LED570-03

LED570-03
TECHNICAL DATA
Visible LED, 5 mm
AlGaInP
LED570-03 is a AlGaInP LED mounted on a lead frame with a clear epoxy lens.
On forward bias it emits a band of visible light with a peak at 570 nm.
Specifications
•
•
•
•
Structure: AlGaInP
Peak Wavelength: typ. 570 nm
Optical Output Power: typ. 0.6 mW
Package: 5 mm clear epoxy resin
Absolute Maximum Ratings (Ta=25°C)
Item
Symbol
Power Dissipation
PD
Forward Current
IF
Reverse Voltage
VR
Operating Temperature
Topr
Storage Temperature
Tstg
Soldering Temperature *
Tsol
* must be completed within 3 seconds
Value
110
50
5
-30 … +80
-30 … +100
265
Unit
mW
mA
V
°C
°C
°C
(Unit: mm)
Electro-Optical Characteristics
Item
Forward Voltage
Reverse Current
Total Radiated Power
Radiant Intensity
Brightness
Peak Wavelength
Half Width
Viewing Half Angle
Symbol
VF
IR
PO
IE
IV
λP
Δλ
Θ1/2
Condition
IF = 20 mA
VR = 5 V
IF = 20 mA
IF = 20 mA
IF = 20 mA
IF = 20 mA
IF = 20 mA
IF = 20 mA
Min.
560
-
Typ.
2.1
0.6
2.1
1.3
570
10
±12
Max.
2.3
10
580
-
Unit
V
µA
mW
mW/sr
cd
nm
nm
deg.
Brightness is measured by Tektronix J-16
Total Radiated Power is measured by S3584-08
Radiant Intensity is measured by Tektronix J-6512
Notes
• Do not view directly into the emitting area of the LED during operation!
• The above specifications are for reference purpose only and subjected to change without prior notice.
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Precaution for Use
1. Cautions
• DO NOT look directly into the emitted light or look through the optical system. To prevent in
adequate exposure of the radiation, wear protective glasses.
2. Lead Forming
• When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
• Lead forming should be done before soldering.
• DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
Recommended Land Layout (Unit: mm)
3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• DO NOT apply any stress to the lead particularly when heat.
• The LEDs must not be reposition after soldering.
• After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
• When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
• Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
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Soldering Conditions
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
•
All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
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