F-215 SEAM–30–02.0–L–04–2–A–GP–K–TR SEAM–20–01–L–06–2–RA–GP–TR (1,27 mm) .050" SEAM-RA, SEAM-GP SERIES HI-DENSITY RIGHT ANGLE OPEN PIN FIELD SEAM-RA Mates with: SEAF, SEAF-RA, SEAFP SEAM-GP Mates with: SEAF-RA-GP SEAM NO. PINS PER ROW PLATING OPTION 01 SPECIFICATIONS Insulator Material: Black LCP Contact Material: Copper Alloy Current Rating: SEAM-RA = 2.0 A per pin (6 adjacent pins powered) Operating Temp Range: -55°C to +125°C Plating: Au or Sn over 50 µ" (1,27 µm) Ni Contact Resistance: SEAM-RA = 19 mΩ SEAM-GP = 5.5 mΩ Working Voltage: SEAM-RA = 260 VAC SEAM-GP = 240 VAC Mated Cycles: SEAM-GP = 100 RoHS Compliant: Yes Lead-Free Solderable: Yes = 10 µ" (0,25 µm) Gold on contact area, Matte Tin on solder tail (19,30) .760 (8,13) .320 –S (12,32) .485 (7,91) .312 (1,60) .063 = 30 µ" (0,76 µm) Gold on contact area, Matte Tin on solder tail (0,64) .025 SOLDER TYPE RA = Four Rows – 06 = Six Rows – 08* TR OPTION – GP –1 – 04 –L – 20, – 30, –40, –50 For complete specifications and recommended PCB layouts see www.samtec.com?SEAM-RA or www.samtec.com?SEAM NO. OF ROWS = Guide Post = Tin/Lead Alloy Solder Charge –2 – TR =Tape & Reel –K = Polyimide film Pick & Place Pad = Lead-Free Solder Charge = Eight Rows NO. PINS PER ROW –20 = Ten Rows –30 * Note: Fixturing required to –40 process eight and ten row options, –50 see www.samtec.com/searayfixture – 10* A (38,94) 1.533 (51,64) 2.033 (64,34) 2.533 (77,04) 3.03 –GP= No. of positions x (1,27) .050 + (19,56) 0.77 Without –GP= No. of positions x (1,27) .050 + (11,18) 0.44 A (5,36) .211 (1,27) .050 TEST DATA* SEAM-RA/SEAF-05 SEAM-RA/SEAF-RA Single-Ended 23 Gbps 24 Gbps Differential Pair 23 Gbps 22 Gbps * @ 3dB insertion loss. Test board losses de-embedded from performance data. Complete test data available at www.samtec.com?SEAM-RA or contact [email protected] (3,05) .120 DIA RECOGNITIONS For complete scope of recognitions see www.samtec.com/quality SEAM NO. PINS PER ROW – 20, – 30, –40, –50 06 PLATING OPTION 02.0 – 04 –L = 10 µ" (0,25 µm) Gold on contact area, Matte Tin on solder tail –S (5,54) .218 NO. OF ROWS = 30 µ" (0,76 µm) Gold on contact area, Matte Tin on solder tail 01 =Four Rows SOLDER TYPE – 08 = Polyimide film Pick & Place Pad – TR –2 = Lead-Free Solder Charge =Eight Rows =Tape & Reel (Not available with 50 positions) – 10 ALSO AVAILABLE (MOQ Required) (8,13) .320 (4,60) .181 (1,27) .050 TR =Ten Rows (1,27) .050 Note: Some sizes, styles and options are non-standard, non-returnable. K –K = Tin/Lead Alloy Solder Charge No. of positions x (1,27) .050 + (19,46) .766 (3,05) .120 DIA Note: SEAM-GP Patented GP –1 – 06 =Six Rows A *Note: –C Plating passes • Extended Guide Post 10 year MFG testing (12,65) .498 • Guide post Field termination kits Note: Some lengths, styles and optionsplatings are non-standard, non• Other returnable. Contact Samtec. (0,86) (1,12) .044 DIA .034 DIA No. of positions x (1,27) .050 + (3,58) .141 (0,51) .020 (1,02) SQ .040 WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice.