LED1550-35 series TECHNICAL DATA Infrared LED InGaAsP LED1550-35 series are InGaAsP LEDs mounted on a metal stemp and covered with epoxy resin or glass lens can. On forward bias, it emits a spectral band of radiation, which peaks at 1550 nm. Specifications • • • • • Structure: InGaAsP Peak Wavelength: typ. 1550 nm Optical Ouput Power: typ. ≤2.0 mW Resin Material: Epoxy resin or glass lens cap Solder: Lead free Absolute Maximum Ratings (Ta=25°C) Type Power Dissipation Forward Current Pulse Forward Current *1 Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature *² Symbol PD IF IFP VR TOP TSTG TSOL Value 120 100 1000 5 -20 … +90 -30 … +100 265 Unit mW mA mA V °C °C °C 1 * duty = 1%, pulse width = 10 µs 2 * must be completed within 5 seconds Electro-Optical Characteristics (Ta=25°C) Item Forward Voltage Reverse Current Peak Wavelength Half Width Rise Time Fall Time Symbol VF IR λP Δλ tr tf Condition IF = 50 mA VR = 5 V IF = 50 mA IF = 50 mA IF = 50 mA IF = 50 mA Min. 1500 - Typ. 1.10 1550 100 10 10 Max. 1.40 10 1600 - Unit V µA nm nm ns ns Characteristics of Radiant Power (Ta=25°C) Type LED1550-35K00 LED1550-35K42 LED1550-35M00 LED1550-35M32 LED1550-35T52 Radiation Power (IF = 50 mA) [Unit: mW] Min. Typ. Max. 1.6 2.0 2.0 2.0 1.2 Viewing Half Angle [Θ1/2] ±50° ±6° ±50° ±15° ±55° Radiant Power is measured by Ando Optical Multi Meter AQ2140 & AQ2742 Note: Do not view directly into the emitting area of the LED during operation! The above specifications are for reference purpose only and subjected to change without prior notice. 07.04.2011 LED1550-35 series 1 of 3 Outer Dimensions [Unit: mm] 35K00 35K42 35M00 35M32 35T52 07.04.2011 LED1550-35 series 2 of 3 Precaution for Use 1. Cautions • DO NOT look directly into the emitted light or look through the optical system. To prevent in adequate exposure of the radiation, wear protective glasses. 2. Lead Forming • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the leadframe as a fulcrum during lead forming. • Lead forming should be done before soldering. • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. • When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the LEDs. 3. Soldering Conditions • Solder the LEDs no closer than 3 mm from the base of the lead. • DO NOT apply any stress to the lead particularly when heat. • The LEDs must not be reposition after soldering. • After soldering the LEDs, the lead should be protected from mechanical shock or vibration until the LEDs return to room temperature. • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. • Cut the LED leads at room temperature. Cutting the leads at high temperature may cause the failure of the LEDs. Soldering Conditions 4. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 07.04.2011 LED1550-35 series 3 of 3