RENESAS R8C-16

R8C/16 Group, R8C/17 Group
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
1.
REJ03B0101-0200
Rev.2.00
Jan 30, 2006
Overview
This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU
core and is packaged in a 20-pin plastic molded LSSOP. This MCU operates using sophisticated
instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of
executing instructions at high speed.
Furthermore, the data flash ROM (1KB × 2blocks) is embedded in the R8C/17 group.
The difference between the R8C/16 and R8C/17 groups is only the existence of the data flash ROM. Their
peripheral functions are the same.
1.1
Applications
Electric household appliance, office equipment, housing equipment (sensor, security), general industrial
equipment, audio, etc.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 1 of 35
R8C/16 Group, R8C/17 Group
1.2
1. Overview
Performance Overview
Table 1.1 lists the Performance Outline of the R8C/16 Group and Table 1.2 lists the Performance Outline
of the R8C/17 Group.
Table 1.1
Performance Outline of the R8C/16 Group
Item
Performance
CPU
Number of Basic Instructions 89 instructions
Minimum Instruction
50ns(f(XIN)=20MHz, VCC=3.0 to 5.5V)
Execution Time
100ns(f(XIN)=10MHz, VCC=2.7 to 5.5V)
Operating Mode
Single-chip
Address Space
1 Mbyte
Memory Capacity
See Table 1.3 R8C/16 Group Product Information
Peripheral
Port
I/O port : 13 pins (including LED drive port),
Function
Input : 2 pins
LED Drive Port
I/O port: 4 pins
Timer
Timer X: 8 bits × 1 channel, Timer Z: 8 bits × 1 channel
(Each timer equipped with 8-bit prescaler)
Timer C: 16 bits × 1 channel
(Circuits of input capture and output compare)
Serial Interface
1 channel
Clock synchronous serial I/O, UART
1 channel
I2C bus Interface (IIC)(1)
A/D Converter
10-bit A/D converter: 1 circuit, 4 channels
Watchdog Timer
15 bits × 1 channel (with prescaler)
Reset start selectable, Count source protection mode
Interrupt
Internal: 9 factors, External: 4 factors, Software: 4
factors
Priority level: 7 levels
Clock Generation Circuit
2 circuits
Main clock oscillation circuit (Equipped with a built-in
feedback resistor)
On-chip oscillator (high speed, low speed)
Equipped with frequency adjustment function on highspeed on-chip oscillator
Oscillation Stop Detection
Main clock oscillation stop detection function
Function
Voltage Detection Circuit
Included
Power-on Reset Circuit
Included
Electric
Supply Voltage
VCC=3.0 to 5.5V (f(XIN)=20MHz)
Characteristics
VCC=2.7 to 5.5V (f(XIN)=10MHz)
Power Consumption
Typ. 9mA (VCC=5.0V, f(XIN)=20MHz)
Typ. 5mA (VCC=3.0V, f(XIN)=10MHz)
Typ. 35µA (VCC=3.0V, wait mode, peripheral clock off)
Typ. 0.7µA (VCC=3.0V, stop mode)
Flash Memory Program/Erase Supply
VCC=2.7 to 5.5V
Voltage
Program/Erase Endurance
100 times
Operating Ambient Temperature
-20 to 85°C
-40 to 85°C (D Version)
Package
20-pin plastic mold LSSOP
NOTES:
1. I2C bus is a trademark of Koninklijke Philips Electronics N. V.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 2 of 35
R8C/16 Group, R8C/17 Group
Table 1.2
1. Overview
Performance Outline of the R8C/17 Group
Item
Performance
CPU
Number of Basic Instructions 89 instructions
Minimum Instruction Execution 50ns(f(XIN)=20MHz, VCC=3.0 to 5.5V)
Time
100ns(f(XIN)=10MHz, VCC=2.7 to 5.5V)
Operating Mode
Single-chip
Address Space
1 Mbyte
Memory Capacity
See Table 1.4 R8C/17 Group Product Information
Peripheral
Port
I/O : 13 pins (including LED drive port),
Function
Input : 2 pin
LED drive port
I/O port: 4 pins
Timer
Timer X: 8 bits × 1 channel, Timer Z: 8 bits × 1 channel
(Each timer equipped with 8-bit prescaler)
Timer C: 16 bits × 1 channel
(Circuits of input capture and output compare)
Serial Interface
1 channel
Clock synchronous serial I/O, UART
1 channel
I2C bus Interface (IIC)(1)
A/D Converter
10-bit A/D converter: 1 circuit, 4 channels
Watchdog Timer
15 bits × 1 channel (with prescaler)
Reset start selectable, Count source protection mode
Interrupt
Internal: 9 factors, External: 4 factors, Software: 4
factors
Priority level: 7 levels
Clock Generation Circuit
2 circuits
Main clock generation circuit (Equipped with a built-in
feedback resistor)
On-chip oscillator (high speed, low speed)
Equipped with frequency adjustment function on highspeed on-chip oscillator
Oscillation Stop Detection
Main clock oscillation stop detection function
Function
Voltage Detection Circuit
Included
Power-on Reset Circuit
Included
Electric
Supply Voltage
VCC=3.0 to 5.5V (f(XIN)=20MHz)
Characteristics
VCC=2.7 to 5.5V (f(XIN)=10MHz)
Power Consumption
Typ. 9mA (VCC = 5.0V, f(XIN) = 20MHz)
Typ. 5mA (VCC = 3.0V, f(XIN) = 10MHz)
Typ.35µA (VCC = 3.0V, wait mode, peripheral clock off)
Typ. 0.7µA (VCC = 3.0V, stop mode)
Flash Memory Program/Erase Supply Voltage VCC=2.7 to 5.5V
Program and Erase
10,000 times (Data flash)
1,000 times (Program ROM)
Endurance
Operating Ambient Temperature
-20 to 85°C
-40 to 85°C (D Version)
Package
20-pin plastic mold LSSOP
NOTES:
1. I2C bus is a trademark of Koninklijke Philips Electronics N. V.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 3 of 35
R8C/16 Group, R8C/17 Group
1.3
1. Overview
Block Diagram
Figure 1.1 shows a Block Diagram.
I/O port
8
4
Port P1
Port P3
1
2
Port P4
Peripheral Function
Timer
A/D Converter
(10 bits × 4 channels)
Timer X (8 bits)
Timer Z (8 bits)
Timer C (16 bits)
UART or
Clock Synchronous Serial I/O
(8 bits × 1 channel)
System Clock Generator
XIN-XOUT
High-Speed On-Chip
Oscillator
Low-Speed On-Chip
Oscillator
I2C bus Interface
Watchdog Timer
(15 bits)
R8C/Tiny Series CPU Core
R0H
R1H
R0L
R1L
R2
R3
SB
ROM(1)
USP
ISP
INTB
A0
A1
FB
Memory
RAM(2)
PC
FLG
Multiplier
NOTES:
1. ROM size depends on MCU type.
2. RAM size depends on MCU type.
Figure 1.1
Block Diagram
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 4 of 35
R8C/16 Group, R8C/17 Group
1.4
1. Overview
Product Information
Table 1.3 lists the Product Information of R8C/16 Group and Table 1.4 lists the Product Information of
R8C/17 Group.
Table 1.3
Product Information of R8C/16 Group
ROM
Capacity
8 Kbytes
12 Kbytes
16 Kbytes
8 Kbytes
12 Kbytes
16 Kbytes
Type No.
R5F21162SP
R5F21163SP
R5F21164SP
R5F21162DSP
R5F21163DSP
R5F21164DSP
Type No.
RAM
Capacity
512 bytes
768 bytes
1 Kbyte
512 bytes
768 bytes
1 Kbyte
As of Jan 2006
Package
Type
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
Remarks
Flash Memory Version
D Version
R 5 F 21 16 4 D SP
Package Type:
SP : PLSP0020JB-A
Grouping
D : Operation Ambient Temperature -40°C to 85°C
No Symbol : Operation Ambient Temperature -20°C to 85°C
ROM Capacity
2 : 8KB
3 : 12KB
4 : 16KB
R8C/16 Group
R8C/Tiny Series
Memory Type
F : Flash Memory Version
Renesas MCU
Renesas Semiconductors
Figure 1.2
Part Number, Memory Size and Package of R8C/16 Group
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 5 of 35
R8C/16 Group, R8C/17 Group
Table 1.4
1. Overview
Product Information of R8C/17 Group
Type No.
R5F21172SP
R5F21173SP
R5F21174SP
R5F21172DSP
R5F21173DSP
R5F21174DSP
Type No.
ROM Capacity
Program ROM Data flash
8 Kbytes
1 Kbyte × 2
12 Kbytes
1 Kbyte × 2
16 Kbytes
1 Kbyte × 2
8 Kbytes
1 Kbyte × 2
12 Kbytes
1 Kbyte × 2
16 Kbytes
1 Kbyte × 2
RAM
Capacity
512 bytes
768 bytes
1 Kbyte
512 bytes
768 bytes
1 Kbyte
As of Jan 2006
Package Type
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
Remarks
Flash Memory Version
D Version
R 5 F 21 17 4 D SP
Package Type:
SP : PLSP0020JB-A
Grouping
D : Operation Ambient Temperature -40°C to 85°C
No Symbol : Operating Ambient Temperature -20°C to 85°C
ROM Capacity
2 : 8KB
3 : 12KB
4 : 16KB
R8C/17 Group
R8C/Tiny Series
Memory Type
F : Flash Memory Version
Renesas MCU
Renesas Semiconductors
Figure 1.3
Part Number, Memory Size and Package of R8C/17 Group
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 6 of 35
R8C/16 Group, R8C/17 Group
1.5
1. Overview
Pin Assignments
Figure 1.4 shows the PLSP0020JB-A Package Pin Assignment (top view).
PIN Assignment (top view)
1
20
P3_4/SDA/CMP1_1
P3_7/CNTR0
2
19
P3_3/TCIN/INT3/CMP1_0
RESET
3
18
P1_0/KI0/AN8/CMP0_0
XOUT/P4_7(1)
4
17
P1_1/KI1/AN9/CMP0_1
VSS/AVSS
5
16
AVCC/VREF
XIN/P4_6
6
15
P1_2/KI2/AN10/CMP0_2
VCC
7
14
P1_3/KI3/AN11/TZOUT
MODE
8
13
P1_4/TXD0
P4_5/INT0
9
12
P1_5/RXD0/CNTR01/INT11
10
11
P1_6/CLK0
P1_7/CNTR00/INT10
R8C/16 Group
R8C/17 Group
P3_5/SCL/CMP1_2
NOTES:
1. P4_7 is a port for the input.
Package: PLSP0020JB-A(20P2F-A)
Figure 1.4
PLSP0020JB-A Package Pin Assignment (top view)
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 7 of 35
R8C/16 Group, R8C/17 Group
1.6
1. Overview
Pin Description
Table 1.5 lists the Pin Description and Table 1.6 lists the Pin Name Information by Pin Number.
Table 1.5
Pin Description
Function
I/O Type
Description
I
Apply 2.7V to 5.5V to the VCC pin. Apply 0V to
the VSS pin
Analog Power Supply AVCC
Input
AVSS
I
Power supply input pins to A/D converter.
Connect AVCC to VCC. Apply 0V to AVSS.
Connect a capacitor between AVCC and AVSS.
Reset Input
RESET
I
Input “L” on this pin resets the MCU
MODE
MODE
I
Connect this pin to VCC via a resistor
Main Clock Input
XIN
I
Main Clock Output
XOUT
O
These pins are provided for the main clock
generation circuit I/O. Connect a ceramic
resonator or a crystal oscillator between the XIN
and XOUT pins. To use an externally derived
clock, input it to the XIN pin and leave the XOUT
pin open.
INT Interrupt
INT0, INT1, INT3
I
INT interrupt input pins
Key Input Interrupt
KI0 to KI3
I
Key input interrupt input pins
Timer X
CNTR0
I/O
Timer X I/O pin
CNTR0
O
Timer X output pin
Timer Z
TZOUT
O
Timer Z output pin
Timer C
TCIN
I
Timer C input pin
CMP0_0 to CMP0_2,
CMP1_0 to CMP1_2
O
Timer C output pins
CLK0
I/O
Transfer clock I/O pin
RXD0
I
Serial data input pin
TXD0
O
Serial data output pin
bus Interface
(IIC)
SCL
I/O
Clock I/O pin
SDA
I/O
Data I/O pin
Reference Voltage
Input
VREF
I
Reference voltage input pin to A/D converter
Connect VREF to VCC
A/D Converter
AN8 to AN11
I
Analog input pins to A/D converter
I/O Port
P1_0 to P1_7, P3_3
to P3_5, P3_7, P4_5
Input Port
P4_6, P4_7
Power Supply Input
Serial Interface
I2C
I: Input
O: Output
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Pin Name
VCC
VSS
I/O
I/O: Input and output
Page 8 of 35
I
These are CMOS I/O ports. Each port contains
an I/O select direction register, allowing each
pin in that port to be directed for input or output
individually.
Any port set to input can select whether to use a
pull-up resistor or not by program.
P1_0 to P1_3 also function as LED drive ports.
Port for input-only
R8C/16 Group, R8C/17 Group
Table 1.6
Pin
Number
Pin Name Information by Pin Number
Control
Pin
1
2
3
4
5
6
7
8
9
1. Overview
Port
Interrupt
P3_5
P3_7
RESET
XOUT
VSS/AVSS
XIN
VCC
MODE
I/O Pin of Peripheral Functions
Serial
I2C bus
Timer
Interface
Interface
CMP1_2
SCL
A/D Converter
CNTR0
P4_7
P4_6
P4_5
INT0
10
P1_7
INT10
11
12
P1_6
P1_5
13
14
15
CNTR00
CLK0
RXD0
INT11
CNTR01
P1_4
P1_3
KI3
TZOUT
AN11
P1_2
KI2
CMP0_2
AN10
P1_1
KI1
CMP0_1
AN9
18
P1_0
KI0
CMP0_0
AN8
19
P3_3
INT3
TCIN/CMP1_0
20
P3_4
16
17
TXD0
AVCC/VREF
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 9 of 35
CMP1_1
SDA
R8C/16 Group, R8C/17 Group
2.
2. Central Processing Unit (CPU)
Central Processing Unit (CPU)
Figure 2.1 shows the CPU Register. The CPU contains 13 registers. Of these, R0, R1, R2, R3, A0, A1 and
FB comprise a register bank. Two sets of register banks are provided.
b31
b15
R2
R3
b8b7
b0
R0H (high-order of R0)
R0L (low-order of R0)
R1H (high-order of R1)
R1L (low-order of R1)
Data Register (1)
R2
R3
A0
A1
FB
b19
b15
Address Register (1)
Frame Bass Register (1)
b0
Interrupt Table Register
INTBL
INTBH
The 4-high order bits of INTB are INTBH and
the 16-low bits of INTB are INTBL.
b19
b0
Program Counter
PC
b15
b0
USP
User Stack Pointer
ISP
Interrupt Stack Pointer
SB
Static Base Register
b15
b0
FLG
b15
b8
IPL
b7
Flag Register
b0
U I O B S Z D C
Carry Flag
Debug Flag
Zero Flag
Sign Flag
Register Bank Select Flag
Overflow Flag
Interrupt Enable Flag
Stack Pointer Select Flag
Reserved Bit
Processor Interrupt Priority Level
Reserved Bit
NOTES:
1. A register bank comprises these registers. Two sets of register banks are provided.
Figure 2.1
CPU Register
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 10 of 35
R8C/16 Group, R8C/17 Group
2.1
2. Central Processing Unit (CPU)
Data Registers (R0, R1, R2 and R3)
R0 is a 16-bit register for transfer, arithmetic and logic operations. The same applies to R1 to R3. The
R0 can be split into high-order bit (R0H) and low-order bit (R0L) to be used separately as 8-bit data
registers. The same applies to R1H and R1L as R0H and R0L. R2 can be combined with R0 to be used
as a 32-bit data register (R2R0). The same applies to R3R1 as R2R0.
2.2
Address Registers (A0 and A1)
A0 is a 16-bit register for address register indirect addressing and address register relative addressing.
They also are used for transfer, arithmetic and logic operations. The same applies to A1 as A0. A0 can
be combined with A0 to be used as a 32-bit address register (A1A0).
2.3
Frame Base Register (FB)
FB is a 16-bit register for FB relative addressing.
2.4
Interrupt Table Register (INTB)
INTB is a 20-bit register indicates the start address of an interrupt vector table.
2.5
Program Counter (PC)
PC, 20 bits wide, indicates the address of an instruction to be executed.
2.6
User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
The stack pointer (SP), USP and ISP, are 16 bits wide each. The U flag of FLG is used to switch
between USP and ISP.
2.7
Static Base Register (SB)
SB is a 16-bit register for SB relative addressing.
2.8
Flag Register (FLG)
FLG is a 11-bit register indicating the CPU state.
2.8.1
Carry Flag (C)
The C flag retains a carry, borrow, or shift-out bit that has occurred in the arithmetic logic unit.
2.8.2
Debug Flag (D)
The D flag is for debug only. Set to “0”.
2.8.3
Zero Flag (Z)
The Z flag is set to “1” when an arithmetic operation resulted in 0; otherwise, “0”.
2.8.4
Sign Flag (S)
The S flag is set to “1” when an arithmetic operation resulted in a negative value; otherwise, “0”.
2.8.5
Register Bank Select Flag (B)
The register bank 0 is selected when the B flag is “0”. The register bank 1 is selected when this flag
is set to “1”.
2.8.6
Overflow Flag (O)
The O flag is set to “1” when the operation resulted in an overflow; otherwise, “0”.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 11 of 35
R8C/16 Group, R8C/17 Group
2.8.7
2. Central Processing Unit (CPU)
Interrupt Enable Flag (I)
The I flag enables a maskable interrupt.
An interrupt is disabled when the I flag is set to “0”, and are enabled when the I flag is set to “1”. The
I flag is set to “0” when an interrupt request is acknowledged.
2.8.8
Stack Pointer Select Flag (U)
ISP is selected when the U flag is set to “0”, USP is selected when the U flag is set to “1”.
The U flag is set to “0” when a hardware interrupt request is acknowledged or the INT instruction of
software interrupt numbers 0 to 31 is executed.
2.8.9
Processor Interrupt Priority Level (IPL)
IPL, 3 bits wide, assigns processor interrupt priority levels from level 0 to level 7.
If a requested interrupt has greater priority than IPL, the interrupt is enabled.
2.8.10
Reserved Bit
When write to this bit, set to “0”. When read, its content is indeterminate.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 12 of 35
R8C/16 Group, R8C/17 Group
3.
3. Memory
Memory
3.1
R8C/16 Group
Figure 3.1 is a Memory Map of the R8C/16 group. The R8C/16 group provides 1-Mbyte address space
from addresses 00000h to FFFFFh.
The internal ROM is allocated lower addresses beginning with address 0FFFFh. For example, a 16Kbyte internal ROM is allocated addresses 0C000h to 0FFFFh.
The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting
address of each interrupt routine.
The internal RAM is allocated higher addresses beginning with address 00400h. For example, a 1Kbyte internal RAM is allocated addresses 00400h to 007FFh. The internal RAM is used not only for
storing data but for calling subroutines and stacks when interrupt request is acknowledged.
Special function registers (SFR) are allocated addresses 00000h to 002FFh. The peripheral function
control registers are allocated them. All addresses, which have nothing allocated within the SFR, are
reserved area and cannot be accessed by users.
00000h
SFR
(See 4. Special Function
Register (SFR))
002FFh
00400h
Internal RAM
0XXXXh
0FFDCh
Undefined Instruction
Overflow
BRK Instruction
Address Match
Single Step
Watchdog Timer • Oscillation Stop Detection • Voltage Monitor 2
0YYYYh
Address Break
(Reserved)
Reset
Internal ROM
0FFFFh
0FFFFh
Expansion Area
FFFFFh
NOTES:
1. Blank spaces are reserved. No access is allowed.
Internal ROM
Part Number
Figure 3.1
Internal RAM
Size
0YYYYh
Size
0XXXXh
R5F21164SP, R5F21164DSP
16 Kbytes
0C000h
1 Kbyte
007FFh
R5F21163SP, R5F21163DSP
R5F21162SP, R5F21162DSP
12 Kbytes
8 Kbytes
0D000h
0E000h
768 bytes
512 bytes
006FFh
005FFh
Memory Map of R8C/16 Group
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 13 of 35
R8C/16 Group, R8C/17 Group
3.2
3. Memory
R8C/17 Group
Figure 3.2 is a memory map of the R8C/17 group. The R8C/17 group provides 1-Mbyte address space
from addresses 00000h to FFFFFh.
The internal ROM (program ROM) is allocated lower addresses beginning with address 0FFFFh. For
example, a 16-Kbyte internal ROM is allocated addresses 0C000h to 0FFFFh.
The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. They store the starting
address of each interrupt routine.
The internal ROM (data flash) is allocated addresses 02400h to 02BFFh.
The internal RAM is allocated higher addresses beginning with address 00400h. For example, a 1Kbyte internal RAM is allocated addresses 00400h to 007FFh. The internal RAM is used not only for
storing data but for calling subroutines and stacks when interrupt request is acknowledged.
Special function registers (SFR) are allocated addresses 00000h to 002FFh. The peripheral function
control registers are allocated them. All addresses, which have nothing allocated within the SFR, are
reserved area and cannot be accessed by users.
00000h
SFR
(See 4. Special Function
Register (SFR))
002FFh
00400h
Internal RAM
0XXXXh
02400h
02BFFh
Internal ROM
(Data flash)(1)
0FFDCh
Undefined Instruction
Overflow
BRK Instruction
Address Match
Single Step
Watchdog Timer • Oscillation Stop Detection • Voltage Monitor 2
0YYYYh
Address Break
(Reserved)
Reset
Internal ROM
(Program ROM)
0FFFFh
0FFFFh
Expansion Area
FFFFFh
NOTES:
1. The data flash block A (1 Kbyte) and block B (1 Kbyte) are shown.
2. Blank spaces are reserved. No access is allowed.
Internal ROM
Part Number
Figure 3.2
Internal RAM
Size
0YYYYh
Size
0XXXXh
R5F21174SP, R5F21174DSP
16 Kbytes
0C000h
1 Kbyte
007FFh
R5F21173SP, R5F21173DSP
R5F21172SP, R5F21172DSP
12 Kbytes
8 Kbytes
0D000h
0E000h
768 bytes
512 bytes
006FFh
005FFh
Memory Map of R8C/17 Group
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 14 of 35
R8C/16 Group, R8C/17 Group
4.
4. Special Function Register (SFR)
Special Function Register (SFR)
SFR (Special Function Register) is the control register of peripheral functions. Tables 4.1 to 4.4 list the SFR
information.
Table 4.1
SFR Information(1)(1)
Address
0000h
0001h
0002h
0003h
0004h
0005h
0006h
0007h
0008h
0009h
000Ah
000Bh
000Ch
000Dh
000Eh
000Fh
0010h
0011h
0012h
0013h
0014h
0015h
0016h
0017h
0018h
0019h
001Ah
001Bh
001Ch
001Dh
001Eh
001Fh
0020h
0021h
0022h
0023h
Register
Symbol
After Reset
Processor Mode Register 0
Processor Mode Register 1
System Clock Control Register 0
System Clock Control Register 1
PM0
PM1
CM0
CM1
00h
00h
01101000b
00100000b
Address Match Interrupt Enable Register
Protect Register
AIER
PRCR
00h
00h
Oscillation Stop Detection register
Watchdog Timer Reset Register
Watchdog Timer Start Register
Watchdog Timer Control Register
Address Match Interrupt Register 0
OCD
WDTR
WDTS
WDC
RMAD0
00000100b
XXh
XXh
00011111b
00h
00h
X0h
Address Match Interrupt Register 1
RMAD1
00h
00h
X0h
Count Source Protection Mode Register
CSPR
00h
INT0 Input Filter Select Register
INT0F
00h
High-Speed On-Chip Oscillator Control Register 0
High-Speed On-Chip Oscillator Control Register 1
High-Speed On-Chip Oscillator Control Register 2
HRA0
HRA1
HRA2
00h
When shipping
00h
002Ah
002Bh
002Ch
002Dh
002Eh
002Fh
0030h
0031h
0032h
Voltage Detection Register 1(2)
Voltage Detection Register 2(2)
VCA1
VCA2
00001000b
0033h
0034h
0035h
0036h
Voltage Monitor 1 Circuit Control Register (2)
VW1C
Voltage Monitor 2 Circuit Control Register (5)
VW2C
0000X000b(3)
0100X001b(4)
00h
0037h
0038h
0039h
003Ah
003Bh
003Ch
003Dh
003Eh
003Fh
X: Undefined
NOTES:
1. Blank spaces are reserved. No access is allowed.
2. Software reset, the watchdog timer reset or the voltage monitor 2 reset does not affect this register.
3. Owing to Hardware reset.
4. Owing to Power-on reset or the voltage monitor 1 reset.
5. Software reset, the watchdog timer reset or the voltage monitor 2 reset does not affect the b2 and b3.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 15 of 35
00h(3)
01000000b(4)
R8C/16 Group, R8C/17 Group
Table 4.2
Address
0040h
0041h
0042h
0043h
0044h
0045h
0046h
0047h
0048h
0049h
004Ah
004Bh
004Ch
004Dh
004Eh
004Fh
0050h
0051h
0052h
0053h
0054h
0055h
0056h
0057h
0058h
0059h
005Ah
005Bh
005Ch
005Dh
005Eh
005Fh
0060h
0061h
0062h
0063h
0064h
0065h
0066h
0067h
0068h
0069h
006Ah
006Bh
006Ch
006Dh
006Eh
006Fh
0070h
0071h
0072h
0073h
0074h
0075h
0076h
0077h
0078h
0079h
007Ah
007Bh
007Ch
007Dh
007Eh
007Fh
4. Special Function Register (SFR)
SFR Information(2)(1)
Register
Symbol
After reset
Key Input Interrupt Control Register
A/D Conversion Interrupt Control Register
IIC Interrupt Control Register
Compare 1 Interrupt Control Register
UART0 Transmit Interrupt Control Register
UART0 Receive Interrupt Control Register
KUPIC
ADIC
IIC2AIC
CMP1IC
S0TIC
S0RIC
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
Timer X Interrupt Control Register
TXIC
XXXXX000b
Timer Z Interrupt Control Register
TZIC
INT1IC
XXXXX000b
XXXXX000b
INT3IC
XXXXX000b
TCIC
CMP0IC
INT0IC
XXXXX000b
XXXXX000b
XX00X000b
INT1 Interrupt Control Register
INT3 Interrupt Control Register
Timer C Interrupt Control Register
Compare 0 Interrupt Control Register
INT0 Interrupt Control Register
X: Undefined
NOTES:
1. Blank spaces are reserved. No access is allowed.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 16 of 35
R8C/16 Group, R8C/17 Group
Table 4.3
Address
0080h
0081h
0082h
0083h
0084h
0085h
0086h
0087h
0088h
0089h
008Ah
008Bh
008Ch
008Dh
008Eh
008Fh
0090h
0091h
0092h
0093h
0094h
0095h
0096h
0097h
0098h
0099h
009Ah
009Bh
009Ch
009Dh
009Eh
009Fh
00A0h
00A1h
00A2h
00A3h
00A4h
00A5h
00A6h
00A7h
00A8h
00A9h
00AAh
00ABh
00ACh
00ADh
00AEh
00AFh
00B0h
00B1h
00B2h
00B3h
00B4h
00B5h
00B6h
00B7h
00B8h
00B9h
00BAh
00BBh
00BCh
00BDh
00BEh
00BFh
4. Special Function Register (SFR)
SFR Information(3)(1)
Register
Symbol
After Reset
Timer Z Mode Register
TZMR
00h
Timer Z Waveform Output Control Register
Prescaler Z Register
Timer Z Secondary Register
Timer Z Primary Register
PUM
PREZ
TZSC
TZPR
00h
FFh
FFh
FFh
Timer Z Output Control Register
Timer X Mode Register
Prescaler X Register
Timer X Register
Timer Count Source Setting Register
TZOC
TXMR
PREX
TX
TCSS
00h
00h
FFh
FFh
00h
Timer C Register
TC
00h
00h
External Input Enable Register
INTEN
00h
Key Input Enable Register
KIEN
00h
Timer C Control Register 0
Timer C Control Register 1
Capture, Compare 0 Register
TCC0
TCC1
TM0
Compare 1 Register
TM1
UART0 Transmit/Receive Mode Register
UART0 Bit Rate Register
UART0 Transmit Buffer Register
U0MR
U0BRG
U0TB
UART0 Transmit/Receive Control Register 0
UART0 Transmit/Receive Control Register 1
UART0 Receive Buffer Register
U0C0
U0C1
U0RB
00h
00h
00h
00h(2)
FFh
FFh
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
UART Transmit/Receive Control Register 2
UCON
00h
IIC bus Control Register 1
IIC bus Control Register 2
IIC bus Mode Register
IIC bus Interrupt Enable Register
IIC bus Status Register
Slave Address Register
IIC bus Transmit Data Register
IIC bus Receive Data Register
ICCR1
ICCR2
ICMR
ICIER
ICSR
SAR
ICDRT
ICDRR
00h
7Dh
18h
00h
00h
00h
FFh
FFh
X: Undefined
NOTES:
1. Blank spaces are reserved. No access is allowed.
2. When output compare mode (the TCC13 bit in the TCC1 register = 1) is selected, the value after reset is “FFFFh”.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 17 of 35
R8C/16 Group, R8C/17 Group
Table 4.4
Address
00C0h
00C1h
00C2h
00C3h
00C4h
00C5h
00C6h
00C7h
00C8h
00C9h
00CAh
00CBh
00CCh
00CDh
00CEh
00CFh
00D0h
00D1h
00D2h
00D3h
00D4h
00D5h
00D6h
00D7h
00D8h
00D9h
00DAh
00DBh
00DCh
00DDh
00DEh
00DFh
00E0h
00E1h
00E2h
00E3h
00E4h
00E5h
00E6h
00E7h
00E8h
00E9h
00EAh
00EBh
00ECh
00EDh
00EEh
00EFh
00F0h
00F1h
00F2h
00F3h
00F4h
00F5h
00F6h
00F7h
00F8h
00F9h
00FAh
00FBh
00FCh
00FDh
00FEh
00FFh
4. Special Function Register (SFR)
SFR Information(4)(1)
Register
Symbol
After reset
A/D Register
AD
XXh
XXh
A/D Control Register 2
ADCON2
00h
A/D Control Register 0
A/D Control Register 1
ADCON0
ADCON1
00000XXXb
00h
Port P1 Register
P1
XXh
Port P1 Direction Register
PD1
00h
Port P3 Register
P3
XXh
Port P3 Direction Register
Port P4 Register
PD3
P4
00h
XXh
Port P4 Direction Register
PD4
00h
Pull-Up Control Register 0
Pull-Up Control Register 1
Port P1 Drive Capacity Control Register
Timer C Output Control Register
PUR0
PUR1
DRR
TCOUT
00XX0000b
XXXXXX0Xb
00h
00h
01B3h
01B4h
01B5h
01B6h
01B7h
Flash Memory Control Register 4
FMR4
01000000b
Flash Memory Control Register 1
FMR1
1000000Xb
Flash Memory Control Register 0
FMR0
00000001b
0FFFFh
Optional Function Select Register
OFS
(2)
X: Undefined
NOTES:
1. Blank columns, 0100h to 01B2h and 01B8h to 02FFh are all reserved. No access is allowed.
2. The OFS register cannot be changed by program. Use a flash programmer to write to it.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 18 of 35
R8C/16 Group, R8C/17 Group
5.
5. Electrical Characteristics
Electrical Characteristics
Table 5.1
Absolute Maximum Ratings
Rated value
Unit
VCC
Symbol
Supply Voltage
Parameter
VCC = AVCC
Condition
-0.3 to 6.5
V
AVCC
Analog Supply Voltage
VCC = AVCC
-0.3 to 6.5
V
V
VI
Input Voltage
-0.3 to VCC+0.3
VO
Output Voltage
-0.3 to VCC+0.3
V
Pd
Power Dissipation
300
mW
Topr
Operating Ambient Temperature
-20 to 85 / -40 to 85 (D version)
°C
Tstg
Storage Temperature
-65 to 150
°C
Table 5.2
Topr = 25°C
Recommended Operating Conditions
Symbol
Parameter
Conditions
Standard
Min.
Typ.
Max.
Unit
VCC
Supply Voltage
2.7
−
5.5
V
AVCC
Analog Supply Voltage
−
VCC(3)
−
V
VSS
Supply Voltage
−
0
−
V
AVSS
Analog Supply Voltage
−
0
−
V
VIH
Input “H” Voltage
0.8VCC
−
VCC
V
VIL
Input “L” Voltage
0
−
0.2VCC
V
IOH(sum)
Peak Sum
Output “H”
Current
−
−
-60
mA
IOH(peak)
Peak Output “H” Current
−
−
-10
mA
IOH(avg)
Average Output “H” Current
−
−
-5
mA
IOL(sum)
Peak Sum
Output “L”
Currents
Sum of All
Pins IOL (peak)
−
−
60
mA
IOL(peak)
Peak Output “L”
Currents
Except P1_0 to P1_3
IOL(avg)
f(XIN)
Sum of All
Pins IOH (peak)
Average Output
“L” Current
P1_0 to P1_3
−
−
10
mA
Drive Capacity HIGH
−
−
30
mA
Drive Capacity LOW
−
−
10
mA
−
−
5
mA
Drive Capacity HIGH
−
−
15
mA
Drive Capacity LOW
−
−
5
mA
Except P1_0 to P1_3
P1_0 to P1_3
Main Clock Input Oscillation Frequency
3.0V ≤ VCC ≤ 5.5V
0
−
20
MHz
2.7V ≤ VCC < 3.0V
0
−
10
MHz
NOTES:
1. VCC = AVCC = 2.7 to 5.5V at Topr = -20 to 85 °C / -40 to 85 °C, unless otherwise specified.
2. The typical values when average output current is 100ms.
3. Hold VCC = AVCC.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 19 of 35
R8C/16 Group, R8C/17 Group
Table 5.3
5. Electrical Characteristics
A/D Converter Characteristics
Symbol
Parameter
−
Resolution
−
Absolute
Accuracy
Conditions
Standard
Min.
Typ.
Max.
Unit
Vref = VCC
−
−
10
Bits
10-Bit Mode
φAD = 10MHz, Vref = VCC = 5.0V
−
−
±3
LSB
8-Bit Mode
φAD = 10MHz, Vref = VCC = 5.0V
−
−
±2
LSB
10-Bit Mode
φAD = 10MHz, Vref = VCC = 3.3V(3)
−
−
±5
LSB
8-Bit Mode
φAD = 10MHz, Vref = VCC = 3.3V(3)
−
−
±2
LSB
Rladder
Resistor Ladder
Vref = VCC
10
−
40
kΩ
tconv
Conversion Time 10-Bit Mode
φAD = 10MHz, Vref = VCC = 5.0V
3.3
−
−
µs
φAD = 10MHz, Vref = VCC = 5.0V
2.8
−
−
µs
V
8-Bit Mode
Vref
Reference voltage
−
VCC(4)
−
VIA
Analog Input Voltage
0
−
Vref
V
−
A/D Operating
Clock
Frequency(2)
0.25
−
10
MHz
1
−
10
MHz
Without Sample & Hold
With Sample & Hold
NOTES:
1. VCC = AVCC = 2.7 to 5.5V at Topr = -20 to 85 °C / -40 to 85 °C, unless otherwise specified.
2. If f1 exceeds 10MHz, divide the f1 and hold A/D operating clock frequency (φAD) 10MHz or below.
3. If the AVcc is less than 4.2V, divide the f1 and hold A/D operating clock frequency (φAD) f1/2 or below.
4. Hold VCC = Vref
P1
P3
P4
Figure 5.1
Port P1, P3 and P4 Measurement Circuit
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 20 of 35
30pF
R8C/16 Group, R8C/17 Group
Table 5.4
Flash Memory (Program ROM) Electrical Characteristics
Symbol
−
5. Electrical Characteristics
Parameter
Program/Erase Endurance(2)
Conditions
R8C/16 Group
R8C/17 Group
Standard
Unit
Min.
Typ.
Max.
100(3)
−
−
times
1,000(3)
−
−
times
µs
−
Byte Program Time
VCC = 5.0 V at Topr = 25 °C
−
50
400
−
Block Erase Time
VCC = 5.0 V at Topr = 25 °C
−
0.4
9
s
td(SR-ES)
Time Delay from Suspend Request until
Erase Suspend
−
−
8
ms
−
Erase Suspend Request Interval
10
−
−
ms
−
Program, Erase Voltage
2.7
−
5.5
V
−
Read Voltage
2.7
−
5.5
V
−
Program, Erase Temperature
0
−
60
°C
−
Data Hold Time(7)
20
−
−
year
Ambient temperature = 55 °C
NOTES:
1. VCC = AVcc = 2.7 to 5.5V at Topr = 0 to 60 °C, unless otherwise specified.
2. Definition of program and erase
The program and erase endurance shows an erase endurance for every block.
If the program and erase endurance is “n” times (n = 100, 10000), “n” times erase can be performed for every block.
For example, if performing 1-byte write to the distinct addresses on Block A of 1Kbyte block 1,024 times and then erasing that
block, program and erase endurance is counted as one time.
However, do not perform multiple programs to the same address for one time ease.(disable overwriting).
3. Endurance to guarantee all electrical characteristics after program and erase.(1 to “Min.” value can be guaranateed).
4. In the case of a system to execute multiple programs, perform one erase after programming as reducing effective reprogram
endurance not to leave blank area as possible such as programming write addresses in turn. If programming a set of 16
bytes, programming up to 128 sets and then erasing them one time can reduce effective reprogram endurance. Additionally,
averaging erase endurance for Block A and B can reduce effective reprogram endurance more. To leave erase endurance for
every block as information and determine the restricted endurance are recommended.
5. If error occurs during block erase, attempt to execute the clear status register command, then the block erase command at
least three times until the erase error does not occur.
6. Customers desiring Program/Erase failure rate information should contact their Renesas technical support representative.
7. The data hold time incudes time that the power supply is off or the clock is not supplied.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 21 of 35
R8C/16 Group, R8C/17 Group
Table 5.5
5. Electrical Characteristics
Flash Memory (Data flash Block A, Block B) Electrical Characteristics
Symbol
Parameter
Conditions
Standard
Min.
Typ.
Max.
Unit
10,000(3)
−
−
times
VCC = 5.0 V at Topr = 25 °C
−
50
400
µs
Byte Program Time
(Program/Erase Endurance > 1,000 Times)
VCC = 5.0 V at Topr = 25 °C
−
65
−
µs
Block Erase Time
(Program/Erase Endurance ≤ 1,000 Times)
VCC = 5.0 V at Topr = 25 °C
−
0.2
9
s
−
Block Erase Time
(Program/Erase Endurance > 1,000 Times)
VCC = 5.0 V at Topr = 25 °C
−
0.3
−
s
td(SR-ES)
Time Delay from Suspend Request until
Erase Suspend
−
−
8
ms
−
Erase Suspend Request Interval
10
−
−
ms
−
Program, Erase Voltage
2.7
−
5.5
V
−
Read Voltage
2.7
−
5.5
V
−
Program, Erase Temperature
-20(8)
−
85
°C
−
Data Hold Time(9)
20
−
−
year
−
Program/Erase Endurance(2)
−
Byte Program Time
(Program/Erase Endurance ≤ 1,000 Times)
Ambient temperature = 55 °C
NOTES:
1. VCC = AVcc = 2.7 to 5.5V at Topr = −20 to 85 °C / −40 to 85 °C, unless otherwise specified.
2. Definition of program and erase
The program and erase endurance shows an erase endurance for every block.
If the program and erase endurance is “n” times (n = 100, 10000), “n” times erase can be performed for every block.
For example, if performing 1-byte write to the distinct addresses on Block A of 1Kbyte block 1,024 times and then erasing that
block, program and erase endurance is counted as one time.
However, do not perform multiple programs to the same address for one time ease.(disable overwriting).
3. Endurance to guarantee all electrical characteristics after program and erase.(1 to “Min.” value can be guaranateed).
4. Standard of Block A and Block B when program and erase endurance exceeds 1,000 times. Byte program time to 1,000
times are the same as that in program area.
5. In the case of a system to execute multiple programs, perform one erase after programming as reducing effective reprogram
endurance not to leave blank area as possible such as programming write addresses in turn. If programming a set of 16
bytes, programming up to 128 sets and then erasing them one time can reduce effective reprogram endurance. Additionally,
averaging erase endurance for Block A and B can reduce effective reprogram endurance more. To leave erase endurance for
every block as information and determine the restricted endurance are recommended.
6. If error occurs during block erase, attempt to execute the clear status register command, then the block erase command at
least three times until the erase error does not occur.
7. Customers desiring Program/Erase failure rate information should contact their Renesas technical support representative.
8. -40 °C for D version.
9. The data hold time incudes time that the power supply is off or the clock is not supplied.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 22 of 35
R8C/16 Group, R8C/17 Group
5. Electrical Characteristics
Erase-Suspend Request
(Maskable interrupt Request)
FMR46
td(SR-ES)
Figure 5.2
Table 5.6
Time delay from Suspend Request until Erase Suspend
Voltage Detection 1 Circuit Electrical Characteristics
Symbol
Parameter
Vdet1
Voltage Detection Level(3)
−
Voltage Detection Circuit Self Power Consumption
td(E-A)
Waiting Time until Voltage Detection Circuit Operation
Starts(2)
Vccmin
Microcomputer Operating Voltage Minimum Value
Condition
VCA26 = 1, VCC = 5.0V
Standard
Unit
Min.
Typ.
Max.
2.70
2.85
3.00
V
−
600
−
nA
−
−
100
µs
2.7
−
−
V
NOTES:
1. The measurement condition is VCC = AVCC = 2.7V to 5.5V and Topr = -40°C to 85 °C.
2. Necessary time until the voltage detection circuit operates when setting to “1” again after setting the VCA26 bit in the VCA2
register to “0”.
3. Hold Vdet2 > Vdet1.
Table 5.7
Voltage Detection 2 Circuit Electrical Characteristics
Symbol
Parameter
Vdet2
Voltage Detection Level(4)
−
Voltage Monitor 2 Interrupt Request Generation Time(2)
−
Voltage Detection Circuit Self Power Consumption
td(E-A)
Waiting Time until Voltage Detection Circuit Operation
Starts(3)
Condition
VCA27 = 1, VCC = 5.0V
Standard
Unit
Min.
Typ.
Max.
3.00
3.30
3.60
V
−
40
−
µs
−
600
−
nA
−
−
100
µs
NOTES:
1. The measurement condition is VCC = AVCC = 2.7V to 5.5V and Topr = -40°C to 85 °C.
2. Time until the voltage monitor 2 interrupt request is generated since the voltage passes Vdet1.
3. Necessary time until the voltage detection circuit operates when setting to “1” again after setting the VCA27 bit in the VCA2
register to “0”.
4. Hold Vdet2 > Vdet1.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 23 of 35
R8C/16 Group, R8C/17 Group
5. Electrical Characteristics
Reset Circuit Electrical Characteristics (When Using Voltage Monitor 1 Reset )
Table 5.8
Symbol
Parameter
Condition
Standard
Min.
Unit
Typ.
Max.
-20°C ≤ Topr < 85°C
−
−
Vdet1
V
tw(Vpor2-Vdet1) Supply Voltage Rising Time When Power-On Reset is -20°C ≤ Topr < 85°C,
Deasserted(1)
tw(por2) ≥ 0s(3)
−
−
100
ms
Power-On Reset Valid Voltage
Vpor2
NOTES:
1. This condition is not applicable when using with Vcc ≥ 1.0V.
2. When turning power on after the time to hold the external power below effective voltage (Vpor1) exceeds10s, refer to Table
5.9 Reset Circuit Electrical Characteristics (When Not Using Voltage Monitor 1 Reset).
3. tw(por2) is time to hold the external power below effective voltage (Vpor2).
Table 5.9
Reset Circuit Electrical Characteristics (When Not Using Voltage Monitor 1 Reset)
Symbol
Parameter
Condition
Standard
Min.
Typ.
Unit
Max.
Vpor1
Power-On Reset Valid Voltage
-20°C ≤ Topr < 85°C
−
−
0.1
V
tw(Vpor1-Vdet1)
Supply Voltage Rising Time When Power-On Reset is
Deasserted
0°C ≤ Topr ≤ 85°C,
tw(por1) ≥ 10s(2)
−
−
100
ms
tw(Vpor1-Vdet1)
Supply Voltage Rising Time When Power-On Reset is
Deasserted
-20°C ≤ Topr < 0°C,
tw(por1) ≥ 30s(2)
−
−
100
ms
tw(Vpor1-Vdet1)
Supply Voltage Rising Time When Power-On Reset is
Deasserted
-20°C ≤ Topr < 0°C,
tw(por1) ≥ 10s(2)
−
−
1
ms
tw(Vpor1-Vdet1)
Supply Voltage Rising Time When Power-On Reset is
Deasserted
0°C ≤ Topr ≤ 85°C,
tw(por1) ≥ 1s(2)
−
−
0.5
ms
NOTES:
1. When not using the voltage monitor 1 reset, use with Vcc≥ 2.7V.
2. tw(por1) is time to hold the external power below effective voltage (Vpor1).
Vdet1(3)
Vdet1(3)
Vccmin
Vpor2
Vpor1
tw(por1)
tw(Vpor1–Vdet1)
Sampling Time(1, 2)
tw(por2) tw(Vpor2–Vdet1)
Internal Reset
Signal
(“L” Valid)
1
× 32
fRING-S
1
× 32
fRING-S
NOTES:
1. Hold the voltage of the microcomputer operation voltage range (Vccmin or above) within sampling time.
2. A sampling clock can be selected. Refer to 6. Voltage Detection Circuit of Hardware Manual for details.
3. Vdet1 indicates the voltage detection level of the voltage detection 1 circuit. Refer to 6. Voltage Detection Circuit of
Hardware Manual for details.
Figure 5.3
Reset Circuit Electrical Characteristics
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 24 of 35
R8C/16 Group, R8C/17 Group
Table 5.10
5. Electrical Characteristics
High-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
−
High-Speed On-Chip Oscillator Frequency
When the Reset is Deasserted
VCC = 5.0V, Topr = 25 °C
−
8
−
MHz
−
High-Speed On-Chip Oscillator Frequency
Temperature • Supplay Voltage
Dependence
0 to +60 °C / 5 V ± 5 %(2)
7.44
−
8.56
MHz
−20 to +85 °C / 2.7 to 5.5 V(2)
7.04
−
8.96
MHz
−40 to +85 °C / 2.7 to 5.5 V(2)
6.80
−
9.20
MHz
NOTES:
1. The measurement condition is VCC = AVCC = 5.0V and Topr = 25 °C.
2. The standard value shows when the HRA1 register is assumed as the value in shipping and the HRA2 register value is set to
00h.
Table 5.11
Power Supply Circuit Timing Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
td(P-R)
Time for Internal Power Supply Stabilization during
Power-On(2)
1
−
2000
µs
td(R-S)
STOP Exit Time(3)
−
−
150
µs
NOTES:
1. The measurement condition is VCC = AVCC = 2.7 to 5.5V and Topr = 25 °C.
2. Waiting time until the internal power supply generation circuit stabilizes during power-on.
3. Time until CPU clock supply starts since the interrupt is acknowledged to exit stop mode.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 25 of 35
R8C/16 Group, R8C/17 Group
Table 5.12
5. Electrical Characteristics
Timing Requirements of I2C bus Interface (IIC) (1)
Symbol
Parameter
Standard
Condition
Min.
Typ.
Max.
Unit
tSCL
SCL Input Cycle Time
12tCYC+
600(2)
−
−
ns
tSCLH
SCL Input “H” Width
3tCYC+
300(2)
−
−
ns
tSCLL
SCL Input “L” Width
5tCYC+
300(2)
−
−
ns
tsf
SCL, SDA Input Fall Time
−
−
300
ns
tSP
SCL, SDA Input Spike Pulse Rejection Time
−
−
1tCYC(2)
ns
tBUF
SDA Input Bus-Free Time
5tCYC(2)
−
−
ns
tSTAH
Start Condition Input Hold Time
3tCYC(2)
−
−
ns
tSTAS
Retransmit Start Condition Input SetUp Time
3tCYC(2)
−
−
ns
tSTOS
Stop Condition Input SetUp Time
3tCYC(2)
−
−
ns
tSDAS
Data Input SetUp Time
1tCYC+20(2)
−
−
ns
tSDAH
Data Input Hold Time
0
−
−
ns
NOTES:
1. VCC = AVCC = 2.7 to 5.5V, VSS = 0V and Topr = -20 to 85 °C / -40 to 85 °C, unless otherwise specified.
2. 1tCYC=1/f1(s)
VIH
SDA
VIL
tBUF
tSTAH
tSCLH
tSTAS
tSP
tSTOS
SCL
P(2)
S(1)
tsf
Sr(3)
tSCLL
tSDAS
tSCL
tSDAH
NOTES:
1. Start condition
2. Stop condition
3. Retransmit “start” condition
Figure 5.4
I/O Timing of I2C bus Interface (IIC)
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
P(2)
Page 26 of 35
R8C/16 Group, R8C/17 Group
Table 5.13
Electrical Characteristics (1) [VCC = 5V]
Symbol
VOH
Parameter
Output “H” Voltage Except XOUT
XOUT
VOL
Output “L” Voltage
Except P1_0 to P1_3,
XOUT
Standard
Unit
Min.
Typ.
Max.
IOH = -5mA
VCC − 2.0
−
VCC
V
IOH = -200µA
VCC − 0.3
−
VCC
V
Drive capacity
HIGH
IOH = -1mA
VCC − 2.0
−
VCC
V
Drive capacity
LOW
IOH = -500µA
VCC − 2.0
−
VCC
V
IOL = 5mA
−
−
2.0
V
IOL = 200µA
−
−
0.45
V
IOL = 15mA
−
−
2.0
V
Drive capacity
LOW
IOL = 5mA
−
−
2.0
V
Drive capacity
LOW
IOL = 200µA
−
−
0.45
V
Drive capacity
HIGH
IOL = 1mA
−
−
2.0
V
Drive capacity
LOW
IOL = 500µA
−
−
2.0
V
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
CNTR0, CNTR1,
TCIN, RXD0
0.2
−
1.0
V
RESET
0.2
−
2.2
V
µA
XOUT
Hysteresis
Condition
Drive capacity
HIGH
P1_0 to P1_3
VT+-VT-
5. Electrical Characteristics
IIH
Input “H” current
VI = 5V
−
−
5.0
IIL
Input “L” current
VI = 0V
−
−
-5.0
µA
VI = 0V
30
50
167
kΩ
−
1.0
−
MΩ
40
125
250
kHz
2.0
−
−
V
RPULLUP Pull-Up Resistance
RfXIN
Feedback
Resistance
XIN
fRING-S
Low-Speed On-Chip Oscillator Frequency
VRAM
RAM Hold Voltage
During stop mode
NOTES:
1. VCC = AVCC = 4.2 to 5.5V at Topr = -20 to 85 °C / -40 to 85 °C, f(XIN)=20MHz, unless otherwise specified.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 27 of 35
R8C/16 Group, R8C/17 Group
Table 5.14
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (2) [Vcc = 5V] (Topr = -40 to 85 °C, unless otherwise specified.)
Parameter
Condition
Power Supply
Current
(VCC=3.3 to 5.5V)
In single-chip mode,
the output pins are
open and other pins
are VSS
Unit
Typ.
Max.
XIN = 20MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
No division
−
9
15
mA
XIN = 16MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
No division
−
8
14
mA
XIN = 10MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
No division
−
5
−
mA
XIN = 20MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
4
−
mA
XIN = 16MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
3
−
mA
XIN = 10MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
2
−
mA
Main clock off
High-speed on-chip oscillator on=8MHz
Low-speed on-chip oscillator on=125kHz
No division
−
4
8
mA
Main clock off
High-speed on-chip oscillator on=8MHz
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
1.5
−
mA
Low-Speed
On-Chip
Oscillator
Mode
Main clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
470
900
µA
Wait Mode
Main clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA26 = VCA27 = 0
−
40
80
µA
Wait Mode
Main clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
While a WAIT instruction is executed
Peripheral clock off
VCA26 = VCA27 = 0
−
38
76
µA
Stop Mode
Main clock off, Topr = 25 °C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA26 = VCA27 = 0
−
0.8
3.0
µA
High-Speed
Mode
MediumSpeed Mode
High-Speed
On-Chip
Oscillator
Mode
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Standard
Min.
Page 28 of 35
R8C/16 Group, R8C/17 Group
5. Electrical Characteristics
Timing Requirements (Unless otherwise specified: VCC = 5V, VSS = 0V at Topr = 25 °C) [ VCC = 5V ]
Table 5.15
XIN Input
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(XIN)
XIN Input Cycle Time
50
−
ns
tWH(XIN)
XIN Input “H” Width
25
−
ns
tWL(XIN)
XIN Input “L” Width
25
−
ns
Table 5.16
CNTR0 Input, CNTR1 Input, INT1 Input
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(CNTR0)
CNTR0 Input Cycle Time
100
−
ns
tWH(CNTR0)
CNTR0 Input “H” Width
40
−
ns
tWL(CNTR0)
CNTR0 input “L” Width
40
−
ns
Table 5.17
TCIN Input, INT3 Input
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(TCIN)
TCIN Input Cycle Time
400(1)
−
ns
tWH(TCIN)
TCIN Input “H” Width
200(2)
−
ns
tWL(TCIN)
TCIN input “L” Width
200(2)
−
ns
NOTES:
1. When using Timer C input capture mode, adjust the cycle time ( 1/ Timer C count source frequency x 3) or above.
2. When using Timer C input capture mode, adjust the width ( 1/ Timer C count source frequency x 1.5) or above.
Table 5.18
Serial Interface
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(CK)
CLKi Input Cycle Time
200
−
ns
tW(CKH)
CLKi Input “H” Width
100
−
ns
tW(CKL)
CLKi Input “L” Width
100
−
ns
td(C-Q)
TXDi Output Delay Time
−
50
ns
th(C-Q)
TXDi Hold Time
0
−
ns
tsu(D-C)
RXDi Input Setup Time
50
−
ns
th(C-D)
RCDi Input Hold Time
90
−
ns
Table 5.19
External Interrupt INT0 Input
Symbol
tW(INH)
tW(INL)
Parameter
Standard
Unit
Min.
Max.
INT0 Input “H” Width
250(1)
−
ns
INT0 Input “L” Width
250(2)
−
ns
NOTES:
1. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input HIGH width to the greater value, either (1/
digital filter clock frequency x 3) or the minimum value of standard.
2. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input LOW width to the greater value, either (1/
digital filter clock frequency x 3) or the minimum value of standard.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 29 of 35
R8C/16 Group, R8C/17 Group
5. Electrical Characteristics
VCC = 5V
tc(CNTR0)
tWH(CNTR0)
CNTR0 Input
tWL(CNTR0)
tc(TCIN)
tWH(TCIN)
TCIN Input
tWL(TCIN)
tc(XIN)
tWH(XIN)
XIN Input
tWL(XIN)
tc(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TxDi
td(C-Q)
tsu(D-C)
RxDi
tW(INL)
INTi Input
Figure 5.5
tW(INH)
Timing Diagram When VCC = 5V
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 30 of 35
th(C-D)
R8C/16 Group, R8C/17 Group
Table 5.20
Electrical Characteristics (3) [VCC = 3V]
Symbol
VOH
Parameter
Output “H” Voltage Except XOUT
XOUT
VOL
5. Electrical Characteristics
Output “L” Voltage
Hysteresis
IIH
Input “H” Current
IIL
Input “L” Current
Standard
Min.
Typ.
Max.
VCC − 0.5
−
VCC
V
Drive capacity
HIGH
IOH = -0.1mA
VCC − 0.5
−
VCC
V
Drive capacity
LOW
IOH = -50µA
VCC − 0.5
−
VCC
V
−
−
0.5
V
IOH = -1mA
IOL = 1mA
P1_0 to P1_3
Drive capacity
HIGH
IOL = 2mA
−
−
0.5
V
Drive capacity
LOW
IOL = 1mA
−
−
0.5
V
Drive capacity
HIGH
IOL = 0.1mA
−
−
0.5
V
Drive capacity
LOW
IOL = 50µA
−
−
0.5
V
0.2
−
0.8
V
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
CNTR0, CNTR1,
TCIN, RXD0
RESET
VI = 3V
RPULLUP Pull-Up Resistance
RfXIN
Feedback
Resistance
fRING-S
Low-Speed On-Chip Oscillator Frequency
VRAM
RAM Hold Voltage
0.2
−
1.8
V
−
−
4.0
µA
VI = 0V
−
−
-4.0
µA
VI = 0V
66
160
500
kΩ
−
3.0
−
MΩ
40
125
250
kHz
2.0
−
−
V
XIN
During stop mode
NOTES:
1. VCC = AVCC = 2.7 to 3.3V at Topr = -20 to 85 °C / -40 to 85 °C, f(XIN)=10MHz, unless otherwise specified.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Unit
Except P1_0 to P1_3,
XOUT
XOUT
VT+-VT-
Condition
Page 31 of 35
R8C/16 Group, R8C/17 Group
Table 5.21
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (4) [Vcc = 3V] (Topr = -40 to 85 °C, unless otherwise specified.)
Parameter
Condition
Power Supply
Current
(VCC=2.7 to 3.3V)
In single-chip mode,
the output pins are
open and other pins
are VSS
Unit
Typ.
Max.
XIN = 20MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
No division
−
8
13
mA
XIN = 16MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
No division
−
7
12
mA
XIN = 10MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
No division
−
5
−
mA
XIN = 20MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
3
−
mA
XIN = 16MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
2.5
−
mA
XIN = 10MHz (square wave)
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
1.6
−
mA
Main clock off
High-speed on-chip oscillator on=8MHz
Low-speed on-chip oscillator on=125kHz
No division
−
3.5
7.5
mA
Main clock off
High-speed on-chip oscillator on=8MHz
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
1.5
−
mA
Low-Speed
On-Chip
Oscillator
Mode
Main clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
Divide-by-8
−
420
800
µA
Wait Mode
Main clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA26 = VCA27 = 0
−
37
74
µA
Wait Mode
Main clock off
High-speed on-chip oscillator off
Low-speed on-chip oscillator on=125kHz
While a WAIT instruction is executed
Peripheral clock off
VCA26 = VCA27 = 0
−
35
70
µA
Stop Mode
Main clock off, Topr = 25 °C
High-speed on-chip oscillator off
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA26 = VCA27 = 0
−
0.7
3.0
µA
High-Speed
Mode
MediumSpeed Mode
High-Speed
On-Chip
Oscillator
Mode
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Standard
Min.
Page 32 of 35
R8C/16 Group, R8C/17 Group
5. Electrical Characteristics
Timing requirements (Unless otherwise specified: VCC = 3V, VSS = 0V at Topr = 25 °C) [VCC = 3V]
Table 5.22
XIN Input
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(XIN)
XIN Input Cycle Time
100
−
ns
tWH(XIN)
XIN Input “H” Width
40
−
ns
tWL(XIN)
XIN Input “L” Width
40
−
ns
Table 5.23
CNTR0 Input, CNTR1 Input, INT1 Input
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(CNTR0)
CNTR0 Input Cycle Time
300
−
ns
tWH(CNTR0)
CNTR0 Input “H” Width
120
−
ns
tWL(CNTR0)
CNTR0 Input “L” Width
120
−
ns
Table 5.24
TCIN Input, INT3 Input
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(TCIN)
TCIN Input Cycle Time
1,200(1)
−
ns
tWH(TCIN)
TCIN Input “H” Width
600(2)
−
ns
tWL(TCIN)
TCIN Input “L” Width
600(2)
−
ns
NOTES:
1. When using the Timer C input capture mode, adjust the cycle time (1/ Timer C count source frequency x 3) or above.
2. When using the Timer C input capture mode, adjust the width (1/ Timer C count source frequency x 1.5) or above.
Table 5.25
Serial Interface
Symbol
Parameter
Standard
Min.
Max.
Unit
tc(CK)
CLKi Input Cycle Time
300
−
ns
tW(CKH)
CLKi Input “H” Width
150
−
ns
tW(CKL)
CLKi Input “L” Width
150
−
ns
td(C-Q)
TXDi Output Delay Time
−
80
ns
th(C-Q)
TXDi Hold Time
0
−
ns
tsu(D-C)
RXDi Input Setup Time
70
−
ns
th(C-D)
RCDi Input Hold Time
90
−
ns
Table 5.26
External Interrupt INT0 Input
Symbol
tW(INH)
tW(INL)
Parameter
Standard
Unit
Min.
Max.
INT0 Input “H” Width
380(1)
−
ns
INT0 Input “L” Width
380(2)
−
ns
NOTES:
1. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input HIGH width to the greater value, either (1/
digital filter clock frequency x 3) or the minimum value of standard.
2. When selecting the digital filter by the INT0 input filter select bit, use the INT0 input LOW width to the greater value, either (1/
digital filter clock frequency x 3) or the minimum value of standard.
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 33 of 35
R8C/16 Group, R8C/17 Group
5. Electrical Characteristics
VCC = 3V
tc(CNTR0)
tWH(CNTR0)
CNTR0 Input
tWL(CNTR0)
tc(TCIN)
tWH(TCIN)
TCIN Input
tWL(TCIN)
tc(XIN)
tWH(XIN)
XIN Input
tWL(XIN)
tc(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TxDi
td(C-Q)
tsu(D-C)
RxDi
tW(INL)
INTi Input
Figure 5.6
tW(INH)
Timing Diagram When VCC = 3V
Rev.2.00 Jan 30, 2006
REJ03B0101-0200
Page 34 of 35
th(C-D)
R8C/16 Group, R8C/17 Group
Package Dimensions
Package Dimensions
JEITA Package Code
RENESAS Code
Previous Code
MASS[Typ.]
P-LSSOP20-4.4x6.5-0.65
PLSP0020JB-A
20P2F-A
0.1g
11
E
*1
HE
20
NOTE)
1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION "*3" DOES NOT
INCLUDE TRIM OFFSET.
F
1
Index mark
10
c
A1
Reference
Symbol
D
Dimension in Millimeters
Min
Nom
Max
D
6.4
6.5
6.6
E
4.3
4.4
4.5
L
*2
A2
A
A2
1.15
A
*3
e
bp
y
Detail F
1.45
A1
0
0.1
0.2
bp
0.17
0.22
0.32
c
0.13
0.15
0°
HE
6.2
6.4
6.6
e
0.53
0.65
0.77
y
L
Rev.2.00
Jan 30, 2006
REJ03B0101-0200
Page 35 of 35
0.2
10°
0.10
0.3
0.5
0.7
REVISION HISTORY
REVISION HISTORY
Rev.
Date
0.10
1.00
Sep 06, 2004
Feb 25, 2005
1.10
2.00
R8C/16 Group, R8C/17 Group Datasheet
R8C/16 Group, R8C/17 Group Datasheet
Description
Page
Summary
−
2-3
5
6
7-8
16
First Edition issued
Tables 1.1 and 1.2 revised
Table 1.3 and figure 1.2 revised
Table 1.4 and figure 1.3 revised
Figures 1.4 and 1.5 revised
Table 4.1 revised:
- 000Fh: 000XXXXXb → 00011111b
- 0036h: 00001000b → 0000X000b and 01001001b → 0100X001b
18 Tabel 4.3 revised:
- 009Ch: FFh → 00h; NOTES2 added
- 009Dh: FFh → 00h
21 Table 5.3 revised
22 Tables 5.4 and 5.5 revised
24 Tables 5.8 and 5.9 revised
25 Table 5.11 revised
26 Table 5.12 and figure 5.4 added
27 Table 5.13 revised
28 Table 5.14 revised
29, 33 Table 5.16 and 5.23 revised: Table title “INT2” → “INT1”
31 Table 5.20 revised; NOTE revised
32 Table 5.21 revised
35 Package Dimensions revised
May 26, 2005
5, 6 Tables 1.3 and 1.4 revised
16 Table 4.1 revised:
- 0009h: XXXXXX00b → 00h
- 000Ah: 00XXX000b → 00h
- 001Eh: XXXXX000b → 00h
22 Table 5.5 revised; NOTE revised
26 Fig 5.4 revised
27 Table 5.13 revised
31 Table 5.20 revised
Jan 30, 2006
1
1. Overview; “20-pin plastic molded LSSOP or SDIP” → “20-pin plastic
molded LSSOP” revised
2
Table 1.1 Performance Outline of the R8C/16 Group;
Package:
“20-pin plastic molded SDIP” deleted
3
Table 1.2 Performance Outline of the R8C/17 Group;
Package:
“20-pin plastic molded SDIP” deleted,
Flash Memory: (Data area) → (Data flash)
(Program area) → (Program ROM) revised
4
Figure 1.1 Block Diagram;
“Peripheral Function” added,
“System Clock Generation” → “System Clock Generator” revised
5, 6 Table 1.3 Product Information of R8C/16 Group,
Table 1.4 Product Information of R8C/17 Group; revised.
Figure 1.2 Part Number, Memory Size and Package of R8C/16 Group,
Figure 1.3 Part Number, Memory Size and Package of R8C/17 Group;
Package type: “DD : PRDP0020BA-A” deleted
A-1
REVISION HISTORY
Rev.
Date
2.00
Jan 30, 2006
R8C/16 Group, R8C/17 Group Datasheet
Description
Page
Summary
8
Figure 1.5 PRDP0020BA-A Package Pin Assignment (top view) deleted
Table 1.5 Pin Description;
Timer C: “CMP0_0 to CMP0_3, CMP1_0 to CMP1_3” →
“CMP0_0 to CMP0_2, CMP1_0 to CMP1_2” revised
10 Figure 2.1 CPU Register;
“Reserved Area” → “Reserved Bit” revised
12 2.8.10 Reserved Area;
“Reserved Area” → “Reserved Bit” revised
13 Figure 3.1 Memory Map of R8C/16 Group revised
14
26
3.2 R8C/17 Group;
(program area) → (program ROM), (data area) → (data flash) revised
Figure 3.2 Memory Map of R8C/17 Group revised
Table 4.3 SFR Information(3);
0085h:
“Prescaler Z” → “Prescaler Z Register”
0086h:
“Timer Z Secondary” → “Timer Z Secondary Register”
0087h:
“Timer Z Primary” → “Timer Z Primary Register”
008Ch:
“Prescaler X” → “Prescaler X Register”
008Dh:
“Timer X” → “Timer X Register”
0090h, 0091h: “Timer C” → “Timer C Register” revised
Table 5.4 Flash Memory (Program ROM) Electrical Characteristics;
• NOTES 1 to 7 added
• “Topr” → “Ambient temperature”, “(Program area)” → “(Program ROM)”
revised
Table 5.5 Flash Memory (Data flash Block A, Block B) Electrical
Characteristics;
• NOTE1 revised, NOTE9 added
• “Topr” → “Ambient temperature”, “(Program area)” → “(Program ROM)”
revised
Figure 5.2 Time delay from Suspend Request until Erase Suspend revised
Table 5.7 Voltage Detection 2 Circuit Electrical Characteristics; NOTE1
revised
Table 5.8 Reset Circuit Electrical Characteristics (When Using Voltage
Monitor 1 Reset ); NOTE2 revised
Table 5.9 Reset Circuit Electrical Characteristics (When Not Using Voltage
Monitor 1 Reset); NOTE1 revised
Table 5.10 High-speed On-Chip Oscillator Circuit Electrical Characteristics
revised
Table 5.12 Timing Requirements of I2C bus Interface (IIC); NOTE1 revised
28
Table 5.14 Electrical Characteristics (2) [Vcc = 5V] revised
29
“Timing Requirements (Unless ... at Ta = 25°C) [ VCC = 5V ]” →
“Timing Requirements (Unless ... at Topr = 25°C) [ VCC = 5V ]” revised
Table 5.18 Serial Interface; “35” → “50”, “80” → “50”
Table 5.21 Electrical Characteristics (4) [Vcc = 3V] revised
17
21
22
23
24
25
32
33
35
“Timing requirements (Unless ... at Ta = 25°C) [VCC = 3V]” →
“Timing requirements (Unless ... at Topr = 25°C) [VCC = 3V]” revised
Table 5.25 Serial Interface; “55” → “70”, “160” → “70”
Package Dimensions; Package “PRDP0020BA-A” deleted
A-2
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