LED850-66-60

LED850-66-60
TECHNICAL DATA
High Power LED Array, 60 chips
AlGaAs
LED850-66-60 is a wide viewing and extremely high output power illuminator assembled with a
total of 60 high efficiency AlGaAs diode chips, mounted on a metal stem TO-66 with AIN ceramics
and covered with double coated clear silicone and epoxy resin.
These devices are designed for high current operation with proper heat sinking to improver thermal
conductive efficiency.
Specifications
•
•
•
•
•
Structure:
Peak Wavelength:
Optical Output Power:
Package:
Lens:
AlGaAs, 60 LED chips
850 nm
1.5 W
TO-66 stem with AIN
clear silicone and epoxy resin
Absolute Maximum Ratings (TA=25°C)
Item
Power Dissipation
Forward Current
1
Pulse Forward Current *
Reverse Voltage
Operating Temperature
Storage Temperature
2
Soldering Temperature *
Symbol
PD
IF
IFP
VR
Topr
Tstg
Tsol
Value
7.5
1.2
6
50
-30 … +80
-30 … +110
240
Unit
W
A
A
V
°C
°C
°C
1
(Unit: mm)
* duty = 1%, pulse width = 1 µs
2
* must be completed within 3 seconds at 260°C
Electro-Optical Characteristics
Item
Peak Wavelength
Half Width
Symbol
λP
Δλ
Total Radiated Power
PO
Radiant Intensity
Forward Voltage
Reverse Voltage
Viewing Half Angle
Rise Time
Fall Time
IE
VF
VR
Θ1/2
tR
tF
Condition
IF = 800 mA
IF = 800 mA
IF = 800 mA
IFP = 5 A
IF = 800 mA
IF = 800 mA
IR = 10 µA
IF = 800 mA
IF = 100 mA
IF = 100 mA
Min.
840
50
-
Typ.
850
40
1.5
9.0
400
7.5
±60
30
20
Max.
860
-
Unit
nm
nm
W
mW/sr
V
V
deg.
ns
ns
Heat Sink is required, to keep the LED at ≤60 °C.
Note: The above specifications are for reference purpose only and subjected to change without prior notice.
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Typical Performance Curves
Forward Current – Forward Voltage
Radiant Intensity – Forward Current
Forward Current – Pulse Duration
Forward Voltage – Ambient Temperature
Relative Radiant Intensity –
Ambient Temperature
Allowed Forward Current –
Ambient Temperature
Peak Wavelength
Peak Wavelength – Ambient Temperature
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Precaution for Use
1. Cautions
•
This high power LED must be cooled!
•
DO NOT look directly into the emitting area of the LED during operation!
•
WARNING: LED is emitting invisible light!
2. Soldering Conditions
•
DO NOT apply any stress to the lead particularly when heat.
•
After soldering the LEDs should be protected from mechanical shock or vibration until the LEDs return
to room temperature.
•
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the
mechanical stress on the LEDs.
3. Static Electricity
•
The LEDs are very sensitive to Static Electricity and surge
voltage. So it is recommended that a wrist band and/or an antielectrostatic glove be used when handling the LEDs.
•
All devices, equipment and machinery must be grounded properly.
It is recommended that precautions should be taken against surge
voltage to the equipment that mounts the LEDs.
4. Heat Generation
•
Thermal design of the end product is of paramount importance. Please consider the heat generation of
the LED when making the system design. The coefficient of temperature increase per input electric
power is affected by the thermal resistance of the circuit board and density of LED placement on the
board, as well as other components. It is necessary to avoid intense heat generation and operate
within the maximum ratings given in the specification.
•
The operating current should be decided after considering the ambient maximum temperature of
LEDs.
5. Storage
•
The LEDs should be stored at 30°C or less and 60%RH or less after being shipped and the storage
life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a
sealed container with nitrogen atmosphere and moisture absorbent material.
•
Please avoid rapid transitions in ambient temperature, especially in high humidity environments where
condensation can occur.
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