SMB1W-760-I TECHNICAL DATA High Power LED, SMD AlGaAs SMB1W-760-I are AlGaAs High Power LEDs isolated mounted on a cooper heat sink with a 5x5 mm SMD package and molded with epoxy resin. On forward bias, it emits a radiation of typical 330 mW at a peak wavelength of 760 nm. Specifications • • • • Structure: AlGaAs, 1W high power chip Peak Wavelength: typ. 760 nm Optical Output Power: typ. 330 mW Package SMD, PPA resin Isolator: AIN ceramics Lead frame die: silver plated on copper Lens: epoxy resin Absolute Maximum Ratings (Ta=25°C) Item Power Dissipation Forward Current Pulse Forward Current *1 Reverse Voltage Thermal Resistance Operating Temperature Storage Temperature Soldering Temperature *2 Symbol PD IF IFP VR Rth Topr Tstg Tsol Value 2000 800 4000 5 10 -30 … +85 -30 … +100 255 Unit mW mA mA V K/W °C °C °C (Unit: mm) *1 duty = 1%, pulse width = 10 µs *2 must be completed within 5 seconds Electro-Optical Characteristics Item Forward Voltage Pulsed Forward Current Symbol VF VFP Total Radiated Power PO Radiant Intensity IE Peak Wavelength Half Width Viewing Half Angle Rise Time Fall Time λP Δλ Θ1/2 tr tf Condition IF = 800 mA IFP = 4 A IF = 800 mA IFP = 4 A IF = 800 mA IFP = 4 A IF = 100 mA IF = 100 mA IF = 100 mA IF = 100 mA IF = 100 mA Min. - Typ. 2.0 4.5 330 1650 145 725 760 25 ±62 80 80 Max. 2.5 5.5 - Unit V V mW mW/sr nm nm deg. ns ns Total Radiated Power is measured by S3584-08 Radiant Intensity is measured by Tektronix J-6512 Notes: Do not view directly into the emitting area of the LED during operation! The above specifications are for reference purpose only and subjected to change without prior notice. 13.10.2011 SMB1W-760-I 1 of 5 Typical Performance Curves Forward Current – Forward Voltage Relative Radiant Intensity –Forward Current Forward Current – Pulse Duration Allowed Forward Current – Ambient Temperature 13.10.2011 SMB1W-760-I 2 of 5 Relative Radiant Intensity – Ambient Temperature Forward Voltage – Ambient Temperature Peak Wavelength Peak Wavelength – Ambient Temperature 13.10.2011 SMB1W-760-I 3 of 5 Radiation pattern 13.10.2011 SMB1W-760-I SMB1W-760-I-01 SMB1W-760-I-02 SMB1W-760-I-03 SMB1W-760-I-04 SMB1W-760-I-05 SMB1W-760-I 4 of 5 Recommended Land Layout (Unit: mm) 1. Soldering Conditions • DO NOT apply any stress to the lead particularly when heat. • After soldering the LEDs should be protected from mechanical shock or vibration until the LEDs return to room temperature. • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. Soldering Conditions 2. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 13.10.2011 SMB1W-760-I 5 of 5