F-213 QTE–014–01–F–D–DP–A ® (0,80 mm) .0315" QTE–040–01–L–D–A QTE–060–01–L–D–A QTE SERIES HIGH SPEED GROUND PLANE HEADER SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QTE Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50µ" (1,27 µm) Ni Current Rating: Contacts: 1.3A per contact @ 95°C Ground Plane: 10.1A per ground plane @ 95°C Operating Temp Range: -55°C to +125°C Voltage Rating: 225 VAC mated with QSE & 5 mm Stack Height Max Cycles: 100 RoHS Compliant: Yes Processing: Lead–Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (020-060) Board Stacking: For applications requiring more than two connectors per board contact [email protected] Board Mates: QSE *Note: –C Plating passes 10 year MFG testing Note: Some lengths, styles and options are non-standard, non-returnable. Standard stack heights from 5 mm to 25 mm ® Cable Mates: EQCD, EQSD, EQDP, EQRF (See Application Specific note) fina TM 10 year Mixed Flowing Gas with 50µ" Gold Call Samtec for maximum cycles mated with QSE 100 GbE XAUI ® PCI Express SATA t I/O) MGT (Rocke ™ d an iB fin In Rated @ 3dB Insertion Loss with PCB effects* w/o PCB effects** Single-Ended Signaling –D 9 GHz / 18 Gbps 9 GHz / 18 Gbps Differential Pair Signaling –D 8 GHz / 16 Gbps 14 GHz / 28 Gbps Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps *Performance data includes effects of a non-optimized PCB. **Test board losses de-embedded from performance data. Performance data for other stack heights and complete test data available at www.samtec.com?QTE or contact [email protected] QTE/QSE 5 mm Stack Height Type PINS PER ROW NO. OF PAIRS QTE –020, –040, –060 (40 total pins per bank = –D) –014, –028, –042 PLATING OPTION Specify LEAD STYLE from chart –F –D = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails = Single-Ended = 10µ" (0,25 µm) Gold on Signal Pins and Ground Plane, Matte Tin on tails –D = (No. of Positions per Row/20) x (20,00) .7875 (20,00) .7875 (7,11) .280 02 (0,80) .0315 (0,20) .008 A (0,76) .030 (0,89) .035 DIA ––L (0,64) .025 WWW.SAMTEC.COM A TYPE OTHER OPTION –K –L –D–DP = (No. of Positions per Row/14) x (20,00) .7875 (5,97) .235 notes at Download app ppnote om/a c.c te m sa w. ww @ samtec.com Contact SIG on protocols ns for questio LEAD STYLE (14 pairs per bank = –D–DP) 01 l i nch.com s ocol Prot orted Supp EXTENDED LIFE PRODUCT APPLICATION SPECIFIC OPTION • 14mm, 15 mm, 22 mm and 30 mm stack height (Caution: Some automatic placement/inspection machines may have component height restrictions. Please consult machinery specifications.) • 30µ" (0,76 µm) Gold (Specify -H plating for Data Rate cable mating applications.) • Edge Mount • 56(-DP), 80, 100 positions per row • Guide Posts, Screw Down & Friction Lock • Retention Option Call Samtec. Integral metal plane for power or ground –C* = Electro-Polished Selective 50µ" (1,27 µm) min Au over 150µ" (3,81 µm) Ni on Signal Pins in contact area, 10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni on Ground Plane in contact area, Matte Tin over 50µ" (1,27 µm) min Ni on all solder tails –D–DP = Differential Pair (–01 only) QTE LEAD STYLE –01 –02 –03 –04 –05 –07 A HEIGHT WITH QSE* (4,27) .168 (7,26) .286 (10,27) .404 (15,25) .600 (18,26) .718 (24,24) .954 (5,00) .197 (8,00) .315 (11,00) .433 (16,00) .630 (19,00) .748 (25,00) .984 = (7,00 mm) .275" DIA Polyimide Film Pick & Place Pad –TR = Tape & Reel Packaging (N/A on 56 & 80 positions or -05 & -07 lead style) –L = Latching Option (N/A on 42, 56, 60 & 80 positions) *Processing conditions will affect mated height. ALSO AVAILABLE Board Spacing Standoffs. See SO Series.