal: VDD to 2.1V Two cycles with two clocks DC − 4.0 MHz FXT Crystal: VDD to 3V Two cycles with two clocks DC − 8.0 MHz Crystal: VDD to 5V Two cycles with two clocks DC − ERC ERC: VDD to 5V R: 5KΩ, C: 39pF Input Leakage Current for input pins VIN = VDD, VSS VIH1 IIL Input High Voltage (VDD=5V) Ports 5, 6 VIL1 Input Low Voltage (VDD=5V) Input High Threshold Voltage (VDD=5V) VIHT1 VILT1 Ports 5, 6 /RESET, TCC (Schmitt trigger) /RESET, TCC Input Low Threshold Voltage (VDD=5V) (Schmitt trigger) Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) F±30% 1500 20.0 MHz F±30% kHz − − − ±1 − µA 2.0 − − 0.8 V 2.0 − − V − − 0.8 V V • 47 EM78P173N 8-Bit Microcontroller with OTP ROM (Continuation) Symbol Parameter Condition Min. Typ. Max. Unit VIHX1 Clock Input High Voltage (VDD=5V) OSCI 2.5 − − V VILX1 Clock Input Low Voltage (VDD=5V) OSCI − − 1.0 V VIH2 Input High Voltage (VDD=3V) Ports 5, 6 1.5 − − V Ports 5, 6 − − 0. 4 V 1.5 − − V − − 0.4 V VIL2 Input Low Voltage (VDD=3V) VIHT2 Input High Threshold Voltage (VDD=3V) VILT2 /RESET, TCC (Schmitt trigger) /RESET, TCC Input Low Threshold Voltage (VDD=3V) (Schmitt trigger) VIHX2 Clock Input High Voltage (VDD=3V) OSCI 1.5 − − V VILX2 Clock Input Low Voltage (VDD=3V) OSCI − − 0.6 V VOH1 Output High Voltage (Ports 5, Ports 6) IOH = -12mA 2.4 − − V VOL1 Output Low Voltage (P50~P53, IOL = 12mA P60~P62, P66~P67 are Schmitt trigger) − − 0.4 V VOL2 Output Low Voltage (P64, P65) IOL = 16.0mA − − 0.4 V IOL = 20mA − − 0.4 V − 70 − µA − 30 − µA − − 1 µA − − 10 µA − 15 20 µA − 15 25 µA − − 1.5 mA − − 2.8 mA VOL3 Output Low Voltage (P63) IPH Pull-high current IPD Pull-down current ISB1 Power down current ISB2 Power down current ICC1 Operating supply current at two clocks (VDD=3V) ICC2 Operating supply current at two clocks (VDD=3V) ICC3 Operating supply current at two clocks (VDD=5.0V) ICC4 Operating supply current at two clocks (VDD=5.0V) Pull-high active, input pin at VSS Pull-down active, input pin at VDD All input and I/O pins at VDD, Output pin floating, WDT disabled All input and I/O pins at VDD, Output pin floating, WDT enabled /RESET= 'High', Fosc=32kHz (Crystal type, CLKS="0"), Output pin floating, WDT disabled /RESET= 'High', Fosc=32kHz (Crystal type, CLKS="0"), Output pin floating, WDT enabled /RESET= 'High', Fosc=4 MHz (Crystal type, CLKS="0"), Output pin floating /RESET= 'High', Fosc=10 MHz (Crystal type, CLKS="0"), Output pin floating NOTE These parameters are theoretical values and have not been tested. 48 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM Internal RC Electrical Characteristics (Ta=25°C, VDD=5 V, VSS=0V) Drift Rate Internal RC Temperature Voltage Min. Typ. Max. 4 MHz 25°C 5V 3.92 MHz 4 MHz 4.08 MHz 16 MHz 25°C 5V 15.68 MHz 16 MHz 16.32 MHz 8 MHz 25°C 5V 7.84 MHz 8 MHz 8.16 MHz 1 MHz 25°C 5V 0.98MHz 1MHz 1.02MHz Internal RC Electrical Characteristics (Ta= -40 ~85°C) Drift Rate Internal RC Temperature Voltage Min. Typ. Max. 4 MHz -40 ~ 85°C 2.1V~5.5V 3.76 MHz 4 MHz 4.24 MHz 16 MHz -40 ~ 85°C 4.0V~5.5V 15.36 MHz 16MHz 16.64 MHz 8 MHz -40 ~ 85°C 3.0V~5.5V 7.60 MHz 8 MHz 8.40 MHz 1 MHz -40 ~ 85°C 2.1V~5.5V 0.94 MHz 1MHz 1.06 MHz 8.2 AC Characteristics Ta=25°C, VDD=5V, VSS=0V Symbol Parameter Conditions Min. Typ. Max. Unit Dclk Input CLK duty cycle − 45 50 55 % Tins Instruction cycle time (CLKS="0") Crystal type 100 − DC ns RC type 500 − DC ns Ttcc TCC input period − (Tins+20)/N* − − ns Tdrh Device reset hold time Ta = 25°C, XTAL, WDTPS1, WDTPS0=1, 1 16.8-30% 16.8 16.8+30% ms Trst /RESET pulse width Ta = 25°C 2000 − − ns *Twdt1 Watchdog timer period Ta = 25°C WDTPS1, WDTPS0=1,1 16.8-30% 17.6 16.8+30% ms *Twdt2 Watchdog timer period Ta = 25°C WDTPS1, WDTPS0=1,0 4.5-30% 4.5 4.5+30% ms *Twdt3 Watchdog timer period Ta = 25°C WDTPS1, WDTPS0=0,1 288-30% 288 288+30% ms *Twdt4 Watchdog timer period Ta = 25°C WDTPS1, WDTPS0=0,0 72-30% 72 72+30% ms Tset Input pin setup time − − 0 − ns Thold Input pin hold time − − 20 − ns Cload=20pF − 50 − ns Tdelay Output pin delay time Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 49 EM78P173N 8-Bit Microcontroller with OTP ROM NOTE These parameters are theoretical values and have not been tested. The Watchdog Timer duration is determined by Code Option (Bit 6, Bit 5) *N = selected prescaler ratio *Twdt1: The Option Word (WDTPS1, WDTPS0) is used to define the oscillator WDT time. In Crystal mode the WDT time-out length is the same as 18 ms. *Twdt2: The Option Word (WDTPS1, WDTPS0) is used to define the oscillator WDT time. In Crystal mode the WDT time-out length is the same as 4.5 ms. *Twdt3: The Option Word (WDTPS1, WDTPS0) is used to define the oscillator WDT time. In Crystal mode the WDT time-out length is the same as 288 ms. *Twdt4: The Option Word (WDTPS1, WDTPS0) is used to define the oscillator WDT time. In Crystal mode the WDT time-out length is the same as 72 ms. 50 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 9 Timing Diagrams AC Test Input/Output Waveform Note: AC Testing: Input are driven at 2.4V for logic “1”, and 0.4V for logic “0” Timing measurements are made at 2.0V for logic “1”, and 0.8V for logic “0” Figure 9-1a AC Test Input/Output Waveform Timing Diagram Reset Timing (CLK = "0") Figure 9-1b Reset Timing Diagram TCC Input Timing (CLKS = "0") Figure 9-1c TCC Input Timing Diagram Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 51 EM78P173N 8-Bit Microcontroller with OTP ROM APPENDIX A Package Type OTP MCU Package Type Pin Count Package Size EM78P173ND14J/S DIP 14 300 mil EM78P173NSO14J/S SOP 14 150 mil EM78P173NMS10J/S MSOP 10 118 mil These are Green products which do not contain hazardous substances and comply with the third edition of Sony SS-00259 standard. Pb content is less than 100ppm and complies with Sony specifications. Part No. Electroplate type Pure Tin Ingredient (%) Sn: 100% Melting point (°C) 52 • EM78P173N 232°C Electrical resistivity (μΩ-cm) 11.4 Hardness (hv) 8~10 Elongation (%) >50% Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM B Package Information 14-Lead Plastic Dual In–line Package (PDIP) — 300 mil Figure B-1a EM78P173N 14-Lead PDIP Package Type Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 53 EM78P173N 8-Bit Microcontroller with OTP ROM 14-Lead Small Outline Package (SOP) — 150 mil Figure B-1b EM78P173N 14-Lead SOP Package Type 54 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) EM78P173N 8-Bit Microcontroller with OTP ROM 10-Lead Micro Small Outline Package (MSOP) — 118 mil Figure B-1c EM78P173N 10-Lead MSOP Package Type Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice) • 55 EM78P173N 8-Bit Microcontroller with OTP ROM C Quality Assurance and Reliability Test Category Solderability Test Conditions Remarks Solder temperature = 245 ± 5°C, for 5 seconds up to the stopper using a rosin-type flux – Step 1: TCT, 65°C (15 min)~150°C (15 min), 10 cycles Step 2: Bake at 125°C, TD (endurance) = 24 hrs Step 3: Soak at 30°C/60%, TD (endurance) = 192 hrs Step 4: IR flow 3 cycles Pre-condition (Pkg thickness ≥ 2.5mm or 3 Pkg volume ≥ 350 mm ---- 225 ± 5°C) For SMD IC (such as SOP, QFP, SOJ, etc) (Pkg thickness ≤ 2.5 mm or 3 Pkg volume ≤ 350 mm ---- 240 ± 5°C) Temperature cycle test -65°C (15 min) ~ 150°C (15 min), 200 cycles – Pressure cooker test TA = 121°C, RH = 100%, pressure = 2 atm, TD (endurance) = 96 hrs – High temperature / High humidity test TA = 85°C , RH = 85%, TD (endurance) = 168 , 500 hrs – High-temperature storage life TA = 150°C, TD (endurance) = 500, 1000 hrs – High-temperature operating life TA = 125°C, VCC = Max. operating voltage, TD (endurance) = 168, 500, 1000 hrs – Latch-up TA = 25°C, VCC = Max. operating voltage, 800mA/40V – ESD (HBM) TA = 25°C, ≥∣± 4KV∣ IP_ND,OP_ND,IO_ND IP_NS,OP_NS,IO_NS IP_PD,OP_PD,IO_PD, IP_PS,OP_PS,IO_PS, TA = 25°C, ≥ ∣± 400V∣ ESD (MM) C.1 VDD-VSS(+),VDD_VSS (-) mode Address Trap Detect An address trap detect is one of the MCU embedded fail-safe functions that detects MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an instruction from a certain section of ROM, an internal recovery circuit is auto started. If a noise-caused address error is detected, the MCU will repeat execution of the program until the noise is eliminated. The MCU will then continue to execute the next program. 56 • Product Specification (V1.1) 07.08.2011 (This specification is subject to change without further notice)