Micro Interposers Z-RayTM Ultra Low Profile Arrays TM Samtec’s Z-Ray™ micro array interposers are ultra low profile, ultra high density, and highly customizable solutions ideal for board-to-board, cable-to-board and complex IC-to-board applications. STANDARD & CUSTOM Z-RAY ™ MICRO INTERPOSER CAPABILITIES • Ultra low profile, high density arrays, with BeCu micro-formed contacts on 0,80 mm and 1,00 mm pitches Series • Ultra flexible, with a variety of standard and custom configurations, including dual compression, solder ball, and an array of sizes and shapes ZA8 Pitch • Assembled into rugged low profile FR4 substrate under high pressure and temperature • Choice of fastener options, including application specific designs, screw downs, quick install (easy on/off), and thermal spreaders ZA1 Capabilities 0,80 mm 1,00 mm > 0,65 mm Stack Height 1,00 mm 0,50 mm to 4,00 mm Total I/Os 100 - 400 1,000+ Ruggedizing Screw Down Holes, Alignment Holes Latches, Thermal Spreaders, Quick-Release Spring Constraints Construction Single Layer FR4 Multi-layer FR4 (e.g., Pitch Spreaders) Terminations Dual Compression, Compression + Solder Ball Features: • One piece design on 0,80 mm or 1,00 mm pitch grid • Low profile 1,00 mm body height • Up to 1,200 contacts / in2 • Low 25 g normal force with .008" (0,20 mm) contact deflection • Customer-specific stack heights, pin counts, pitches, insulator shapes and plating thicknesses • Customizable in X-Y-Z axes • Quick-turn customizations with minimal NRE and tooling charges 0,80 mm Pitch 1,00 mm Pitch Interposer: ZA8 Interposer: ZA1 (1,07) .042 DIA A (4,00) .157 (0,80) .0315 (1,25) .049 DIA Also Available Ultra High Density A (1,07) .042 DIA (5,00) .197 (1,00) .0394 (1,25) .049 DIA 40 x 10 DUAL COMPRESSION 40 x 10 DUAL COMPRESSION B B (0,20) .008 TYP BOTH SIDES (1,06) .042 10 X 10 COMPRESSION WITH SOLDER BALLS POSITIONS A B PER ROW (12,50) .492 (9,35) .368 –10 (20,50) .807 (17,35) .683 –20 (31,70) 1.248 (30,15) 1.187 –30 (39,70) 1.563 (38,15) 1.502 –40 Multi-layer System • Pitch spreaders and other embedded interconnect circuitry (2,00) .079 DIA (2,00) .079 DIA (9,00) .354 • Z-RayTM on 0,635 mm pitch and 1000+ I/Os in development Micro Coax Cables • 34 AWG micro twinax cable on 0,80 mm pitch, 8 and 16 pairs standard Customization (11,00) .433 (0,20) .008 TYP BOTH SIDES (1,09) .043 10 X 10 COMPRESSION WITH SOLDER BALLS POSITIONS A B PER ROW (14,30) .563 (11,40) .449 –10 (24,30) .957 (21,40) .843 –20 (38,30) 1.508 (37,40) 1.472 –30 (48,30) 1.902 (47,40)1.866 –40 For more High Density Solutions, please visit samtec.com/arrays UNITED STATES • NORTHERN CALIFORNIA • SOUTHERN CALIFORNIA • SOUTH AMERICA • UNITED KINGDOM • GERMANY • FRANCE • ITALY • NORDIC/BALTIC BENELUX • ISRAEL • INDIA • AUSTRALIA / NEW ZEALAND • SINGAPORE • JAPAN • SHANGHAI • SHENZHEN • TAIWAN • HONG KONG • KOREA JANUARY 2015