DESCRIPTION FEATURES BLOCK DIAGRAM

PT16820
OLED Driver IC
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DESCRIPTION
The PT16820 is a single-chip CMOS OLED
driver/controller for organic light emitting diode dot
passive matrix display systems. It consists of 256
segments and 136 commons.
The PT16820 communicates with the host
microcontroller via an 8080/6800-series compatible
parallel interface or a serial interface. The PT16820
has a set of control registers that can be addressed by
the interface.
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FEATURES
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Segment source current: 600µA (max.)
Common sink current: 160mA
16/4/2 gray scale levels
Gray Scale lookup table
Embedded 256x136x4x2 bits SRAM
64-step output current adjustment
Current reference controlled by external
resistor
Programmable frame rate
Selectable MCU interface
8-bit 8080/6800-series parallel interface
Serial interface
On-chip oscillator
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Supports up to 256x136 dot matrix panel
Power supply:
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Low voltage power ( VDD ): 3.0 ~ 5.5V
Core Logic power (VCC) 1.8V
Segment power (VHA): 8.0V ~ 26V
Common power (VHC): 18V (Max.)
BLOCK DIAGRAM
COM68 ~ COM135
SEG255 ~ SEG0
Cathode
Driver
CUR_IO
IREF
SEG/COM
Driving
Block
Anode
Driver
Oscillator
Cathode
Driver
Display
Timing
Controller
Display SRAM
256x136x4x2
Bits
CKSEL
CLK_EXT
ROSC
COM0 ~ COM67
SYNC
CLK2
M/S
Control
Registers
Command Decoder
VRO
LDO_EN
BG_DIS
Regulator
VHC
VDD
VCC
GND
VHA
PGNDA
R/W#-(WR#)
D[7:0]
SEL[1:0]
CS#
RS
E-(RD#)
TSTMOD
INT
RES#
MCU
Interface
Tel: 886-66296288‧Fax: 886-29174598‧ http://www.princeton.com.tw‧2F, No. 233-1, Baociao Rd., Sindian Dist., New Taipei City 23145, Taiwan
PT16820
CONTENTS
1.
2.
3.
4.
5.
6.
APPLICATION CIRCUIT .........................................................................................................................................3
ORDER INFORMATION .........................................................................................................................................4
PIN CONFIGURATION ...........................................................................................................................................4
PIN DESCRIPTION.................................................................................................................................................5
INPUT/OUTPUT PINS EQUIVALENT CIRCUIT ....................................................................................................7
FUNCTION DESCRIPTION ....................................................................................................................................9
6.1 MCU INTERFACE .............................................................................................................................................9
6.2 ON-CHIP OSCILLATOR....................................................................................................................................9
6.3 GRAPHIC SRAM ...............................................................................................................................................9
6.4 SEGMENT AND COMMON DRIVER ................................................................................................................9
6.5 DUMMY SCAN ................................................................................................................................................10
6.6 MASTER/SLAVE CONFIGURATION ..............................................................................................................11
6.7 COMMAND TABLE .........................................................................................................................................11
6.8 COMMAND DESCRIPTION ............................................................................................................................13
7. ABSOLUTE MAXIMUM RATING ..........................................................................................................................33
8. DC CHARACTERISTICS ......................................................................................................................................34
9. AC CHARACTERISTICS ......................................................................................................................................36
9.1 PARALLEL 8080 INTERFACE (WRITE MODE) .............................................................................................36
9.2 WRITE TIMING TABLE (8080) .......................................................................................................................36
9.3 PARALLEL 8080 INTERFACE (READ MODE) ..............................................................................................37
9.4 READ TIMING TABLE (8080) .........................................................................................................................37
9.5 PARALLEL 6800 INTERFACE (WRITE MODE) .............................................................................................38
9.6 WRITE TIMING TABLE (6800) .......................................................................................................................38
9.7 PARALLEL 6800 INTERFACE (READ MODE) ..............................................................................................39
9.8 READ TIMING TABLE (6800) .........................................................................................................................39
9.9 SERIAL INTERFACE (WRITE ONLY) ............................................................................................................40
9.10 SERIAL TIMING TABLE ................................................................................................................................40
9.11 TIMING OF SEGMENTS AND COMMONS ..................................................................................................41
9.12 VDD AND VHA AND VHC POWER SEQUENCE TIMING ...........................................................................42
9.13 RESET TIMING .............................................................................................................................................43
10. PAD CONFIGURATION .......................................................................................................................................44
11. PAD LOCATION ...................................................................................................................................................45
IMPORTANT NOTICE .................................................................................................................................................. 62
V1.3
2
September 2014
RD#
INT
VDD
WR#
IREF
CLK_EXT
CKSEL
ROSC
D[5:0]
RD# (parallel) / GND (serial)
VDD
VHC
VDD
VHA
MS
VHC
VDD
VHA
GND
PGNDA
VCC
VRO
LDO_EN
SEL[1:0]
CS#
RS
D7
D6
WR# (parallel) / GND (serial)
D7 (parallel) / SDIN (serial)
RS
CS1
D[5:0] (parallel) / GND (serial)
D6 (parallel) / SCK (serial)
CUR_IO
PT16820
CLK2
SYNC
RD#
INT
WR#
D[5:0]
D7
D6
PGNDA
VCC
VRO
LDO_EN
SEL[1:0]
CS#
RS
VHC
VDD
VHA
GND
CUR_IO
MS
COM[67:101]
IREF
CLK_EXT
CKSEL
ROSC
CLK2
VHC
VDD
VHA
RS
CS2
VDD
VDD
1uF
~
10uF
1uF
~
10uF
September 2014
3
V1.3
COM[67:34]
COM[102:135]
COM[0:33]
SEG0
SEG255
COM[101:68]
COM[67:0]
PANEL
COM[135:68]
SEG255
SEG0
COM[33:0]
1uF ~ 10uF
1uF ~ 10uF
COM[135:102]
COM[34:67]
SYNC
PT16820
1. APPLICATION CIRCUIT
PT16820
PT16820
2. ORDER INFORMATION
Valid Part Number
PT16820
Package Type
Bare Chip
Top Code
PT16820-G
3. PIN CONFIGURATION
611
612
(44.99, 15403.975)
1
(45, 146.025)
342
330
V1.3
4
September 2014
PT16820
4. PIN DESCRIPTION
Pin Name
COM33~0
COM68~101
COM102~135
COM67~34
Dummy99, 2
Dummy1, 3
Dummy4~19
Dummy20~23
Dummy24~75
Dummy78~81
Dummy82~98
SEG0~255
I/O
Description
Pin No.
1~34
295~328
346~379
562~595
35, 36
293, 294,
329~345
380~383
396~447
558~561
596~612
37~292
384~387
554~557
388~391
550~553
392~395
546~549
448, 449
450~453
537~544
O
Common (cathode) outputs.
P
Dummy pad
O
Segment (anode) outputs.
VHA
P
Power pin to drive segment.
PGNDA
P
Ground pin.
VHC
P
Power pin to drive common
Bumpcheck1, 2
A
For bumping check
VDD
P
5V/3.3V power input.
CKSEL
I
ROSC
A
GND
P
Ground pin.
MS
I
Master/Slave selection. When MS = H, the chip is master.
Clock signal for master and slave chips.
When MS = H, the chip is a master chip and this pin outputs clock signal.
When MS = L, the chip is a slave chip and this pin is a clock input by which
the slave chip synchronizes with the master chip.
Synchronization signal for master and slave chips.
When MS = H, the chip is a master chip and this pin outputs frame
synchronization signal.
When MS = L, the chip is a slave chip, and this pin is an input by which the
slave chip synchronizes with the master chip.
External clock input.
When internal oscillator is disabled (LOW in CKSEL pin), the pin is the input
pin for external clock source.
When internal oscillator is enabled (HIGH in CKSEL pin), this pin is not used
and should be connected to ground.
No connection pin. It should be left open or connected to ground.
No connection pin. It should be left open or connected to ground
Frame synchronization signal to be used by MCU.
CLK2
IO
SYNC
IO
CLK_EXT
TEST_EN
TSCAN_EN
INT
I
I(PL)
I(PL)
O
Internal clock selection pin.
When this pin is pulled HIGH, internal oscillator is enabled.
When this pin is pulled LOW, internal oscillator is disabled
A resister connected between this pin and ground determines the oscillation
frequency.
Please isolate ROSC from switching noise, e.g. CLK2. If ROSC is
interfered, the jitter of system clock increases.
SEL0, 1
I
Interface mode selection
CS#
I
RS
I
Chip select pin.
Interface data/command selection pin.
When the pin is LOW, D[7:0] is a command.
When the pin is HIGH, D[7:0] is RAM data or register data.
5
V1.3
454, 455
456, 457
458~461
526~529
462, 463
464, 465
466, 467
468, 469
470, 471
472, 473
474, 475
476, 477
478, 479
480, 481
482, 483
September 2014
PT16820
Pin Name
WR# (W/R#)
RD# (E)
Description
6800 Parallel Interface: READ/WRITE or 8080 Parallel Interface: WRITE.
6800 Parallel Interface: data enable or 8080 Parallel Interface: READ.
Bi-directional data bus.
D0~7
IO
In serial mode , D7 is serial data input (SDA) and D6 is serial clock input
(SCLK), and D5 ~ D0 must be connected to GND.
RES#
I
Low-active hardware reset pin.
Test mode selection.
TSTMOD
I(PL) When this pin is HIGH, the chip accepts test mode command.
When this pin is LOW, the chip doesn’t accept test mode command.
Power pin for core logic circuit.
VCC
P
If regulator is enabled, this pin is connected to VRO pin.
If regulator is disabled, this pin is connected to external 1.8V power supply.
Regulator voltage output pin for core logic.
VRO
P
When LDO_EN is pulled HIGH, VRO output 1.8V.
A 10uF capacitor load is recommended.
Regulator enable pin.
LDO_EN
I
When it is pulled HIGH, regulator is enabled.
Segment current reference pin. A resistor should be connected between this
IREF
A
pin and ground to generate the reference current for segment driver.
BG_DIS
I(PL) When this pin is pulled HIGH, the bandgap circuit is disabled.
Tj
A
This pin can be used to monitor temperature of chip.
Used for current matching between master and slave chips.
CUR_IO
A
The resistance load of this pin must be less than 200Ω
I = Input, O =Output, IO = Bi-directional (input/output),
P = Power pin, A = Analog pin
PL= Pulled-low
V1.3
I/O
I
I
6
Pin No.
484, 485
486, 487
488~503
504, 505
506, 507
508~513
514~523
524, 525
530, 531
532, 533
534~536
545
September 2014
PT16820
IMPORTANT NOTICE
Princeton Technology Corporation (PTC) reserves the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and to discontinue any product without notice at any time.
PTC cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a PTC product. No
circuit patent licenses are implied.
Princeton Technology Corp.
2F, 233-1, Baociao Road,
Sindian Dist., New Taipei City 23145, Taiwan
Tel: 886-2-66296288
Fax: 886-2-29174598
http://www.princeton.com.tw
V1.3
62
September 2014