SMB1W-760-I

SMB1W-760-I
TECHNICAL DATA
High Power LED, SMD
AlGaAs
SMB1W-760-I are AlGaAs High Power LEDs isolated mounted on a cooper heat sink with a 5x5
mm SMD package and molded with epoxy resin. On forward bias, it emits a radiation of typical 330
mW at a peak wavelength of 760 nm.
Specifications
•
•
•
•
Structure: AlGaAs, 1W high power chip
Peak Wavelength: typ. 760 nm
Optical Output Power: typ. 330 mW
Package
SMD, PPA resin
Isolator: AIN ceramics
Lead frame die: silver plated on copper
Lens: epoxy resin
Absolute Maximum Ratings (Ta=25°C)
Item
Power Dissipation
Forward Current
Pulse Forward Current *1
Reverse Voltage
Thermal Resistance
Operating Temperature
Storage Temperature
Soldering Temperature *2
Symbol
PD
IF
IFP
VR
Rth
Topr
Tstg
Tsol
Value
2000
800
4000
5
10
-30 … +85
-30 … +100
255
Unit
mW
mA
mA
V
K/W
°C
°C
°C
(Unit: mm)
*1 duty = 1%, pulse width = 10 µs
*2 must be completed within 5 seconds
Electro-Optical Characteristics
Item
Forward Voltage
Pulsed Forward Current
Symbol
VF
VFP
Total Radiated Power
PO
Radiant Intensity
IE
Peak Wavelength
Half Width
Viewing Half Angle
Rise Time
Fall Time
λP
Δλ
Θ1/2
tr
tf
Condition
IF = 800 mA
IFP = 4 A
IF = 800 mA
IFP = 4 A
IF = 800 mA
IFP = 4 A
IF = 100 mA
IF = 100 mA
IF = 100 mA
IF = 100 mA
IF = 100 mA
Min.
-
Typ.
2.0
4.5
330
1650
145
725
760
25
±62
80
80
Max.
2.5
5.5
-
Unit
V
V
mW
mW/sr
nm
nm
deg.
ns
ns
Total Radiated Power is measured by S3584-08
Radiant Intensity is measured by Tektronix J-6512
Notes: Do not view directly into the emitting area of the LED during operation!
The above specifications are for reference purpose only and subjected to change without prior notice.
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Typical Performance Curves
Forward Current – Forward Voltage
Relative Radiant Intensity –Forward Current
Forward Current – Pulse Duration
Allowed Forward Current – Ambient Temperature
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Relative Radiant Intensity – Ambient
Temperature
Forward Voltage – Ambient Temperature
Peak Wavelength
Peak Wavelength – Ambient Temperature
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Radiation pattern
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Recommended Land Layout (Unit: mm)
1. Soldering Conditions
• DO NOT apply any stress to the lead particularly when heat.
• After soldering the LEDs should be protected from mechanical shock or vibration until the
LEDs return to room temperature.
• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
Soldering Conditions
2. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
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