F-215 ERM8–013–05.0–S–DV–DS–L–TR ® ERM8–030–02.0–S–DV–TR ERM8–060–05.0–L–DV–TR (0,80 mm) .0315" ERM8 SERIES RUGGED HIGH SPEED HEADER SPECIFICATIONS Board Mates: ERF8 For complete specifications and recommended PCB layouts see www.samtec.com?ERM8 Cable Mates: ERCD, ERDP Insulator Material: Black LCP Terminal Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: 2.2 A per per pin (1 pin powered per row) Operating Temp Range: -55°C to +125°C Voltage Rating: 200 VAC max RoHS Compliant: Yes MATED HEIGHT* ERM8 LEAD STYLE –05.0 –07.0 –02.0 –05.0 –08.0 –09.0 (7,00) .276 (10,00) .394 (13,00) .512 (14,00) .551 (9,00) .354 (12,00) .472 (15,00) .591 (16,00) .629 ERF8 LEAD STYLE (1,50 mm) .059" NOMINAL WIPE *Processing conditions will affect mated height. Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling 10.5 GHz / 21 Gbps 12 GHz / 24 Gbps Differential Pair Signaling 9.5 GHz / 19 Gbps 15.5 GHz / 31 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?ERM8 or contact [email protected] ERM8/ERF8 7 mm Stack Height Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (005-030) (0,12 mm) .005" max (040-060) (0,15 mm) .006" max (070-075) RECOGNITIONS POSITIONS PER ROW ERM8 For complete scope of recognitions see www.samtec.com/quality s ocol t o r d P orte p p u S 100 GbE ® s PCI Expres notes at Download app ppnote /a m co c. www.samte mtec.com sa @ IG S t Contac protocols on s for question POS. PART NOs. –S (5,70) .224 = 30µ" (0,76 µm) Gold on contact, Matte Tin on tail (7,20) .283 –L –EGPS NEXUS5001™.org 23 ASP-130366-01 ERM8-DV POWER.org™ 35 ASP-135020-01 ERM8-DV LEAD STYLE A B –02.0 –05.0 –08.0 –09.0 (1,61) .063 (4,61) .181 (7,61) .300 (8,61) .339 (5,97) .235 (8,91) .351 (11,91) .469 (12,91) .508 No. of Positions x (0,80) .0315 + (6,00) .236 –L & –EGP = No. of Positions x (0,80) .0315 + (9,00) .354 –EGPS = No. of Positions x 01 (0,80) .0315 + (10,00) .394 (0,80) .0315 (1,32) .052 DIA –DS = Differential Pair (–05.0 lead style only) (–010, –013, –025, –049 Positions only) –K = (4,00 mm) .157" DIA Polyimide Film Pick & Place Pad –L = Latching (–05.0 lead styles only) (Not available with –EGP & –EGPS options) –EGP = Extended Guide Post (–05.0 lead style only) (Not available with –L option) = Extended Guide Post Shield (–05.0 lead style only) (–010, –020, –025, –030 Positions only) (Not available with –L option) –EGP –DSP = Differential Pair + Extended Guide Post (–05.0 lead styles only) (–013 & –025 Positions only) –DSS (3,20) .126 (1,07) .042 (1,10) .043 OTHER OPTION –EGPS (10,80) .425 (3,25) (5,60) .128 .220 02 DV –L = 10µ" (0,25 µm) Gold on contact, Matte Tin on tail SERIES NEXUS5001™.org 11 ASP-137968-01 ERM8-DV POWER.org™ 17 ASP-137972-01 ERM8-DV 20 ASP-130365-01 ERM8-DV ARM/HSSTP Note: Patented Note: Some lengths, styles and options are non-standard, non-returnable. Specify LEAD STYLE from chart (Available with –09.0 lead style only) (8,91) .351 PLATING OPTION LEAD STYLE –005, –010, –011, –013, –020, –025, –030, –035, –040, –049, –050, –060, –070, –075, –100 APPLICATIONS STANDARD Designed for Rugged Micro pitch applications Hot Swap option B A = Differential Pair + Extended Guide Post Shield (–05.0 lead styles only) (–025 positions only) (5,60) .220 WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. TR –TR = Tape & Reel Packaging