AS227-000/099 - Skyworks Solutions, Inc.

DATA SHEET
AS227-000/099: 20 MHz to 2.0 GHz, 4 W pHEMT SP3T Switch
Applications
J3 V3
 Transmit/receive switching for telematic systems at elevated
power levels
Features
 Broadband frequency range: 20 MHz to 2.0 GHz
 Very low insertion loss: 0.5 dB typical @ 0.9 GHz
 High isolation: 26 dB typical @ 0.9 GHz
 High input power compression: 0.1 dB @ > +37 dBm
 Low current consumption: <50 μA @ 3 V
J2
RFC
V2
 Bare pHEMT die: 1015 x 1015 x 200 μm
 Chips supplied on Gel-Pak® or singulated wafers on film frame
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
V1 J1
S1923b
Figure 1. AS227-000 Block Diagram
Description
The AS227-000/099 is a high power, pHEMT Single-Pole,
Triple-Throw (SP3T) switch. The switch is designed for use in
systems operating from 20 MHz to 2.0 GHz for which low loss,
high isolation, low control voltage, and chip scale size are
required.
The device is controlled with positive, negative, or a combination
of both voltages. The RF signal paths within the device are fully
bilateral.
The AS227-000/099 is provided as a bare die in an ultra-compact
1015 x 1015 x 200 μm design. Chips are shipped in quantities of
100 per 2 x 2 inch Gel-Pak (use part number AS227-000). For
high volume orders, chips can be supplied on a film frame (use
part number AS227-099).
A functional block diagram is shown in Figure 1. The pin
configuration is shown in Figure 2. Signal pin assignments and
functional pin descriptions are provided in Table 1.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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1
DATA SHEET • AS227-000/099 SP3T SWITCH
Note: Pin 8 is the backside of chip and should be grounded.
S2536
Figure 2. AS227-000/099 Pinout
(Top View)
Table 1. AS227-000/099 Signal Descriptions
Pin
Name
Description
Pin
Name
Description
1
V1
DC control voltage.
5
J3
RF port. Must be DC blocked for positive
voltage operation (Note 1).
2
RFC
RF common port. Must be DC blocked for
positive voltage operation (Note 1).
6
V3
DC control voltage.
3
V2
DC control voltage
7
J1
RF port. Must be DC blocked for positive
voltage operation (Note 1).
4
J2
RF port. Must be DC blocked for positive
voltage operation (Note 1).
8
GND
Ground. Backside of chip. Mount with
conductive epoxy.
Note 1: A 47 pF blocking capacitor is required for >500 MHz operation. Use larger value capacitors for lower frequency operation.
Technical Description
Electrical and Mechanical Specifications
The AS227-000/099 is controlled using three voltage inputs, V1,
V2, and V3 (pins 1, 3, and 6, respectively). Depending on the
voltage level applied to these pins, the common RF port (RFC) is
connected to one of three RF ports (J1, J2, or J3) using a low
insertion loss path, while the path between RFC and the other RF
ports are in an isolation state.
The absolute maximum ratings of the AS227-000/099 are
provided in Table 2. Electrical specifications are provided in
Table 3 and the operating characteristics are specified in Table 4.
When the control voltages are toggled, the states between RFC
and the other RF ports are also toggled.
Typical performance characteristics of the AS227-000/099 are
illustrated in Figures 3 through 7.
The state of the AS227-000 is determined by the logic provided in
Table 5.
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DATA SHEET • AS227-000/099 SP3T SWITCH
Table 2. AS227-000 Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
0
+6
V
Control voltage
VCTL
RF input power (VCTL > 0.9 GHz)
PIN
+36
dBm
Operating temperature
TOP
–40
+85
°C
Storage temperature
TSTG
–65
+150
°C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. AS227-000/099 Electrical Specifications (Note 1)
(VCTL = 0-3 V, TOP = +25 C, PIN = 0 dBm, Characteristic Impedance = 50 Ω, Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Insertion loss
0.02 to 0.5 GHz
0.5 to 1.0 GHz
1.0 to 2.0 GHz
Isolation
0.02 to 0.5 GHz
0.5 to 1.0 GHz
1.0 to 2.0 GHz
Return loss (Note 2)
Switching characteristics:
Rise/fall
On/off
0.1 dB Input Compression Point
IP0.1dB
Control voltage:
Low (@ 20 μA max)
High (@100 μA max)
High (@ 200 μA max)
VCTL_L
VCTL_H
VCTL_H
Min
Typical
Max
Units
0.45
0.50
0.70
0.60
0.70
0.90
dB
dB
dB
32
26
20
dB
dB
dB
0.02 to 1.0 GHz
1.0 to 2.0 GHz
18
14
dB
dB
10/90% or 90/10% RF
50% VCTL to 90/10% RF
200
300
ns
ns
@ 48 MHz
@ 900 MHz
+35
+38
dBm
dBm
30
24
18
0
2.7
5.0
V
V
V
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: Return loss state. Lower frequency return loss is dependent on value of the DC blocking capacitors.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • AS227-000/099 SP3T SWITCH
Typical Performance Characteristics
(VCTL = 0-3 V, TOP = +25 C, PIN = 0 dBm, Characteristic Impedance [ZO] = 50 Ω, CBL = 100 pF, Unless Otherwise Noted)
0
0
–10
–15
–0.6
Isolation (dB)
Insertion Loss (dB)
–0.4
RFC to J2
RFC to J3
–5
RFC to J1
RFC to J2
RFC to J3
–0.2
–0.8
–1.0
–1.2
–20
–25
–30
–1.4
–35
–1.6
–40
–1.8
–45
–50
–2.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
0.5
1.0
2.0
2.5
3.0
0
RFC to J1
RFC to J3
–5
–10
RFC to J1
RFC to J2
–10
–15
Isolation (dB)
–15
–20
–25
–30
–35
–20
–25
–30
–35
–40
–40
–45
–45
–50
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Frequency (GHz)
–50
0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency (GHz)
Figure 5. Isolation vs Frequency
(RFC to J2 n Insertion Loss)
Figure 6. Isolation vs Frequency
(RFC to J3 in Insertion Loss)
0
RFC to J1
RFC to J2
RFC to J3
–5
–10
Return Loss (dB)
4.0
0
–5
–15
–20
–25
–30
–35
–40
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Frequency (GHz)
Figure 7. Return Loss vs Frequency
(Insertion Loss State)
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3.5
Figure 4. Isolation vs Frequency
(RFC to J1 in Insertion Loss)
Figure 3. Insertion Loss vs Frequency
Isolation (dB)
1.5
Frequency (GHz)
Frequency (GHz)
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3.5
4.0
DATA SHEET • AS227-000/099 SP3T SWITCH
Table 4. Truth Table
Note:
V1
(Pin 1)
V2
(Pin 3)
V3
(Pin 6)
RFC to J1 Path
RFC to J2 Path
RFC to J3 Path
VHIGH
VLOW
VLOW
Insertion Loss
Isolation
Isolation
VLOW
VHIGH
VLOW
Isolation
Insertion Loss
Isolation
VLOW
VLOW
VHIGH
Isolation
Isolation
Insertion Loss
VLOW = 0 to 0.2 V, VHIGH = 2.7 to 5 V. Any state other than described in this Table places the device in an undefined state. An undefined state does not damage the device.
Evaluation Board Description
Package and Handling Information
The AS227-000/099 is evaluated in a plastic package format to
determine its performance characteristics. An Evaluation Board
schematic diagram is provided in Figure 8. An assembly drawing
for the Evaluation Board is shown in Figure 9.
Instructions on the shipping container label regarding exposure to
moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The AS227-000 chips are shipped in Gel-Paks. The AS227-099
wafers are shipped on film frames (see singulated wafer format
dimensions in Figure 11).
Chip Dimensions
Chip dimensions are shown in Figure 10.
The AS227-000/099 has no backside metal and must be attached
using conductive epoxy.
C1
RF Common Port
DC Control Voltage
DC Control Voltage
C4
RF Input/Output
C2
RF Input/Output
C3
RF Input/Output
DC Control Voltage
Note: Use 47 pF blocking capacitors (C1, C2, C3, C4) for >500 MHz operation. Higher values
recommended for lower frequency operation. Exposed paddle must be grounded.
Use 10 nF blocking capacitors (C1, C2, C3, C4) for <50 MHz operation.
S2538
Figure 7. AS227-000/099 Evaluation Board Schematic
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • AS227-000/099 SP3T SWITCH
RFC
V2
V1
J2
J1
V3
J3
S2537
Figure 8. AS227-000/099 Evaluation Board Assembly Diagram
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DATA SHEET • AS227-000/099 SP3T SWITCH
Single bond pad openings
3 V2
V1 1
2 RFC
72
938
1015
72
4 J2
77
5 J3
6 V3
J1 7
77
361
390
647
938
1015
Notes: All dimensions are in microns.
Pin 8 is ground pad on backside of chip.
Bond pads are gold metalized.
Chip backside metalization: none.
Chip thickness: 200 microns
S2539
Figure 9. AS227-000/099 Chip Dimensions
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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DATA SHEET • AS227-000/099 SP3T SWITCH
202.5
210.3
195.0
202.6
6.0
Wafer Flat
6.0
Label
Inner Ring
Notes:
1. All dimensions in millimeters.
2. Tape material: unexposed UV tape.
Outer Ring
Grip Ring Number: GRP-2620-6
S2506
Figure 10. AS227-099 (Singulated Wafer Format)
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DATA SHEET • AS227-000/099 SP3T SWITCH
Ordering Information
Model Name
AS227 SPDT Switch
Manufacturing Part Number
AS227-000 (100 chips per 2 x 2 inch Gel-Pak)
Evaluation Board Part Number
AS227-000-EVB
AS227-099 (singulated wafers on film frame)
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