ESD Array ESDP051210V12C0 Description This specification is applied to electrostatic discharge (ESD) protection. It is designed to protect the high-speed data lines against ESD transients. It has very low capacitance and fast turn on times makes it ideal for data and transmission lines with high data rates. According to the special property of device, we recommend not to use on such application as DC/AC power line. Features u u u u u u Protection against ESD voltages and currents (IEC 61000-4-2 Level 4) Extremely quick response time (<1ns) present ideal ESD protection Extremely low capacitance (0.1pF typical) Extremely low leakage current and low power consumption Almost zero signal distortion with high cut-off frequency response of ESD device No VDD power supply need and EOS prevent from VDD/GND impulse impact Equivalent Circuits Marking Notice: VDD pin is optional for additional VDD ESD protection, normally regarded as open N/C pin (ie. no VDD supply need) Product Model Applications u u u u u u u u u u USB2.0 / USB3.0 IEEE-1394 DVI HDMI Display port Digital Video Equipment Mobil Phone GPS Antenna Bluetooth Communication Equipment TV / Monitor Electrical Characteristics Characteristic Rate Voltage VDC Leakage Current Trigger Voltage Value (Max) IL 12V (Max) (@6VDC) 1μA VT Clamping Voltage 300V Typical VC Capacitance, @1MHz 30V Typical CP 0.1pF Typical, 0.2pF Max Response time <1ns Peak Pulse Current (TP=8/20,for VDD only) 6A ESD Voltage Capability, IEC61000-4-2 Contact Discharge Mode 8KV ESD Voltage Capability, IEC61000-4-2 Air Discharge Mode 15KV CP - Device Capacitance measured with 1Vrms SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 1/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP051210V12C0 Explanation of Part Number ESDP 05 1210 V12 C0 C0, Mode Code Max Rated Voltage VDC, V12=12V Chip Size, 1210 = 1210 (EIA) Channels, 05 = 5 channels Series Type: Polymer ESD Suppressors Construction & Dimensions End termination Unit: mm Ag / Ni / Sn □Marking for related position indicator: on the front side of Symbol Spec. L 3.00±0.10 W 2.50±0.10 T 0.60 Max Pin1 & Pin2. B 0.40±0.15 T – Product Code 5 – Channel amount 2 – Ground pin site A – Special code C 0.40±0.15 D 0.95±0.10 P 0.95 P1 1.90 X 0.5 - 0.6 Y 1.10 Z 3.60 G 1.40 device and located between T 5 2 A Marking Recommended pad outline SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 2/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP051210V12C0 Temperature Specifications Parameter Value Unit Operating Temperature -55 to +125 °C Storage Temperature --55 to +125 °C 5 to 40 °C <65 %RH 12 Max Month Taping Package Storage Condition Storage Temperature Relative Humidity Storage Time Soldering Parameters Reflow Condition TP Critical Zone TL to TP Ramp-up Pb free assembly -Temperature Min (Ts(min)) +150°C -Temperature Max (Ts(max)) +200°C -Time (min to max) (TS) 60 -180 Seconds TL Temperature TS(max) Pre Heat Ramp-down TS(min) Average ramp up rate ( Liquidus Temp TL) to peak 3°C/Second Max TS(max) to TL - Ramp-up Rate 3°C/Second Max Preheat 25 Time to peak temperature (t 25℃ to peak) Time - Temperature (TL) (Liquidus) +217°C - Time (min to max) (TL) 60 -150 Seconds Reflow Precaution for soldering Precaution for soldering Note that this product will be easily damaged by rapid heating, Peak Temperature (TP) 260 +0/-5°C rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. Time within 5°C of actual peak Temperature (TP) 20-40 Seconds We recommend to take preheating and gradual cooling Ramp-down Rate 6°C/Second Max Time 25°C to peak Temperature (TP) 8 minutes Max Soldering gun procedure Note the follows, in case of using solder gun for replacement. 1) The tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30W 2) The soldering gun tip shall not touch this product directly. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 3/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. ESD Array ESDP051210V12C0 Packaging Information Carrier Tape Dimensions Unit: mm Packaging method - Products shall be heat-sealed in the chip pocket, spacing Symbol Spec. A 8.00±0.30 B 3.50±0.05 C 1.75±0.10 D 2.00±0.05 E 4.00±0.10 F 1.50±0.10 L 3.30±0.10 W 2.80±0.10 T 0.75±0.03 pitch 2-mm of paper carrier tape with cover tape, and carrier tape shall be reeled to the reel. - Tape material to be paper. - Cover Tape adhesion to be 35±25 grams. Taping Reel Dimensions Unit: mm Taping Specifications There Shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the heat of taping. Quantity of products in the taping package Standard Quantity 5000PCS / Reel Shipping quantity is a multiple of standard quantity SOCAY Electronics Co., Ltd. Revision November 08, 2013 www.socay.com 4/4 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information.