F-215 SUPPLEMENT HDAF–11–08.0–S–13–2 HDAM–11–12.0–S–13–2 (2,00 mm) .0787" HDAM, HDAF SERIES RUGGED ELEVATED HIGH DENSITY ARRAY HDAM Mates with: HDAF HDAF Mates with: HDAM HDAM NO. OF PINS PER ROW LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart = 30µ" (0,76 µm) Gold on contact area, Matte Tin on tails and guide pins SPECIFICATIONS (22,50) .886 1A 1M No. of Pins Per Row x (2,00) .0787 + (16,06) .632 (2,00) .0787 NO. OF PINS PER ROW LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart = 30µ" (0,76 µm) Gold on contact area, Matte Tin on tails and weld tabs (2,00) .0787 –11, –15, –23 ARRAY 11x13 15x13 23x13 *2:1 S:G Ratio PAIR COUNT* (22,50) .886 44 60 92 No. of Pins Per Row x (2,00) .0787 + (11,55) .455 ALSO AVAILABLE (MOQ Required) • Tin-Lead Solder Charge • Other platings Contact Samtec. 1M 1A Note: Some lengths, styles and options are non-standard, non-returnable. (2,00) .0787 A –12.0 (14,41) .567 (19,41) .764 NO. OF ROWS –S LEAD STYLE –08.0 –18.0 Note: HD Mezz is a trademark of Molex Incorporated = Lead-Free Tin Alloy 95.5% Sn/ 3.8% Ag/0.7% Cu Solder Charge = Pick & Place Pad A (10,51) .414 (20,51) .807 • Integrated guide posts HDAM/HDAF 35 mm Stack Height Rated @ 3dB Insertion Loss* Single-Ended 9 GHz / 18 Gbps Signaling Differential Pair 9 GHz / 18 Gbps Signaling *Data based on simulations using Final Inch® design. *Performance data includes effects of a non-optimized PCB. Performance data for other stack heights and complete test data available at www.samtec.com?HDAM, www.samtec.com?HDAF or contact [email protected] (5,09) .200 HDAF (1,20) .0472 –P –2 LEAD STYLE –17.0 No. of Pins Per Row x (2,00) .0787 + (11,55) .455 (1,20) .0472 DIFFERENTIAL APPLICATIONS –13 OTHER OPTION A RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality SOLDER TYPE –S –11, –15, –23 For complete specifications and recommended PCB layouts see www.samtec.com?HDAM or www.samtec.com?HDAF Insulator Material: Black LCP Contact Material: Copper Alloy Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: 3.4 A per pin (6 adjacent pins powered) Operating Temp Range: -55°C to +125°C Contact Resistance: 19 mΩ Working Voltage: 200 VAC Mated Cycles: 100 RoHS Compliant: Yes Lead-Free Solderable: Yes NO. OF ROWS –13 SOLDER TYPE –2 = Lead-Free Tin Alloy 95.5% Sn/ 3.8% Ag/ 0.7% Cu Solder Charge OTHER OPTION –P = Pick & Place Pad No. of Pins Per Row x (2,00) .0787 + (17,92) .706 • Integrated guide posts (1,20) .0472 A WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice.