RF7206

RF7206
3 V W-CDMA BAND 2 LINEAR PA MODULE
Package Style: Module, 10-Pin, 3 mm x 3 mm x 1.0 mm
Features

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

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HSDPA and HSPA+ Compliant
Low Voltage Positive Bias
Supply (3.0 V to 4.35 V)
+28.5 dBm Linear Output
Power (+27.0 dBm HSDPA
and HSPA+)
High Efficiency Operation
39% at POUT = +28.5 dBm
19% at POUT = +19.0 dBm
(Without DC/DC Converter)
Low Quiescent Current in Low
Power Mode: 17 mA
Internal Voltage Regulator
Eliminates the Need for External Reference Voltage (VREF)
3-Mode Power States with
Digital Control Interface
Supports DC/DC Converter
Operation
Integrated Power Coupler
Integrated Blocking and Collector Decoupling Capacitors
Applications


WCDMA/HSDPA/HSPA+
Wireless Handsets and Data
Cards
Dual-Mode UMTS Wireless
Handsets
Functional Block Diagram
Product Description
The RF7206 is a high-power, high-efficiency, linear power amplifier
designed for use as the final RF amplifier in 3 V, 50  W-CDMA mobile cellular equipment and spread-spectrum systems. This PA is developed for
UMTS Band 2 which operates in the 1850 MHz to 1910 MHz frequency
band. The RF7206 has two digital control pins to select one of three
power modes to optimize performance and current drain at lower power
levels. The part also has an integrated directional coupler which eliminates the need for an external discrete coupler at the output. The RF7206
is fully HSDPA and HSPA+-compliant and is assembled in a 10-pin,
3 mm x 3 mm module.
Ordering Information
RF7206
RF7206PCBA-410
3 V W-CDMA Band 2 Linear PA Module
Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT

SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 8
RF7206
Absolute Maximum Ratings
Parameter
Supply Voltage in Standby Mode
Rating
Unit
6.0
V
Supply Voltage in Idle Mode
6.0
V
Supply Voltage in Operating Mode,
50  Load
6.0
V
Supply Voltage, VBAT
6.0
V
Control Voltage, VMODE0,
VMODE1
3.5
V
Control Voltage, VEN
3.5
V
RF - Input Power
+6
dBm
RF - Output Power
+30
dBm
Output Load VSWR (Ruggedness)
10:1
Operating Ambient Temperature
-30 to +110
°C
Storage Temperature
-55 to +150
°C
Parameter
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
RoHS status based on EU Directive 2002/95/EC (at time of this document revision).
Min.
Specification
Typ.
Max.
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Unit
Condition
Recommended Operating
Conditions
Operating Frequency Range
1850
1910
MHz
VBAT
+3.0
+3.4
+4.35
V
VCC
+3.01
+3.4
+4.35
V
VEN
0
1.4
VMODE0, VMODE1
0.5
V
PA disabled.
1.8
3.0
V
PA enabled.
0.5
V
Logic “low”.
1.8
3.0
V
Logic “high”.
0
1.5
POUT
Maximum Linear Output
(HPM)
28.52,3
dBm
High Power Mode (HPM)
Maximum Linear Output
(MPM)
19.02,3
dBm
Medium Power Mode (MPM)
Maximum Linear Output
(LPM)
8.02,3
dBm
Low Power Mode (LPM)
Ambient Temperature
-30
+25
+85
°C
Notes:
1Minimum V for max P
CC
OUT is indicated. VCC down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery
current.
2For operation at V = +3.2 V, derate P
CC
OUT by 0.6 dB. For operation at VCC = 3.0 V, derate POUT by 1.3 dB.
3P
OUT
2 of 8
is specified for 3GPP (Voice) modulation. For HSDPA and HSPA+ operation, derate POUT by 1.5 dB:
HSDPA Configuration: c  12, d  15, hs  24, HSPA+ Configuration: 3GPP Release 7 Subtest 1
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS100805
RF7206
Parameter
Min.
Specification
Typ.
Max.
Unit
Condition
T = +25C, VCC = VBAT = +3.4 V, VEN = +1.8 V, 50 
system, WCDMA Rel 99 Modulation unless otherwise specified.
Electrical Specifications
Gain
HPM, POUT = 28.5 dBm
25.0
26.5
dB
15
17.5
dB
MPM, POUT  19.0 dBm
14.5
dB
LPM, POUT  8.0 dBm
dB
HPM, 19.0 dBm  POUT  28.5 dBm
1
10.5
Gain Linearity
±0.2
ACLR - 5 MHz Offset
-39
-36
dBc
HPM, POUT = 28.5 dBm
-42
-36
dBc
MPM, POUT = 19.0 dBm
-42
-36
dBc
LPM, POUT = 8.0 dBm
-52
-47
dBc
HPM, POUT = 28.5 dBm
-58
-47
dBc
MPM, POUT = 19.0 dBm
-60
-47
dBc
LPM, POUT = 8.0 dBm
ACLR - 10 MHz Offset
PAE Without DC/DC Converter
35
39
%
HPM, POUT = 28.5 dBm
16
19
%
MPM, POUT = 19.0 dBm
Current Drain
80
mA
MPM, POUT = 16.0 dBm
38
mA
LPM, POUT = 8.0 dBm
mA
LPM, POUT = 0.0 dBm
20
Quiescent Current
85
125
mA
HPM, DC only
20
28
mA
MPM, DC only
LPM, DC only
17
24
mA
Enable Current
0.3
1.0
mA
Source or sink current. VEN = 1.8 V.
Mode Current (IMODE0, IMODE1)
0.3
1.0
mA
Source or sink current. VMODE0, VMODE1 = 1.8 V.
Leakage Current
5.0
15.0
A
DC only. VCC = VBAT = 4.35 V,
VEN = VMODE0 = VMODE1 = 0.5 V.
Noise Power in Receive Band
-137
-134
dBm/Hz
Input Impedance
1.7:1
All power modes, measured at duplex offset
frequency (FTX + 80 MHz). Rx: 1930 MHz to
1990 MHz, POUT  28.5 dBm
VSWR
No ext. matching, POUT  28.5 dBm, all modes.
Harmonic, 2FO
-27
-15
dBm
POUT  28.5 dBm, all power modes.
Harmonic, 3FO
-35
-20
dBm
POUT  28.5 dBm, all power modes.
-70
dBc
All spurious, POUT  28.5 dBm, all conditions,
load VSWR  6:1, all phase angles.
+30
°
Phase shift at 19 dBm when switching from
HPM to MPM and MPM to LPM at 8 dBm.
DC Enable Time
10
S
DC only. Time from VEN = high to stable idle current (90% of steady state value).
RF Rise/Fall Time
6
S
POUT  28.5 dBm, all modes. 90% of target, DC
settled prior to RF.
Spurious Output Level
Insertion Phase Shift
-30
Coupling Factor
19.5
dB
POUT  28.5 dBm, all modes.
Coupling Accuracy - Temp/Voltage
±0.5
dB
POUT  28.5 dBm, all modes. -30 °C  T  85 °C,
3.0 V  VCC & VBAT  4.35 V, referenced to 25 °C,
3.4 V conditions.
Coupling Accuracy - VSWR
±0.7
dB
POUT  28.5 dBm, all modes, load VSWR = 2:1,
±0.7 dB accuracy corresponds to 12 dB directivity. Coupler termination resistance = 33 .
Note: 1Excludes DC/DC converter operation. Gain may be lower when using DC/DC converter to conserve battery current.
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF7206
Pin
1
2
Function
VBAT
RF IN
3
4
5
6
7
8
VMODE1
VMODE0
VEN
CPL_OUT
GND
CPL_IN
9
10
RF OUT
VCC
Pkg
Base
GND
Description
Supply voltage for bias circuitry and the first stage amplifier.
RF input internally matched to 50  and DC blocked. Input matching includes a shunt inductor to ground which
would short DC voltage placed on this pin.
Digital control input for power mode selection (see Operating Modes truth table).
Digital control input for power mode selection (see Operating Modes truth table).
Digital control input for PA enable and disable (see Operating Modes truth table).
Coupler output.
This pin must be grounded.
Coupler input used for cascading couplers in series. Terminate this pin with a 50  resistor if not connected to
another coupler.
RF output internally matched to 50 and DC blocked.
Supply voltage for the second stage amplifier which can be connected to battery supply or output of DC-DC converter.
Ground connection. The package backside should be soldered to a topside ground pad connecting to the PCB
ground plane with multiple ground vias. The pad should have a low thermal resistance and low electrical impedance to the ground plane.
VEN
VMODE0 VMODE1
VBAT
VCC
Low
Low
Low
3.0 V to 4.35 V
3.0 V to 4.35 V
Power down mode
Low
X
X
3.0 V to 4.35 V
3.0 V to 4.35 V
Standby Mode
High
Low
Low
3.0 V to 4.35 V
3.0 V to 4.35 V
High power mode
High
High
Low
3.0 V to 4.35 V
3.0 V to 4.35 V
Medium power mode
High
High
High
3.0 V to 4.35 V
3.0 V to 4.35 V
Low power mode
High
High
High
3.0 V to 4.35 V
0.5 V
Optional lower VCC in low power mode
Conditions/Comments
Package Drawing
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS100805
RF7206
Preliminary Application Schematic
DS100805
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF7206
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3 inch
to 8 inch gold over 180 inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
Figure 1. PCB Metal Land Pattern (Top View)
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS100805
RF7206
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2 mil to 3 mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
Figure 2. PCB Solder Mask Pattern (Top View)
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on a
0.5 mm to 1.2 mm grid pattern with 0.025 mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
DS100805
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
7 of 8
RF7206
8 of 8
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
DS100805