Atmel 42268 Wireless ZigBit ATZB X0

ZIGBIT 900MHZ WIRELESS MODULES
ATZB-X0-256-4-0-CN
DATASHEET
Features
•
•
•
•
•
Compact size (38.5 x 20.0mm)
•
Ample memory resources (256KB In-System, Self-Programmable Flash memory,
4KB EEPROM, 16KB SRAM)
•
High RX sensitivity (-103dBm)
Outperforming link budget (up to +112dB)
Up to +9.0dBm output power
Very low power consumption:
• 8.7mA in RX mode (1)
• 34.8mA in TX mode (1)
• 0.6µA in sleep mode (2)
Wide range of interfaces (both analog and digital)
•
•
•
•
•
•
•
•
Notes:
4-wire SPI, TWI
ISP, JTAG
Two analog comparator input
UART, USART
Timer, PWM
Four ADC lines
External Clock Input, Internal Clock Output
Up to 32 lines configurable as GPIO
•
•
•
•
•
•
•
•
•
Preassigned Atmel® MAC address that can be used on end product
Capability to use MAC address into the internal EEPROM
IEEE® 802.15.4 compliant Transceiver
•
•
•
•
Mesh networking capability
900MHz ISM band
Serial bootloader
High Performance Low Power Atmel AVR® XMEGA® 8- and 32-bit Microcontroller
Rapid design-in with built-in Chip Antenna
RF Test point using MS-147 RF connector
Small physical footprint and low profile for optimum fit in very small application
boards
Easy-to-use low cost development kit
Single source of support for HW and SW
Worldwide license-free operation
1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),
PHY_TX_PWR=0x0 (for TX current), All digital outputs pulled high.
2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN.
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Table of Contents
1. Introduction ........................................................................................ 3
1.1
1.2
1.3
1.4
Summary ........................................................................................................... 3
Applications ....................................................................................................... 3
Abbreviations and Acronyms ............................................................................ 3
Related Documents........................................................................................... 4
2. ZigBit Module Overview ..................................................................... 5
2.1
Overview ........................................................................................................... 5
3. Specifications ..................................................................................... 7
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Electrical Characteristics ................................................................................... 7
3.1.1
Absolute Maximum Ratings ................................................................ 7
3.1.2
Power Supply...................................................................................... 7
3.1.3
RF Characteristics .............................................................................. 8
3.1.4
ATxmega256A3U Microcontroller Characteristics .............................. 9
3.1.5
Module Interfaces Characteristics ....................................................... 9
Physical/environmental Characteristics and Outline ......................................... 9
Pin Configuration............................................................................................. 10
Antenna Orientation Recommendation ........................................................... 11
Mounting Information ...................................................................................... 11
Soldering Profile .............................................................................................. 14
Antenna Reference Designs ........................................................................... 14
4. Schematics ...................................................................................... 15
4.1
4.2
Handling Instructions....................................................................................... 20
General Recommendations ............................................................................ 20
5. Persistence Memory ........................................................................ 21
6. Ordering Information ........................................................................ 22
7. Agency Certifications ....................................................................... 23
7.1
7.2
7.3
United States (FCC) ........................................................................................ 23
European Union (ETSI) ................................................................................... 23
Industry Canada (IC) Compliance Statements ................................................ 24
8. Revision History ............................................................................... 25
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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1.
Introduction
1.1
Summary
ATZB-X0-256-4-0-CN ZigBit® is an ultra-compact and low-power 900MHz IEEE 802.15.4/ZigBee® OEM module from
Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATxmega256A3U [1]
Microcontroller and AT86RF212B [5] 700/800/900MHz ISM band Transceiver. The radio transceiver provides high data
rates from 20kb/s up to 1Mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling
a very robust wireless communication. The module is designed for wireless sensing, monitoring, control, data
acquisition applications, to name a few. This ZigBit module eliminates the need for costly and time-consuming RF
development, and shortens time-to-market for wireless applications.
The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed
and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.
1.2
Applications
The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing
mesh network, while optimizing network traffic and minimizing power consumption.
For detailed software support information, visit http://www.atmel.com/products/wireless.
The applications include, but are not limited to:
•
•
•
•
•
•
•
•
1.3
Building automation and monitoring
•
Lighting controls
•
Wireless smoke- and CO-detectors
•
Structural integrity monitoring
HVAC monitoring and control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
•
Machinery condition and performance monitoring
•
Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity,
vibration, etc.
Automated meter reading (AMR)
Abbreviations and Acronyms
ADC
Analog-to-Digital Converter
API
Application Programming Interface
DC
Direct Current
DTR
Data Terminal Ready
EEPROM
Electrically Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
GPIO
General Purpose Input/output
HAF
High Frequency
HVAC
Heating, Ventilating, and Air Conditioning
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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HW
2
1.4
Hardware
IC
Inter-Integrated Circuit
IEEE
Institute of Electrical and Electronics Engineers
IRQ
Interrupt Request
ISM
Industrial, Scientific and Medical radio band
JTAG
Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
MAC
Medium Access Control layer
MCU
Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit
module
NRE
Network layer
OEM
Original Equipment Manufacturer
OTA
Over-The-Air upgrade
PA
Power Amplifier
PCB
Printed Circuit Board
PER
Package Error Ratio
RAM
Random Access Memory
RF
Radio Frequency
RPC
Reduced Power Consumption
RTS/CTS
Request to Send/ Clear to Send
RX
Receiver
SMA
Surface Mount Assembly
SoC
System on Chip
SPI
Serial Peripheral Interface
SW
Software
TTM
Time-To-Market
TX
Transmitter
UART
Universal Asynchronous Receiver/Transmitter
USART
Universal Synchronous/Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
ZigBee, ZigBee PRO
Wireless networking standards targeted at low-power applications
802.15.4
The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
Related Documents
[1] ATXMEGA256A3U Datasheet in http://www.atmel.com/devices/ATXMEGA256A3U.aspx?tab=documents.
[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz
http://www.hirose.co.jp/cataloge_hp/e35801505.pdf.
[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs).
[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007.
[5] AT86RF212B Datasheet in http://www.atmel.com/devices/AT86RF212B.aspx?tab=documents.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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2.
ZigBit Module Overview
2.1
Overview
The ATZB-X0-256-4-0-CN ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module. Based
on a solid combination of the latest Atmel MCU Wireless hardware platform, 900MHz ISM band transceiver and Atmel
Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low power
consumption and exceptional ease of integration.
Figure 2-1. ATZB-X0-256-4-0-CN User Interface Diagram
This ZigBit module contains the Atmel ATxmegaA256A3U Microcontroller and AT86RF212B 900MHz ISM band
Transceiver for ZigBee and IEEE 802.15.4 [3]. The module features 256KB In-System Self-Programmable flash
memory, 16KB SRAM and 4KB EEPROM.
The compact all-in-one board design of MCU and Radio Transceiver with very minimal components on the RF path to
Antenna dramatically improves the ZigBit’s compact size, range performance on signal transmission and increases its
sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller
footprint. The MS-147 connector [2] can be used as an RF Test port.
ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module
can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module
Evaluation kit containing the ZigBit Extension board for the Atmel Xplained PRO HW Evaluation platform can be used to
develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU
solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the
HW/FW design, prototyping, and mass production phases of product development.
All ZigBits are preloaded with a Bootloader when they are sold as Modules, either in Single units or T&R.
Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would
function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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The MAC stack running on the host processor can then control data transmission and manages module peripherals.
Thus very minimal firmware customization is required for successful module design-in. Third-party sensors can then be
connected directly to the module, thus expanding the existing set of peripheral interfaces.
Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the
device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy
a MAC address separately for the product using the ZigBit.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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3.
Specifications
3.1
Electrical Characteristics
3.1.1
Absolute Maximum Ratings
Table 3-1.
Notes:
3.1.2
Absolute Maximum Ratings
(1)(2)
Parameter
Minimum
Maximum
Voltage on any pin, except RESET with respect to ground
-0.3V
3.6V (VDD max)
Input RF level
+10dBm
Current into VCC pins
200mA
1.
Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed
under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated
in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2.
Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to
prevent permanent damage.
Power Supply
Table 3-2.
°
Test Conditions (unless otherwise stated), Vcc = 3V, Tamb = 25 C
Parameter
Range
Unit
Supply voltage, VDD
1.8 to 3.6
V
Active Current consumption: RX mode + Max sensitivity
14.5
mA
13.9
mA
9.3
mA
8.7
mA
34.8
mA
6.1
mA
740
µA
0.6
µA
Active Current consumption: RX mode + Least sensitivity
Active Current consumption: RX mode + Max sensitivity, MCU Sleep
(2)
Active Current consumption: RX mode + Least sensitivity, MCU Sleep
Active Current consumption: TX mode
(1)
(2)
– BUSY_TX – Transmit state
Current consumption: TRX_OFF, MCU Active
Current consumption: TRX_OFF, MCU Sleep
(2)
Sleep Current consumption: TRX Sleep, MCU Sleep
(2)
Note 1: Output TX power (when measuring consumption in TX mode) is +9dBm.
Note 2:
a)
All interfaces are set to the default state (see Table 3-8 Pinout Description).
b)
JTAG is not connected.
c)
CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down modes.
Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol
settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an
application.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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3.1.3
RF Characteristics
Table 3-3.
RF Characteristics
(3)
Parameter
Condition
Frequency band – FCC and Industry Canada
(2)
Range
Unit
902 – 928
MHz
Numbers of channels (FCC and Industry Canada)
10
Channel spacing
2
MHz
Transmitter output power
Adjusted in 36 steps
-25 to +11
dBm
Receiver sensitivity
PER = 1%
-103
dBm
20, up to 1000
Kbps
50
Ω
On-air data rate
TX output/ RX input nominal impedance
Range
Notes:
(1)
For balanced
Open field, LoS, Elevated 1120
m
1.
Range measured is Line of Sight at 10ft elevation from Ground at different combinations of orientation of transmitter and receiver, with
special conditions were there is minimal or no RF interference from other sources. For best case orientation of the ZigBits to achieve
maximum range, refer to Section 3.4.
2.
Appropriate FW (Register selection) must be used for operating this ZigBit in North America.
3.
For detailed characteristics, refer to [2].
Table 3-4.
TX Power Settings
PHY_TX_PWR 3:0 Register value
Power register setting [dBm]
Output power [dBm] (typical
values at RF connector)
C0
11
8.59
C1
10
8.14
80
9
7.43
82
8
5.85
83
7
4.97
84
6
4.1
40
5
3.58
86
4
2.12
00
3
1.4
01
2
0.42
02
1
-0.93
03
0
-2.09
04
-1
-3.16
27
-2
-4.29
91
-6
-7.86
0D
-10
-12.27
15
-18
-19.51
1D
-25
-26.82
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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3.1.4
ATxmega256A3U Microcontroller Characteristics
Table 3-5.
3.1.5
ATxmega256A3U Characteristics
Parameter
Range
Unit
On-chip flash memory size
256K
Bytes
On-chip RAM size
16K
Bytes
On-chip EEPROM size
4K
Bytes
Operation frequency
16
MHz
Module Interfaces Characteristics
Table 3-6.
Module Interfaces Characteristics
Parameters
(1)
Condition
UART maximum baud rate
Range
Unit
115.2
Kbps
ADC conversion time (latency)
(RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12
5-8
ClkADC cycles
ADC input resistance
Static load resistor of input signal
4.0
kΩ
ADC reference voltage (VREF)
1.0 to AVCC – 0.6
V
ADC input voltage
0 - AVDD
V
TWI maximum clock
400
kHz
GPIO High level input voltage
VCC = 2.7-3.6V
2 to VCC+0.3
V
GPIO Low level input voltage
VCC = 2.7-3.6V
-0.3 to 0.3 VDD
V
GPIO High level output voltage VOH
VCC = 3.0-3.6V
2.4 to 0.94VCC
V
GPIO Low level output voltage VOL
VCC = 3.0-3.6V
0.05VCC typ.
Max. 0.4
V
32.768
kHz
Real-time oscillator frequency
Note 1: For detailed characteristics, refer to [1].
3.2
Physical/environmental Characteristics and Outline
Table 3-7.
Physical Characteristics
Parameters
Value
Comments
Size
38.5 x 20.0mm
Operating temperature range
-40°C to +85°C
-40°C to +85°C operational
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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3.3
Pin Configuration
Table 3-8.
Pin out
ATZB-X0-256-4-0-CN Pinout Description
Pin descriptions
Function
1
AVSS
Analog Ground
2
AVSS
Analog Ground
3
DEVDD
Digital Power input pin
4
DEVDD
Digital Power input pin
5
RSET/PDI_CLOCK
RESET
6
PD4/SS
SPI
7
PD5/MOSI/XCK1
SPI
8
PD6/MISO/RXD1/D-
SPI
9
PD7/SCK/TXD1/D+
SPI
10
PA5
GPIO / ADC / Analog COMP+
11
PA4
GPIO/ADC/Analog Comp-
12
DVSS
Digital Ground
13
PD2/SYNC/ASYNC/OC0C/
UART
14
PD3/SYNC/TXD0/OC0D
UART
15
PD1/SCL/INT/OC0B
USART
16
PDI_DATA
PWM/TC
17
PA6
GPIO/ADC
18
PA7
GPIO/ADC
19
PB3
GPIO/ADC/DAC1
20
PB2
GPIO/ADC/DAC/intwkup
21
PF1/OC0B/INT/XCK0
INT/PWM/GPIO
22
PF2/OC0C/INT/RXD0
INT/PWM/GPIO
23
PF3/OC0D/INT/TXD0
INT/PWM/GPIO
24
PB0/IAREF/INT
ADC ref
25
PA0/ADC0/INT
ADC/ GPIO
26
PA1/ADC1/INT
ADC/ GPIO
27
PA2/ADC2/INT
ADC/ GPIO
28
PA3/ADC3/INT
ADC/ GPIO
29
DVSS
Digital Ground
30
PB6/TCK/INT
JTAG
31
PB4/TMS/INT
JTAG
32
PB7/TDO/INT
JTAG
33
PB5/TDI/INT
JTAG
34
PE3/TXD
GPIO/output counter
35
PE2/RXD
Wakeup INT
36
PE1/XCK
TWI/INT/GPIO
37
PE0
TWI/INT/GPIO
38
PE5/OC1B/INT
GPIO/TC
39
PE4/SYNC/OC1A
Master Clock out put
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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Pin out
Pin descriptions
Function
40
PF0
GPIO/Timer
41
DVSS
Digital Ground
42
DVSS
Digital Ground
NOTE:
3.4
TXD, RXD of UART are crossed inside ZigBit Module. External UART devices connecting to ZigBit Module should follow straight
connection for UART.
UART_TXD_external_device <-> UART_TXD
UART_RXD_external_device <-> UART_RXD
Antenna Orientation Recommendation
The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this
illustration.
3.5
Mounting Information
Figure 3-1 shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on the
PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded via
several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
Figure 3-1.
ATZB-X0-256-4-0-CN Dimensions
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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11
Figure 3-2.
ATZB-X0-256-4-0-CN Pinout
Figure 3-3.
ATZB-X0-256-4-0-CN Foot Print Dimensions
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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Figure 3-4.
ATZB-X0-256-4-0-CN Mounting Information (preferred placement)
Figure 3-5.
ATZB-X0-256-4-0-CN Mounting Information (alternative placement)
The ZigBit’s location and orientation on the carrier board is illustrated in the above PCB Land pattern and Mounting
information drawing. The Recommended placement of ZigBit on Carrier Board needs to be accurately followed to
ensure performance on the end application.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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3.6
Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9.
(1)
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max.
Preheat temperature 175°C ±25°C
180s max.
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max.
Time within 25°C to peak temperature
8 minutes
Note:
3.7
Soldering profile
1.
The package is backward compatible with PB/Sn soldering profile.
Antenna Reference Designs
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board
material and thickness, shields, the material used for enclosure, the board neighborhood, and other components
adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.
General Recommendations:
•
•
•
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
•
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band
frequency
Placing high profile components next to antenna should be avoided
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of
high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna
pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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4.
Schematics
The following schematic drawings for the ATZB-X0-256-4-0-CN are in the following order:
•
•
•
•
Top level schematics
Connector schematics
ATxmega256A3U schematics
AT86RF212B schematics
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
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D
C
B
A
1
1
ZigBit Xmega Sub-GHz board PCB
COPCB200
PCB200
2
GPIO/ADC
SPI INTERFACE
TWI
TWI
Product number/revision
Serial number
Label ZigBit Shield
LABEL1
COLABEL1
Xmega_212B_Connector.SchDoc
PDI/GPIO
XMEGA233
4
a
Xmega_212B_MCU.SchDoc
PDI/GPIO
UART/USART
JTAG
JTAG
INT/PWM/GPIO
INT/PWM/GPIO
UART/USART
4
GPIO/ADC/ANALOGCOMP
GPIO/ADC
SPI INTERFACE
GPIO/ADC/DAC
3
3
GPIO/ADC/DAC
GPIO/ADC/ANALOGCOMP
CONNECTOR
2
5
B
TRX_I/F
5
TRX_I/F
6
6
2/6/2014
7
Xmega_212B_Toplevel.SchDoc
TITLE: ATZB-X0-256-4-0-CN
Document number: *
Date:
INDIA
MSK
Chennai
*
OJS
ATMEL Chennai
Xmega_212B_RF.SchDoc
RF
7
4:23:38 PM
1
Revision: 5
PAGE:
8
of
8
4
D
C
B
A
D
C
B
1
GND_RF
C11
10 pF
GND
680R
R1
IRQ
/SEL
MOSI
DVSS
MISO
2
GND_RF
SCLK
DVSS
GND
TRX_DIG2
TRX_IRQ
SLP_TR
TRX_nRST
TRX_MISO
CLKM
GND
U1
TRX_SCK
TRX_MOSI
4Q1
16.0MHz
2
24
23
22
21
20
19
18
17
GND
1uF
C2
10 pF
Place xtal circuit closer
to TRX . Isolate from
digital signals.
IRQ
nSEL
MOSI
MISO
C8
2.2 pF
SCLK
GND
C3
CLKM
Place de-coupling closer
to TRX
VCC_3V3
TRX_I/F
CLKM
2
TRX_nSEL
16
TRX_I/F
3
1
15
DVSS
14
1uF
C1
AT86RF212B-ZU
DVDD
AVSS
1uF
1uF
C6
C7
AN_VCC_3V3
27
XTAL2
25
13
DVDD
EVDD
28
DEVDD
12
DVSS
AVDD
29
DIG2
IRQ
SLP_TR
DIG3
DIG4
AVSS
RFP
RFN
AVSS
DVSS
/RST
RESET_N
MISO
MOSI
SCLK
nSEL
CLKM
10
A
1
30
XTAL1
26
11
SLP_TR
AVSS
9
DIG2
AVSS
31
DIG1
AVSS
GND_RF
GND_RF
32
PAD
33
GND_RF
GND
DIG3
DIG4
RESET_N
3
Place de-coupling closer
to TRX
1
2
3
4
5
6
7
8
DIG1
DIG2
SLP_TR
3
i
PCB Rule
RF_P
PCB Rule
i
RF_N
4
3
4
Bal
Bal
B1
4
GND_RF
5
1
C5
68pF
5
0896FB15A0100
European Band 0896FB15A0100
Chinese Band
0783FB15A0100
Jap/NA Band
BoM varients for Balun:
0896FB15A0100
GND_RF
50Ohm
2
GND
GND
5
GND
6
1
6
GND_RF
L1
4.7nH
L2
6
C12
5.6pF
GND_RF
8.2nH
tune the values for
Antenna matching
Layout:
Maintain two ground planes and
two power planes
GND_RF
2
GND_RF
MS147
RF_IN RF_OUT
J1
3
GND
GND
4
1
0R
2/6/2014
TITLE: ATZB-X0-256-4-0-CN
7
Xmega_212B_RF.SchDoc
4:23:38 PM
0R
R3
2
Revision: 5
PAGE:
8
of
8
BoM Varients:
Japanese/North American Band
DNI-R2, DNI-R3
European Band Mount-R2, DNI-R3
Chinese Band
Mount-R2, Mount-R3
R2
Document number: A08-1567
Date:
Chennai
MSK
MSK
MGR Road
OJS
RMZ Millenia
2
ATMEL India
NC
0915AT43A0026
FEED POINT
A1
BoM Varients for Antenna:
Japanese/North American Band
0915AT43A0026
European Band 0868AT43A0020
Chinese Band
0783AT43A0008
7
2
D
C
B
A
D
C
B
A
GPIO/ADC/DAC
POGPIO0ADC0DAC0PB3
POGPIO0ADC0DAC0PB2
POGPIO0ADC0DAC
1
TWI
2
PD7
PD6
PD5
PD4
PA5
PA4
PB3
PB2
AREF
PA7
PA6
PA3
PA2
PA1
PA0
PE3
PE2
PE1
PE0
GPIO/ADC/DAC
GPIO/ADC
SPI INTERFACE
2
GPIO/ADC/ANALOG COMP
GPIO/ADC
POGPIO0ADC0PA7
POGPIO0ADC0PA6
POGPIO0ADC0PA3
POGPIO0ADC0PA2
POGPIO0ADC0PA1
POGPIO0ADC0PA0
POGPIO0ADC0AREF
POGPIO0ADC
TWI
POTWI0PE3
POTWI0PE2
POTWI0PE1
POTWI0PE0
POTWI
POSPI
POSPI
INTERFACE0PD4
INTERFACE0PD5
INTERFACE0PD6
INTERFACE
SPI INTERFACE0PD7
INTERFACE
GPIO/ADC/ANALOGCOMP
POGPIO0ADC0ANALOGCOMP0PA5
POGPIO0ADC0ANALOGCOMP0PA4
POGPIO0ADC0ANALOGCOMP
1
3
11
15
16
17
18
NLPD10XCK0
PD1_XCK0
NLPDI0DATA
PDI_DATA
NLPA6
PA6
NLPA7
PA7
PA7
PB0_AREF_INT
PA5
PA4
PB3
21
NLPF10OC0B0INT0XCK0
PF1_OC0B_INT_XCK0
4
PIZ201 PIZ201 2 PIZ201 3 PIZ201 4
COZ201
Z201
PF1/OC0B/INT/XCK0
PB2
PB3
PA7
PA6
PDI_DATA
PD1/XCK0
PD3/TXD0
PD2/RXD0
GND
PA4
PA5
PD7/SCK/TXD1/D+
PD6/MISO/RXD1/D-
ATZB-X-0-256-4-0-CN
PIZ200021
20
PIZ200020
19
PIZ200019
PIZ200018
PIZ200017
PIZ200016
PIZ200015
PIZ200014
NLPB2
PB2
NLPB3
PB3
14
NLPD30TXD0
PD3_TXD0
PA6
PB2
13
PIZ200013
NLPD20RXD0
PD2_RXD0
PA3_ADC3_INT
12
PIZ200012
GND
PA2_ADC2_INT
10
PIZ200011
NLPA4
PA4
PIZ200010
NLPA5
PA5
PA1_ADC1_INT
9
PIZ20009
PA0_ADC0_INT
NLUSBD0P
USBD_P
8
PIZ20008
NLUSBD0N
USBD_N
PD4/SS
RSET/PDI_CLOCK
VDD
VDD
GND
GND
PE3_GPIO
6
PIZ20006
5
PIZ20005
PIZ20004
4
3
PIZ20003
2
PIZ20002
1
PIZ20001
7
NLPD50MOSI0XCK1 PIZ20007
PD5_MOSI_XCK1
PD5/MOSI/XCK1
NLPD40SS
PD4_SS
NLnRST
nRST
VCC_3V3
VCC_3V3
GND
GND
4
PE2_ASYNC
PE1_SCL
PE0_SDA
USBD_P
USBD_N
PD5_MOSI_XCK1
PD4_SS
3
COZ200
Z200
EMI Shield
1
2
3
4
PF0
GND
GND
5
PF2/OC0C/INT/RXD0
PF3/OC0D/INT/TXD0
PB0/IAREF/INT
PA0/ADC0/INT
PA1/ADC1/INT
PA2/ADC2/INT
PA3/ADC3/INT
GND
PB6/TCK/INT
PB4/TMS/INT
PB7/TDO/INT
PB5/TDI/INT
PE3
PE2/ASYNC
PE1/SCL
PE0/SDA
PE5/OC1B/INT
PE4/SYNC/OC1A
5
39
PIZ200022
22
23
PIZ200023
24
PIZ200024
25
PIZ200025
26
PIZ200026
27
28
PIZ200027
PIZ200028
29
PIZ200029
30
PIZ200030
31
PIZ200031
32
33
PIZ200032
PIZ200033
34
PIZ200034
35
PIZ200035
36
PIZ200036
37
PIZ200037
38
PIZ200038
PIZ200039
40
PIZ200040
41
42
PIZ200041
PIZ200042
6
PDI_DATA
PE4_SYNC_OC1A
PE5_OC1B_INT
NLPB00AREF0INT
PB0_AREF_INT
NLPF30OC0D0INT0TXD0
PF3_OC0D_INT_TXD0
NLPF20OC0C0INT0RXD0
PF2_OC0C_INT_RXD0
PE5
PE4
PDI
PF0
PF3
PF2
PF1
PB7
PB6
PB5
PB4
PDI/GPIO
INT/PWM/GPIO
JTAG
UART/USART
OJS
nRST
PD3
PD2
PD1
7
2/6/2014
*
7
Xmega_212B_Connector.SchDoc
TITLE: ATZB-X0-256-4-0-CN
Document number: A08-1567
Date:
NORWAY
N-7075 TILLER
Vestre Rosten 79 MSK
ATMEL Norway
PF0
NLPA00ADC00INT
PA0_ADC0_INT
NLPA10ADC10INT
PA1_ADC1_INT
NLPA20ADC20INT
PA2_ADC2_INT
NLPA30ADC30INT
PA3_ADC3_INT
PF3_OC0D_INT_TXD0
PF2_OC0C_INT_RXD0
GND
PF1_OC0B_INT_XCK0
NLPB60TCK0INT
PB6_TCK_INT
PB7_TDO_INT
PB6_TCK_INT
PB5_TDI_INT
PB4_TMS_INT
nRST
PD3_TXD0
PD2_RXD0
PD1_XCK0
NLPB40TMS0INT
PB4_TMS_INT
NLPB70TDO0INT
PB7_TDO_INT
NLPB50TDI0INT
PB5_TDI_INT
NLPE30GPIO
PE3_GPIO
NLPE20ASYNC
PE2_ASYNC
NLPE10SCL
PE1_SCL
NLPE00SDA
PE0_SDA
NLPE50OC1B0INT
PE5_OC1B_INT
NLPE40SYNC0OC1A
PE4_SYNC_OC1A
NLPF0
PF0
GND
GND
6
4:23:39 PM
2
Revision: 5
PAGE:
PDI/GPIO
POPDI0GPIO0PF0
POPDI0GPIO0PE5
POPDI0GPIO0PE4
POPDI0GPIO0PDI
POPDI0GPIO
of
8
INT/PWM/GPIO
POINT0PWM0GPIO0PF3
POINT0PWM0GPIO0PF2
POINT0PWM0GPIO0PF1
POINT0PWM0GPIO
JTAG
POJTAG0PB7
POJTAG0PB6
POJTAG0PB5
POJTAG0PB4
POJTAG0NRST
POJTAG
POUART0USART0PD3
POUART0USART0PD2
POUART0USART0PD1
POUART0USART
UART/USART
8
4
D
C
B
A
D
GND_RF
L200
COL200
PIL20002
L201
COL201
PIL20101
1
BLM15BB221SN1
PIL20102
GND
VCC_3V3
BLM15BB221SN1
PIL20001
AN_VCC_3V3
GPIO/ADC/ANALOGCOMP
POGPIO0ADC0ANALOGCOMP0PA5
POGPIO0ADC0ANALOGCOMP0PA4
POGPIO0ADC0ANALOGCOMP
PIC20 2
PIC20 1COC202
PIC203 2
PIC203 1COC203
GND
GND
Place de-coupling closer
to MCU
GND
2
COC204
PIC204 2
PIC204 1
VCC_3V3
PIC20602
PIC20601
PA5
PA4
PB3
PB2
+
PIC20101
GND
GND
Place 4.7uF closer to
Vcc input for module
GND
COC205 COC206 PIC20102 COC201
PIC20502
PIC20501
PA7
PA6
PA3
PA2
PA1
PA0
PD7
PD6
PD5
PD4
AREF
GPIO/ADC/DAC
GPIO/ADC
SPI INTERFACE
GPIO/ADC/ANALOG COMP
100n
C202
C
GPIO/ADC/DAC
POGPIO0ADC0DAC0PB3
POGPIO0ADC0DAC0PB2
POGPIO0ADC0DAC
100n
C203
B
GPIO/ADC
POGPIO0ADC0PA7
POGPIO0ADC0PA6
POGPIO0ADC0PA3
POGPIO0ADC0PA2
POGPIO0ADC0PA1
POGPIO0ADC0PA0
POGPIO0ADC0AREF
POGPIO0ADC
POSPI
INTERFACE0PD4
INTERFACE0PD5
INTERFACE0PD6
INTERFACE
POSPI
SPI INTERFACE0PD7
INTERFACE
100n
C204
A
100n
C205
PD4_SS
GND
PIC20802
PIC20801
C208
COC208
100n
VCC_3V3
PA5
PA4
PB3
PB2
PB0_AREF_INT
PA7
PA6
PA3_ADC3_INT
PA2_ADC2_INT
PA1_ADC1_INT
PA0_ADC0_INT
USBD_P
USBD_N
PD5_MOSI_XCK1
3
GND
VCC_3V3
3
NLPC00TRX0nRST
PC0_TRX_nRST
NLPB2
PB2
NLPB3
PB3
NLPB40TMS0INT
PB4_TMS_INT
NLPB50TDI0INT
PB5_TDI_INT
NLPB60TCK0INT
PB6_TCK_INT
NLPB70TDO0INT
PB7_TDO_INT
NLPA30ADC30INT
PA3_ADC3_INT
NLPA4
PA4
NLPA5
PA5
NLPA6
PA6
NLPA7
PA7
NLPB00AREF0INT
PB0_AREF_INT
PC1_TRX_DIG2
PC2_TRX_IRQ
PC3_TRX_SLP_TR
PC0_TRX_nRST
4
PC6_TRX_SPI_MISO
PC5_TRX_SPI_MOSI
NLPA20DCINTLPA10DCINTLPA0DCINT
NLnRST
CLKM
GND
NLPDI0AT
nRST
PDI_DATA
PA2_ADC2_INT
PA1_ADC1_INT
PA0_ADC0_INT
GND
VCC_3V3
5
NLPF30OC D I T X
PIU20 65 PIU20 64 PIU20 63 PIU20 62 PIU20 61 PIU20 6 PIU20 59 PIU20 58 PIU20 57 PIU20 56 PIU20 5 PIU20 54 PIU20 53 PIU20 52 PIU20 51 PIU20 5 PIU20 49
CLKM
TRX_DIG2
TRX_IRQ
SLP_TR
TRX_nRST
TRX_MISO
TRX_MOSI
TRX_SCK
TRX_nSEL
ATxmega256A3U-MH
PC7_TRX_SPI_SCK
CLKM
GND
VCC_3V3
PA3(ADCA3/ACA3)
PA4(ADCA4/ACA4)
PA5(ADCA5/ACA5)
PA6(ADCA6/ACA6)
PA7(ADCA7/ACA7)
PB0(ADCB0/ACB0/AREFB)
PB1(ADCB1/ACB1)
PB2(ADCB2/ACB2/DACB0)
PB3(ADCB3/ACB3/DACB1)
PB4(ADCB4/ACB4/TMS)
PB5(ADCB5/ACB5/TDI)
PB6(ADCB6/ACB6/TCK)
PB7(ADCB7/ACB7/TDO)
GND
VCC
PC0(SDA/OC0A/OC0ALS)
PC4_TRX_SPI_SS
1
PIU20001
2
PIU20002
3
PIU20003
4
PIU20004
5
PIU20005
6
PIU20006
7
PIU20007
8
PIU20008
9
PIU20009
10
PIU200010
11
PIU200011
12
PIU200012
13
PIU200013
14
PIU200014
15
PIU200015
16
PIU200016
4
65
PAD_GND
2
100n
C206
1
4.7uF/10V
C201
PF3_OC0D_INT_TXD0
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PIU20 17 PIU20 18 PIU20 19 PIU20 PIU20 1 PIU20 2 PIU20 3 PIU20 4 PIU20 5 PIU20 6 PIU20 7 PIU20 8 PIU20 9 PIU20 3 PIU20 31 PIU20 32
TRX_I/F
NLPC10TRXDIG2NLPC0TRXIQNLPC30TRXS NLPC40TRXSINLPC50TRXSIMONLPC60TRXSIMONLPC70TRXSIK NLPD10XCKNLPD20RXDNLPD30TXD NLPD50MOSIXCK1NLUSBD0N
5
TRX_I/F
POTRX0I0F0TRX0SCK
POTRX0I0F0TRX0NSEL
POTRX0I0F0TRX0NRST
POTRX0I0F0TRX0MOSI
POTRX0I0F0TRX0MISO
POTRX0I0F0TRX0IRQ
POTRX0I0F0TRX0DIG2
POTRX0I0F0SLP0TR
POTRX0I0F0CLKM
POTRX0I0F
VCC_3V3
GND
NLPD40S
COU200
U200
nRSTPIR20001
COR200
R200
100K
i PCB Rule
(OC0C/RXD0)PF2
(OC0B/XCK0)PF1
(OC0A)PF0
VCC
GND
PE7
PE6
(OC1B)PE5
(OC1A)PE4
(OC0D/TXD0)PE3
(OC0C/RXD0)PE2
(OC0B/XCK0/SCL)PE1
(OC0A/SDA)PE0
VCC
GND
(D+/TXD1/SCK)PD7
(ACA2/ADCA2)PA2
(ACA1/ADCA1)PA1
(AREFA/ACA0/ADCA0)PA0
AVCC
GND
(XTAL1)PR1
(XTAL2)PR0
PDI_CLK/RESET
PDI_DATA
PF7
PF6
VCC
GND
PF5
(OC0A)PF4
(OC0D/TXD0)PF3
PC1(SCL/XCK0/OC0B/OC0AHS)
PC2(RXD0/OC0C/OC0BLS)
PC3(TXD0/OC0D/OC0BHS)
PC4(SS/OC1A/OC0CLS)
PC5(XCK1/MOSI/OC1B/OC0CHS)
PC6(RXD1/MISO/OC0DLS)
PC7(TXD1/SCK/OC0DHS)
GND
VCC
PD0(OC0A)
PD1(XCK0/OC0B)
PD2(RXD0/OC0C)
PD3(TXD0/OC0D)
PD4(SS/OC1A)
PD5(MOSI/XCK1/OC1B)
PD6(MISO/RXD1/D-)
17
PC1_TRX_DIG2
18
PC2_TRX_IRQ
PC3_TRX_SLP_TR 19
20
PC4_TRX_SPI_SS
PC5_TRX_SPI_MOSI 21
PC6_TRX_SPI_MISO 22
PC7_TRX_SPI_SCK 23
24
25
26
27
28
29
30
31
32
PD1_XCK0
PD2_RXD0
PD3_TXD0
PD4_SS
PD5_MOSI_XCK1
USBD_N
NLUSBD0P
USBD_P
VCC_3V3
6
GND
TOSC1
TOSC2
NLPE50OC1B0INT
PE5_OC1B_INT
NLPE40SYNC0OC1A
PE4_SYNC_OC1A
NLPE30GPIO
PE3_GPIO
NLPE20ASYNC
PE2_ASYNC
NLPE10SCL
PE1_SCL
NLPE00SDA
PE0_SDA
VCC_3V3
GND
NLPF20OC0C0INT0RXD0
PF2_OC0C_INT_RXD0
NLPF10OC0B0INT0XCK0
PF1_OC0B_INT_XCK0
NLPF0
PF0
i
PCB Rule
48
VCC_3V3
PIU200048
47
PIU200047
46
PIU200046
45
PIU200045
44
PIU200044
43
PIU200043
42
PIU200042
41
PIU200041
40
PIU200040
39
PIU200039
38
PIU200038
37
PIU200037
36
PIU200036
35
PIU200035
34
PIU200034
33
PIU200033
PIR20002
6
7
PDI/GPIO
PIXC20 1
PIXC20 2
4:23:39 PM
COXC200
XC200
FC-135 32.768 kHz
TOSC1
TITLE: ATZB-X0-256-4-0-CN
Xmega_212B_MCU.SchDoc
UART/USART
JTAG
TWI
INT/PWM/GPIO
TOSC2
PE5
PE4
PDI
PF0
PF3
PF2
PF1
PD3
PD2
PD1
PB7
PB6
PB5
PB4
2/6/2014
*
MSK
OJS
PE3
PE2
PE1
PE0
nRST
Document number: A08-1567
Date:
Chennai
MGR Road
RMZ Millenia
ATMEL India
Place xtal circuit closer
to MCU. Isolate from
digital signals.
PE5_OC1B_INT
PE4_SYNC_OC1A
PDI_DATA
PF0
PF3_OC0D_INT_TXD0
PF2_OC0C_INT_RXD0
PF1_OC0B_INT_XCK0
PD3_TXD0
PD2_RXD0
PD1_XCK0
PB7_TDO_INT
PB6_TCK_INT
PB5_TDI_INT
PB4_TMS_INT
nRST
PE3_GPIO
PE2_ASYNC
PE1_SCL
PE0_SDA
7
3
8
of
10 pF
PIC20702
10 pF
PIC20002
Revision: 5
PAGE:
COC207
C207
PIC20701
COC200PIC20001
C200
4
GND
PDI/GPIO
POPDI0GPIO0PF0
POPDI0GPIO0PE5
POPDI0GPIO0PE4
POPDI0GPIO0PDI
POPDI0GPIO
INT/PWM/GPIO
POINT0PWM0GPIO0PF3
POINT0PWM0GPIO0PF2
POINT0PWM0GPIO0PF1
POINT0PWM0GPIO
UART/USART
POUART0USART0PD3
POUART0USART0PD2
POUART0USART0PD1
POUART0USART
POJTAG0PB7
POJTAG0PB6
POJTAG0PB5
POJTAG0PB4
POJTAG0NRST
POJTAG
JTAG
POTWI0PE3
POTWI0PE2
POTWI0PE1
POTWI0PE0
POTWI
TWI
8
D
C
B
A
4.1
Handling Instructions
The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is
galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection
coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this
should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying
the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure
suitable Ingress Protection standards are complied with.
The MS-147 connector should never be exposed to Varnish / similar conformal coating material which will affect
electrical connection on the surfaces of connector.
The in-built chip antenna has been tuned for the particular design.
4.2
General Recommendations
•
•
•
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
•
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit's RF
frequency band
Placing high profile components next to antenna should be avoided
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268A−WIRELESS−04/2014
20
5.
Persistence Memory
A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The
organization of the persistence memory is as follows:
Table 5-1.
Persistence Memory
Data
Size
Structure Revision
MAC address
2 bytes
(1)
8 bytes
Board information overall
49 bytes
Board information – PCBA Name
30 bytes
Board information – PCBA Serial number
10 bytes
Board information – PCBA Atmel Part Number
8 bytes
Board information – PCBA Revision
1 byte
Reserved
3 bytes
XTAL Calibration Value
1 byte
Reserved
7 bytes
Reserved
4 bytes
CRC
1 byte
In ATZB-X0-256-4-0-CN, the persistence memory is stored in User Signature Row of ATxmega256A3U Microcontroller
starting from address 0x0000. This section is not erased by chip erase and requires a dedicated erase command.
The user signature row is a separate memory section that is fully accessible (read and write) from application software
and external programmers. See section “Read User Signature Row / Production Signature Row” under section “NVM
Flash Commands” in XMEGA AU manual [1] for details in reading the user signature data from application software.
Note:
1. The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel. User of the
ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The MAC ID can be read
from the ZigBit using the Performance Analyzer Application that is supplied through Atmel Studio Gallery Extension.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268A−WIRELESS−04/2014
21
6.
Ordering Information
Table 6-1.
Ordering Information
Part number
Description
ATZB-X0-256-4-0-CN
900 MHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and
AT86RF212B Transceiver with MS-147 test connector and chip antenna, Single unit
ATZB-X0-256-4-0-CNR
900 MHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and
AT86RF212B Transceiver with MS-147 test connector and chip antenna, Tape & Reel
Note:
Tape & Reel quantity: 200.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268A−WIRELESS−04/2014
22
7.
Agency Certifications
7.1
United States (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an
OEM manufacturer must comply with the following regulations:
1.
The ATZB-X0-256-4-0-CN modular transmitter must be labeled with its own FCC ID number, and, if the FCC
ID is not visible when the module is installed inside another device, then the outside of the device into which
the module is installed must also display a label referring to the enclosed module. This exterior label can use
wording such as the following:
IMPORTANT: Contains FCC ID: VW4A091745. This equipment complies with Part 15 of the FCC Rules. Operation
is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired operation (FCC 15.19).
The internal antenna used for this mobile transmitter must provide a separation distance of at least 20cm from all
persons and must not be collocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may
only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105).
7.2
European Union (ETSI)
The ATZB-X0-256-3-0-C Module has been certified for use in European Union countries. If these modules are
incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized
EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and
kept on file as described in Annex II of the R&TTE Directive.
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268A−WIRELESS−04/2014
23
Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does
not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body
for compliance testing to all required standards.
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall
consist of the initials "CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the
apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.
7.3
Industry Canada (IC) Compliance Statements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm between the device and
the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20cm de distance entre le
dispositif et l'utilisateur ou des tiers.
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end product
must be labelled in a visible area with the following:
“Contains Transmitter Module IC: 11019A-091745”
OR
“Contains IC: 11019A-091745”
Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à
l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le
produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 11019A-091745”
OR
“Contains IC: 11019A-091745”
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268A−WIRELESS−04/2014
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8.
Revision History
Doc. Rev.
Date
Comments
42268A
04/2014
Initial document release
ATZB-X0-256-4-0-CN [ZigBit 900MHz Wireless Modules]
42268A−WIRELESS−04/2014
25
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