RF7225 - RFMD.com

RF7225
3V W-CDMA BAND 5 LINEAR PA MODULE
Package Style: Module, 10-Pin, 3mmx3mmx1.0mm
Features









VBAT
3-Mode Power States with
Digital Control Interface
Integrated Power Coupler
Integrated Blocking and Collector Decoupling Capacitors
Applications


AMP
HSDPA and HSPA+ Compliant
Low Voltage Positive Bias
Supply (3.0V to 4.35V)
+28.0dBm Linear Output
Power (+26.5dBm HSDPA)
High Efficiency Operation
41% at POUT =+28.0dBm
22% at POUT =+18.0dBm
11% at POUT =+10.0dBm
Low Quiescent Current in Low
Power Mode: 6mA
Internal Voltage Regulator
Eliminates the Need for External Reference Voltage (VREF)
WCDMA/HSDPA/HSUPA Wireless Handsets and Data
Cards
Dual-Mode UMTS Wireless
Handsets
10 VCC
1
RF IN
2
VMODE1
3
VMODE0
4
VEN
5
9 RF OUT
Bias Control
& PA/VMODE
Enable
8
CPL IN
7
GND
6 CPL OUT
Functional Block Diagram
Product Description
The RF7225 is a high-power, high-efficiency, linear power amplifier
designed for use as the final RF amplifier in 3V, 50 W-CDMA mobile cellular equipment and spread-spectrum systems. This PA is developed for
UMTS Band 5 which operates in the 824MHz to 849MHz frequency band.
The RF7225 has two digital control pins to select one of three power
modes to optimize performance and current drain at lower power levels.
The part also has an integrated directional coupler which eliminates the
need for an external discrete coupler at the output. The RF7225 is fully
HSDPA and HSPA+ compliant and is assembled in a 10-pin, 3mmx3mm
module.
Ordering Information
RF7225
RF7225PCBA-410
3V W-CDMA Band 5 Linear PA Module
Fully Assembled Evaluation Board
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT

SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MEMS
LDMOS
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Prelim DS110224
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
1 of 6
RF7225
Absolute Maximum Ratings
Parameter
Rating
Unit
Supply Voltage in Standby Mode
6.0
V
Supply Voltage in Idle Mode
6.0
V
Supply Voltage in Operating Mode, 50 Load
6.0
V
Supply Voltage, VBAT
6.0
V
Control Voltage, VMODE0, VMODE1
3.5
V
Control Voltage, VEN
3.5
V
RF - Input Power
+10
dBm
RF - Output Power
+30
dBm
Output Load VSWR (Ruggedness)
10:1
Operating Ambient Temperature
-30 to +110
°C
Storage Temperature
-55 to +150
°C
Specification
Typ.
Max.
Parameter
Min.
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may
cause permanent damage to the device. Extended application of Absolute Maximum
Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied.
RoHS status based on EUDirective2002/95/EC (at time of this document revision).
The information in this publication is believed to be accurate and reliable. However, no
responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any
infringement of patents, or other rights of third parties, resulting from its use. No
license is granted by implication or otherwise under any patent or patent rights of
RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Unit
Condition
Recommended Operating
Conditions
Operating Frequency Range
824
849
MHz
VBAT
+3.0
+3.4
+4.35
V
VCC
+3.01
+3.4
+4.35
V
VEN
0
1.4
VMODE0, VMODE1
1.8
0
1.5
1.8
0.5
V
PA disabled.
3.0
V
PA enabled.
0.5
V
Logic “low”.
3.0
V
Logic “high”.
POUT
Maximum Linear Output
(HPM)
28.02,3
dBm
High Power Mode (HPM)
Maximum Linear Output
(MPM)
18.02,3
dBm
Medium Power Mode (MPM)
Maximum Linear Output
(LPM)
10.02,3
dBm
Low Power Mode (LPM)
Ambient Temperature
-30
+25
+85
°C
Notes:
1
Minimum VCC for max POUT is indicated.
2
For operation at VCC =+3.2V, derate POUT by 0.6dB. For operation at VCC =3.0V, derate POUT by 1.3dB.
3
POUT is specified for 3GPP (Rel99) modulation. For HSDPA and HSPA+ operation, derate POUT by 1.5dB:
HSDPA Configuration: c12, d15, hs24
HSPA+ Configuration: Rel7 Subtest 1
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7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Prelim DS110224
RF7225
Parameter
Min.
Specification
Typ.
Max.
Unit
Condition
T=+25C, VCC =VBAT =+3.4V, VEN =+1.8V, 50
system, W-CDMA Rel 99 Modulation unless
otherwise specified.
Electrical Specifications
Gain
27
30
dB
HPM, POUT =28.0dBm
16
19
dB
MPM, POUT 18.0dBm
14
dB
LPM, POUT 10.0dBm
Gain Linearity
±0.7
dB
HPM, 18.0dBmPOUT 28.0dBm
ACLR - 5MHz Offset
-40
dBc
HPM, POUT =28.0dBm
-40
dBc
MPM, POUT =18.0dBm
10
ACLR - 10MHz Offset
PAE
Current Drain
Quiescent Current
Enable Current
-40
dBc
LPM, POUT =10.0dBm
-52
dBc
HPM, POUT =28.0dBm
MPM, POUT =18.0dBm
-60
dBc
-60
dBc
LPM, POUT =10.0dBm
41
%
HPM, POUT =28.0dBm
22
%
MPM, POUT =18.0dBm
11
%
LPM POUT =10.0dBm
450
mA
HPM, POUT =28dBm
85
mA
MPM, POUT =18dBm
LPM, POUT =10dBm
30
mA
100
mA
HPM, DC only
27
mA
MPM, DC only
6
mA
LPM, DC only
0.1
mA
Source or sink current. VEN =1.8V.
mA
Source or sink current. VMODE0, VMODE1 =1.8V.
A
DC only. VCC =VBAT =4.35V,
VEN =VMODE0 =VMODE1 =0.5V.
Mode Current (IMODE0, IMODE1)
0.1
Leakage Current
5.0
Noise Power in Receive Band
-135
dBm/Hz
Input Impedance
15.0
All power modes, measured at duplex offset
frequency (FTX+45MHz). Rx: 869MHz to
894MHz, POUT 28.0dBm
1.5:1
VSWR
No ext. matching, POUT 28dBm, all modes.
Harmonic, 2FO
-15
dBm
POUT 28.0dBm, all power modes.
Harmonic, 3FO
-25
dBm
POUT 28.0dBm, all power modes.
dBc
All spurious, POUT 28dBm, all conditions, load
VSWR6:1, all phase angles.
Spurious Output Level
-70
Insertion Phase Shift
±25
°
Phase shift at 18dBm when switching from
HPM to MPM and MPM to LPM at 10dBm.
DC Enable Time
10
S
DC only. Time from VEN =high to stable idle current (90% of steady state value).
RF Rise/Fall Time
6
S
POUT 28.0dBm, all modes. 90% of target, DC
settled prior to RF.
Coupling Factor
-20
dB
POUT 28.0dBm, all modes.
Coupling Accuracy - Temp/Voltage
±0.5
dB
POUT 28.0dBm, all modes. -30°CT85°C,
3.0VVCC & VBAT 4.35V, referenced to 25°C,
3.4V conditions.
Coupling Accuracy - VSWR
±0.25
dB
POUT 28dBm, all modes, load VSWR=2:1,
±0.25dB accuracy corresponds to 20dB directivity.
Prelim DS110224
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
3 of 6
RF7225
Pin
1
2
Function
VBAT
RF IN
3
4
5
6
7
8
VMODE1
VMODE0
VEN
CPL_OUT
GND
CPL_IN
9
10
Pkg
Base
RF OUT
VCC
GND
Description
Supply voltage for bias circuitry.
RF input internally matched to 50 and DC blocked. Input matching includes a shunt inductor to ground which
would short DC voltage placed on this pin.
Digital control input for power mode selection (see Operating Modes truth table).
Digital control input for power mode selection (see Operating Modes truth table).
Digital control input for PA enable and disable (see Operating Modes truth table).
Coupler output.
This pin must be grounded.
Coupler input used for cascading couplers in series. Terminate this pin with a 50 resistor if not connected to
another coupler.
RF output internally matched to 50and DC blocked.
Supply voltage for the first and second stage amplifier.
Ground connection. The package backside should be soldered to a topside ground pad connecting to the PCB
ground plane with multiple ground vias. The pad should have a low thermal resistance and low electrical impedance to the ground plane.
VEN
VMODE0 VMODE1
VBAT
VCC
Low
Low
Low
3.0V to 4.35V
3.0V to 4.35V
Power down mode
Low
X
X
3.0V to 4.35V
3.0V to 4.35V
Standby Mode
Conditions/Comments
High
Low
Low
3.0V to 4.35V
3.0V to 4.35V
High power mode
High
High
Low
3.0V to 4.35V
3.0V to 4.35V
Medium power mode
High
High
High
3.0V to 4.35V
3.0V to 4.35V
Low power mode
Package Drawing
4 of 6
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Prelim DS110224
RF7225
Preliminary Application Schematic
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch
to 8inch gold over 180inch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land Pattern
PCB Metal Land Pattern (Top View)
Prelim DS110224
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support, contact RFMD at (+1) 336-678-5570 or [email protected].
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RF7225
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
PCB Solder Mask Pattern (Top View)
Thermal Pad and Via Design
The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device.
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing
strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a
0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the
quantity of vias be increased by a 4:1 ratio to achieve similar results.
6 of 6
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or [email protected].
Prelim DS110224