HI-DENSITY RIGHT ANGLE OPEN PIN FIELD

F-215
SEAM–30–02.0–L–04–2–A–GP–K–TR
SEAM–20–01–L–06–2–RA–GP–TR
(1,27 mm) .050"
SEAM-RA, SEAM-GP SERIES
HI-DENSITY RIGHT ANGLE OPEN PIN FIELD
SEAM-RA Mates with:
SEAF, SEAF-RA, SEAFP
SEAM-GP Mates with:
SEAF-RA-GP
SEAM
NO. PINS
PER ROW
PLATING
OPTION
01
SPECIFICATIONS
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Current Rating:
SEAM-RA = 2.0 A per pin
(6 adjacent pins powered)
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over
50 µ" (1,27 µm) Ni
Contact Resistance:
SEAM-RA = 19 mΩ
SEAM-GP = 5.5 mΩ
Working Voltage:
SEAM-RA = 260 VAC
SEAM-GP = 240 VAC
Mated Cycles:
SEAM-GP = 100
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
= 10 µ" (0,25 µm)
Gold on contact area,
Matte Tin on solder tail
(19,30) .760
(8,13)
.320
–S
(12,32)
.485
(7,91)
.312
(1,60)
.063
= 30 µ" (0,76 µm)
Gold on contact area,
Matte Tin on solder tail
(0,64)
.025
SOLDER
TYPE
RA
= Four Rows
– 06
= Six Rows
– 08*
TR
OPTION
– GP
–1
– 04
–L
– 20, – 30,
–40, –50
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM-RA
or www.samtec.com?SEAM
NO. OF
ROWS
= Guide
Post
= Tin/Lead Alloy
Solder Charge
–2
– TR
=Tape &
Reel
–K
= Polyimide
film Pick &
Place Pad
= Lead-Free
Solder Charge
= Eight Rows
NO. PINS
PER ROW
–20
= Ten Rows
–30
* Note: Fixturing required to
–40
process eight and ten row options,
–50
see www.samtec.com/searayfixture
– 10*
A
(38,94) 1.533
(51,64) 2.033
(64,34) 2.533
(77,04) 3.03
–GP= No. of positions x (1,27) .050 + (19,56) 0.77
Without –GP= No. of positions x (1,27) .050 + (11,18) 0.44
A
(5,36)
.211
(1,27)
.050
TEST DATA*
SEAM-RA/SEAF-05 SEAM-RA/SEAF-RA
Single-Ended
23 Gbps
24 Gbps
Differential Pair
23 Gbps
22 Gbps
* @ 3dB insertion loss. Test board losses
de-embedded from performance data.
Complete test data available at www.samtec.com?SEAM-RA
or contact [email protected]
(3,05) .120 DIA
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
SEAM
NO. PINS
PER ROW
– 20, – 30,
–40, –50
06
PLATING
OPTION
02.0
– 04
–L
= 10 µ" (0,25 µm)
Gold on contact area,
Matte Tin on solder tail
–S
(5,54)
.218
NO. OF
ROWS
= 30 µ" (0,76 µm)
Gold on contact area,
Matte Tin on solder tail
01
=Four Rows
SOLDER
TYPE
– 08
= Polyimide
film Pick &
Place Pad
– TR
–2
= Lead-Free
Solder Charge
=Eight Rows
=Tape & Reel
(Not available
with 50
positions)
– 10
ALSO AVAILABLE
(MOQ Required)
(8,13)
.320
(4,60)
.181
(1,27)
.050
TR
=Ten Rows
(1,27)
.050
Note: Some sizes, styles and
options are non-standard,
non-returnable.
K
–K
= Tin/Lead Alloy
Solder Charge
No. of positions x (1,27) .050 + (19,46) .766
(3,05) .120 DIA
Note: SEAM-GP Patented
GP
–1
– 06
=Six Rows
A
*Note:
–C Plating
passes
• Extended
Guide
Post
10 year MFG testing
(12,65)
.498
• Guide post Field termination kits
Note: Some lengths, styles
and
optionsplatings
are non-standard, non• Other
returnable.
Contact Samtec.
(0,86)
(1,12) .044 DIA
.034 DIA
No. of positions x
(1,27) .050 + (3,58) .141
(0,51)
.020 (1,02)
SQ .040
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.