ESD Array ESDP041206V12B0 Description This specification is applied to electrostatic discharge (ESD) protection. It is designed to protect the high-speed data lines against ESD transients. It has very low capacitance and fast turn on times makes it ideal for data and transmission lines with high data rates. According to the special property of device, we recommend not to use on such application as DC/AC power line. Features u u u u u u u RoHS compliant, Lead-Free Protection against ESD voltages and currents (IEC 61000-4-2 Level 4) Extremely quick response time (<1ns) present ideal ESD protection Extremely low capacitance (0.25pF typical) Extremely low leakage current Surface mount device Zero signal distortion Equivalent Circuits Product Model Applications u u u u u u u u u Antenna circuit USB2.0 / USB3.0 IEEE-1394 DVI HMDI Digital Video Equipment Mobil Phone GPS Antenna Bluetooth Communication Equipment Electrical Characteristics Symbol Unit Rate Voltage VDC V Leakage Current IL μA 0.01 Trigger Voltage VT V 300 Clamping Voltage VC V 30 Capacitance, @1MHz CP pF 0.25 Response time ESD Voltage Capability, Contact Discharge Mode ESD Voltage Capability, Air Discharge Mode ESD Pulse Withstand Min Typical Max. 12 ns 0.5 1 KV 8 KV 15 Pulses 1000 VT - Measurement by using Transmission Line Pulse (TLP) VC - Measurement by using Transmission Line Pulse (TLP) CP - Device Capacitance measured with 1Vrms SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 1/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP041206V12B0 Explanation of Part Number ESDP 04 1206 V12 B0 B0, Mode Code Max Rated Voltage VDC, V12=12V Chip Size, 1206 = 1206 (EIA) Elements Series Type: Polymer ESD Suppressors Construction & Dimensions Unit: mm Substrate Ceramic (Alumina) Symbol Spec. Encapsulate Polymer L 3.20±0.10 End termination Ag / Ni / Sn W 1.60±0.10 H 0.50±0.10 B 0.40±0.20 C 0.40±0.20 D 0.20±0.10 E 3.2 F 2.2 G 1.0 J 0.5 P 0.8 Typ. Recommended pad outline SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 2/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP041206V12B0 Temperature Specifications Environmental Specifications Item Specifications Test Condition Reference 90%RH, 40°C Rate Voltage 12VDC 1000hrs MIL-STD-202 Method 103 -40°C to +85°C，30 min. cycle, 5 cycles JIS C0025 (1998)Test Na Bias Humidity IL≤ 10μA Thermal Shock IL≤ 10μA High Temperature IL≤ 10μA Rated Voltage, 85°C, 1000hrs MIL-STD-202G Method 108 Solder leach Resistance IL≤ 10μA 260°C, 10s MIL-STD-202G Method 210F Vibration IL≤ 10μA The entire frequency rage: 10-55Hz, 1.5mm amplitude, 2 hours for each of X,Y,Z directions Parameter Value Unit Operating Temperature -55 to +125 °C Storage Temperature --55 to +125 °C Storage Temperature 5 to 40 °C Relative Humidity <65 %RH Storage Time 12 Max Month Taping Package Storage Condition MIL-STD-202G Method 201A IL - Leakage current at rated voltage, the maximum leakage current was measured after reliability test. Soldering Parameters Reflow Condition TP Ramp-up Critical Zone TL to TP Pb free assembly -Temperature Min (Ts(min)) +150°C -Temperature Max (Ts(max)) +200°C -Time (min to max) (TS) 60 -180 Seconds TL Pre Heat Temperature TS(max) Ramp-down TS(min) Preheat Average ramp up rate ( Liquidus Temp TL) to peak 3°C/Second Max TS(max) to TL - Ramp-up Rate 3°C/Second Max 25 Time to peak temperature (t 25℃ to peak) Time - Temperature (TL) (Liquidus) +217°C - Time (min to max) (TL) 60 -150 Seconds Reflow Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and gradual cooling Soldering gun procedure Note the follows, in case of using solder gun for replacement. 1) The tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30W 2) The soldering gun tip shall not touch this product directly. Peak Temperature (TP) 260 +0/-5°C Time within 5°C of actual peak Temperature (TP) 20-40 Seconds Ramp-down Rate 6°C/Second Max Time 25°C to peak Temperature (TP) 8 minutes Max Soldering volume Note that excess of soldering volume will easily get crack the body of this product. SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 3/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP041206V12B0 Packaging Information Carrier Tape Dimensions Unit: mm Packaging method - Products shall be heat-sealed in the chip pocket, spacing Symbol Spec. A 8.00±0.30 B 3.50±0.05 C 1.75±0.10 D 2.00±0.05 E 4.00±0.10 F 1.50±0.10 L 3.62±0.20 W 2.02±0.20 T 0.75±0.05 pitch 2-mm of paper carrier tape with cover tape, and carrier tape shall be reeled to the reel. - Tape material to be paper. - Cover Tape adhesion to be 40±15 grams. Taping Reel Dimensions Unit: mm Taping Specifications There Shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the heat of taping. Quantity of products in the taping package Standard Quantity 5000PCS / Reel Shipping quantity is a multiple of standard quantity SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 4/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information.