(Actual part not depicted) DESIGN QUALIFICATION TEST REPORT

Project Number: Design Qualification Test Report
Tracking Code: 505421_Report_Rev_1
Requested by: Joe Smallwood
Date: 5/12/2015
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
Tech: Tony Wagoner
Test Start: 2/25/2015
Test Completed: 4/13/2015
(Actual part not depicted)
DESIGN QUALIFICATION TEST REPORT
ZA8/PCB
ZA8-30-2-1.00-Z-10/MATING PCB
Page 1 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
REVISION HISTORY
DATE
REV.NUM.
5/12/2015
1
DESCRIPTION
Initial Issue
Page 2 of 34
ENG
KH
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
CERTIFICATION
All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST)
traceable standards according to IS0 10012-l and ANSI/NCSL 2540-1, as applicable.
All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be
reproduced without prior written approval of Samtec.
SCOPE
To perform the following tests: Design Qualification test. Please see test plan.
APPLICABLE DOCUMENTS
Standards: EIA Publication 364
TEST SAMPLES AND PREPARATION
1)
2)
3)
4)
All materials were manufactured in accordance with the applicable product specification.
All test samples were identified and encoded to maintain traceability throughout the test sequences.
Any additional preparation will be noted in the individual test sequences.
Samtec Test PCBs used: PCB-106308-TST/PCB-106309-TST
Page 3 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
FLOWCHARTS
Page 4 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
FLOWCHARTS Continued
Page 5 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
FLOWCHARTS Continued
Page 6 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
FLOWCHARTS Continued
Page 7 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
FLOWCHARTS Continued
Page 8 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
FLOWCHARTS Continued
Page 9 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
ATTRIBUTE DEFINITIONS
The following is a brief, simplified description of attributes.
THERMAL SHOCK:
1)
2)
3)
4)
5)
6)
EIA-364-32, Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors.
Test Condition 1: -55°C to +85°C
Test Time: ½ hour dwell at each temperature extreme
Number of Cycles: 100
All test samples are pre-conditioned at ambient.
All test samples are exposed to environmental stressing in the mated condition.
THERMAL:
1)
2)
3)
4)
5)
EIA-364-17, Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors.
Test Condition 4 at 105° C.
Test Time Condition B for 250 hours.
All test samples are pre-conditioned at ambient.
All test samples are exposed to environmental stressing in the mated condition.
HUMIDITY:
1)
2)
3)
4)
5)
Reference document: EIA-364-31, Humidity Test Procedure for Electrical Connectors.
Test Condition B, 240 Hours.
Method III, +25° C to + 65° C, 90% to 98% Relative Humidity excluding sub-cycles 7a and 7b.
All samples are pre-conditioned at ambient.
All test samples are exposed to environmental stressing in the mated condition.
MECHANICAL SHOCK (Specified Pulse):
1)
2)
3)
4)
5)
6)
7)
Reference document: EIA-364-27, Mechanical Shock Test Procedure for Electrical Connectors
Test Condition C
Peak Value: 100 G
Duration: 6 Milliseconds
Wave Form: Half Sine
Velocity: 12.3 ft/s
Number of Shocks: 3 Shocks / Direction, 3 Axis (18 Total)
VIBRATION:
1)
2)
3)
4)
5)
6)
Reference document: EIA-364-28, Vibration Test Procedure for Electrical Connectors
Test Condition V, Letter B
Power Spectral Density: 0.04 G² / Hz
G ‘RMS’: 7.56
Frequency: 50 to 2000 Hz
Duration: 2.0 Hours per axis (3 axis total)
NANOSECOND-EVENT DETECTION:
1) Reference document: EIA-364-87, Nanosecond-Event Detection for Electrical Connectors
2) Prior to test, the samples were characterized to assure the low nanosecond event being monitored will trigger
the detector.
3) After characterization it was determined the test samples could be monitored for 50 nanosecond events
MATING/UNMATING:
1) Reference document: EIA-364-13, Mating and Unmating Forces Test Procedure for Electrical Connectors.
2) The full insertion position was to within 0.003” to 0.004” of the plug bottoming out in the receptacle to
prevent damage to the system under test.
3) One of the mating parts is secured to a floating X-Y table to prevent damage during cycling.
Page 10 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
ATTRIBUTE DEFINITIONS Continued
The following is a brief, simplified description of attributes
NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING):
1) Reference document: EIA-364-04, Normal Force Test Procedure for Electrical Connectors.
2) The contacts shall be tested in the connector housing.
3) If necessary, a “window” shall be made in the connector body to allow a probe to engage and deflect the
contact at the same attitude and distance (plus 0.05 mm [0.002”]) as would occur in actual use.
4) The connector housing shall be placed in a holding fixture that does not interfere with or otherwise influence
the contact force or deflection.
5) Said holding fixture shall be mounted on a floating, adjustable, X-Y table on the base of the Dillon TC2,
computer controlled test stand with a deflection measurement system accuracy of 5.0 µm (0.0002”).
6) The nominal deflection rate shall be 5 mm (0.2”)/minute.
7) Unless otherwise noted a minimum of five contacts shall be tested.
8) The force/deflection characteristic to load and unload each contact shall be repeated five times.
9) The system shall utilize the TC2 software in order to acquire and record the test data.
10) The permanent set of each contact shall be measured within the TC2 software.
11) The acquired data shall be graphed with the deflection data on the X-axis and the force data on the Y-axis
and a print out will be stored with the Tracking Code paperwork.
TEMPERATURE RISE (Current Carrying Capacity, CCC):
1) EIA-364-70, Temperature Rise versus Current Test Procedure for Electrical Connectors and Sockets.
2
2) When current passes through a contact, the temperature of the contact increases as a result of I R (resistive)
heating.
3) The number of contacts being investigated plays a significant part in power dissipation and therefore
temperature rise.
4) The size of the temperature probe can affect the measured temperature.
5) Copper traces on PC boards will contribute to temperature rise:
a. Self heating (resistive)
b. Reduction in heat sink capacity affecting the heated contacts
6) A de-rating curve, usually 20%, is calculated.
7) Calculated de-rated currents at four temperature points are reported:
a. Ambient
о
b. 65 C
о
c. 75 C
о
d. 95 C
8) Typically, neighboring contacts (in close proximity to maximize heat build up) are energized.
9) The thermocouple (or temperature measuring probe) will be positioned at a location to sense the maximum
temperature in the vicinity of the heat generation area.
10) A computer program, TR 803.exe, ensures accurate stability for data acquisition.
11) Hook-up wire cross section is larger than the cross section of any connector leads/PC board traces, jumpers,
etc.
12) Hook-up wire length is longer than the minimum specified in the referencing standard.
Page 11 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
ATTRIBUTE DEFINITIONS Continued
The following is a brief, simplified description of attributes
LLCR:
1) EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
2) A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
3) The following guidelines are used to categorize the changes in LLCR as a result from stressing
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms: --------------------- Minor
c. +10.1 to +30.0 mOhms: ------------------- Acceptable
d. +30.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms: ------------------ Unstable
f. >+2000 mOhms:---------------------------- Open Failure
GAS TIGHT:
1)
2)
3)
4)
To provide method for evaluating the ability of the contacting surfaces in preventing penetration of harsh
vapors which might lead to oxide formation that may degrade the electrical performance of the contact
system.
EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
The following guidelines are used to categorize the changes in LLCR as a result from stressing
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms: -------------------- Minor
c. +10.1 to +30.0 mOhms: ------------------ Acceptable
d. +30.1 to +50.0 mOhms: ------------------ Marginal
e. +50.1 to +2000 mOhms: ------------------ Unstable
f. >+2000 mOhms: --------------------------- Open Failure
Procedure:
a. Reference document: EIA-364-36, Test Procedure for Determination of Gas-Tight Characteristics
for Electrical Connectors, Sockets and/or Contact Systems.
b. Test Conditions:
i. Class II--- Mated pairs of contacts assembled to their plastic housings.
ii. Reagent grade Nitric Acid shall be used of sufficient volume to saturate the test chamber
iii. The ratio of the volume of the test chamber to the surface area of the acid shall be 10:1.
iv. The chamber shall be saturated with the vapor for at least 15 minutes before samples are
added.
v. Exposure time, 55 to 65 minutes.
vi. The samples shall be no closer to the chamber walls than 1 inches and no closer to the
surface of the acid than 3 inches.
vii. The samples shall be dried after exposure for a minimum of 1 hour.
о
viii. Drying temperature 50 C
ix. The final LLCR shall be conducted within 1 hour after drying.
Page 12 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
ATTRIBUTE DEFINITIONS Continued
The following is a brief, simplified description of attributes
INSULATION RESISTANCE (IR):
To determine the resistance of insulation materials to leakage of current through or on the surface of these
materials when a DC potential is applied.
1) PROCEDURE:
a. Reference document: EIA-364-21, Insulation Resistance Test Procedure for Electrical Connectors.
b. Test Conditions:
i. Between Adjacent Contacts or Signal-to-Ground
ii. Electrification Time 2.0 minutes
iii. Test Voltage (500 VDC) corresponds to calibration settings for measuring resistances.
2) MEASUREMENTS:
3) When the specified test voltage is applied (VDC), the insulation resistance shall not be less than 5000
megohms.
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
To determine if the sockets can operate at its rated voltage and withstand momentary over potentials due to
switching, surges, and other similar phenomenon. Separate samples are used to evaluate the effect of
environmental stresses so not to influence the readings from arcing that occurs during the measurement
process.
1) PROCEDURE:
a. Reference document: EIA-364-20, Withstanding Voltage Test Procedure for Electrical Connectors.
b. Test Conditions:
i. Between Adjacent Contacts or Signal-to-Ground
ii. Barometric Test Condition 1
iii. Rate of Application 500 V/Sec
iv. Test Voltage (VAC) until breakdown occurs
2) MEASUREMENTS/CALCULATIONS
a. The breakdown voltage shall be measured and recorded.
b. The dielectric withstanding voltage shall be recorded as 75% of the minimum breakdown voltage.
c. The working voltage shall be recorded as one-third (1/3) of the dielectric withstanding voltage (onefourth of the breakdown voltage).
Page 13 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
RESULTS
Temperature Rise, CCC at a 20% de-rating





CCC for a
CCC for a
CCC for a
CCC for a
CCC for a
30°C Temperature Rise---------------0.93 A per contact
30°C Temperature Rise---------------0.75 A per contact
30°C Temperature Rise---------------0.54 A per contact
30°C Temperature Rise---------------0.48 A per contact
30°C Temperature Rise---------------0.23 A per contact
Mating/Unmating Forces:
Thermal Aging Group


Initial
o Mating


After Thermal
o Mating


Min --------------------------------------24.81 Lbs
Max--------------------------------------26.85 Lbs
Min --------------------------------------10.01 Lbs
Max--------------------------------------15.68 Lbs
Mating/Unmating Durability Group
ZA8-30-2-1.00-Z-10/Mating PCB
 Initial
o Mating
 Min --------------------------------------25.18 Lbs
 Max--------------------------------------26.44 Lbs
 After 25 Cycles
o Mating
 Min --------------------------------------22.50 Lbs
 Max--------------------------------------23.70 Lbs
 After Humidity
o Mating
 Min --------------------------------------- 4.12 Lbs
 Max--------------------------------------- 5.97 Lbs
Mating/Unmating Basic Group
ZA8-10-2-1.00-Z-10/Mating PCB
 Initial
o Mating
 Min --------------------------------------- 8.40 Lbs
 Max--------------------------------------- 9.05 Lbs
 After 25 Cycles
o Mating
 Min --------------------------------------- 7.27 Lbs
 Max--------------------------------------- 7.66 Lbs
Mating/Unmating Durability Group
ZA8-40-2-1.00-Z-10/Mating PCB
 Initial
o Mating
 Min --------------------------------------27.41 Lbs
 Max--------------------------------------31.13 Lbs
 After 25 Cycles
o Mating
 Min --------------------------------------23.79 Lbs
 Max--------------------------------------26.54 Lbs
Page 14 of 34
with 10 contacts (1x10) powered
with 20 contacts (2x10) powered
with 30 contacts (3x10) powered
with 40 contacts (4x10) powered
with 400 contacts (40x10) powered
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
RESULTS Continued
Normal Force at 0.0070 inch deflection

Initial
o Min -------------------------------------------------32.90 gf
o Max ------------------------------------------------36.90 gf
Set ----- 0.0020 in
Set ----- 0.0028 in
Insulation Resistance minimums, IR
Pin to Pin
 Initial
o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed
 Thermal
o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed
 Humidity
o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed
Row to Row
 Initial
o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed
 Thermal
o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed
 Humidity
o Mated ------------------------------------------------ 45000 Meg Ω ------------------------ Passed
Dielectric Withstanding Voltage minimums, DWV

Minimums
o Breakdown Voltage ---------------------------------- 446 VAC
o Test Voltage ------------------------------------------- 335 VAC
o Working Voltage ------------------------------------- 110 VAC
Pin to Pin
 Initial DWV -------------------------------------------------- Passed
 Thermal DWV ----------------------------------------------- Passed
 Humidity DWV---------------------------------------------- Passed
Row to Row
 Initial DWV -------------------------------------------------- Passed
 Thermal DWV ----------------------------------------------- Passed
 Humidity DWV---------------------------------------------- Passed
Page 15 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
RESULTS Continued
LLCR Gas Tight (192 LLCR test points)


Initial --------------------------------------------------------------- 28.70 mOhms Max
Gas-Tight
o <= +5.0 mOhms ----------------------------------- 189 Points ------------------------- Stable
o +5.1 to +10.0 mOhms ----------------------------------- 2 Points ------------------------- Minor
o +10.1 to +30.0 mOhms --------------------------------- 1 Points ------------------------- Acceptable
o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure
LLCR Thermal Aging (192 LLCR test points)


Initial --------------------------------------------------------------- 20.09 mOhms Max
Thermal Aging
o <= +5.0 mOhms ----------------------------------- 163 Points ------------------------- Stable
o +5.1 to +10.0 mOhms --------------------------------- 21 Points ------------------------- Minor
o +10.1 to +30.0 mOhms --------------------------------- 8 Points ------------------------- Acceptable
o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure
LLCR Durability (192 LLCR test points)




Initial --------------------------------------------------------------- 16.40 mOhms Max
Durability, 25 Cycles
o <= +5.0 mOhms ----------------------------------- 192 Points ------------------------- Stable
o +5.1 to +10.0 mOhms ----------------------------------- 0 Points ------------------------- Minor
o +10.1 to +30.0 mOhms --------------------------------- 0 Points ------------------------- Acceptable
o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure
Thermal
o <= +5.0 mOhms ----------------------------------- 191 Points ------------------------- Stable
o +5.1 to +10.0 mOhms ----------------------------------- 1 Points ------------------------- Minor
o +10.1 to +30.0 mOhms --------------------------------- 0 Points ------------------------- Acceptable
o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure
Humidity
o <= +5.0 mOhms ----------------------------------- 188 Points ------------------------- Stable
o +5.1 to +10.0 mOhms ----------------------------------- 4 Points ------------------------- Minor
o +10.1 to +30.0 mOhms --------------------------------- 0 Points ------------------------- Acceptable
o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure
Page 16 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
RESULTS Continued
LLCR Shock & Vibration (192 LLCR test points)


Initial --------------------------------------------------------------- 23.96 mOhms Max
Shock &Vibration
o <= +5.0 mOhms ----------------------------------- 190 Points ------------------------- Stable
o +5.1 to +10.0 mOhms ----------------------------------- 1 Points ------------------------- Minor
o +10.1 to +30.0 mOhms --------------------------------- 1 Points ------------------------- Acceptable
o +30.1 to +50.0 mOhms --------------------------------- 0 Points ------------------------- Marginal
o +50.1 to +2000 mOhms --------------------------------- 0 Points ------------------------- Unstable
o >+2000 mOhms ------------------------------------------ 0 Points ------------------------- Open Failure
Mechanical Shock & Random Vibration:
o
o
Shock
 No Damage ----------------------------------- ---------------------------------- Pass
 50 Nanoseconds ------------------------------ ---------------------------------- Pass
Vibration
 No Damage ----------------------------------- ---------------------------------- Pass
 50 Nanoseconds ------------------------------ ---------------------------------- Pass
Page 17 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES
TEMPERATURE RISE (Current Carrying Capacity, CCC):
1) High quality thermocouples whose temperature slopes track one another were used for temperature
monitoring.
2) The thermocouples were placed at a location to sense the maximum temperature generated during testing.
3) Temperature readings recorded are those for which three successive readings, 15 minutes apart, differ less
than 1° C (computer controlled data acquisition).
4) Adjacent contacts were powered:
a. Linear configuration with 10 adjacent conductors/contacts powered
505421
10 (1x10) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.93 Amps
2.4
Room Temp= 21.9°C
Maximum Current, Amps per Contact
2.0
1.95
1.6
1.56
105°C
Limit
1.35
1.17
1.2
1.08
0.93
0.8
0.67
0.54
0.4
0.0
20
30
40
50
60
70
80
90
100
110
Ambient Temperature (°C)
Base Curve
Derated 20 %
Measured Current
RT Peak Amp
RT Derated Amp
65°C Peak Amp
65°C Derated Amp
75°C Peak Amp
75°C Derated Amp
95°C Peak Amp
95°C Derated Amp
Limit
Page 18 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
505421
10 (1x10) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
50
45
Temperature Rise (°C above ambient)
40
35
30
25
20
15
10
5
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Current (Amps)
Actual
20% Derated
Page 19 of 34
1
1.1
1.2
1.3
1.4
1.5
1.6
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
b. Linear configuration with 20 adjacent conductors/contacts powered
505421
20 (2x10) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.75 Amps
1.8
Room Temp= 21.9°C
1.58
Maximum Current, Amps per Contact
1.5
1.2
1.26
105°C
Limit
1.09
0.94
0.9
0.87
0.75
0.53
0.6
0.43
0.3
0.0
20
30
40
50
60
70
80
90
100
110
Ambient Temperature (°C)
Base Curve
Derated 20 %
Measured Current
RT Peak Amp
RT Derated Amp
65°C Peak Amp
65°C Derated Amp
75°C Peak Amp
75°C Derated Amp
95°C Peak Amp
95°C Derated Amp
Limit
505421
20 (2x10) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
40
Temperature Rise (°C above ambient)
35
30
25
20
15
10
5
0
0
0.1
0.2
0.3
0.4
0.5
0.6
Current (Amps)
Actual
20% Derated
Page 20 of 34
0.7
0.8
0.9
1
1.1
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
c. Linear configuration with 30 adjacent conductors/contacts powered
505421
30 (3x10) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.54 Amps
1.4
Room Temp= 21.7°C
Maximum Current, Amps per Contact
1.2 1.13
1.0
0.8
105°C
Limit
0.78
0.90
0.67
0.6
0.62
0.54
0.38
0.4
0.30
0.2
0.0
20
30
40
50
60
70
80
90
100
110
Ambient Temperature (°C)
Base Curve
Derated 20 %
Measured Current
RT Peak Amp
RT Derated Amp
65°C Peak Amp
65°C Derated Amp
75°C Peak Amp
75°C Derated Amp
95°C Peak Amp
95°C Derated Amp
Limit
0.8
0.9
505421
30 (3x10) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
50
45
Temperature Rise (°C above ambient)
40
35
30
25
20
15
10
5
0
0
0.1
0.2
0.3
0.4
0.5
Current (Amps)
Actual
20% Derated
Page 21 of 34
0.6
0.7
1
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
d. Linear configuration with 40 adjacent conductors/contacts powered
505421
40 (4x10) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.48 Amps
1.2
Room Temp= 20.5°C
1.00
Maximum Current, Amps per Contact
1.0
0.8
0.80
105°C
Limit
0.69
0.60
0.6
0.55
0.48
0.4
0.35
0.28
0.2
0.0
20
30
40
50
60
70
80
90
100
110
Ambient Temperature (°C)
Base Curve
Derated 20 %
Measured Current
RT Peak Amp
RT Derated Amp
65°C Peak Amp
65°C Derated Amp
75°C Peak Amp
75°C Derated Amp
95°C Peak Amp
95°C Derated Amp
Limit
505421
40 (4x10) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
60
Temperature Rise (°C above ambient)
50
40
30
20
10
0
0
0.1
0.2
0.3
0.4
Current (Amps)
Actual
20% Derated
Page 22 of 34
0.5
0.6
0.7
0.8
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
e. Linear configuration with all adjacent conductors/contacts powered
505421
400 (40x10)(All Power) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
Current Rating per Contact (30 Deg. Rise, 20% Derated) = 0.23 Amps
0.6
Room Temp= 21.8°C
Maximum Current, Amps per Contact
0.5
0.48
0.4
0.39
105°C
Limit
0.33
0.29
0.3
0.26
0.23
0.2
0.16
0.13
0.1
0.0
20
30
40
50
60
70
80
90
100
110
Ambient Temperature (°C)
Base Curve
Derated 20 %
Measured Current
RT Peak Amp
RT Derated Amp
65°C Peak Amp
65°C Derated Amp
75°C Peak Amp
75°C Derated Amp
95°C Peak Amp
95°C Derated Amp
Limit
505421
400 (40x10)(All Power) Contacts in Series
Part Numbers: ZA8-40-2-1.00-Z-10 / Mating Boards
60
Temperature Rise (°C above ambient)
50
40
30
20
10
0
0
0.1
0.2
0.3
Current (Amps)
Actual
20% Derated
Page 23 of 34
0.4
0.5
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
Mating\Unmating Force:
Thermal Aging Group
Initial
Mating
Minimum
Maximum
Average
St Dev
Count
Unmating
Mating
After Thermals
Unmating
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
110.34
119.42
114.45
2.73
8
24.81
26.85
25.73
0.61
8
0.00
0.00
0.00
0.00
8
0.00
0.00
0.00
0.00
8
44.51
69.74
57.99
9.53
8
10.01
15.68
13.04
2.14
8
0.00
0.00
0.00
0.00
8
0.00
0.00
0.00
0.00
8
Mating\Unmating Durability Group
ZA8-30-2-1.00-Z-10/Mating PCB
Initial
After 25 Cycles
Mating
Unmating
Mating
Unmating
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Minimum
112.01
25.18
0.00
0.00
100.06
22.50
0.00
0.00
Maximum
117.60
26.44
0.00
0.00
105.40
23.70
0.00
0.00
Average
114.28
25.69
0.00
0.00
102.93
23.14
0.00
0.00
St Dev
1.79
0.40
0.00
0.00
2.19
0.49
0.00
0.00
Count
8
8
8
8
8
8
8
8
After Humidity
Mating
Unmating
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Minimum
18.33
4.12
0.00
0.00
Maximum
26.57
5.97
0.00
0.00
Average
22.47
5.05
0.00
0.00
St Dev
2.32
0.52
0.00
0.00
Count
8
8
8
8
Page 24 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
Mating\Unmating Force:
Mating\Unmating Basic Group
ZA8-10-2-1.00-Z-10/Mating PCB
Initial
Mating
25 Cycles
Unmating
Mating
Unmating
Newtons
Force
(Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Minimum
37.36
8.40
0.00
0.00
32.34
7.27
0.00
0.00
Maximum
40.23
9.05
0.00
0.00
34.07
7.66
0.00
0.00
Average
38.42
8.64
0.00
0.00
33.40
7.51
0.00
0.00
St Dev
1.02
0.23
0.00
0.00
0.59
0.13
0.00
0.00
Count
8
8
8
8
8
8
8
8
Mating\Unmating Basic Group
ZA8-40-2-1.00-Z-10/Mating PCB
Initial
Mating
25 Cycles
Unmating
Mating
Unmating
Newtons
Force
(Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Newtons
Force (Lbs)
Minimum
121.92
27.41
0.00
0.00
105.82
23.79
0.00
0.00
Maximum
138.47
31.13
0.00
0.00
118.05
26.54
0.00
0.00
Average
129.55
29.13
0.00
0.00
112.94
25.39
0.00
0.00
St Dev
6.12
1.38
0.00
0.00
3.97
0.89
0.00
0.00
Count
8
8
8
8
8
8
8
8
Page 25 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
Mating\Unmating Force Comparison
Mating Data for 10, 30 and 40 Position ZA8/Mating PCB
Mating (Initial)
Mating (25 Cycles)
35.00
30.00
Force (lbs)
25.00
20.00
15.00
10.00
5.00
0.00
10 Pos.
30 Pos.
Number of Terminals per Row
Page 26 of 34
40 Pos.
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
NORMAL FORCE (FOR CONTACTS TESTED IN THE HOUSING):
1) Calibrated force gauges are used along with computer controlled positioning equipment.
2) For Normal force 8-10 measurements are taken and the averages reported.
Row 1
Initial
Averages
Min
Max
St. Dev
Count
0.0007
5.96
4.60
8.30
1.156
12
0.0014
12.12
10.60
15.00
1.426
12
0.0021
17.55
15.80
20.90
1.725
12
Deflections in inches Forces in Grams
0.0028
0.0035
0.0042
0.0049
0.0056
22.60
27.20
30.89
32.93
33.71
20.50
24.90
28.50
31.40
32.20
27.10
31.80
34.60
35.70
36.50
2.161
2.244
1.965
1.334
1.240
12
12
12
12
12
0.0063
34.08
32.60
36.80
1.197
12
0.0070
34.38
32.90
36.90
1.118
12
SET
0.0024
0.0020
0.0028
0.0002
12
Normal Force Initial - Average
40
35
32.9
34.1
33.7
34.4
30.9
30
27.2
25
Force-Grams
22.6
20
17.6
15
12.1
10
6.0
5
0.0
0
0
0.001
0.002
0.003
0.004
Deflection-Inches
Page 27 of 34
0.005
0.006
0.007
Average Initial Normal Force
0.008
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
INSULATION RESISTANCE (IR):
Minimum
Initial
Thermal
Humidity
Minimum
Initial
Thermal
Humidity
Mated
ZA8/PCB
45000
45000
45000
Pin to Pin
Unmated
ZA8
Not Tested
Not Tested
Not Tested
Unmated
PCB
Not Tested
Not Tested
Not Tested
Mated
ZA8/PCB
45000
45000
45000
Row to Row
Unmated
ZA8
Not Tested
Not Tested
Not Tested
Unmated
PCB
Not Tested
Not Tested
Not Tested
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
Voltage Rating Summary
SEAF8-RA/SEAM8-GP
Break Down Voltage
446
335
Test Voltage
110
Working Voltage
Minimum
Pin to Pin
Initial Test Voltage
After Thermal Test Voltage
After Humidity Test Voltage
Passed
Passed
Passed
Row to Row
Initial Test Voltage
After Thermal Test Voltage
After Humidity Test Voltage
Page 28 of 34
Passed
Passed
Passed
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
LLCR Durability:
1)
2)
3)
4)
A total of 192 points were measured.
EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
The following guidelines are used to categorize the changes in LLCR as a result from stressing.
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms: -------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------ Acceptable
d. +15.1 to +50.0 mOhms: ------------------ Marginal
e. +50.1 to +2000 mOhms------------------- Unstable
f. >+2000 mOhms: --------------------------- Open Failure
LLCR Measurement Summaries by Pin Type
Date
Room Temp (Deg C)
Rel Humidity (%)
Technician
mOhm values
3/13/2015
22
34
Aaron
McKim
Actual
Initial
Average
St. Dev.
Min
Max
Summary Count
Total Count
3/24/2015
4/1/2015
22
22
36
35
Tony
Tony
Wagoner
Wagoner
Delta
Delta
25 Cycles
Therm Shck
Pin Type 1: Signal
11.89
1.31
8.19
16.40
192
192
0.50
0.55
0.00
3.04
192
192
0.87
0.85
0.01
6.16
192
192
4/13/2015
22
36
Tony
Wagoner
Delta
Humidity
1.32
1.32
0.00
7.32
192
192
LLCR Delta Count by Category
mOhms
25 Cycles
Therm Shck
Humidity
Stable
<=5
192
191
188
Minor
>5 & <=10
0
1
4
Acceptable
>10 & <=30
0
0
0
Page 29 of 34
Marginal
>30 & <=50
0
0
0
Unstable
>50 & <=1000
0
0
0
Open
>1000
0
0
0
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
LLCR Thermal Aging:
1)
2)
3)
4)
A total of 192 points were measured.
EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
The following guidelines are used to categorize the changes in LLCR as a result from stressing.
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms: --------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------- Acceptable
d. +15.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms: ------------------ Unstable
f. >+2000 mOhms:---------------------------- Open Failure
LLCR Measurement Summaries by Pin Type
Date
Room Temp (Deg C)
Rel Humidity (%)
Technician
mOhm values
Average
St. Dev.
Min
Max
Summary Count
Total Count
3/12/2015
22
37
Aaron McKim
Actual
Initial
13.04
2.02
7.55
20.09
192
192
3/30/2015
22
35
Tony Wagoner
Delta
Thermal
Pin Type 1: Signal
Delta
Delta
2.86
3.55
0.00
29.96
192
192
LLCR Delta Count by Category
mOhms
Thermal
Stable
<=5
163
Minor
>5 & <=10
21
Acceptable
>10 & <=30
8
Page 30 of 34
Marginal
>30 & <=50
0
Unstable
>50 & <=1000
0
Open
>1000
0
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
LLCR Gas Tight:
1)
2)
3)
4)
A total of 192 points were measured.
EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
A computer program, LLCR 221.exe, ensures repeatability for data acquisition.
The following guidelines are used to categorize the changes in LLCR as a result from stressing.
a. <= +5.0 mOhms: ---------------------------- Stable
b. +5.1 to +10.0 mOhms: --------------------- Minor
c. +10.1 to +15.0 mOhms: -------------------- Acceptable
d. +15.1 to +50.0 mOhms: -------------------- Marginal
e. +50.1 to +2000 mOhms: ------------------- Unstable
f. >+2000 mOhms: ---------------------------- Open Failure
LLCR Measurement Summaries by Pin Type
Date
Room Temp (Deg C)
Rel Humidity (%)
Technician
mOhm values
Average
St. Dev.
Min
Max
Summary Count
Total Count
2/25/2015
22
36
Tony Wagoner
Actual
Initial
14.70
3.44
5.27
28.70
192
192
3/4/2015
22
34
Aaron McKim
Delta
Acid Vapor
Pin Type 1: Signal
Delta
Delta
1.06
1.25
0.00
11.01
192
192
LLCR Delta Count by Category
mOhms
Acid Vapor
Stable
<=5
189
Minor
>5 & <=10
2
Acceptable
>10 & <=30
1
Marginal
>30 & <=50
0
Page 31 of 34
Unstable
>50 & <=1000
0
Open
>1000
0
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
DATA SUMMARIES Continued
LLCR Shock &Vibration:
1). A total of 192 points were measured.
2). EIA-364-23, Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets.
3). The following guidelines are used to categorize the changes in LLCR as a result from stressing.
a. <= +5.0 mOhms: --------------------------- Stable
b. +5.1 to +10.0 mOhms: -------------------- Minor
c. +10.1 to +15.0 mOhms: ------------------- Acceptable
d. +15.1 to +50.0 mOhms: ------------------- Marginal
e. +50.1 to +2000 mOhms ------------------- Unstable
f. >+2000 mOhms: ---------------------------- Open Failure
LLCR Measurement Summaries by Pin Type
Date
Room Temp (Deg C)
Rel Humidity (%)
Technician
mOhm values
Average
St. Dev.
Min
Max
Summary Count
Total Count
2/25/2015
22
36
Tony Wagoner
Actual
Initial
13.82
2.36
8.37
23.96
192
192
2/27/2015
22
36
Tony Wagoner
Delta
Shock-Vib
Pin Type 1: Signal
Delta
Delta
1.73
1.20
0.05
10.02
192
192
LLCR Delta Count by Category
mOhms
Shock-Vib
Stable
<=5
190
Minor
>5 & <=10
1
Acceptable
>10 & <=30
1
Marginal
>30 & <=50
0
Unstable
>50 & <=1000
0
Nanosecond Event Detection:
Shock and Vibration Event Detection Summary
Contacts tested
Test Condition
Shock Events
Test Condition
Vibration Events
Total Events
60
C, 100g's, 6ms, Half-Sine
0
V-B, 7.56 rms g
0
0
Page 32 of 34
Open
>1000
0
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
EQUIPMENT AND CALIBRATION SCHEDULES
Equipment #: TCT-07
Description: Automated Test Stand
Manufacturer: Chatillon/Lloyd
Model: LF Plus
Serial #: LF1310
Accuracy: See Manual
… Last Cal: 11/14/2014, Next Cal: 11/14/2015
Equipment #: HPT-01
Description: Hipot Safety Tester
Manufacturer: Vitrek
Model: V73
Serial #: 019808
Accuracy:
… Last Cal: 05/15/2014, Next Cal: 05/15/2015
Equipment #: MO-04
Description: Multimeter /Data Acquisition System
Manufacturer: Keithley
Model: 2700
Serial #: 0798688
Accuracy: See Manual
… Last Cal: 09/11/2014, Next Cal: 09/11/2015
Equipment #: PS-02
Description: Power Supply
Manufacturer: Hewlett-Packer
Model: 6033A
Serial #: N/A
Accuracy: See Manual
… Last Cal: NOT CALIBRATED
Equipment #: MO-10
Description: Model 2750 Multimeter/Switch System (Integra Series)
Manufacturer: Keithley
Model: 2750
Serial #: 1215161
Accuracy: See Manual
… Last Cal: 09/11/2014, Next Cal: 09/11/2015
Equipment #: THC-05
Description: Temperature/Humidity Chamber (Chamber Room)
Manufacturer: Thermotron
Model: SM-8-3800
Serial #: 05 23 00 02
Accuracy: See Manual
… Last Cal: 11/14/2014, Next Cal: 05/31/2015
Page 33 of 34
Tracking Code: 505421_Report_Rev_1
Part #: ZA8-30-2-1.00-Z-10/MATING PCB
Part description: ZA8/PCB
EQUIPMENT AND CALIBRATION SCHEDULES
Equipment #: TSC-01
Description: Vertical Thermal Shock Chamber
Manufacturer: Cincinnati Sub Zero
Model: VTS-3-6-6-SC/AC
Serial #: 10-VT14993
Accuracy: See Manual
… Last Cal: 06/30/2014, Next Cal: 06/30/2015
Equipment #: OV-05
Description: Forced Air Oven, 5 Cu. Ft., 120 V (Chamber Room)
Manufacturer: Sheldon Mfg.
Model: CE5F
Serial #: 02008008
Accuracy: +/- 5 deg. C
… Last Cal: 02/18/2015, Next Cal: 02/18/2016
Equipment #: SVC-01
Description: Shock & Vibration Table
Manufacturer: Data Physics
Model: LE-DSA-10-20K
Serial #: 10037
Accuracy: See Manual
… Last Cal: 04/22/2014, Next Cal: 04/22/2015
Equipment #: ACLM-01
Description: Accelerometer
Manufacturer: PCB Piezotronics
Model: 352C03
Serial #: 115819
Accuracy: See Manual
… Last Cal: 07/18/2014, Next Cal: 07/18/2015
Equipment #: ED-03
Description: Event Detector
Manufacturer: Analysis Tech
Model: 32EHD
Serial #: 1100604
Accuracy: See Manual
… Last Cal: 10/31/2014, Next Cal: 10/31/2015
Page 34 of 34