ZIGBIT 2.4GHZ WIRELESS MODULES ATZB-X0-256-3-0-C DATASHEET Features • • • • • • Compact size (33.0 x 20.0mm) High RX sensitivity (- 96dBm) Outperforming link budget (up to 99.6dB) Up to +3.6dBm output power Very low power consumption: • 6.3mA in RX mode(1) • 20.5mA in TX mode(1) • 0.3µA in sleep mode(2) Ample memory resources: • 256KBytes in-system self-programmable Flash memory, 4KBytes EEPROM, 16KBytes SRAM • • • • • • • • • • • • • • Wide range of interfaces (both analog and digital): • 4- wire SPI, TWI • ISP, JTAG • Two analog comparator input • UART, USART • Timer, PWM • Four ADC lines • External clock input, internal clock output • Up to 32 lines configurable as GPIO Preassigned Atmel® MAC address that can be used on end product Capability to use MAC address into the internal EEPROM IEEE® 802.15.4 compliant transceiver 2.4GHz ISM band Serial bootloader High performance, low power Atmel® AVR® XMEGA® 8/16-bit Microcontroller Rapid design-in with built-in chip antenna RF test point using MS-147 RF connector Small physical footprint and low profile for optimum fit in very small application boards Mesh networking capability Easy-to-use low cost development kit Single source of support for HW and SW Worldwide license-free operation Notes: 1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current), PHY_TX_PWR=0x0 (for TX current), All digital outputs pulled high. 2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN. 42172B−WIRELESS−03/2014 Table of Contents 1. Introduction ........................................................................................ 3 1.1 1.2 1.3 1.4 Summary ........................................................................................................... 3 Applications ....................................................................................................... 3 Abbreviations and Acronyms ............................................................................ 3 Related Documents........................................................................................... 5 2. ZigBit Module Overview ..................................................................... 6 2.1 Overview ........................................................................................................... 6 3. Specification....................................................................................... 8 3.1 3.2 3.3 3.4 3.5 3.6 3.7 Electrical Characteristics ................................................................................... 8 3.1.1 Absolute Maximum Ratings ................................................................ 8 3.1.2 Power Supply...................................................................................... 8 3.1.3 RF Characteristics .............................................................................. 9 3.1.4 ATXMEGA256A3U Microcontroller Characteristics .......................... 10 3.1.5 Module Interfaces Characteristics ..................................................... 10 Physical/Environmental Characteristics and Outline ....................................... 10 Pin Configuration............................................................................................. 11 Antenna orientation recommendation ............................................................. 12 Mounting Information ...................................................................................... 12 Soldering Profile .............................................................................................. 15 Antenna Reference Designs ........................................................................... 16 4. Schematics ...................................................................................... 16 4.1 4.2 Handling Instructions....................................................................................... 17 General Recommendations ............................................................................ 17 5. Persistence Memory ........................................................................ 17 6. Ordering Information ........................................................................ 19 7. Agency Certifications ....................................................................... 20 7.1 7.2 7.3 United States (FCC) ........................................................................................ 20 European Union (ETSI) ................................................................................... 21 Industry Canada (IC) Compliance statements ................................................ 21 8. Revision History ............................................................................... 23 ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 2 1. Introduction 1.1 Summary ATZB-X0-256-3-0-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATxmega256A3U [1] Microcontroller and AT86RF233 [5] 2.4GHz ISM band transceiver. The radio transceiver provides high data rates from 250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit output power enabling a very robust wireless communication. The module is designed for wireless sensing, monitoring, control, data acquisition applications, to name a few. This ZigBit module eliminates the need for costly and time-consuming RF development, and shortens time-to-market for wireless applications. The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed and tuned for the ZigBit design to enable quick integration of the ZigBit into any application. 1.2 Applications The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing mesh network, while optimizing network traffic and minimizing power consumption. For detailed software support information, please visit http://www.atmel.com/products/wireless. The application areas include, but are not limited to: • • • • • • • • 1.3 Building automation and monitoring o Lighting controls o Wireless smoke- and CO-detectors o Structural integrity monitoring HVAC monitoring & control Inventory management Environmental monitoring Security Water metering Industrial monitoring o Machinery condition and performance monitoring o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc. Automated meter reading (AMR) Abbreviations and Acronyms ADC Analog-to-Digital Converter API Application Programming Interface DC Direct Current DTR Data Terminal Ready EEPROM Electrically Erasable Programmable Read-Only Memory ESD Electrostatic Discharge GPIO General Purpose Input/Output HAF High Frequency ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 3 HVAC Heating, Ventilating, and Air Conditioning HW Hardware I2 C Inter-Integrated Circuit IEEE Institute of Electrical and Electronics Engineers IRQ Interrupt Request ISM Industrial, Scientific and Medical radio band JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard interface MAC Medium Access Control layer MCU Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit module NRE Network layer OEM Original Equipment Manufacturer OTA Over-The-Air upgrade PA Power Amplifier PCB Printed Circuit Board PER Package Error Ratio RAM Random Access Memory RF Radio Frequency RPC Reduced Power Consumption RTS/CTS Request to Send/ Clear to Send RX Receiver SMA Surface Mount Assembly SoC System on Chip SPI Serial Peripheral Interface SW Software TTM Time-To-Market TX Transmitter UART Universal Asynchronous Receiver/Transmitter USART Universal Synchronous/Asynchronous Receiver/Transmitter USB Universal Serial Bus ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications 802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 4 1.4 Related Documents [1] ATXMEGA256A3U Datasheet in http://www.atmel.com/Images/Atmel-8386-8-and-16-bit-AVR-MicrocontrollerATxmega64A3U-128A3U-192A3U-256A3U_datasheet.pdf [2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz http://www.hirose.co.jp/cataloge_hp/e35801505.pdf [3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007 [5] AT86RF233 Datasheet in http://www.atmel.com/Images/Atmel-8351-MCU_Wireless-AT86RF233_Datasheet.pdf ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 5 2. ZigBit Module Overview 2.1 Overview The ATZB-X0-256-3-0-C ZigBit is a compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module. Based on a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and Atmel Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low power consumption and exceptional ease of integration. Figure 2-1. ATZB-X0-256-3-0-C Block diagram . This ZigBit module contains Atmel’s ATxmega256A3U Microcontroller and AT86RF233 2.4GHz ISM band Transceiver for ZigBee and IEEE 802.15.4 [1]. The module features 256KB in-system self-programmable Flash memory, 16KB SRAM and 4KB EEPROM. The compact all-in-one board design of MCU and radio transceiver with very minimal components on the RF path to Antenna dramatically improves the ZigBit’s compact size, range performance on signal transmission and increases its sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop applications on smaller footprint. The MS-147 connector [2] can be used as an RF Test port. ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module evaluation kit containing the ZigBit extension board for the Atmel Xplained PRO HW evaluation platform can be used to develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the HW/FW design, prototyping, and mass production phases of product development. All ZigBits are preloaded with a bootloader when they are sold as modules, either in single units or T&R. Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would function as a single MCU, or it can be paired with a host processor driving the module over a serial interface. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 6 The MAC stack running on the host processor can then control data transmission and manages module peripherals. Thus very minimal firmware customization is required for successful module design-in. Third-party sensors can then be connected directly to the module, thus expanding the existing set of peripheral interfaces. Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy a MAC address separately for the product using the ZigBit. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 7 3. Specification 3.1 Electrical Characteristics 3.1.1 Absolute Maximum Ratings Table 3-1. Notes: 3.1.2 Absolute Maximum Ratings (1)(2) Parameter Minimum Maximum Voltage on any pin, except RESET with respect to ground -0.3V 3.6V (VDD max) Input RF level +10dBm Current into Vcc pins 200mA 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Attention! ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to prevent permanent damage. Power Supply Table 3-2. ° Test Conditions (unless otherwise stated), Vcc = 3V, Tamb = 25 C. Parameter Range Unit Supply voltage, VDD 1.8 to 3.6 V Active Current consumption: RX mode – BUSY_RX - Receive state 16.5 mA Active Current consumption: RX mode - RX_ON with RPC, MCU Active 11.8 mA Active Current consumption: RX mode - RX_ON, MCU Active 17.0 mA Active Current consumption: RX mode - RX_ON with RPC, MCU Power_down 6.1 mA Active Current consumption: RX mode - RX_ON, MCU Power_down 11.3 mA 20.5 mA Active Current consumption: TX mode – PLL_ON 5.6 mA Current consumption: TRX_OFF, MCU Active 5.5 mA 443 µA 0.3 µA 0.3 µA 380 µA 380 µA 8.5 µA 8.5 µA 388 µA 388 µA Active Current consumption: TX mode (1) – BUSY_TX – Transmit state Current consumption: TRX_OFF, MCU Power_down Sleep Current consumption: TRX Sleep, MCU Power_down Sleep Current consumption: TRX Sleep, MCU Power_save Sleep Current consumption: TRX Sleep, MCU Standby (2) (2) (2) Sleep Current consumption: TRX Sleep, MCU Extended_Standby Sleep Current consumption: TRX Deep_Sleep, MCU Power_down Sleep Current consumption: TRX Deep_Sleep, MCU Power_save Sleep Current consumption: TRX Deep_Sleep, MCU Standby (2) (2) (2) (2) Sleep Current consumption: TRX Deep_Sleep, MCU Extended_Standby (2) Note 1: Output TX power (when measuring consumption in TX mode) is +3 dBm. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 8 Note 2: a) All interfaces are set to the default state (see Pin Assignment Table). b) JTAG is not connected. c) CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down modes Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an application. 3.1.3 RF Characteristics Table 3-3. RF Characteristics (1) . Parameter Condition Typical Values Unit Frequency band 2.4000 to 2.4835 GHz Numbers of channels 16 Channel spacing 5 MHz Transmitter output power Adjusted in 16 steps -17 to +4 dBm Receiver sensitivity PER = 1% -96 dBm 250, upto 2000 Kbps 50 Ω On-air data rate TX output/ RX input nominal impedance Range For balanced Open field, LoS, Elevated 48 – 178 # m Note # Range measured is Line of Sight and at 10ft elevation from Ground at different combinations of orientations of transmitter and receiver, with special conditions were there is minimal or no RF interference from other sources. For best case orientation of the ZigBits to achieve maximum range, refer to section 3.4 Table 3-4. TX power settings PHY_TX_PWR 3:0 Register value Power register setting [dBm] Typical Output power [dBm] (values at RF connector) 0 +4 +3 1 +3.7 +2.9 2 +3.4 +2.7 3 +3 +2.6 4 +2.5 +2.5 5 +2 +0.4 6 +1 -0.3 7 0 -1 8 -1 -2 9 -2 -3.0 10 -3 -4. 11 -4 -5.7 12 -6 -7.5 13 -8 -9.8 14 -12 -13.0 15 -17 -17.9 Note 1: For detailed characteristics, refer to [2]. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 9 3.1.4 ATXMEGA256A3U Microcontroller Characteristics Table 3-5. ATXMEGA256A3U Characteristics. Parameter Range Unit On-chip flash memory size 256K Bytes On-chip RAM size 16K Bytes On-chip EEPROM size 4K Bytes Operation frequency 16 MHz 3.1.5 Module Interfaces Characteristics Table 3-6. Module Interfaces Characteristics Parameters (1) . Condition UART maximum baud rate Range Unit 115.2 Kbps ADC conversion time (latency) (RES+2)/2+(GAIN !=0) RES (Resolution) = 8 or 12 5-8 ClkADC cycles ADC input resistance Static load resistor of input signal 4.0 kΩ ADC reference voltage (VREF) 1.0 to AVcc – 0.6 V ADC input voltage 0 - AVDD V TWI maximum clock 400 kHz GPIO High level input voltage Vcc = 2.7-3.6V 2 to Vcc+0.3 V GPIO Low level input voltage Vcc = 2.7-3.6V -0.3 to 0.3 VDD V GPIO High level output voltage VOH Vcc = 3.0-3.6V 2.4 to 0.94Vcc V GPIO Low level output voltage VOL Vcc = 3.0-3.6V 0.05Vcc typ Max 0.4 V 32.768 kHz Real-time oscillator frequency Note 1: For detailed characteristics, refer to [1]. 3.2 Physical/Environmental Characteristics and Outline Table 3-7. Physical characteristics. Parameters Value Size 33.0 x 20.0 mm Operating temperature range -40°C to +85°C Comments -40°C to +85°C operational ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 10 3.3 Pin Configuration Table 3-8. Pin Out ATZB-X0-256-3-0-C Pinout description Pin descriptions Function 1 AVSS Analog Ground 2 AVSS Analog Ground 3 DEVDD Digital Power input pin 4 DEVDD Digital Power input pin 5 RSET/PDI_CLOCK RESET 6 PD4/SS SPI 7 PD5/MOSI/XCK1 SPI 8 PD6/MISO/RXD1/D- SPI 9 PD7/SCK/TXD1/D+ SPI 10 PA5 GPIO / ADC / Analog COMP+ 11 PA4 GPIO/ADC/Analog Comp- 12 DVSS Digital Ground 13 PD2/SYNC/ASYNC/OC0C/ UART 14 PD3/SYNC/TXD0/OC0D UART 15 PD1/SCL/INT/OC0B USART 16 17 PDI_DATA PA6 PWM/TC GPIO/ADC 18 PA7 GPIO/ADC 19 PB3 GPIO/ADC/DAC1 20 PB2 GPIO/ADC/DAC/intwkup 21 PF1/OC0B/INT/XCK0 INT/PWM/GPIO 22 PF2/OC0C/INT/RXD0 INT/PWM/GPIO 23 PF3/OC0D/INT/TXD0 INT/PWM/GPIO 24 25 PB0/IAREF/INT PA0/ADC0/INT Adc ref ADC/ GPIO 26 PA1/ADC1/INT ADC/ GPIO 27 PA2/ADC2/INT ADC/ GPIO 28 PA3/ADC3/INT ADC/ GPIO 29 DVSS Digital Ground 30 PB6/TCK/INT JTAG 31 PB4/TMS/INT JTAG 32 PB7/TDO/INT JTAG 33 PB5/TDI/INT JTAG 34 PE3/TXD GPIO/output counter 35 36 PE2/RXD PE1/XCK Wakeup INT TWI/INT/GPIO 37 PE0 TWI/INT/GPIO 38 PE5/OC1B/INT GPIO/TC 39 PE4/SYNC/OC1A Master Clock out put ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 11 Pin Out 3.4 Pin descriptions Function 40 PF0 GPIO/Timer 41 DVSS Digital Ground 42 DVSS Digital Ground Antenna orientation recommendation The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this illustration. 3.5 Mounting Information The Figures below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and losses. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 12 Figure 3-1. ATZB-X0-256-3-0-C Dimensions Figure 3-2. ATZB-X0-256-3-0-C Pinout ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 13 Figure 3-3. ATZB-X0-256-3-0-C Foot Print Dimensions Figure 3-4. ATZB-X0-256-3-0-C Mounting Information (Preferred Placement) ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 14 Figure 3-5. Figure 3-4. ATZB-X0-256-3-0-C Mounting Information (Alternative Placement) The ZigBit’s location and orientation on the carrier board is illustrated in the above Mounting information drawing. The Recommended placement of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the end application Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers of the carrier board The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be equal to or greater than 33mm 3.6 Soldering Profile The J-STD-020C-compliant soldering profile is recommended according to Table 3-9. Table 3-9. Soldering profile (1) Profile feature Green package Average ramp-up rate (217°C to peak) 3°C/s max Preheat temperature 175°C ±25°C 180s max Temperature maintained above 217°C 60s to 150s Time within 5°C of actual peak temperature 20s to 40s Peak temperature range 260°C Ramp-down rate 6°C/s max ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 15 Profile feature Green package Time within 25°C to peak temperature 8 minutes Note: 3.7 1. The package is backward compatible with PB/Sn soldering profile. Antenna Reference Designs Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board material and thickness, shields, the material used for enclosure, the board neighborhood, and other components adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit. General Recommendations: • Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning. • Placing high profile components next to antenna should be avoided. • Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern. • ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band frequency. The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges. 4. Schematics The following schematic drawings for the ATZB-X0-256-3-0-C are in the following order: • Top level schematics • Connector schematics • ATxmega256A3BU schematics • AT86RF233 schematics ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 16 1 2 3 4 5 6 7 8 A A CONNECTOR XMEGA233 SPI INTERFACE RF SPI INTERFACE GPIO/ADC GPIO/ADC B B GPIO/ADC/ANALOGCOMP GPIO/ADC/ANALOGCOMP GPIO/ADC/DAC GPIO/ADC/DAC INT/PWM/GPIO INT/PWM/GPIO TRX_I/F JTAG JTAG TWI TWI UART/USART TRX_I/F UART/USART PDI/GPIO PDI/GPIO Xmega_233_RF.SchDoc Xmega_233_Connector.SchDoc Xmega_233_MCU.SchDoc C C COPCB200 PCB200 COLABEL1 LABEL1 a Product number/revision Serial number D Label ZigBit Shield B ATMEL R&D OJS RMZ Millenia MSK Perungudi * D Chennai ZigBit Xmega 2.4GHz board PCB Date: 4/5/2013 Document number: * 4:38:22 PM PAGE: 1 of Revision: 4 TITLE: ATZB-X0-256-3-0-C Xmega_233_Toplevel.SchDoc 1 2 3 4 5 6 7 8 4 1 2 3 4 5 6 7 8 A A COZ200 Z200 PD4 PD5 POSPI POSPI INTERFACE0PD4 INTERFACE0PD5 INTERFACE0PD6 INTERFACE SPIINTERFACE0PD7 INTERFACE SPI INTERFACE PD6 PD7 PD1 POUART0USART0PD3 POUART0USART0PD2 POUART0USART0PD1 POUART0USART UART/USART UART/USART PD2 PD3 B PA0 PA1 PA2 GPIO/ADC POGPIO0ADC0PA7 POGPIO0ADC0PA6 POGPIO0ADC0PA3 POGPIO0ADC0PA2 POGPIO0ADC0PA1 POGPIO0ADC0PA0 POGPIO0ADC0AREF POGPIO0ADC GPIO/ADC PA3 PA6 PA7 AREF POGPIO0ADC0DAC0PB3 POGPIO0ADC0DAC0PB2 POGPIO0ADC0DAC GPIO/ADC/DAC PB2 GPIO/ADC/DAC PB3 GND PD4_SS GND PD5_MOSI_XCK1 VCC_3V3 USBD_N VCC_3V3 USBD_P POGPIO0ADC0ANALOGCOMP0PA5 POGPIO0ADC0ANALOGCOMP0PA4 POGPIO0ADC0ANALOGCOMP GPIO/ADC/ANALOGCOMP GPIO/ADC/ANALOG COMP PA4 PA5 2 PIZ20002 3 PIZ20003 PIZ20004 4 nRST 5 PIZ20005 PD4_SS PIZ20006 PD1_XCK0 6 GND GND GND GND VDD PF0 VDD PE4/SYNC/OC1A RSET/PDI_CLOCK PE5/OC1B/INT PD4/SS PE0/SDA 7 PD5_MOSI_XCK1PIZ20007 PD5/MOSI/XCK1 PD2_RXD0 8 USBD_N PIZ20008 USBD_P PIZ20009 9 PD3_TXD0 PA0_ADC0_INT PA5 10 PIZ200010 PA1_ADC1_INT PA4 PIZ200011 PA2_ADC2_INT 11 GND 12 PIZ200012 13 PA3_ADC3_INT PD2_RXD0 PIZ200013 PA6 PD3_TXD0 14 PIZ200014 PA7 PD1_XCK0 15 PIZ200015 PB0_AREF_INT PDI_DATA 16 PIZ200016 PA6 17 PIZ200017 PA7 PIZ200018 PB2 18 PB3 19 PIZ200019 PB2 20 PIZ200020 PB3 PF1_OC0B_INT_XCK0 C 1 PIZ20001 21 PIZ200021 PE1/SCL PD6/MISO/RXD1/D- PE2/ASYNC PD7/SCK/TXD1/D+ PE3 PA5 PB5/TDI/INT PA4 PB7/TDO/INT GND PB4/TMS/INT PD2/RXD0 PB6/TCK/INT PD3/TXD0 GND PD1/XCK0 PA3/ADC3/INT PDI_DATA PA2/ADC2/INT PA6 PA1/ADC1/INT PA7 PA0/ADC0/INT PB3 PB0/IAREF/INT PB2 PF3/OC0D/INT/TXD0 PF1/OC0B/INT/XCK0 PF2/OC0C/INT/RXD0 42 GND PIZ200042 41 PIZ200041 40 PE1_SCL PF0 PIZ200039 39 PE4_SYNC_OC1A 38 PIZ200038 PE5_OC1B_INT 37 PIZ200037 PE0_SDA 36 PIZ200036 PE1_SCL 35 PIZ200035 PE2_ASYNC PIZ200034 34 PE3_GPIO 33 PIZ200033 PB5_TDI_INT 32 PB7_TDO_INT PB4_TMS_INT 30 29 PIZ200029 28 PIZ200028 27 PIZ200027 26 PIZ200026 25 PB5_TDI_INT PB6_TCK_INT PB7_TDO_INT GND PF1_OC0B_INT_XCK0 PF2_OC0C_INT_RXD0 PA2_ADC2_INT PE0 PE1 TWI PE2 POTWI0PE3 POTWI0PE2 POTWI0PE1 POTWI0PE0 POTWI TWI PE3 nRST B PB4 PB5 JTAG JTAG POJTAG0PB7 POJTAG0PB6 POJTAG0PB5 POJTAG0PB4 POJTAG0NRST POJTAG PB6 PB7 PF3_OC0D_INT_TXD0 PF1 PF2 INT/PWM/GPIO POINT0PWM0GPIO0PF3 POINT0PWM0GPIO0PF2 POINT0PWM0GPIO0PF1 POINT0PWM0GPIO INT/PWM/GPIO PF3 PA1_ADC1_INT 24 PIZ200024 PB0_AREF_INT 22 nRST PA3_ADC3_INT PA0_ADC0_INT PIZ200022 PE3_GPIO PB6_TCK_INT PIZ200025 23 PIZ200023 PE2_ASYNC PB4_TMS_INT PIZ200032 31 PIZ200031 PIZ200030 PE0_SDA GND PIZ200040 PF0 PF0 PDI_DATA PF3_OC0D_INT_TXD0 PE4_SYNC_OC1A PF2_OC0C_INT_RXD0 PE5_OC1B_INT PDI PDI/GPIO PE4 PDI/GPIO POPDI0GPIO0PF0 POPDI0GPIO0PE5 POPDI0GPIO0PE4 POPDI0GPIO0PDI POPDI0GPIO PE5 PA4 C ATZB-X-0-256-3-0-C PA5 COZ201 Z201 EMI Shield 1 2 3 4 PIZ201 PIZ201 2PIZ201 3 PIZ201 4 D B a ATMEL Norway OJS Vestre Rosten 79 MSK N-7075 TILLER D * NORWAY Date: 4/5/2013 Document number: * 4:38:23 PM PAGE: 2 of Revision: A TITLE: ATZB-X0-256-3-0-C Xmega_233_Connector.SchDoc 1 2 3 4 5 6 7 8 4 1 2 3 4 5 6 PD5_MOSI_XCK1 PD5 PA3_ADC3_INT PA3 2 3 PIU20002 PIU20003 PIU20004 4 5 PIU20005 6 PIU20006 7 8 PIU20007 PA6 PA6 PB2 PB3 PB4_TMS_INT PB5_TDI_INT PB6_TCK_INT PB7_TDO_INT PA7 PA7 PB0_AREF_INT AREF GND VCC_3V3 PIU20008 PIU20009 9 10 PIU200010 11 PIU200011 12 13 PIU200012 PIU200013 14 PIU200014 15 PIU200015 PC0_TRX_nRST 16 PIU200016 PA3(ADCA3/ACA3) PA4(ADCA4/ACA4) PA5(ADCA5/ACA5) PA6(ADCA6/ACA6) PA7(ADCA7/ACA7) PB0(ADCB0/ACB0/AREFB) PB1(ADCB1/ACB1) PB2(ADCB2/ACB2/DACB0) PB3(ADCB3/ACB3/DACB1) PB4(ADCB4/ACB4/TMS) PB5(ADCB5/ACB5/TDI) PB6(ADCB6/ACB6/TCK) PB7(ADCB7/ACB7/TDO) GND VCC PC0(SDA/OC0A/OC0ALS) PB2 PB2 POGPIO0ADC0DAC0PB3 POGPIO0ADC0DAC0PB2 POGPIO0ADC0DAC GPIO/ADC/DAC GPIO/ADC/DAC PB3 PB3 C GPIO/ADC/ANALOG COMP GPIO/ADC/ANALOGCOMP POGPIO0ADC0ANALOGCOMP0PA5 POGPIO0ADC0ANALOGCOMP0PA4 POGPIO0ADC0ANALOGCOMP PE3 nRST nRST PB4_TMS_INT PB5_TDI_INT PB6_TCK_INT 48 PIU200048 47 46 PIU200047 PIU200046 PIU200045 45 PF2_OC0C_INT_RXD0 PF1_OC0B_INT_XCK0 PF0 42 41 PIU200042 PIU200041 PIU200040 40 39 PIU200039 38 PIU200038 37 36 PIU200037 PIU200036 35 PIU200035 TOSC1 TOSC2 PE5_OC1B_INT PE4_SYNC_OC1A PE3_GPIO PE2_ASYNC PE1_SCL PE0_SDA PA5 USBD_P PC5_TRX_SPI_MOSI VCC_3V3 PC6_TRX_SPI_MISO COL200 L200 100n 100n 100n PIC20101 + C201 C206 PIL20101 GND_RF PIC205 2 PIC206 2 PIC205 1COC205 PIC206 1COC206 C205 100n C202 PIL20102 BLM15BB221SN1 D PIC203 2 PIC204 2 PIC203 1COC203 PIC204 1COC204 C203 PIC20 2 PIC20 1CO 20 100n PIL20002 L201 COL201 C204 PIL20001 BLM15BB221SN1 4.7uF/10V AN_VCC_3V3 PIC20102COC201 PC0_TRX_nRST PIC20802 PIC208 1 C208 100n PC2_TRX_IRQ PC1_TRX_DIG2 GND CLKM GND GND GND GND GND GND GND INT/PWM/GPIO POINT0PWM0GPIO0PF3 POINT0PWM0GPIO0PF2 POINT0PWM0GPIO0PF1 POINT0PWM0GPIO INT/PWM/GPIO i PCB Rule PF1_OC0B_INT_XCK0 PF2_OC0C_INT_RXD0 PF3_OC0D_INT_TXD0 PF1 PF2 PF3 PF0 i PCB Rule PF0 PDI_DATA GND PDI PE4_SYNC_OC1A PE4 POPDI0GPIO0PF0 POPDI0GPIO0PE5 POPDI0GPIO0PE4 POPDI0GPIO0PDI POPDI0GPIO PDI/GPIO PDI/GPIO C PE5_OC1B_INT PE5 TOSC2 Place xtal circuit closer to MCU. Isolate from digital signals. COC200 C200 PIC20001 10 pF PIC20002 COC207 C207 PIC20701 10 PIC20702pF PAGE: 3 PIXC20 01 COXC200 XC200 FC-135 32.768 kHz PIXC20 2 TOSC1 TRX_MOSI GND TRX_MISO TRX_I/F POTRX0I0F0TRX0SCK POTRX0I0F0TRX0NSEL POTRX0I0F0TRX0NRST POTRX0I0F0TRX0MOSI POTRX0I0F0TRX0MISO POTRX0I0F0TRX0IRQ POTRX0I0F0TRX0DIG2 POTRX0I0F0SLP0TR POTRX0I0F0CLKM POTRX0I0F TRX_I/F SLP_TR ATMEL India OJS TRX_IRQ RMZ Millenia MSK TRX_DIG2 MGR Road * CLKM Chennai Date: Place de-coupling closer to MCU POUART0USART0PD3 POUART0USART0PD2 POUART0USART0PD1 POUART0USART UART/USART PD3 TRX_SCK TRX_nRST PC3_TRX_SLP_TR COC208 UART/USART PB7 PD2 PD3_TXD0 TRX_nSEL PC7_TRX_SPI_SCK VCC_3V3 POJTAG0PB7 POJTAG0PB6 POJTAG0PB5 POJTAG0PB4 POJTAG0NRST POJTAG JTAG PB6 PD1 PD2_RXD0 GND VCC_3V3 PC4_TRX_SPI_SS VCC_3V3 JTAG PB5 B PD1_XCK0 VCC_3V3 34 PIU200034 33 PIU200033 PB4 VCC_3V3 GND 44 PIU200044 43 PIU200043 PB7_TDO_INT PIU20 17PIU20 18 PIU20 19 PIU20 PIU20 1 PIU20 PIU20 3 PIU20 4 PIU20 5 PIU20 6 PIU20 7PIU20 8 PIU20 9 PIU20 3 PIU20 31 PIU20 3 PA4 PA5 POTWI0PE3 POTWI0PE2 POTWI0PE1 POTWI0PE0 POTWI TWI TWI PE2 COU200 U200 (OC0C/RXD0)PF2 (OC0B/XCK0)PF1 (OC0A)PF0 VCC GND PE7 PE6 (OC1B)PE5 (OC1A)PE4 (OC0D/TXD0)PE3 (OC0C/RXD0)PE2 (OC0B/XCK0/SCL)PE1 (OC0A/SDA)PE0 VCC GND (D+/TXD1/SCK)PD7 PC1_TRX_DIG2 PC2_TRX_IRQ PC3_TRX_SLP_TR PC4_TRX_SPI_SS PC5_TRX_SPI_MOSI PC6_TRX_SPI_MISO PC7_TRX_SPI_SCK ATxmega256A3U-MH PA4 PE1 PE2_ASYNC PD1_XCK0 PD2_RXD0 PD3_TXD0 PD4_SS PD5_MOSI_XCK1 USBD_N PA2_ADC2_INT 1 PIU20001 PIU20 64PIU20 63 PIU20 6 PIU20 61 PIU20 6 PIU20 59PIU20 58 PIU20 57 PIU20 56 PIU20 5 PIU20 54PIU20 53 PIU20 5 PIU20 51 PIU20 5 PIU20 49 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 65 PAD_GND GPIO/ADC PA3_ADC3_INT PA4 PA5 PA6 PA7 PB0_AREF_INT PA1_ADC1_INT PA2 PE0 PE1_SCL (ACA2/ADCA2)PA2 (ACA1/ADCA1)PA1 (AREFA/ACA0/ADCA0)PA0 AVCC GND (XTAL1)PR1 (XTAL2)PR0 PDI_CLK/RESET PDI_DATA PF7 PF6 VCC GND PF5 (OC0A)PF4 (OC0D/TXD0)PF3 PIU20 65 PA0_ADC0_INT PA1 A PE0_SDA PC1(SCL/XCK0/OC0B/OC0AHS) PC2(RXD0/OC0C/OC0BLS) PC3(TXD0/OC0D/OC0BHS) PC4(SS/OC1A/OC0CLS) PC5(XCK1/MOSI/OC1B/OC0CHS) PC6(RXD1/MISO/OC0DLS) PC7(TXD1/SCK/OC0DHS) GND VCC PD0(OC0A) PD1(XCK0/OC0B) PD2(RXD0/OC0C) PD3(TXD0/OC0D) PD4(SS/OC1A) PD5(MOSI/XCK1/OC1B) PD6(MISO/RXD1/D-) USBD_P PA0 GPIO/ADC GND 8 PE3_GPIO GND B VCC_3V3 7 VCC_3V3 USBD_N PD6 PD7 POGPIO0ADC0PA7 POGPIO0ADC0PA6 POGPIO0ADC0PA3 POGPIO0ADC0PA2 POGPIO0ADC0PA1 POGPIO0ADC0PA0 POGPIO0ADC0AREF POGPIO0ADC GND VCC_3V3 PIR20002 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SPI INTERFACE COR200 R200 100K PF3_OC0D_INT_TXD0 PD4_SS PD4 POSPI POSPI INTERFACE0PD4 INTERFACE0PD5 INTERFACE0PD6 INTERFACE0PD7 INTERFACE SPI INTERFACE CLKM A nRST PDI_DATA PA2_ADC2_INT PA1_ADC1_INT PA0_ADC0_INT nRST PIR20001 Place 4.7uF closer to Vcc input for module 4/5/2013 Document number: * D 4:38:23 PM of Revision: 4 TITLE: ATZB-X0-256-3-0-C Xmega_233_MCU.SchDoc 1 2 3 4 5 6 7 8 4 1 A 2 POTRX0I0F0TRX0SCK POTRX0I0F0TRX0NSEL POTRX0I0F0TRX0NRST POTRX0I0F0TRX0MOSI POTRX0I0F0TRX0MISO POTRX0I0F0TRX0IRQ POTRX0I0F0TRX0DIG2 POTRX0I0F0SLP0TR POTRX0I0F0CLKM POTRX0I0F TRX_I/F TRX_I/F 3 CLKM CLKM TRX_nSEL nSEL TRX_SCK SCLK TRX_MOSI MOSI TRX_MISO MISO TRX_nRST RESET_N 4 5 6 7 8 A SLP_TR SLP_TR IRQ TRX_IRQ DIG2 TRX_DIG2 VCC_3V3 C1 COC1 PIC101 C2 PIC102 SLP_TR DIG2 DIG1 1uF 9 DIG1 RF_N 4 RFP PIU104 RF_P i PCB Rule 50Ohm 1 PIB10001 1 PIJ101 COC4 C4 PIC402 3 2 RF_IN RF_OUT PIJ102 PIJ104 PIB10 5 PIB10 6 GND_RF 3 2 Bal PIC4013 pF PIL201COL2 COA1 A1 PIA103 2450AT42B100 1 2 PIA101 FEED POINT NC PIA102 PIA104 PIL101COL1 L1 L2 GND_RF 3.3nH 3.3nH PIL202 PIL102 GND_RF GND_RF 32 31 30 29 28 27 25 33 3 4 PIB10004 tune the values for Antenna matching GND_RF MS147 PIU1025 PIU1026 PIU1027 PIU1028 PIU1029 PIU103 PIU1031 PIU1032 4 PIQ104 PIQ101 PIQ102 C 2 16.0MHz GND_RF COC9 PIC901 C9 100n GND_RF COC10 C10 1uFGND_RF PIC1001 PIC1002 10 pF AN_VCC_3V3 GND_RF PIC902 COC11 PIC1101 PIC1102 C11 Bal COJ1 J1 GND_RF PIQ103 1 COQ1 Q1 GND_RF AVSS DIE PIU103 AVSS DIG3 COC8 C8 10 pF PIC801 PIC802 3 AVSS PIU103 AVSS 1 DIG3 PIU101 AVDD IRQ 24 PIU1024 AVSS DIG4 EVDD 2 DIG4 PIU102 XTAL1 SEL XTAL2 MOSI 23 PIU1023 IRQ 3 PIB10003 GND_RF 2450BM15A0015E GND PCB Rule i PIB10 2 4 5 RFN PIU105 B100 GND AVSS COB100 GND 11 12 10 DIG2 DVSS 13 14 DVSS 22 PIU1022 nSEL C Place xtal circuit closer to TRX . Isolate from digital signals. 15 MISO PIJ103 RESET_N GND MOSI 26 GND SCLK 6 PIU106 4 21 PIU1021 7 DVSS PIU107 GND 20 PIU1020 MISO B AT86RF233-ZU 8 RSTN PIU108 GND SCLK GND CLKM DVSS MLF32 19 PIU1019 AT86RF233 18 PIU1018 SLP_TR 17 PIR102680R PIU1017 DVDD DVSS GND COC3 C3 2.2 pF COR1 R1 PIC301 PIC302 PIR101 DVDD 16 PIU10 6 PIU10 5 PIU10 4 PIU10 3 PIU10 2 PIU10 1 PIU10 PIU109 COU1 U1 CLKM DEVDD B GND 6 GND 5 PIC202 100n COC2 PIC201 Place de-coupling closer to TRX Place de-coupling closer to TRX GND_RF D ATMEL India OJS RMZ Millenia MSK MGR Road * D Chennai Date: 4/5/2013 Document number: * 4:38:23 PM PAGE: 4 of Revision: 4 TITLE: ATZB-X0-256-3-0-C Xmega_233_RF.SchDoc 1 2 3 4 5 6 7 8 4 4.1 Handling Instructions The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure suitable Ingress Protection standards are complied with. The MS-147 connector should never be exposed to varnish / similar conformal coating material which will affect electrical connection on the surfaces of connector. The in-built chip antenna has been tuned for the particular design 4.2 General Recommendations • Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning • Placing high profile components next to antenna should be avoided • Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern • 5. ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit RF frequency band Persistence Memory A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The organization of the persistence memory is as follows: Table 5-1. Persistence Memory Data Size Structure Revision MAC address 2 bytes (1) 8 bytes Board information overall 49 bytes Board information – PCBA Name 30 bytes Board information – PCBA Serial number 10 bytes Board information – PCBA Atmel Part Number 8 bytes Board information – PCBA Revision 1 byte Reserved 3 bytes XTAL Calibration Value 1 byte Reserved 7 bytes Reserved 4 bytes CRC 2 bytes In ATZB-X0-256-3-0-C, the persistence memory is stored in User signature Row of Atxmega256A3U microcontroller starting from address 0x0000. This section is not erased by chip erase and requires a dedicated erase command. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 17 The user signature row is a separate memory section that is fully accessible (read and write) from application software and external programmers. See section “Read User Signature Row / Production Signature Row” under section “NVM Flash Commands” in Xmega AU manual [1] for details in reading the user signature data from application software Note: 1. The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel. User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The MAC ID can be read from the ZigBit using the Performance Analyzer Application that is supplied through Atmel Studio Gallery Extension. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 18 6. Ordering Information Part number Description ATZB-X0-256-3-0-C 2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233 Transceiver with MS-147 test connector and chip antenna, Single unit (1) ATZB-X0-256-3-0-CR Note: 2.4GHz IEEE802.15.4/ZigBee OEM module based on ATXMEGA256A3U MCU and AT86RF233 Transceiver with MS-147 test connector and chip antenna, Tape & Reel 1. Tape and reel quantity: 200. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 19 7. Agency Certifications 7.1 United States (FCC) This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an OEM manufacturer must comply with the following regulations: 1. The ATZB-X0-256-3-0-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC ID: VW4A091731 The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause undesired operation. Any similar wording that expresses the same meaning may be used. IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation (FCC 15.19). The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be colocated or operating in conjunction with any other antenna or transmitter. Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment authorization. IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21). IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense (FCC section 15.105). ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 20 7.2 European Union (ETSI) The ATZB-X0-256-3-0-C Module has been certified for use in European Union countries. If these modules are incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive. Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials "CE" taking the following form: The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus. The CE marking must be affixed visibly, legibly, and indelibly. More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12. 7.3 Industry Canada (IC) Compliance statements This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the device and the user or bystanders. Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le dispositif et l'utilisateur ou des tiers CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another device, then the device should display the label on it referring the enclosed module. In that case, the final end product must be labelled in a visible area with the following: “Contains Transmitter Module IC:11019A-091731” OR “Contains IC: 11019A-091731” ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 21 Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le produit final doit être étiqueté dans un endroit visible par le texte suivant: “Contains Transmitter Module IC: 11019A-091731” OR “Contains IC: 11019A-091731” ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 22 8. Revision History Doc. Rev. Date Comments 42172B 04/2014 Removed a table note below Table 3-8 42172A 11/2013 Initial revision. ATZB-X0-256-3-0-C ZigBit 2.4GHz Wireless Modules [DATASHEET] 42172B−WIRELESS−03/2014 23 Atmel Corporation Atmel Asia Limited Atmel Munich GmbH Atmel Japan G.K. 1600 Technology Drive Unit 01-5 & 16, 19F Business Campus 16F Shin-Osaki Kangyo Building San Jose, CA 95110 BEA Tower, Millennium City 5 Parkring 4 1-6-4 Osaki, Shinagawa-ku USA 418 Kwun Tong Road D-85748 Garching b. Munich Tokyo 141-0032 Tel: (+1)(408) 441-0311 Kwun Tong, Kowloon GERMANY JAPAN Fax: (+1)(408) 487-2600 HONG KONG Tel: (+49) 89-31970-0 Tel: (+81)(3) 6417-0300 www.atmel.com Tel: (+852) 2245-6100 Fax: (+49) 89-3194621 Fax: (+81)(3) 6417-0370 Fax: (+852) 2722-1369 © 2014 Atmel Corporation. All rights reserved. / Rev.: 42172B−WIRELESS−03/2014 Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR®, ZigBit®, XMEGA®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. 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