LED720-66-60 TECHNICAL DATA High Power LED Array, 60 chips AlGaAs LED720-66-60 is a wide viewing and extremely high output power illuminator assembled with a total of 60 high efficiency AlGaAs diode chips, mounted on a metal stem TO-66 with AIN ceramics and covered with double coated clear silicone and epoxy resin. These devices are designed for high current operation with proper heat sinking to improver thermal conductive efficiency. Specifications • • • • • Structure: Peak Wavelength: Optical Output Power: Package: Lens: AlGaAs, 60 LED chips 720 nm 550 mW TO-66 stem with AIN clear silicone and epoxy resin Absolute Maximum Ratings (TA=25°C) Item Power Dissipation Forward Current 1 Pulse Forward Current * Reverse Voltage Junction Temperature 2 Thermal Resistance * Operating Temperature Storage Temperature 3 Soldering Temperature * Symbol PD IF IFP VR TJ RTH Topr Tstg Tsol Value 8.0 750 3 50 100 2 -30 … +80 -30 … +110 240 Unit W mA A V °C K/W °C °C °C (Unit: mm) 1 * duty = 1%, pulse width = 1 µs 2 * junction – package, mounted on heat sink 3 * must be completed within 3 seconds at 260°C Electro-Optical Characteristics Item Peak Wavelength Half Width Symbol λP Δλ Total Radiated Power PO Radiant Intensity Forward Voltage Reverse Voltage Viewing Half Angle Rise Time Fall Time IE VF VR Θ1/2 tR tF Condition IF = 600 mA IF = 600 mA IF = 600 mA IFP = 3 A IF = 600 mA IF = 600 mA IR = 10 µA IF = 600 mA IF = 600 mA IF = 600 mA Min. 50 - Typ. 720 30 550 2750 180 9.5 ±60 100 100 Max. - Unit nm nm mW mW/sr V V deg. ns ns Heat Sink is required, to keep the LED at ≤60 °C. Note: The above specifications are for reference purpose only and subjected to change without prior notice. 25.04.2012 LED720-66-60 1 of 3 Typical Performance Curves Forward Current – Forward Voltage Radiant Intensity – Forward Current Allowable Power Dissipation – Ambient Temperature Allowed Forward Current – Ambient Temperature Relative Precaution for Use 1. Cautions • This high power LED must be cooled! • DO NOT look directly into the emitting area of the LED during operation! • WARNING: LED is emitting invisible light! 2. Soldering Conditions • DO NOT apply any stress to the lead particularly when heat. • After soldering the LEDs should be protected from mechanical shock or vibration until the LEDs return to room temperature. • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. 3. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an antielectrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 25.04.2012 LED720-66-60 2 of 3 4. Heat Generation • Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in the specification. • The operating current should be decided after considering the ambient maximum temperature of LEDs. 5. Storage • The LEDs should be stored at 30°C or less and 60%RH or less after being shipped and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with nitrogen atmosphere and moisture absorbent material. • Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. 25.04.2012 LED720-66-60 3 of 3